JP6736374B2 - 液体吐出ヘッド用半導体チップの製造方法 - Google Patents
液体吐出ヘッド用半導体チップの製造方法 Download PDFInfo
- Publication number
- JP6736374B2 JP6736374B2 JP2016122469A JP2016122469A JP6736374B2 JP 6736374 B2 JP6736374 B2 JP 6736374B2 JP 2016122469 A JP2016122469 A JP 2016122469A JP 2016122469 A JP2016122469 A JP 2016122469A JP 6736374 B2 JP6736374 B2 JP 6736374B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- groove
- semiconductor chip
- manufacturing
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1635—Manufacturing processes dividing the wafer into individual chips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
- B41J2/1603—Production of bubble jet print heads of the front shooter type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/162—Manufacturing of the nozzle plates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1628—Manufacturing processes etching dry etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1626—Manufacturing processes etching
- B41J2/1629—Manufacturing processes etching wet etching
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1631—Manufacturing processes photolithography
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1621—Manufacturing processes
- B41J2/1632—Manufacturing processes machining
- B41J2/1634—Manufacturing processes machining laser machining
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Dicing (AREA)
- Laser Beam Processing (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016122469A JP6736374B2 (ja) | 2016-06-21 | 2016-06-21 | 液体吐出ヘッド用半導体チップの製造方法 |
| US15/623,281 US9925776B2 (en) | 2016-06-21 | 2017-06-14 | Method of manufacturing semiconductor chips for liquid discharge head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016122469A JP6736374B2 (ja) | 2016-06-21 | 2016-06-21 | 液体吐出ヘッド用半導体チップの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017228605A JP2017228605A (ja) | 2017-12-28 |
| JP2017228605A5 JP2017228605A5 (https=) | 2019-07-11 |
| JP6736374B2 true JP6736374B2 (ja) | 2020-08-05 |
Family
ID=60661611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016122469A Active JP6736374B2 (ja) | 2016-06-21 | 2016-06-21 | 液体吐出ヘッド用半導体チップの製造方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US9925776B2 (https=) |
| JP (1) | JP6736374B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2024065616A (ja) * | 2022-10-31 | 2024-05-15 | キヤノン株式会社 | ウエハのダイシング方法、及び、液体吐出ヘッド |
| JP2024081956A (ja) | 2022-12-07 | 2024-06-19 | キヤノン株式会社 | ウエハ、液体吐出ヘッド、液体吐出チップおよび液体吐出チップの製造方法 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005268752A (ja) | 2004-02-19 | 2005-09-29 | Canon Inc | レーザ割断方法、被割断部材および半導体素子チップ |
| JP4529692B2 (ja) * | 2005-01-07 | 2010-08-25 | セイコーエプソン株式会社 | 結晶性基材の分割方法、及び、液体噴射ヘッドの製造方法 |
| JP2007194373A (ja) * | 2006-01-18 | 2007-08-02 | Seiko Epson Corp | シリコンデバイスの製造方法及び液体噴射ヘッドの製造方法 |
| JP5455461B2 (ja) * | 2009-06-17 | 2014-03-26 | キヤノン株式会社 | シリコン基板の加工方法及び液体吐出ヘッド用基板の製造方法 |
| JP5370262B2 (ja) * | 2010-05-18 | 2013-12-18 | 豊田合成株式会社 | 半導体発光チップおよび基板の加工方法 |
| JP6095320B2 (ja) * | 2011-12-02 | 2017-03-15 | キヤノン株式会社 | 液体吐出ヘッド用基板の製造方法 |
| JP2014220403A (ja) | 2013-05-09 | 2014-11-20 | 浜松ホトニクス株式会社 | 半導体エネルギー線検出素子及び半導体エネルギー線検出素子の製造方法 |
-
2016
- 2016-06-21 JP JP2016122469A patent/JP6736374B2/ja active Active
-
2017
- 2017-06-14 US US15/623,281 patent/US9925776B2/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| US9925776B2 (en) | 2018-03-27 |
| JP2017228605A (ja) | 2017-12-28 |
| US20170361616A1 (en) | 2017-12-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5862733B1 (ja) | 半導体片の製造方法 | |
| JP6452490B2 (ja) | 半導体チップの生成方法 | |
| KR100984727B1 (ko) | 대상물 가공 방법 및 대상물 가공 장치 | |
| KR101853975B1 (ko) | 레이저 가공 방법 | |
| CN102157447B (zh) | 切割半导体晶片的方法、从半导体晶片切割的芯片以及从半导体晶片切割的芯片的阵列 | |
| US8091234B2 (en) | Manufacturing method for liquid discharge head substrate | |
| US7934810B2 (en) | Ink jet recording head including beams dividing supply ports | |
| JP4656670B2 (ja) | 液体吐出ヘッド及び液体吐出ヘッドの製造方法 | |
| US7294558B2 (en) | Method and apparatus for cleaving a wafer through expansion resulting from vaporization or freezing of liquid | |
| JP6736374B2 (ja) | 液体吐出ヘッド用半導体チップの製造方法 | |
| KR100991720B1 (ko) | 레이저 가공장치용 빔 정형 모듈 | |
| US9333750B2 (en) | Method of processing substrate | |
| WO2010050085A1 (ja) | 半導体ウェハ及びその分割方法 | |
| EP2856586B1 (en) | Laser ablation process for manufacturing submounts for laser diode and laser diode units | |
| US20230115673A1 (en) | Method for manufacturing wafers | |
| JP5884935B1 (ja) | 半導体片の製造方法 | |
| JP6395539B2 (ja) | 液体吐出ヘッド用基板の製造方法、及びシリコン基板の加工方法 | |
| JP2009061668A (ja) | シリコン基板の加工方法、及び液体吐出ヘッドの製造方法 | |
| US20140353362A1 (en) | Laser Ablation Process for Manufacturing Submounts for Laser Diode and Laser Diode Units | |
| JP2017228605A5 (https=) | ||
| JP6245414B1 (ja) | 半導体素子の製造方法 | |
| JP2016096167A (ja) | 半導体片の製造方法、回路基板および電子装置 | |
| JP2006222359A (ja) | 発光ダイオードアレイの製造方法 | |
| JP2024124838A (ja) | 半導体装置の製造方法 | |
| JP2017124532A (ja) | 吐出素子基板の製造方法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20190607 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190607 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200605 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200616 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200715 |
|
| R151 | Written notification of patent or utility model registration |
Ref document number: 6736374 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |