JP2017159382A5 - - Google Patents

Download PDF

Info

Publication number
JP2017159382A5
JP2017159382A5 JP2016044113A JP2016044113A JP2017159382A5 JP 2017159382 A5 JP2017159382 A5 JP 2017159382A5 JP 2016044113 A JP2016044113 A JP 2016044113A JP 2016044113 A JP2016044113 A JP 2016044113A JP 2017159382 A5 JP2017159382 A5 JP 2017159382A5
Authority
JP
Japan
Prior art keywords
probe
measurement
control unit
irradiate
measurement window
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016044113A
Other languages
Japanese (ja)
Other versions
JP2017159382A (en
JP6622117B2 (en
Filing date
Publication date
Application filed filed Critical
Priority to JP2016044113A priority Critical patent/JP6622117B2/en
Priority claimed from JP2016044113A external-priority patent/JP6622117B2/en
Priority to KR1020170023261A priority patent/KR102496905B1/en
Priority to CN201710129352.0A priority patent/CN107160288B/en
Priority to TW106107403A priority patent/TWI709457B/en
Publication of JP2017159382A publication Critical patent/JP2017159382A/en
Publication of JP2017159382A5 publication Critical patent/JP2017159382A5/ja
Application granted granted Critical
Publication of JP6622117B2 publication Critical patent/JP6622117B2/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Description

前記第２プローブ５０からのレーザー光は、ワーク４０の研磨加工中に常時照射されていても良いが、該第２プローブ５０の真下に上定盤２の第２測定窓部５２とキャリア３０の透光部材３５とが並ぶ瞬間だけに照射されるように制御されていてもよい。この場合、複数の第２測定窓部５２を等間隔で配置したことで、規則的なタイミングで照射することができる。なお、第２測定窓部５２を複数設けたことで、測定回数が多くなって測定精度も向上する。
また、前記第２プローブ５０による測定データは、前記第２光ファイバー５１を通じて光のまま前記演算制御部２９に送っても良いが、前記第２プローブ５０で電気信号に変換し、該第２プローブ５０と前記演算制御部２９とを結ぶ不図示の電気ケーブルを通じて該演算制御部２９に送っても良く、あるいは無線で送っても構わない。 The laser beam from the second probe 50 may be always irradiated during the polishing process of the workpiece 40, but the second measurement window 52 of the upper surface plate 2 and the carrier 30 are directly under the second probe 50. It may be controlled to irradiate only at the moment when the translucent members 35 are arranged. In this case, it is possible to irradiate with regular timing by arranging the plurality of second measurement window portions 52 at equal intervals. In addition, by providing the 2nd measurement window part 52 with two or more, the frequency | count of a measurement increases and a measurement precision improves.
The measurement data from the second probe 50 may be sent to the arithmetic control unit 29 as light through the second optical fiber 51, but is converted into an electrical signal by the second probe 50, and the second probe 50 May be sent to the calculation control unit 29 through an electric cable (not shown) connecting the calculation control unit 29 or wirelessly.

JP2016044113A 2016-03-08 2016-03-08 Planar polishing apparatus and carrier Active JP6622117B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2016044113A JP6622117B2 (en) 2016-03-08 2016-03-08 Planar polishing apparatus and carrier
KR1020170023261A KR102496905B1 (en) 2016-03-08 2017-02-22 Surface polishing apparatus and carrier
CN201710129352.0A CN107160288B (en) 2016-03-08 2017-03-06 Plane grinding device and wandering star wheel
TW106107403A TWI709457B (en) 2016-03-08 2017-03-07 Surface polishing apparatus and carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016044113A JP6622117B2 (en) 2016-03-08 2016-03-08 Planar polishing apparatus and carrier

Publications (3)

Publication Number Publication Date
JP2017159382A JP2017159382A (en) 2017-09-14
JP2017159382A5 true JP2017159382A5 (en) 2019-02-14
JP6622117B2 JP6622117B2 (en) 2019-12-18

Family

ID=59848707

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016044113A Active JP6622117B2 (en) 2016-03-08 2016-03-08 Planar polishing apparatus and carrier

Country Status (4)

