JP2017179186A - 樹脂組成物、および半導体装置 - Google Patents
樹脂組成物、および半導体装置 Download PDFInfo
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- JP2017179186A JP2017179186A JP2016070332A JP2016070332A JP2017179186A JP 2017179186 A JP2017179186 A JP 2017179186A JP 2016070332 A JP2016070332 A JP 2016070332A JP 2016070332 A JP2016070332 A JP 2016070332A JP 2017179186 A JP2017179186 A JP 2017179186A
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- C08F279/00—Macromolecular compounds obtained by polymerising monomers on to polymers of monomers having two or more carbon-to-carbon double bonds as defined in group C08F36/00
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- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
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- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- C08L51/04—Compositions of graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers grafted on to rubbers
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- C08F236/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds
- C08F236/02—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds
- C08F236/04—Copolymers of compounds having one or more unsaturated aliphatic radicals, at least one having two or more carbon-to-carbon double bonds the radical having only two carbon-to-carbon double bonds conjugated
- C08F236/06—Butadiene
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Abstract
Description
〔1〕(A)化学式(1):
(B)脂肪族環状構造を有し、化学式(1)の構造を有さないアクリレート化合物またはメタクリレート化合物、
(C)酸無水物変性ポリブタジエン化合物、
(D)シリカ粒子、および
(E)重合開始剤
を含むことを特徴とする、樹脂組成物。
〔2〕(A)成分が、一般式(2):
少なくとも1種を含む、上記〔1〕記載の樹脂組成物。
〔3〕(D)成分が、樹脂組成物100質量部に対して、20〜65質量部である、上記〔1〕または〔2〕の樹脂組成物。
〔4〕(B)成分が、一般式(4):
〔5〕(A)成分が、一般式(2)で表される化合物および一般式(3)で表される化合物を含む、上記〔2〕〜〔4〕のいずれか記載の樹脂組成物。
〔6〕(E)成分が、ラジカル重合開始剤である、上記〔1〕〜〔5〕のいずれか記載の樹脂組成物。
〔7〕室温で液状である、上記〔1〕〜〔6〕のいずれか記載の樹脂組成物。
〔8〕上記〔1〕〜〔7〕のいずれか記載の樹脂組成物を含む、先供給型液状封止剤。
〔9〕上記〔1〕〜〔7〕のいずれか記載の樹脂組成物の硬化物。
〔10〕上記〔1〕〜〔7〕のいずれか記載の樹脂組成物の硬化物を有する、半導体装置。
本発明の樹脂組成物(以下、樹脂組成物という)は、(A)化学式(1):
(B)脂肪族環状構造を有し、化学式(1)の構造を有さないアクリレート化合物またはメタクリレート化合物、
(C)酸無水物変性ポリブタジエン化合物、
(D)シリカ粒子、および
(E)重合開始剤
を含むことを特徴とする。
・エポキシ樹脂(液状、固形のいずれの使用可)、エポキシ樹脂硬化剤、エポキシ樹脂硬化促進剤。
・レオロジー調整剤(塗布適性、流動適性調整に使用可)。
・分散剤、沈降防止剤(充填剤、着色剤の分散性向上、沈降防止のために使用可)。
・消泡剤(消泡性調整に使用可)。
・着色剤(着色に使用可)。
・表面調整剤(表面状態、濡れ性調整に使用可)。
・エラストマー類(弾性率、応力調整のために使用可)。
・固形樹脂(粘度、靭性等の調整のため組成物として液状を保てる範囲内で使用可)。
・フラックス剤。
・重合抑制、禁止剤。
本発明の半導体装置は、上述の樹脂組成物の硬化物を有する。半導体装置としては、バンプを有する半導体チップと、配線を有する基板とを含むものであればよく、フリップチップのNCP実装されたものが、挙げられる。この場合、半導体チップのバンプ、基板の配線の接続部のいずれにも、突起電極が形成されており、バンプ先端および/または基板の配線に、はんだ層が形成されていてもよい。
Claims (10)
- (A)化学式(1):
(B)脂肪族環状構造を有し、化学式(1)の構造を有さないアクリレート化合物またはメタクリレート化合物、
(C)酸無水物変性ポリブタジエン化合物、
(D)シリカ粒子、および
(E)重合開始剤
を含むことを特徴とする、樹脂組成物。 - (A)成分が、一般式(2):
- (D)成分が、樹脂組成物100質量部に対して、20〜65質量部である、請求項1または2の樹脂組成物。
- (B)成分が、一般式(4):
- (A)成分が、一般式(2)で表される化合物および一般式(3)で表される化合物を含む、請求項2〜4のいずれか1項記載の樹脂組成物。
- (E)成分が、ラジカル重合開始剤である、請求項1〜5のいずれか1項記載の樹脂組成物。
- 室温で液状である、請求項1〜6のいずれか1項記載の樹脂組成物。
- 請求項1〜7のいずれか1項記載の樹脂組成物を含む、先供給型液状封止剤。
- 請求項1〜7のいずれか1項記載の樹脂組成物の硬化物。
- 請求項1〜7のいずれか1項記載の樹脂組成物の硬化物を有する、半導体装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016070332A JP6799934B2 (ja) | 2016-03-31 | 2016-03-31 | 樹脂組成物、および半導体装置 |
KR1020187027816A KR102269234B1 (ko) | 2016-03-31 | 2017-03-30 | 수지 조성물 및 반도체 장치 |
US16/086,982 US10738187B2 (en) | 2016-03-31 | 2017-03-30 | Resin composition and semiconductor device |
PCT/JP2017/013275 WO2017170873A1 (ja) | 2016-03-31 | 2017-03-30 | 樹脂組成物、および半導体装置 |
TW106111077A TW201806977A (zh) | 2016-03-31 | 2017-03-31 | 樹脂組成物及半導體裝置 |
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JP2016070332A JP6799934B2 (ja) | 2016-03-31 | 2016-03-31 | 樹脂組成物、および半導体装置 |
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JP2017179186A true JP2017179186A (ja) | 2017-10-05 |
