JP2017193691A5 - - Google Patents
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- Publication number
- JP2017193691A5 JP2017193691A5 JP2016086586A JP2016086586A JP2017193691A5 JP 2017193691 A5 JP2017193691 A5 JP 2017193691A5 JP 2016086586 A JP2016086586 A JP 2016086586A JP 2016086586 A JP2016086586 A JP 2016086586A JP 2017193691 A5 JP2017193691 A5 JP 2017193691A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- thermosetting resin
- resin film
- multilayer
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 17
- 229920005989 resin Polymers 0.000 claims 16
- 239000011347 resin Substances 0.000 claims 16
- 229920001187 thermosetting polymer Polymers 0.000 claims 16
- 239000010410 layer Substances 0.000 claims 15
- 238000001723 curing Methods 0.000 claims 11
- 238000000034 method Methods 0.000 claims 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 6
- 239000003795 chemical substances by application Substances 0.000 claims 6
- 239000003822 epoxy resin Substances 0.000 claims 6
- 239000011229 interlayer Substances 0.000 claims 6
- 229920000647 polyepoxide Polymers 0.000 claims 6
- 239000011256 inorganic filler Substances 0.000 claims 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims 5
- 238000004519 manufacturing process Methods 0.000 claims 5
- 238000009413 insulation Methods 0.000 claims 3
- 229920003986 novolac Polymers 0.000 claims 3
- -1 polysiloxane skeleton Polymers 0.000 claims 3
- 239000000377 silicon dioxide Substances 0.000 claims 3
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 claims 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims 2
- 239000004020 conductor Substances 0.000 claims 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims 2
- 239000007787 solid Substances 0.000 claims 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 claims 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims 1
- 239000000654 additive Substances 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 235000010290 biphenyl Nutrition 0.000 claims 1
- 239000004305 biphenyl Substances 0.000 claims 1
- 239000007822 coupling agent Substances 0.000 claims 1
- 229930003836 cresol Natural products 0.000 claims 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims 1
- 238000005553 drilling Methods 0.000 claims 1
- 150000002148 esters Chemical class 0.000 claims 1
- 238000013007 heat curing Methods 0.000 claims 1
- 150000002460 imidazoles Chemical class 0.000 claims 1
- 238000010030 laminating Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 150000002903 organophosphorus compounds Chemical class 0.000 claims 1
- 239000007800 oxidant agent Substances 0.000 claims 1
- 239000013034 phenoxy resin Substances 0.000 claims 1
- 229920006287 phenoxy resin Polymers 0.000 claims 1
- 238000007747 plating Methods 0.000 claims 1
- 238000007788 roughening Methods 0.000 claims 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016086586A JP6897008B2 (ja) | 2016-04-22 | 2016-04-22 | 層間絶縁層用熱硬化性樹脂組成物、層間絶縁層用樹脂フィルム、多層樹脂フィルム、多層プリント配線板及びその製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016086586A JP6897008B2 (ja) | 2016-04-22 | 2016-04-22 | 層間絶縁層用熱硬化性樹脂組成物、層間絶縁層用樹脂フィルム、多層樹脂フィルム、多層プリント配線板及びその製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017193691A JP2017193691A (ja) | 2017-10-26 |
| JP2017193691A5 true JP2017193691A5 (enrdf_load_stackoverflow) | 2019-04-18 |
| JP6897008B2 JP6897008B2 (ja) | 2021-06-30 |
Family
ID=60155858
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016086586A Active JP6897008B2 (ja) | 2016-04-22 | 2016-04-22 | 層間絶縁層用熱硬化性樹脂組成物、層間絶縁層用樹脂フィルム、多層樹脂フィルム、多層プリント配線板及びその製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6897008B2 (enrdf_load_stackoverflow) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6765215B2 (ja) * | 2016-04-27 | 2020-10-07 | デンカ株式会社 | 回路基板用樹脂組成物とそれを用いた金属ベース回路基板 |
| WO2019155800A1 (ja) * | 2018-02-08 | 2019-08-15 | 関西ペイント株式会社 | レジスト組成物及びレジスト膜 |
| JP2019157027A (ja) * | 2018-03-15 | 2019-09-19 | 日立化成株式会社 | 熱硬化性樹脂組成物、層間絶縁用樹脂フィルム、複合フィルム、プリント配線板及びその製造方法 |
| JP2020050797A (ja) * | 2018-09-27 | 2020-04-02 | パナソニックＩｐマネジメント株式会社 | 樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及びプリント配線板 |
| JP7020378B2 (ja) * | 2018-11-20 | 2022-02-16 | 味の素株式会社 | 樹脂組成物 |
| WO2021025125A1 (ja) * | 2019-08-08 | 2021-02-11 | 住友ベークライト株式会社 | 熱硬化性樹脂組成物 |
| JP7452028B2 (ja) * | 2020-01-23 | 2024-03-19 | 株式会社レゾナック | 封止用樹脂組成物、電子部品装置、及び電子部品装置の製造方法 |
| KR102716421B1 (ko) * | 2022-06-07 | 2024-10-11 | 한화이센셜 주식회사 | 절연 필름용 접착제 조성물, 절연 필름 시트 및 회로 배선판의 제조 방법 |
| KR20240066073A (ko) * | 2022-11-07 | 2024-05-14 | 주식회사 엘지화학 | 수지 조성물 및 이를 포함하는 인쇄회로기판 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3714377B2 (ja) * | 1997-05-23 | 2005-11-09 | 信越化学工業株式会社 | 難燃性エポキシ樹脂組成物 |
| JP2006282824A (ja) * | 2005-03-31 | 2006-10-19 | Somar Corp | 電子部品保護用エポキシ樹脂組成物及びこれを用いた半導体装置 |
| JP5090635B2 (ja) * | 2005-09-20 | 2012-12-05 | 住友ベークライト株式会社 | 樹脂組成物、基材付き絶縁シート、及び、多層プリント配線板 |
| JP2010090237A (ja) * | 2008-10-07 | 2010-04-22 | Ajinomoto Co Inc | エポキシ樹脂組成物 |
| JP2012107149A (ja) * | 2010-11-19 | 2012-06-07 | Sumitomo Bakelite Co Ltd | 液状封止樹脂組成物および半導体装置 |
| JP2013040298A (ja) * | 2011-08-18 | 2013-02-28 | Sekisui Chem Co Ltd | エポキシ樹脂材料及び多層基板 |
| SG11201505058PA (en) * | 2013-01-15 | 2015-08-28 | Mitsubishi Gas Chemical Co | Resin composition, prepreg, laminate, metal foil-clad laminate, and printed-wiring board |
-
2016
- 2016-04-22 JP JP2016086586A patent/JP6897008B2/ja active Active
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