JP2017201686A5 - - Google Patents

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Publication number
JP2017201686A5
JP2017201686A5 JP2017080052A JP2017080052A JP2017201686A5 JP 2017201686 A5 JP2017201686 A5 JP 2017201686A5 JP 2017080052 A JP2017080052 A JP 2017080052A JP 2017080052 A JP2017080052 A JP 2017080052A JP 2017201686 A5 JP2017201686 A5 JP 2017201686A5
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JP
Japan
Prior art keywords
layer
conductor
metal
surface conductor
active metal
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JP2017080052A
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English (en)
Japanese (ja)
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JP2017201686A (ja
JP6936040B2 (ja
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Publication of JP2017201686A5 publication Critical patent/JP2017201686A5/ja
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Publication of JP6936040B2 publication Critical patent/JP6936040B2/ja
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JP2017080052A 2016-04-28 2017-04-13 メタライズ基板及びその製造方法 Active JP6936040B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2016090820 2016-04-28
JP2016090820 2016-04-28

Publications (3)

Publication Number Publication Date
JP2017201686A JP2017201686A (ja) 2017-11-09
JP2017201686A5 true JP2017201686A5 (enrdf_load_stackoverflow) 2019-12-26
JP6936040B2 JP6936040B2 (ja) 2021-09-15

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Family Applications (1)

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JP2017080052A Active JP6936040B2 (ja) 2016-04-28 2017-04-13 メタライズ基板及びその製造方法

Country Status (1)

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JP (1) JP6936040B2 (enrdf_load_stackoverflow)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110649153B (zh) * 2019-09-26 2022-09-30 中电科技集团重庆声光电有限公司 一种多层金属薄膜键合层结构及其制备方法
JP7700435B2 (ja) * 2020-10-09 2025-07-01 株式会社レゾナック 実装基板
CN113582732B (zh) * 2021-08-10 2022-11-18 浮梁县景龙特种陶瓷有限公司 一种提高金属化与陶瓷结合力的膏剂配方

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3029702B2 (ja) * 1990-09-28 2000-04-04 株式会社東芝 ＡｌＮ基板
JPH0794631A (ja) * 1993-09-27 1995-04-07 Toshiba Corp セラミック回路基板
JPH10107392A (ja) * 1996-09-26 1998-04-24 Ibiden Co Ltd セラミック配線基板
JP2001160665A (ja) * 1999-11-30 2001-06-12 Kyocera Corp 配線基板
JP2007150050A (ja) * 2005-11-29 2007-06-14 Tokuyama Corp プリント配線板の製造方法
JP2007234660A (ja) * 2006-02-27 2007-09-13 Kyocera Corp 配線基板および配線基板の製造方法
EP2744310A4 (en) * 2011-08-11 2015-06-17 Furukawa Electric Co Ltd WIRING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME AND SEMICONDUCTOR DEVICE
EP2942808A4 (en) * 2013-01-07 2016-11-16 Almt Corp CERAMIC WIRING SUBSTRATE, SEMICONDUCTOR ELEMENT AND METHOD FOR PRODUCING THE CERAMIC WIRING SUBSTRATE
JP6096094B2 (ja) * 2013-10-28 2017-03-15 日本発條株式会社 積層体、絶縁性冷却板、パワーモジュールおよび積層体の製造方法

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