JP2017224651A - 冷却器 - Google Patents
冷却器 Download PDFInfo
- Publication number
- JP2017224651A JP2017224651A JP2016117137A JP2016117137A JP2017224651A JP 2017224651 A JP2017224651 A JP 2017224651A JP 2016117137 A JP2016117137 A JP 2016117137A JP 2016117137 A JP2016117137 A JP 2016117137A JP 2017224651 A JP2017224651 A JP 2017224651A
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- cooling
- plates
- cooler
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005192 partition Methods 0.000 claims abstract description 54
- 239000003507 refrigerant Substances 0.000 claims description 82
- 238000001816 cooling Methods 0.000 abstract description 55
- 239000002826 coolant Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 2
- 239000011347 resin Substances 0.000 description 40
- 229920005989 resin Polymers 0.000 description 40
- 230000002093 peripheral effect Effects 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
3a、3b、3c:パワー端子
4:制御端子
5:前端カバー
6:後端カバー
7:冷媒供給口
8:冷媒排出口
10、10a、10b:樹脂筐体
12:外枠
12a:周壁
12b:上端面
12c、12d:貫通孔
13:パッケージ
14:フィン
15:冷却プレート
16:絶縁板
17:放熱板
18:ガスケット
21a、21b:トランジスタチップ
22:銅ブロック
30、30a、30b:仕切板
31:溝
32:ノズル
33:止め板
39:冷媒流路
39a:冷媒供給流路
39b:冷媒排出流路
Claims (1)
- 冷媒流路の対向する一対の側板の夫々の外側に冷却対象を取り付けることが可能な冷却器であり、
前記一対の側板の間に当該側板と平行に、互いに対向する2枚の仕切板が配置されており、
夫々の前記仕切板は、相対する仕切板を向く面に互いに対向する溝を備えているとともに、前記溝の中に、対向する前記側板に向かって突出するノズルを備えており、
2枚の前記仕切板は互いに接しているとともに、2枚の前記仕切板の前記溝が対向して冷媒供給流路を形成している、ことを特徴とする冷却器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016117137A JP6638565B2 (ja) | 2016-06-13 | 2016-06-13 | 冷却器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016117137A JP6638565B2 (ja) | 2016-06-13 | 2016-06-13 | 冷却器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017224651A true JP2017224651A (ja) | 2017-12-21 |
JP6638565B2 JP6638565B2 (ja) | 2020-01-29 |
Family
ID=60686052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016117137A Active JP6638565B2 (ja) | 2016-06-13 | 2016-06-13 | 冷却器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6638565B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210147514A (ko) * | 2020-05-29 | 2021-12-07 | 효성중공업 주식회사 | 직접 접촉식 방열 장치 |
Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5553394A (en) * | 1995-05-11 | 1996-09-10 | Reliance/Comm Tech Corporation | Radial jet reattachment nozzle heat sink module for cooling electronics |
JP2007258458A (ja) * | 2006-03-23 | 2007-10-04 | Toyota Motor Corp | 冷却器 |
JP2008198751A (ja) * | 2007-02-12 | 2008-08-28 | Denso Corp | 冷却器及びこれを用いた電力変換装置 |
US20080205002A1 (en) * | 2007-02-22 | 2008-08-28 | Tat Wai Calvin Chui | Composite board for heat dissipation and forming methodology |
JP2009239043A (ja) * | 2008-03-27 | 2009-10-15 | Furukawa Electric Co Ltd:The | 微細流路を備えた冷却装置、その製造方法 |
CN201700119U (zh) * | 2010-05-25 | 2011-01-05 | 青钢金属建材股份有限公司 | 散热用微孔板材 |
JP2013215080A (ja) * | 2012-03-09 | 2013-10-17 | Sumitomo Heavy Ind Ltd | 電力変換装置及び作業機械 |
JP2014143273A (ja) * | 2013-01-23 | 2014-08-07 | Toyota Motor Corp | 積層冷却ユニット |
JP2015023124A (ja) * | 2013-07-18 | 2015-02-02 | トヨタ自動車株式会社 | 積層冷却ユニット |
JP2015133420A (ja) * | 2014-01-14 | 2015-07-23 | トヨタ自動車株式会社 | 冷却器とその製造方法 |
