WO2014198154A1 - 电子产品壳体及应用其的电子产品 - Google Patents

电子产品壳体及应用其的电子产品 Download PDF

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Publication number
WO2014198154A1
WO2014198154A1 PCT/CN2014/075275 CN2014075275W WO2014198154A1 WO 2014198154 A1 WO2014198154 A1 WO 2014198154A1 CN 2014075275 W CN2014075275 W CN 2014075275W WO 2014198154 A1 WO2014198154 A1 WO 2014198154A1
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WO
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Prior art keywords
chamber
electronic product
heat
circuit board
user card
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Application number
PCT/CN2014/075275
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English (en)
French (fr)
Inventor
况明强
郭俊生
Original Assignee
华为终端有限公司
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Publication date
Application filed by 华为终端有限公司 filed Critical 华为终端有限公司
Publication of WO2014198154A1 publication Critical patent/WO2014198154A1/zh

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04B—TRANSMISSION
    • H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
    • H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
    • H04B1/3816—Mechanical arrangements for accommodating identification devices, e.g. cards or chips; with connectors for programming identification devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20518—Unevenly distributed heat load, e.g. different sectors at different temperatures, localised cooling, hot spots

Definitions

  • the present invention relates to a communication electronic product housing and an electronic product using the same
  • the present invention relates to communication accessory technology, and more particularly to an electronic product housing and an electronic product port using the same. Background technique
  • SIM Subscriber Identity Module
  • the SIM card is a smart card, which is mainly used in communication.
  • the existing SIM card includes a card base and a chip placed on the card base.
  • the card base is usually a polymer plastic material, such as a resin, so the normal working environment temperature of the SIM card is -20 degrees Celsius to 70 degrees Celsius.
  • the internal ambient temperature tends to be higher than the limit temperature of 70 degrees Celsius, which causes the temperature of the SIM card in the electronic product to be higher than 70 degrees Celsius, which may cause deformation and damage of the SIM card.
  • the ambient temperature inside the car is unstable, its temperature is constantly changing between high and low temperatures, and repeated high and low temperatures have a great influence on the deformation of the SIM card. Therefore, for the SIM card of the car Internet, it is very important to dissipate it.
  • the SIM card is often prevented from being deformed by optimizing the card holder.
  • the SIM card semi-wrapped card holder can be changed to a SIM card full-wrapped card holder.
  • this method still cannot guarantee that the working temperature of the SIM card is within a suitable range, and the influence on the shape and performance of the SIM is still large.
  • Embodiments of the present invention provide an electronic product housing and an electronic product using the same to prevent the SIM card from being deformed or damaged by heat.
  • an electronic product housing includes a first chamber for placing a user card and a second chamber for placing a heat generating device, the first chamber and the second chamber There is an insulating partition between the two.
  • the outer surface of the electronic product housing is respectively provided with at least one first through hole and at least one second through hole on opposite surfaces of the first chamber .
  • the insulating spacer is made of an aluminum foil material.
  • the thermal barrier is a thin plate-like structure.
  • the user card is a SIM card.
  • an electronic product comprising the above described electronic product housing and a circuit board disposed inside the electronic product housing; the thermal insulation partition of the electronic product housing The circuit board is partitioned in the first chamber and the second chamber of the electronic product housing; the user card in the first chamber is electrically connected to the circuit board in the first chamber; the second chamber A heat generating device is disposed on the circuit board in the second chamber.
  • a surface of the circuit board between the user card and the heat insulating partition in the first chamber is provided with a groove.
  • a circuit between the user card and the heat insulating partition in the first chamber There is a third wanted on the board.
  • the first chamber and the second chamber are disposed, and the first chamber and the second chamber are separated by an insulating partition. Therefore, the heat generated by the heat generating device disposed in the second chamber passes through the blocking function of the heat insulating spacer, and cannot be transmitted to the first chamber where the user card is located by heat convection, thereby ensuring the first cavity of the user card.
  • the indoor ambient temperature is suitable and stable, which ensures that the temperature of the user card itself is suitable and stable, thereby preventing the user card from being deformed and damaged by heat.
  • FIG. 1 is a schematic structural view of an electronic product housing according to an embodiment of the present invention.
  • FIG. 2 is a schematic structural diagram of an electronic product according to an embodiment of the present invention. detailed description
  • an embodiment of the present invention provides an electronic product housing 10 including a first chamber 11 for placing a user card and a second chamber 12 for placing a heat generating device, the first chamber 11 and An insulating partition 13 is disposed between the second chambers 12.
  • the second chamber is disposed in the second
  • the heat generated by the heat generating device in the chamber is blocked by the heat insulating partition and cannot be transmitted to the first chamber where the user card is located by heat convection. Therefore, the ambient temperature in the first chamber of the user card is ensured and Stable, ensuring that the temperature of the user card itself is suitable and stable, thereby preventing the user card from being deformed and damaged by heat.
  • the components of the first chamber and the second chamber of the housing of the electronic product need not be limited, that is, the second chamber can also be placed with a user card, and the first chamber is placed with a heat generating device.
  • other structural components such as a circuit board, a fixing bracket, and the like are disposed inside the electronic product casing, and the user card and the heat generating device are connected to other structural members.
  • Heat conduction is the transfer of heat through direct contact between high and low temperature objects
  • heat convection is a phenomenon in which heat propagates from one place to another through a flowing medium
  • heat radiation is a phenomenon in which an object radiates electromagnetic waves due to temperature
