JP2017159382A5 - - Google Patents

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Publication number
JP2017159382A5
JP2017159382A5 JP2016044113A JP2016044113A JP2017159382A5 JP 2017159382 A5 JP2017159382 A5 JP 2017159382A5 JP 2016044113 A JP2016044113 A JP 2016044113A JP 2016044113 A JP2016044113 A JP 2016044113A JP 2017159382 A5 JP2017159382 A5 JP 2017159382A5
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JP
Japan
Prior art keywords
probe
measurement
control unit
irradiate
measurement window
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JP2016044113A
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English (en)
Japanese (ja)
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JP2017159382A (ja
JP6622117B2 (ja
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Priority to JP2016044113A priority Critical patent/JP6622117B2/ja
Priority claimed from JP2016044113A external-priority patent/JP6622117B2/ja
Priority to KR1020170023261A priority patent/KR102496905B1/ko
Priority to CN201710129352.0A priority patent/CN107160288B/zh
Priority to TW106107403A priority patent/TWI709457B/zh
Publication of JP2017159382A publication Critical patent/JP2017159382A/ja
Publication of JP2017159382A5 publication Critical patent/JP2017159382A5/ja
Application granted granted Critical
Publication of JP6622117B2 publication Critical patent/JP6622117B2/ja
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JP2016044113A 2016-03-08 2016-03-08 平面研磨装置及びキャリア Active JP6622117B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016044113A JP6622117B2 (ja) 2016-03-08 2016-03-08 平面研磨装置及びキャリア
KR1020170023261A KR102496905B1 (ko) 2016-03-08 2017-02-22 평면 연마 장치 및 캐리어
CN201710129352.0A CN107160288B (zh) 2016-03-08 2017-03-06 平面研磨装置及游星轮
TW106107403A TWI709457B (zh) 2016-03-08 2017-03-07 平面研磨裝置及載具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016044113A JP6622117B2 (ja) 2016-03-08 2016-03-08 平面研磨装置及びキャリア

Publications (3)

Publication Number Publication Date
JP2017159382A JP2017159382A (ja) 2017-09-14
JP2017159382A5 true JP2017159382A5 (https=) 2019-02-14
JP6622117B2 JP6622117B2 (ja) 2019-12-18

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ID=59848707

Family Applications (1)

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JP2016044113A Active JP6622117B2 (ja) 2016-03-08 2016-03-08 平面研磨装置及びキャリア

Country Status (4)

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JP (1) JP6622117B2 (https=)
KR (1) KR102496905B1 (https=)
CN (1) CN107160288B (https=)
TW (1) TWI709457B (https=)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6760638B2 (ja) * 2016-04-14 2020-09-23 スピードファム株式会社 平面研磨装置
CN107486786A (zh) * 2017-10-01 2017-12-19 德清凯晶光电科技有限公司 防塌边游星轮
JP7035748B2 (ja) * 2018-04-11 2022-03-15 株式会社Sumco ワークの両面研磨装置
JP7046358B2 (ja) * 2018-04-17 2022-04-04 スピードファム株式会社 研磨装置
JP7364217B2 (ja) * 2019-11-05 2023-10-18 スピードファム株式会社 研磨装置
JP7651151B2 (ja) * 2019-12-25 2025-03-26 スピードファム株式会社 ワークホール検出装置及びワークホール検出方法
JP7435113B2 (ja) * 2020-03-23 2024-02-21 株式会社Sumco ワークの両面研磨装置
JP7425411B2 (ja) * 2020-10-12 2024-01-31 株式会社Sumco キャリア測定装置、キャリア測定方法、及びキャリア管理方法
DE112022002923T5 (de) * 2021-06-04 2024-03-14 Sumco Corporation Doppelseitige poliervorrichtung und doppelseitiges polierverfahren für werkstücke
CN117506703B (zh) * 2023-12-01 2024-05-10 苏州博宏源机械制造有限公司 测量装置及抛光系统
TWI880618B (zh) * 2024-01-31 2025-04-11 準力機械股份有限公司 基板研磨設備的研磨構造

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61213611A (ja) * 1985-03-19 1986-09-22 Nec Corp 結晶の研磨方法
JPH05309559A (ja) * 1992-05-12 1993-11-22 Speedfam Co Ltd 平面研磨方法及び装置
JPH0740233A (ja) * 1993-07-27 1995-02-10 Speedfam Co Ltd ワークの厚さ測定装置
JP3326443B2 (ja) * 1993-08-10 2002-09-24 株式会社ニコン ウエハ研磨方法及びその装置
JP3431115B2 (ja) * 1995-03-28 2003-07-28 アプライド マテリアルズ インコーポレイテッド ケミカルメカニカルポリシングの操作をインシチュウでモニタするための装置及び方法
JP2888339B1 (ja) * 1998-03-27 1999-05-10 直江津電子工業株式会社 被加工物保持プレート
JP2008227393A (ja) * 2007-03-15 2008-09-25 Fujikoshi Mach Corp ウェーハの両面研磨装置
US8834230B2 (en) * 2008-07-31 2014-09-16 Shin-Etsu Handotai Co., Ltd. Wafer polishing method and double-side polishing apparatus
JP2010045279A (ja) * 2008-08-18 2010-02-25 Nippon Steel Corp 半導体基板の両面研磨方法
CN201419354Y (zh) * 2009-04-29 2010-03-10 上海合晶硅材料有限公司 一种用于加工薄型硅单晶片的行星片
JP2012205258A (ja) * 2011-03-28 2012-10-22 Seiko Instruments Inc 研磨方法、圧電振動片の製造方法、圧電振動子、発振器、電子機器及び電波時計
JP5630414B2 (ja) * 2011-10-04 2014-11-26 信越半導体株式会社 ウェーハの加工方法
JP5896884B2 (ja) * 2012-11-13 2016-03-30 信越半導体株式会社 両面研磨方法
JP6003800B2 (ja) * 2013-05-16 2016-10-05 信越半導体株式会社 ウェーハの両面研磨方法及び両面研磨システム
JP6146213B2 (ja) * 2013-08-30 2017-06-14 株式会社Sumco ワークの両面研磨装置及び両面研磨方法
KR20150053049A (ko) * 2013-11-07 2015-05-15 주식회사 엘지실트론 웨이퍼의 양면 연마 방법
JP6255991B2 (ja) * 2013-12-26 2018-01-10 株式会社Sumco ワークの両面研磨装置

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