JP6799934B2 JP6799934B2 (ja) | 2020-12-16 |
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JP2016070332A Active JP6799934B2 (ja) | 2016-03-31 | 2016-03-31 | 樹脂組成物、および半導体装置 |
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US (1) | US10738187B2 (ja) |
JP (1) | JP6799934B2 (ja) |
KR (1) | KR102269234B1 (ja) |
TW (1) | TW201806977A (ja) |
WO (1) | WO2017170873A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018163900A1 (ja) * | 2017-03-07 | 2018-09-13 | パナソニックIpマネジメント株式会社 | アンダーフィル用熱硬化性組成物及び半導体装置 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004168933A (ja) * | 2002-11-21 | 2004-06-17 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置。 |
JP2014033197A (ja) * | 2012-07-13 | 2014-02-20 | Panasonic Corp | 半導体装置の製造方法とそれに使用される半導体封止用アクリル樹脂組成物 |
JP2015002204A (ja) * | 2013-06-13 | 2015-01-05 | パナソニック株式会社 | 半導体装置の製造方法とそれに使用される半導体封止用アクリル樹脂組成物 |
JP2015019012A (ja) * | 2013-07-12 | 2015-01-29 | パナソニック株式会社 | 半導体装置の製造方法とそれに使用される半導体封止用アクリル樹脂組成物 |
JP2015017169A (ja) * | 2013-07-10 | 2015-01-29 | ナミックス株式会社 | 先供給型半導体封止剤および半導体装置 |
JP2015078303A (ja) * | 2013-10-17 | 2015-04-23 | ナミックス株式会社 | 樹脂組成物、先供給型半導体封止剤および半導体装置 |
Family Cites Families (4)
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EP2219188A4 (en) | 2007-11-16 | 2011-04-06 | Dainippon Ink & Chemicals | ULTRAVIOLETT CURABLE COMPOSITION FOR OPTICAL DATA CARRIER AND OPTICAL DATA CARRIER |
KR20130142882A (ko) * | 2010-06-01 | 2013-12-30 | 리켄 테크노스 가부시키가이샤 | 도료 및 접착제 조성물, 접착 방법 및 적층체 |
JP5880450B2 (ja) | 2011-01-31 | 2016-03-09 | 住友ベークライト株式会社 | 樹脂組成物および半導体装置 |
JP5490954B1 (ja) * | 2013-09-30 | 2014-05-14 | 日本ビー・ケミカル株式会社 | 導電性積層体およびそれを用いるタッチパネル |
-
2016
- 2016-03-31 JP JP2016070332A patent/JP6799934B2/ja active Active
-
2017
- 2017-03-30 WO PCT/JP2017/013275 patent/WO2017170873A1/ja active Application Filing
- 2017-03-30 US US16/086,982 patent/US10738187B2/en active Active
- 2017-03-30 KR KR1020187027816A patent/KR102269234B1/ko active IP Right Grant
- 2017-03-31 TW TW106111077A patent/TW201806977A/zh unknown
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2004168933A (ja) * | 2002-11-21 | 2004-06-17 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置。 |
JP2014033197A (ja) * | 2012-07-13 | 2014-02-20 | Panasonic Corp | 半導体装置の製造方法とそれに使用される半導体封止用アクリル樹脂組成物 |
JP2015002204A (ja) * | 2013-06-13 | 2015-01-05 | パナソニック株式会社 | 半導体装置の製造方法とそれに使用される半導体封止用アクリル樹脂組成物 |
JP2015017169A (ja) * | 2013-07-10 | 2015-01-29 | ナミックス株式会社 | 先供給型半導体封止剤および半導体装置 |
JP2015019012A (ja) * | 2013-07-12 | 2015-01-29 | パナソニック株式会社 | 半導体装置の製造方法とそれに使用される半導体封止用アクリル樹脂組成物 |
JP2015078303A (ja) * | 2013-10-17 | 2015-04-23 | ナミックス株式会社 | 樹脂組成物、先供給型半導体封止剤および半導体装置 |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018163900A1 (ja) * | 2017-03-07 | 2018-09-13 | パナソニックIpマネジメント株式会社 | アンダーフィル用熱硬化性組成物及び半導体装置 |
CN110382565A (zh) * | 2017-03-07 | 2019-10-25 | 松下知识产权经营株式会社 | 用作底部填充材料的热固性组合物和半导体装置 |
JPWO2018163900A1 (ja) * | 2017-03-07 | 2020-01-16 | パナソニックIpマネジメント株式会社 | アンダーフィル用熱硬化性組成物及び半導体装置 |
US11195769B2 (en) | 2017-03-07 | 2021-12-07 | Panasonic Intellectual Property Management Co., Ltd. | Thermosetting composition for use as underfill material, and semiconductor device |
JP7126129B2 (ja) | 2017-03-07 | 2022-08-26 | パナソニックIpマネジメント株式会社 | アンダーフィル用熱硬化性組成物及び半導体装置 |
Also Published As
Publication number | Publication date |
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KR102269234B1 (ko) | 2021-06-24 |
US10738187B2 (en) | 2020-08-11 |
US20190100646A1 (en) | 2019-04-04 |
TW201806977A (zh) | 2018-03-01 |
KR20180129793A (ko) | 2018-12-05 |
WO2017170873A1 (ja) | 2017-10-05 |
JP6799934B2 (ja) | 2020-12-16 |
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