  • main heat dissipation effect is mainly Related to the surface material and structure of the heat-generating device.
  • heat transfer is mainly performed between the first chamber and the second chamber by means of heat convection.
  • the electronic product housing 10 corresponds to the phase of the first chamber 11 region.
  • At least one first through hole 111 and at least one second through hole 112 may be respectively disposed on the opposite surface.
  • the heat transfer spacer 13 can prevent a large amount of heat generated in the second chamber 12 from being transferred into the first chamber, and at the same time, the first passage hole 111 and the plurality of second through holes 112 can be further reduced. Ambient temperature in the chamber.
  • the first through hole 111 and the second through hole 112 can accelerate the heat dissipation in the first chamber 11 , and the first through hole 111 and the second through hole 112 can match to form a structure for circulating air.
  • the through hole may be disposed on the surface of the electronic product casing 10 corresponding to the first chamber 11 and opposite to the heat insulating partition 13 to further accelerate heat dissipation.
  • air flowing around the electronic product casing flows in from the first through hole 111 or the second through hole 112, and then flows out from the second through hole 112 or the first through hole 111 to complete the flow of air to accelerate User card cooling.
  • first through hole 111 serves as an air outlet
  • second through hole 112 serves as an air inlet
  • the arrow in Fig. 1 is a direction in which air flows.
  • the first through hole 111 or the second through hole 112 may also have both inflow and outflow of air.
  • the material of the heat insulating partition 13 may be an aluminum foil material, and at the same time, may be a thin plate-like structure.
  • the heat insulating separator 13 is a thin plate-like structure mainly considering the overall manufacturing process and processing cost of the electronic product casing.
  • the aluminum foil material has a good thermal energy rebounding effect, and can prevent the heat in the second chamber 12 from being transferred into the first chamber 11.
  • the heat insulating partition 13 can also be other materials having other shapes and capable of insulating.
  • the user card can be a more common SIM card, and of course, other types of cards.
  • An embodiment of the present invention further provides an electronic product, as shown in FIG. 2, including the above-mentioned electronic product housing 10 and a circuit board 21 disposed inside the electronic product housing 10; the thermal insulation partition 13 of the electronic product housing 10. Separating the circuit board 21 in the first chamber 11 and the second chamber 12 of the electronic product housing 10; the user card 22 in the first chamber 11 is electrically connected to the circuit board 21 in the first chamber 11; The heat generating device 23 in the two chambers 12 is fixed to the circuit board 21 in the second chamber 11.
  • the casing is provided with the first chamber and the second chamber, and the first chamber and the second chamber are passed between The heat insulating partitions are spaced apart, so that the heat generated by the heat generating device disposed in the second chamber passes through the blocking function of the heat insulating partition, and cannot be transmitted to the first chamber where the user card is located by heat convection, thereby ensuring User card first
  • the ambient temperature in the chamber is suitable and stable, which ensures that the temperature of the user card itself is suitable and stable, thereby preventing deformation and damage of the user card due to heat.
  • the circuit board 21 is a monolithic structural member that can be disposed in the thermal insulation spacer 13 or in contact with the thermal insulation spacer 13 (in this case, the circuit board 21 and the electronic product housing) The inner wall of the body 10 is fitted together).
  • the user card and the circuit board 21 are connected by a user card holder.
  • the surface of the circuit board 21 located between the user card 22 and the heat insulating partition 13 in the first chamber 11 may be provided with a groove (not shown in FIG. 2). show).
  • the heat generating device 23 is fixed on the circuit board, so that the heat generated by the heat generating device 23 can be transferred to the user card 22 through the circuit board 21, so that the temperature of the user card 22 itself is increased, which adversely affects the user card.
  • the heat transferred by the circuit board 21 is very small relative to the heat generated by the heat generating device 23, so the temperature influence of the heat generating device 23 on the user card 22 is a major problem, that is, the heat convection is the main mode of heat transfer in the embodiment.
  • FIG. 1 the heat convection is the main mode of heat transfer in the embodiment.
  • the circuit board 21 is located at the left and right of the groove. There is a certain gap between the bodies on both sides, so that the transfer of heat in the circuit board 21 can be reduced through the gap, and at the same time, the heat is dissipated at the groove, and of course, it can be located at the user card 22 and the heat insulating partition 13
  • a heat absorbing strip is disposed between the circuit board 21 to absorb heat or other heat dissipating structures or heat sinks.
  • a third through hole 24 may be formed in the circuit board 21 between the user card 22 and the heat insulating partition 13 in the first chamber 11.
  • the opening of the third through hole 24 can also function in the same manner as the above-mentioned groove, and the number of the third through holes 24 is not limited, and can be set as needed.
  • the first through hole 111 and the second through hole 112 constitute an air inlet and an air outlet to allow air to flow
  • the circuit board 21 and the user card 22 are disposed in the first chamber 11, the air flow is blocked. Therefore, by providing the third through hole 24, the path and speed of the air flow can be increased, thereby accelerating the heat dissipation rate of the user card.
  • a through hole may be provided in the electronic product casing 10 adjacent to the user card and opposite to the heat insulating partition 13 to further accelerate heat dissipation.
  • the recess and the third through hole 24 cannot cause damage to other components or circuits on the circuit board 21. Therefore, the arrangement of the recess and the third through hole 24 needs to be determined according to the specific structure of the circuit board 21.
  • a heat dissipation structure similar to the through hole may be provided to accelerate the heat dissipation of the second chamber 12, thereby indirectly reducing the user card. temperature.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Telephone Set Structure (AREA)
  • Purses, Travelling Bags, Baskets, Or Suitcases (AREA)
  • Casings For Electric Apparatus (AREA)

