JP2017183700A5 - - Google Patents
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- Publication number
- JP2017183700A5 JP2017183700A5 JP2016241887A JP2016241887A JP2017183700A5 JP 2017183700 A5 JP2017183700 A5 JP 2017183700A5 JP 2016241887 A JP2016241887 A JP 2016241887A JP 2016241887 A JP2016241887 A JP 2016241887A JP 2017183700 A5 JP2017183700 A5 JP 2017183700A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- plasma processing
- processing apparatus
- dielectric film
- plasma
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 210000002381 Plasma Anatomy 0.000 claims 18
- 238000003672 processing method Methods 0.000 claims 12
- 230000002093 peripheral Effects 0.000 claims 8
- 239000012528 membrane Substances 0.000 claims 1
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020170037372A KR101995812B1 (ko) | 2016-03-28 | 2017-03-24 | 플라스마 처리 장치 및 플라스마 처리 방법 |
US15/469,684 US20170278730A1 (en) | 2016-03-28 | 2017-03-27 | Plasma processing apparatus and plasma processing method |
TW106110164A TWI666679B (zh) | 2016-03-28 | 2017-03-27 | 電漿處理裝置及電漿處理方法 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016062978 | 2016-03-28 | ||
JP2016062978 | 2016-03-28 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017183700A JP2017183700A (ja) | 2017-10-05 |
JP2017183700A5 true JP2017183700A5 (fr) | 2020-01-30 |
JP6877133B2 JP6877133B2 (ja) | 2021-05-26 |
Family
ID=60006448
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016241887A Active JP6877133B2 (ja) | 2016-03-28 | 2016-12-14 | プラズマ処理装置およびプラズマ処理方法 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6877133B2 (fr) |
KR (1) | KR101995812B1 (fr) |
TW (1) | TWI666679B (fr) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7073098B2 (ja) * | 2017-12-27 | 2022-05-23 | 株式会社日立ハイテク | ウエハ処理方法およびウエハ処理装置 |
JP7083080B2 (ja) * | 2018-01-11 | 2022-06-10 | 株式会社日立ハイテク | プラズマ処理装置 |
JP7018801B2 (ja) * | 2018-03-29 | 2022-02-14 | 東京エレクトロン株式会社 | プラズマ処理装置、及び被処理体の搬送方法 |
JP7214021B2 (ja) * | 2018-03-29 | 2023-01-27 | 東京エレクトロン株式会社 | プラズマ処理装置、及び被処理体の搬送方法 |
JP7170449B2 (ja) * | 2018-07-30 | 2022-11-14 | 東京エレクトロン株式会社 | 載置台機構、処理装置及び載置台機構の動作方法 |
JP7236845B2 (ja) * | 2018-11-15 | 2023-03-10 | 株式会社Kelk | 温調装置 |
KR102211817B1 (ko) * | 2018-12-14 | 2021-02-05 | 세메스 주식회사 | 기판 처리 장치 및 기판 처리 방법 |
CN111383885B (zh) * | 2018-12-27 | 2023-03-31 | 中微半导体设备(上海)股份有限公司 | 一种能提高控温精度的基片安装台及等离子体处理设备 |
KR102370471B1 (ko) * | 2019-02-08 | 2022-03-03 | 주식회사 히타치하이테크 | 플라스마 처리 장치 |
TWI701751B (zh) * | 2019-03-12 | 2020-08-11 | 力晶積成電子製造股份有限公司 | 晶圓夾盤裝置、晶圓形變量的量測方法及半導體製造方法 |
CN112951739A (zh) * | 2019-12-10 | 2021-06-11 | 圆益Ips股份有限公司 | 基板支撑架及基板处理装置 |
US20230141653A1 (en) * | 2021-06-14 | 2023-05-11 | Lam Research Corporation | Frontside and backside pressure monitoring for substrate movement prevention |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08264626A (ja) | 1994-04-28 | 1996-10-11 | Hitachi Ltd | 試料保持方法及び試料表面の流体処理方法並びにそれらの装置 |
JPH09143674A (ja) * | 1995-11-24 | 1997-06-03 | Tokyo Electron Ltd | 成膜装置及びその使用方法 |
GB0108002D0 (en) * | 2001-03-30 | 2001-05-23 | Trikon Holdings Ltd | A method of etching a substrate |
JP4815298B2 (ja) * | 2006-07-31 | 2011-11-16 | 株式会社日立ハイテクノロジーズ | プラズマ処理方法 |
US8057602B2 (en) * | 2007-05-09 | 2011-11-15 | Applied Materials, Inc. | Apparatus and method for supporting, positioning and rotating a substrate in a processing chamber |
JP4929150B2 (ja) * | 2007-12-27 | 2012-05-09 | 新光電気工業株式会社 | 静電チャック及び基板温調固定装置 |
JP5745812B2 (ja) * | 2010-10-27 | 2015-07-08 | 東京エレクトロン株式会社 | プラズマ処理装置 |
US8941969B2 (en) * | 2012-12-21 | 2015-01-27 | Applied Materials, Inc. | Single-body electrostatic chuck |
JP6159172B2 (ja) * | 2013-06-26 | 2017-07-05 | 東京エレクトロン株式会社 | 温度制御方法及びプラズマ処理装置 |
CN104377155B (zh) * | 2013-08-14 | 2017-06-06 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 静电卡盘以及等离子体加工设备 |
GB201402126D0 (en) * | 2014-02-07 | 2014-03-26 | Spts Technologies Ltd | Method of processing a substrate |
KR20160015510A (ko) * | 2014-07-30 | 2016-02-15 | 삼성전자주식회사 | 정전척 어셈블리, 이를 구비하는 반도체 제조장치, 및 이를 이용한 플라즈마 처리방법 |
-
2016
- 2016-12-14 JP JP2016241887A patent/JP6877133B2/ja active Active
-
2017
- 2017-03-24 KR KR1020170037372A patent/KR101995812B1/ko active IP Right Grant
- 2017-03-27 TW TW106110164A patent/TWI666679B/zh active
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