JP2017176981A - 連続塗布装置及び連続塗布方法 - Google Patents
連続塗布装置及び連続塗布方法 Download PDFInfo
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- 238000000034 method Methods 0.000 claims abstract description 10
- 230000008602 contraction Effects 0.000 claims description 21
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Abstract
Description
前記塗布ヘッドは、前記撮像装置より前記長尺フィルムの搬送方向下流側に設けられることを特徴とする連続塗布装置を提供するものである。
きる。例えば、塗布ヘッド5のノズル6が千鳥状になるように配列してもよいし、塗布ヘッド5の複数のノズル6がX方向(長尺フィルム2の搬送方向)に沿って配列されるように配置してもよいし、塗布ヘッド5の複数のノズル6をX方向又はY方向に対してわずかに傾けて配置するようにしてもよい。これらの場合も塗布ヘッドは、塗布ロール1に巻き付けた長尺フィルム2に対して垂直に塗液を吐出するように、各塗布ヘッドが塗布ロール1の曲率に沿って設けられる。
Claims (6)
- 長尺フィルムを連続搬送して所定パターンを塗布する連続塗布装置であって、
前記長尺フィルムを巻き付ける塗布ロールと、
前記塗布ロールに巻き付けた前記長尺フィルム上のマーク又はパターンを撮像する撮像装置と、
前記塗布ロールに巻き付けた前記長尺フィルムに前記所定パターンを塗布する塗布ヘッドと、を備え、
前記塗布ヘッドは、前記撮像装置より前記長尺フィルムの搬送方向下流側に設けられることを特徴とする連続塗布装置。 - 前記撮像装置の撮像位置と前記塗布ヘッドからの塗液の着弾位置との間の前記塗布ロール上の長さが、前記長尺フィルムの前記所定パターンの長さ以上であることを特徴とする請求項1に記載の連続塗布装置。
- 前記長尺フィルムの搬送方向に前記塗布ヘッドを複数備え、当該複数の塗布ヘッドのそれぞれは、前記塗布ロールに巻き付けた前記長尺フィルムに対して垂直に塗液を吐出するように、前記塗布ロールの曲率に沿って設けたことを特徴とする請求項1又は2に記載の連続塗布装置。
- 前記塗布ヘッドが吐出する塗液が着弾する前記長尺フィルム上の着弾位置を調節する吐出サイクル調節部を設け、前記吐出サイクル調節部は、前記撮像装置の撮像結果から前記長尺フィルムの伸縮を算出し、塗液の吐出サイクルを調節することを特徴とする請求項1〜3のいずれかに記載の連続塗布装置。
- 前記塗布ヘッドが吐出する塗液が着弾する前記長尺フィルム上の着弾位置を調節する塗布データ調節部を設け、前記塗布データ調節部は、前記撮像装置の撮像結果から前記長尺フィルムの伸縮を算出し、塗液の塗布データを調節することを特徴とする請求項1〜4のいずれかに記載の連続塗布装置。
- 長尺フィルムを連続搬送して所定パターンを塗布する連続塗布方法であって、
前記長尺フィルムを塗布ロールにテンションをかけて巻き付け、
前記塗布ロールに巻き付けた前記長尺フィルム上のマーク又はパターンを撮像装置で撮像し、前記撮像装置の撮像結果から算出した前記長尺フィルムの伸縮に応じて、前記塗布ロールに巻き付けた前記長尺フィルムに前記所定パターンを塗布することを特徴とする連続塗布方法。
Priority Applications (5)
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JP2016066544A JP6652426B2 (ja) | 2016-03-29 | 2016-03-29 | 連続塗布装置及び連続塗布方法 |
US16/086,099 US20200298270A1 (en) | 2016-03-29 | 2017-03-28 | Continuous coating device and continuous coating method |
KR1020187018667A KR20180124835A (ko) | 2016-03-29 | 2017-03-28 | 연속 도포 장치 및 연속 도포 방법 |
CN201780018510.3A CN109070127A (zh) | 2016-03-29 | 2017-03-28 | 连续涂布装置和连续涂布方法 |
PCT/JP2017/012524 WO2017170478A1 (ja) | 2016-03-29 | 2017-03-28 | 連続塗布装置及び連続塗布方法 |
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Cited By (3)
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---|---|---|---|---|
JP2020205179A (ja) * | 2019-06-18 | 2020-12-24 | 住友化学株式会社 | 液滴吐出装置、薄膜製造方法及び有機電子デバイスの製造方法 |
JP2021024195A (ja) * | 2019-08-05 | 2021-02-22 | 三菱ケミカル株式会社 | 積層フィルム及びその製造方法 |
JP7368261B2 (ja) | 2020-02-12 | 2023-10-24 | 東レエンジニアリング株式会社 | 塗布装置 |
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EP4122707A4 (en) * | 2020-03-19 | 2023-08-23 | FUJIFILM Corporation | IMAGE FORMING DEVICE |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008074051A (ja) * | 2006-09-25 | 2008-04-03 | Olympus Corp | 画像記録装置 |