Abstract

本发明实施例提供一种电子产品壳体及应用其的电子产品，涉及通信配件技术，以防止SIM卡受热发生变形、损坏的危险。本发明实施例中，所述电子产品壳体包括用于放置用户卡的第一腔室及用于放置发热器件的第二腔室，所述第一腔室与第二腔室之间设有隔热隔板。本发明主要应用于通信领域中。

Description

电子产品壳体及应用其的电子产品 技术领域 本发明涉及通信电子产品壳体及应用其的电子产品 技术领域
本发明涉及通信配件技术， 尤其涉及一种电子产品壳体及应用其的电子产 口 。 背景技术
对于车机中的电子产品， 例如， 用于车载互联网的无线路由器， 其内部需 要设置 SIM ( Subscriber Identity Module, 客户识别模块）卡来完成联网的操作。 其中， SIM卡为一种智能卡， 主要应用于通信中。
现有的 SIM卡包括卡基及置于卡基上的芯片， 其中卡基通常为高分子塑性 材料， 例如树脂， 因此 SIM卡的正常工作环境温度在 -20摄氏度至 70摄氏度。 而在车机中， 其内部环境温度往往会高于极限温度 70摄氏度， 从而导致其内的 电子产品中的 SIM卡的温度比 70摄氏度还要高， 使 SIM卡发生变形、 损坏的 危险。 另外， 车机内部的环境温度不稳定， 其温度在高、 低温之间不断变化， 反复的高低温对 SIM卡的形变影响也很大。 因此， 对于车载互联网的 SIM卡来 说， 对其进行散热处理显得至关重要。
现有的车机中使用 SIM卡的电子产品中， 往往通过优化 SIM卡的卡座来防 止其变形，具体可以为，将 SIM卡半包裹式的卡座改为 SIM卡全包裹式的卡座。 但是这种方式仍然无法保证 SIM卡的工作环境温度在合适的范围内， 对 SIM的 形状、 性能影响仍然很大。 发明内容
本发明的实施例提供一种电子产品壳体及应用其的电子产品， 以防止 SIM 卡受热发生变形、 损坏的危险。
为达到上述目的， 本发明的实施例釆用如下技术方案： 根据本发明的第一方面， 一种电子产品壳体， 包括用于放置用户卡的第一 腔室及用于放置发热器件的第二腔室， 所述第一腔室与第二腔室之间设有隔热 隔板。
在第一方面的第一种可能的实现方式中， 所述电子产品壳体的外壳上对应 所述第一腔室的相对面上分别设有至少一个第一通孔及至少一个第二通孔。
结合第一方面或第一方面的第一种可能的实现方式， 在第二种可能的实现 方式中， 所述隔热隔板的材质为铝箔材料。
结合第一方面或第一方面的第一种可能的实现方式或第一方面的第二种可 能的实现方式， 在第三种可能的实现方式中， 所述隔热隔板为薄板状结构。
结合第一方面或第一方面的第一种可能的实现方式或第一方面的第二种可 能的实现方式或第一方面的第三种可能的实现方式， 在第四种可能的实现方式 中， 所述用户卡为 SIM卡。
根据本发明的第二方面， 一种电子产品， 包括上述所述的电子产品壳体及 设在所述电子产品壳体内部的电路板； 所述电子产品壳体的隔热隔板将所述电 路板分隔在所述电子产品壳体的第一腔室及第二腔室中； 所述第一腔室内的用 户卡与所述第一腔室内的电路板电连接； 所述第二腔室内的发热器件设置在所 述第二腔室内的所述电路板上。
在第二方面的第一种可能的实现方式中， 所述第一腔室内的位于所述用户 卡及所述隔热隔板之间的电路板的表面设有凹槽。
结合第二方面或第二方面的第一种可能的实现方式， 在第二种可能的实现 方式中， 所述第一腔室内的位于所述用户卡及所述隔热隔板之间的电路板上设 有第三通孑
