JP6638565B2 - 冷却器 - Google Patents
冷却器 Download PDFInfo
- Publication number
- JP6638565B2 JP6638565B2 JP2016117137A JP2016117137A JP6638565B2 JP 6638565 B2 JP6638565 B2 JP 6638565B2 JP 2016117137 A JP2016117137 A JP 2016117137A JP 2016117137 A JP2016117137 A JP 2016117137A JP 6638565 B2 JP6638565 B2 JP 6638565B2
- Authority
- JP
- Japan
- Prior art keywords
- refrigerant
- plate
- cooling
- coolant
- plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/33—Structure, shape, material or disposition of the layer connectors after the connecting process of a plurality of layer connectors
- H01L2224/331—Disposition
- H01L2224/3318—Disposition being disposed on at least two different sides of the body, e.g. dual array
- H01L2224/33181—On opposite sides of the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
3a、3b、3c:パワー端子
4:制御端子
5:前端カバー
6:後端カバー
7:冷媒供給口
8:冷媒排出口
10、10a、10b:樹脂筐体
12:外枠
12a:周壁
12b:上端面
12c、12d:貫通孔
13:パッケージ
14:フィン
15:冷却プレート
16:絶縁板
17:放熱板
18:ガスケット
21a、21b:トランジスタチップ
22:銅ブロック
30、30a、30b:仕切板
31:溝
32:ノズル
33:止め板
39:冷媒流路
39a:冷媒供給流路
39b:冷媒排出流路
Claims (1)
- 冷媒流路の対向する一対の側板の夫々の外側に冷却対象を取り付けることが可能な冷却器であり、
前記一対の側板の間に当該側板と平行に、互いに対向する2枚の仕切板が配置されており、
夫々の前記仕切板は、相対する仕切板を向く面に互いに対向する溝を備えているとともに、前記溝の中に、対向する前記側板に向かって突出するノズルを備えており、
2枚の前記仕切板は互いに接しているとともに、2枚の前記仕切板の前記溝が対向して冷媒供給流路を形成している、ことを特徴とする冷却器。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016117137A JP6638565B2 (ja) | 2016-06-13 | 2016-06-13 | 冷却器 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016117137A JP6638565B2 (ja) | 2016-06-13 | 2016-06-13 | 冷却器 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017224651A JP2017224651A (ja) | 2017-12-21 |
JP6638565B2 true JP6638565B2 (ja) | 2020-01-29 |
Family
ID=60686052
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016117137A Active JP6638565B2 (ja) | 2016-06-13 | 2016-06-13 | 冷却器 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6638565B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102346767B1 (ko) * | 2020-05-29 | 2022-01-04 | 효성중공업 주식회사 | 직접 접촉식 방열 장치 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5553394A (en) * | 1995-05-11 | 1996-09-10 | Reliance/Comm Tech Corporation | Radial jet reattachment nozzle heat sink module for cooling electronics |
JP4699253B2 (ja) * | 2006-03-23 | 2011-06-08 | トヨタ自動車株式会社 | 冷却器 |
JP2008198751A (ja) * | 2007-02-12 | 2008-08-28 | Denso Corp | 冷却器及びこれを用いた電力変換装置 |
CN101252819A (zh) * | 2007-02-22 | 2008-08-27 | 徐达威 | 一种用于散热的合成板和形成方法 |
JP2009239043A (ja) * | 2008-03-27 | 2009-10-15 | Furukawa Electric Co Ltd:The | 微細流路を備えた冷却装置、その製造方法 |
CN201700119U (zh) * | 2010-05-25 | 2011-01-05 | 青钢金属建材股份有限公司 | 散热用微孔板材 |
JP2013215080A (ja) * | 2012-03-09 | 2013-10-17 | Sumitomo Heavy Ind Ltd | 電力変換装置及び作業機械 |
JP2014143273A (ja) * | 2013-01-23 | 2014-08-07 | Toyota Motor Corp | 積層冷却ユニット |
JP2015023124A (ja) * | 2013-07-18 | 2015-02-02 | トヨタ自動車株式会社 | 積層冷却ユニット |
JP6075299B2 (ja) * | 2014-01-14 | 2017-02-08 | トヨタ自動車株式会社 | 冷却器とその製造方法 |
JP2015149361A (ja) * | 2014-02-05 | 2015-08-20 | 株式会社日本自動車部品総合研究所 | 冷却器 |
CN105636411B (zh) * | 2015-12-30 | 2018-02-16 | 中国电子科技集团公司第二十六研究所 | 液冷用金属流道制作方法及液冷金属流道冷板 |
-
2016
- 2016-06-13 JP JP2016117137A patent/JP6638565B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2017224651A (ja) | 2017-12-21 |
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