JP2017228605A5 - - Google Patents
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- Publication number
- JP2017228605A5 JP2017228605A5 JP2016122469A JP2016122469A JP2017228605A5 JP 2017228605 A5 JP2017228605 A5 JP 2017228605A5 JP 2016122469 A JP2016122469 A JP 2016122469A JP 2016122469 A JP2016122469 A JP 2016122469A JP 2017228605 A5 JP2017228605 A5 JP 2017228605A5
- Authority
- JP
- Japan
- Prior art keywords
- groove
- semiconductor chip
- substrate
- manufacturing
- inclined portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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- 239000007788 liquid Substances 0.000 claims description 21
- 239000000758 substrate Substances 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 6
- 238000005530 etching Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 238000000034 method Methods 0.000 claims 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 238000001312 dry etching Methods 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- 238000007599 discharging Methods 0.000 description 1
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016122469A JP6736374B2 (ja) | 2016-06-21 | 2016-06-21 | 液体吐出ヘッド用半導体チップの製造方法 |
| US15/623,281 US9925776B2 (en) | 2016-06-21 | 2017-06-14 | Method of manufacturing semiconductor chips for liquid discharge head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016122469A JP6736374B2 (ja) | 2016-06-21 | 2016-06-21 | 液体吐出ヘッド用半導体チップの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017228605A JP2017228605A (ja) | 2017-12-28 |
| JP2017228605A5 true JP2017228605A5 (https=) | 2019-07-11 |
| JP6736374B2 JP6736374B2 (ja) | 2020-08-05 |
Family
ID=60661611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016122469A Active JP6736374B2 (ja) | 2016-06-21 | 2016-06-21 | 液体吐出ヘッド用半導体チップの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9925776B2 (https=) |
| JP (1) | JP6736374B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024065616A (ja) * | 2022-10-31 | 2024-05-15 | キヤノン株式会社 | ウエハのダイシング方法、及び、液体吐出ヘッド |
| JP2024081956A (ja) | 2022-12-07 | 2024-06-19 | キヤノン株式会社 | ウエハ、液体吐出ヘッド、液体吐出チップおよび液体吐出チップの製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005268752A (ja) | 2004-02-19 | 2005-09-29 | Canon Inc | レーザ割断方法、被割断部材および半導体素子チップ |
| JP4529692B2 (ja) * | 2005-01-07 | 2010-08-25 | セイコーエプソン株式会社 | 結晶性基材の分割方法、及び、液体噴射ヘッドの製造方法 |
| JP2007194373A (ja) * | 2006-01-18 | 2007-08-02 | Seiko Epson Corp | シリコンデバイスの製造方法及び液体噴射ヘッドの製造方法 |
| JP5455461B2 (ja) * | 2009-06-17 | 2014-03-26 | キヤノン株式会社 | シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法 |
| JP5370262B2 (ja) * | 2010-05-18 | 2013-12-18 | 豊田合成株式会社 | 半導体発光チップおよび基板の加工方法 |
| JP6095320B2 (ja) * | 2011-12-02 | 2017-03-15 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法 |
| JP2014220403A (ja) | 2013-05-09 | 2014-11-20 | 浜松ホトニクス株式会社 | 半導体エネルギー線検出素子及び半導体エネルギー線検出素子の製造方法 |
-
2016
- 2016-06-21 JP JP2016122469A patent/JP6736374B2/ja active Active
-
2017
- 2017-06-14 US US15/623,281 patent/US9925776B2/en active Active
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