本发明实施例提供的电子产品壳体及应用其的电子产品中， 由于设有第一 腔室及第二腔室， 且第一腔室与第二腔室之间通过隔热隔板隔开， 从而设在第 二腔室内的发热器件所发出的热量通过隔热隔板的阻隔作用， 无法通过热对流 而传递到用户卡所在的第一腔室中， 因此， 保证了用户卡第一腔室内的环境温 度适宜且稳定， 保证了用户卡本身温度适宜且稳定， 从而防止了用户卡受热而 发生变形、 损坏。 附图说明
为了更清楚地说明本发明实施例中的技术方案， 下面将对实施例描述中所 需要使用的附图作简单地介绍。
图 1为本发明实施例提供的电子产品壳体结构示意图；
图 2为本发明实施例提供的电子产品结构示意图。 具体实施方式
下面将结合本发明实施例中的附图， 对本发明实施例中的技术方案进行清 楚、 完整地描述。
如图 1所示， 本发明实施例提供一种电子产品壳体 10, 包括用于放置用户 卡的第一腔室 11及用于放置发热器件的第二腔室 12 , 第一腔室 11与第二腔室 12之间设有隔热隔板 13。
本发明实施例提供的电子产品壳体中， 由于设有第一腔室及第二腔室， 且 第一腔室与第二腔室之间通过隔热隔板隔开， 从而设在第二腔室内的发热器件 所发出的热量通过隔热隔板的阻隔作用， 无法通过热对流而传递到用户卡所在 的第一腔室中， 因此， 保证了用户卡第一腔室内的环境温度适宜且稳定， 保证 了用户卡本身温度适宜且稳定， 从而防止了用户卡受热而发生变形、 损坏。
此处需要说明的是， 上述电子产品的壳体的第一腔室及第二腔室所放置的 元器件无需进行限定， 即第二腔室也可以放置用户卡， 第一腔室放置发热器件。 另外， 上述电子产品壳体内部还设有其它结构件， 例如电路板、 固定支架等， 且用户卡及发热器件与其它结构件相连接。
其中， 对于热量的传递主要有三种方式， 即热传导、 热对流及热辐射。 热 传导是通过高、 低温物体的直接接触来传递热量； 热对流为热量通过流动的介 质， 从一处传播到另一处的现象； 热辐射为物体由于具有温度而辐射电磁波的 现象（散热效果主要与发热器件的表面材质、 结构有关） 。 在实际的热量传递 中， 通常上述三种方式同时存在， 共同发挥作用， 而对于本实施例来说， 第一 腔室与第二腔室之间主要通过热对流的方式进行热量的传递。
在具体实施时， 如图 1所示， 电子产品壳体 10对应第一腔室 11 区域的相 对面上可以分别设有至少一个第一通孔 111及至少一个第二通孔 112。通过隔热 隔板 13能够防止第二腔室 12 内产生的大量热量传递到第一腔室中， 同时， 通 过设置多个第一通孔 111及多个第二通孔 112能够进一步降低第一腔室中的环境 温度。其中，第一通孔 111及第二通孔 112能够加快第一腔室 11内热量的散发， 同时第一通孔 111及第二通孔 112能够匹配形成使空气流通的结构。其中， 电子 产品壳体 10对应第一腔室 11区域的、 且与隔热隔板 13相对的表面上也可以设 置通孔， 来进一步地加快热量的散发。
本实施例中，通过电子产品壳体周围的空气从第一通孔 111或第二通孔 112 流入，再从第二通孔 112或第一通孔 111中流出从而完成空气的流动， 以加快用 户卡的降温。 图 1中所示的一种情况为第一通孔 111作为出风口， 第二通孔 112 作为进风口， 图 1 中的箭头则为空气流动的方向。 其中， 第一通孔 111或第二 通孔 112也可能同时存在空气的流入与流出。
上述实施例描述的电子产品壳体中， 隔热隔板 13的材质可以为铝箔材料， 且同时可以为薄板状结构。 其中， 隔热隔板 13为薄板状结构主要考虑电子产品 外壳的整体制造流程及加工成本。 且， 铝箔材料具有良好的热能反弹作用， 能 够艮好的防止第二腔室 12中的热量传递到第一腔室 11中。 当然隔热隔板 13也 可以为其它形状结构且能够起到隔热作用的其它材质。
在实际应用中， 用户卡可以为较常用的 SIM卡， 当然， 也可以为其它类型 的卡。