JP2015149361A (ja) * | 2014-02-05 | 2015-08-20 | 株式会社日本自動車部品総合研究所 | 冷却器 |
CN105636411A (zh) * | 2015-12-30 | 2016-06-01 | 中国电子科技集团公司第二十六研究所 | 液冷用金属流道制作方法及液冷金属流道冷板 |
-
2016
- 2016-06-13 JP JP2016117137A patent/JP6638565B2/ja active Active
Patent Citations (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5553394A (en) * | 1995-05-11 | 1996-09-10 | Reliance/Comm Tech Corporation | Radial jet reattachment nozzle heat sink module for cooling electronics |
JP2007258458A (ja) * | 2006-03-23 | 2007-10-04 | Toyota Motor Corp | 冷却器 |
JP2008198751A (ja) * | 2007-02-12 | 2008-08-28 | Denso Corp | 冷却器及びこれを用いた電力変換装置 |
US20080205002A1 (en) * | 2007-02-22 | 2008-08-28 | Tat Wai Calvin Chui | Composite board for heat dissipation and forming methodology |
JP2009239043A (ja) * | 2008-03-27 | 2009-10-15 | Furukawa Electric Co Ltd:The | 微細流路を備えた冷却装置、その製造方法 |
CN201700119U (zh) * | 2010-05-25 | 2011-01-05 | 青钢金属建材股份有限公司 | 散热用微孔板材 |
JP2013215080A (ja) * | 2012-03-09 | 2013-10-17 | Sumitomo Heavy Ind Ltd | 電力変換装置及び作業機械 |
JP2014143273A (ja) * | 2013-01-23 | 2014-08-07 | Toyota Motor Corp | 積層冷却ユニット |
JP2015023124A (ja) * | 2013-07-18 | 2015-02-02 | トヨタ自動車株式会社 | 積層冷却ユニット |
JP2015133420A (ja) * | 2014-01-14 | 2015-07-23 | トヨタ自動車株式会社 | 冷却器とその製造方法 |
JP2015149361A (ja) * | 2014-02-05 | 2015-08-20 | 株式会社日本自動車部品総合研究所 | 冷却器 |
CN105636411A (zh) * | 2015-12-30 | 2016-06-01 | 中国电子科技集团公司第二十六研究所 | 液冷用金属流道制作方法及液冷金属流道冷板 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20210147514A (ko) * | 2020-05-29 | 2021-12-07 | 효성중공업 주식회사 | 직접 접촉식 방열 장치 |
KR102346767B1 (ko) * | 2020-05-29 | 2022-01-04 | 효성중공업 주식회사 | 직접 접촉식 방열 장치 |
Also Published As
Publication number | Publication date |
---|---|
JP6638565B2 (ja) | 2020-01-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6384609B2 (ja) | パワー半導体モジュール及び冷却器 | |
JP6467640B2 (ja) | 半導体装置 | |
JP6315091B2 (ja) | 冷却器及び冷却器の固定方法 | |
JP2011228638A (ja) | 半導体モジュールを備えた半導体装置 | |
JP2007012722A (ja) | パワー半導体モジュール | |
WO2013088864A1 (ja) | 半導体装置 | |
US8081478B1 (en) | Fluid cooled electronics module cover | |
EP3454367B1 (en) | Semiconductor module | |
JP2016219572A (ja) | 液冷式冷却装置 | |
JP6638565B2 (ja) | 冷却器 | |
JP6662242B2 (ja) | 半導体装置 | |
JP2015023124A (ja) | 積層冷却ユニット | |
JP2014143273A (ja) | 積層冷却ユニット | |
JP4668103B2 (ja) | 冷却器 | |
JP2017216293A (ja) | 液冷式冷却装置 | |
JP6658364B2 (ja) | 半導体装置 | |
JP6724613B2 (ja) | 半導体装置 | |
JP2017220651A (ja) | 半導体装置の製造方法 | |
JP6190914B1 (ja) | 冷媒流路付き電気機器 | |
WO2014198154A1 (zh) | 电子产品壳体及应用其的电子产品 | |
JP6178276B2 (ja) | 冷却器 | |
JP6314726B2 (ja) | 半導体モジュール | |
JP4068887B2 (ja) | 半導体レーザ装置及びその冷却方法 | |
KR102308872B1 (ko) | 반도체 부품 쿨링 시스템, 반도체 부품 쿨링 시스템 제조방법, 및 반도체 부품 쿨링 시스템이 적용된 반도체 패키지 | |
KR102497950B1 (ko) | 반도체 부품 쿨링 시스템, 반도체 부품 쿨링 시스템 제조방법, 및 반도체 부품 쿨링 시스템이 적용된 반도체 패키지 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190315 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20191120 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20191126 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20191209 |
|
R151 | Written notification of patent or utility model registration |
Ref document number: 6638565 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R151 |