JP2010284926A (ja) * | 2009-06-12 | 2010-12-24 | Olympus Corp | 画像記録装置及び画像記録装置の制御方法 |
JP2011230315A (ja) * | 2010-04-26 | 2011-11-17 | Seiko Epson Corp | 描画装置 |
JP2012061655A (ja) * | 2010-09-15 | 2012-03-29 | Seiko Epson Corp | 記録装置 |
JP2012212747A (ja) * | 2011-03-31 | 2012-11-01 | Fujifilm Corp | 薄膜トランジスタの製造装置およびその製造方法 |
JP2015147186A (ja) * | 2014-02-07 | 2015-08-20 | 株式会社村田製作所 | 印刷方法及び印刷装置 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07137248A (ja) * | 1993-11-17 | 1995-05-30 | Toray Ind Inc | インクジェット印刷方法およびその装置 |
JP2009128588A (ja) * | 2007-11-22 | 2009-06-11 | Konica Minolta Opto Inc | 光学補償フィルムの製造方法、光学補償フィルム、偏光板及び液晶表示装置 |
JP5587616B2 (ja) * | 2010-01-18 | 2014-09-10 | 株式会社日立製作所 | インクジェット塗布装置及び方法 |
KR102061315B1 (ko) * | 2011-07-27 | 2019-12-31 | 스미도모쥬기가이고교 가부시키가이샤 | 기판제조장치 및 기판제조방법 |
JP5883313B2 (ja) * | 2012-02-23 | 2016-03-15 | 株式会社Screenホールディングス | 画像記録装置、補正係数取得方法および画像記録方法 |
JP6147985B2 (ja) * | 2012-10-15 | 2017-06-14 | トヨタ自動車株式会社 | 塗工装置および塗工方法 |
JP6352727B2 (ja) * | 2014-08-11 | 2018-07-04 | 株式会社Screenホールディングス | 膜・触媒層接合体の製造装置および製造方法 |
-
2016
- 2016-03-29 JP JP2016066544A patent/JP6652426B2/ja not_active Expired - Fee Related
-
2017
- 2017-03-28 KR KR1020187018667A patent/KR20180124835A/ko not_active Application Discontinuation
- 2017-03-28 WO PCT/JP2017/012524 patent/WO2017170478A1/ja active Application Filing
- 2017-03-28 US US16/086,099 patent/US20200298270A1/en not_active Abandoned
- 2017-03-28 CN CN201780018510.3A patent/CN109070127A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008074051A (ja) * | 2006-09-25 | 2008-04-03 | Olympus Corp | 画像記録装置 |
JP2010284926A (ja) * | 2009-06-12 | 2010-12-24 | Olympus Corp | 画像記録装置及び画像記録装置の制御方法 |
JP2011230315A (ja) * | 2010-04-26 | 2011-11-17 | Seiko Epson Corp | 描画装置 |
JP2012061655A (ja) * | 2010-09-15 | 2012-03-29 | Seiko Epson Corp | 記録装置 |
JP2012212747A (ja) * | 2011-03-31 | 2012-11-01 | Fujifilm Corp | 薄膜トランジスタの製造装置およびその製造方法 |
JP2015147186A (ja) * | 2014-02-07 | 2015-08-20 | 株式会社村田製作所 | 印刷方法及び印刷装置 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020205179A (ja) * | 2019-06-18 | 2020-12-24 | 住友化学株式会社 | 液滴吐出装置、薄膜製造方法及び有機電子デバイスの製造方法 |
WO2020255696A1 (ja) * | 2019-06-18 | 2020-12-24 | 住友化学株式会社 | 液滴吐出装置、薄膜製造方法及び有機電子デバイスの製造方法 |
JP2021024195A (ja) * | 2019-08-05 | 2021-02-22 | 三菱ケミカル株式会社 | 積層フィルム及びその製造方法 |
JP7368261B2 (ja) | 2020-02-12 | 2023-10-24 | 東レエンジニアリング株式会社 | 塗布装置 |
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JP6652426B2 (ja) | 2020-02-26 |
US20200298270A1 (en) | 2020-09-24 |
CN109070127A (zh) | 2018-12-21 |
WO2017170478A1 (ja) | 2017-10-05 |
KR20180124835A (ko) | 2018-11-21 |
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