本发明实施例还提供一种电子产品， 如图 2 所示， 包括上述的电子产品壳 体 10及设在电子产品壳体 10 内部的电路板 21 ; 电子产品壳体 10的隔热隔板 13将电路板 21分隔在电子产品壳体 10的第一腔室 11及第二腔室 12中； 第一 腔室 11内的用户卡 22与第一腔室 11内的电路板 21电连接； 第二腔室 12内的 发热器件 23固定在第二腔室 11内的电路板 21上。
本发明实施例提供的电子产品中， 由于使用了上述的电子产品壳体， 且该 壳体由于设有第一腔室及第二腔室， 且第一腔室与第二腔室之间通过隔热隔板 隔开， 从而设在第二腔室内的发热器件所发出的热量通过隔热隔板的阻隔作用， 无法通过热对流而传递到用户卡所在的第一腔室中， 因此， 保证了用户卡第一 腔室内的环境温度适宜且稳定， 保证了用户卡本身温度适宜且稳定， 从而防止 了用户卡受热而发生变形、 损坏。
此处需要说明， 电路板 21为一整体结构件， 其可以穿设在隔热隔条 13中， 也可以与隔热隔条 13之间无缝隙接触（此时， 电路板 21与电子产品壳体 10内 壁相贴合） 。 另， 用户卡与电路板 21通过用户卡卡座相连接。
上述实施例描述的电子产品中， 如图 2所示， 第一腔室 11内的位于用户卡 22及隔热隔板 13之间的电路板 21的表面可以设有凹槽（图 2中未示出）。发热 器件 23固定在电路板上， 使发热器件 23发出的热量能够通过电路板 21传递到 用户卡 22中， 使用户卡 22本身的温度增加， 对用户卡造成不良影响。 其中， 电路板 21传递的热量相对于发热器件 23产生的热量非常微小， 因此发热器件 23对用户卡 22的温度影响为主要问题，即热对流为本实施例中热量传递的主要 方式。 图 2中， 通过在位于用户卡 22与隔热隔板 13之间的电路板 21上设置凹 槽（该凹槽不破坏电路板 21的功能）， 使电路板 21的位于凹槽左、 右两侧的本 体之间具有一定空隙， 从而通过该空隙能够减少热量在电路板 21中的传递， 同 时加快热量在凹槽处的散发， 当然， 也可以在位于用户卡 22与隔热隔板 13之 间的电路板 21上设置吸热条来吸收热量或其它散热结构或散热装置。
上述实施例描述的电子产品中， 如图 2所示， 第一腔室 11内的位于用户卡 22及隔热隔板 13之间的电路板 21上可以设有第三通孔 24。
其中， 第三通孔 24的开设同样能够起到与上述凹槽的相同作用， 且第三通 孔 24的个数不限定， 可根据需要而设定。 当第一通孔 111与第二通孔 112构成 进风口及出风口来使空气流动时， 由于第一腔室 11 内设有电路板 21及用户卡 22, 其对空气的流动会产生阻挡作用， 因此， 通过设置第三通孔 24能够增加空 气流动的路径及速度， 从而加快用户卡的散热速率。 图 2 中， 也可以在临近用 户卡、 且与隔热隔板 13相对面的电子产品壳体 10上设置通孔， 以进一步加快 热量的散发。
在实际应用中， 凹槽和第三通孔 24不能对电路板 21上的其它部件或电路 造成破坏， 因此， 凹槽和第三通孔 24的设置需要根据电路板 21 的具体结构而 定。 另外， 在对应放置发热器件 23的第二腔室 12的电子产品壳体 10上， 也可 以设置类似通孔的散热结构， 来加快第二腔室 12的散热， 从而能够间接地降低 用户卡的温度。
以上所述， 仅为本发明的具体实施方式， 但本发明的保护范围并不局限 于此， 任何熟悉本技术领域的技术人员在本发明揭露的技术范围内， 可轻易 想到的变化或替换， 都应涵盖在本发明的保护范围之内。 因此， 本发明的保 护范围应以所述权利要求的保护范围为准。

Claims

权 利 要 求 书
1、 一种电子产品壳体， 其特征在于， 包括用于放置用户卡的第一腔室及 用于放置发热器件的第二腔室，所述第一腔室与第二腔室之间设有隔热隔板。
2、 根据权利要求 1所述的电子产品壳体， 其特征在于， 所述电子产品壳 体对应所述第一腔室区域的相对面上分别设有至少一个第一通孔及至少一个 第二通孔。
3、 根据权利要求 1或 2所述的电子产品壳体， 其特征在于， 所述隔热隔 板的材质为铝箔材料。
4、 根据权利要求 1-3任一项所述的电子产品壳体， 其特征在于， 所述隔 热隔板为薄板状结构。
5、 根据权利要求 1-4任一项所述的电子产品壳体， 其特征在于， 所述用 户卡为 SIM卡。
6、 一种电子产品， 其特征在于， 包括权利要求 1-5任一项所述的电子产 品壳体及设在所述电子产品壳体内部的电路板； 所述电子产品壳体的隔热隔 板将所述电路板分隔在所述电子产品壳体的第一腔室及第二腔室中；
所述第一腔室内的用户卡与所述第一腔室内的电路板电连接； 所述第二 腔室内的发热器件设置在所述第二腔室内的所述电路板上。
7、 根据权利要求 6所述的电子产品， 其特征在于， 所述第一腔室内的位 于所述用户卡及所述隔热隔板之间的电路板的表面设有凹槽。
8、 根据权利要求 6或 7所述的电子产品， 其特征在于， 所述第一腔室内 的位于所述用户卡及所述隔热隔板之间的电路板上设有第三通孔。
PCT/CN2014/075275 2013-06-14 2014-04-14 电子产品壳体及应用其的电子产品 WO2014198154A1 (zh)

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