Country Link
JP (1) JP6622117B2 (en)
KR (1) KR102496905B1 (en)
CN (1) CN107160288B (en)
TW (1) TWI709457B (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6760638B2 (en) * 2016-04-14 2020-09-23 スピードファム株式会社 Flat surface polishing device
CN107486786A (en) * 2017-10-01 2017-12-19 德清凯晶光电科技有限公司 Anti- turned-down edge erratic star wheel
JP7035748B2 (en) * 2018-04-11 2022-03-15 株式会社Sumco Work double-sided polishing device
JP7046358B2 (en) * 2018-04-17 2022-04-04 スピードファム株式会社 Polishing equipment
JP7364217B2 (en) * 2019-11-05 2023-10-18 スピードファム株式会社 polishing equipment
JP2021102245A (en) * 2019-12-25 2021-07-15 スピードファム株式会社 Workpiece hole detection device and workpiece hole detection method
JP7435113B2 (en) * 2020-03-23 2024-02-21 株式会社Sumco Double-sided polishing device for workpieces
JP7425411B2 (en) * 2020-10-12 2024-01-31 株式会社Sumco Carrier measurement device, carrier measurement method, and carrier management method

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61213611A (en) * 1985-03-19 1986-09-22 Nec Corp Polishing method for crystal
JPH05309559A (en) * 1992-05-12 1993-11-22 Speedfam Co Ltd Plane surface polishing method and device
JPH0740233A (en) * 1993-07-27 1995-02-10 Speedfam Co Ltd Thickness measuring device of work
JP3326443B2 (en) * 1993-08-10 2002-09-24 株式会社ニコン Wafer polishing method and apparatus therefor
DE69618698T2 (en) * 1995-03-28 2002-08-14 Applied Materials Inc Method and device for in-situ control and determination of the end of chemical-mechanical leveling processes
JP2888339B1 (en) * 1998-03-27 1999-05-10 直江津電子工業株式会社 Workpiece holding plate
JP2008227393A (en) 2007-03-15 2008-09-25 Fujikoshi Mach Corp Double-side polishing apparatus for wafer
WO2010013390A1 (en) * 2008-07-31 2010-02-04 信越半導体株式会社 Wafer polishing method and double side polishing apparatus
JP2010045279A (en) * 2008-08-18 2010-02-25 Nippon Steel Corp Method for polishing both surface of semiconductor substrate
CN201419354Y (en) * 2009-04-29 2010-03-10 上海合晶硅材料有限公司 Planet wafer for processing thin-type single crystal silicon wafer
JP2012205258A (en) * 2011-03-28 2012-10-22 Seiko Instruments Inc Polishing method, method for manufacturing piezoelectric vibration piece, piezoelectric vibrator, oscillator, electronic equipment and electric wave clock
JP5630414B2 (en) * 2011-10-04 2014-11-26 信越半導体株式会社 Wafer processing method
JP5896884B2 (en) * 2012-11-13 2016-03-30 信越半導体株式会社 Double-side polishing method
JP6003800B2 (en) * 2013-05-16 2016-10-05 信越半導体株式会社 Wafer double-side polishing method and double-side polishing system
JP6146213B2 (en) * 2013-08-30 2017-06-14 株式会社Sumco Double-side polishing apparatus and double-side polishing method for work
KR20150053049A (en) * 2013-11-07 2015-05-15 주식회사 엘지실트론 Double Side Polishing Method for Wafer
JP6255991B2 (en) * 2013-12-26 2018-01-10 株式会社Sumco Double-side polishing machine for workpieces

Similar Documents

Publication Publication Date Title
JP2017159382A5 (en)
WO2016007867A3 (en) Multichannel coherent transceiver and related apparatus and methods
EP3491218A4 (en) Simultaneous distributed measurements on optical fiber
WO2015044182A3 (en) Beam delivery apparatus and method
JP2016032609A5 (en)
BR112016013353A2 (en) BIOSSENSOR AND METHOD FOR PRODUCING A BIOSENSOR
EP3218747A4 (en) Optical fiber and method and apparatus for accurate fiber optic sensing under multiple stimuli
MX341327B (en) Device for determining the location of mechanical elements.
EA201600652A1 (en) SYSTEM OF FIBER OPTICAL SENSOR
MY176812A (en) Photon emitter array
IN2014DE03117A (en)
WO2014129611A3 (en) Acoustic wave acquiring apparatus and control method therefor
EP2853807A3 (en) Light guide panel, back light assembly and display apparatus each having the light guide panel
GB201300811D0 (en) Method of, and Apparatus for, Making an Optical Waveguide
EP3817653A4 (en) Performing trans-abdominal fetal oxymetry using optical tomography
DE112020005761A5 (en) Device for laser cladding with several laser cladding heads
EA201390512A1 (en) MARKING AND / OR SCANNING DEVICE WITH A DEVICE FOR MEASURING THE SPEED OF THE OBJECT AND A METHOD OF MEASURING THE SPEED OF THE OBJECT USING SUCH THE APPARATUS
JP2011164102A5 (en)
JP2016526408A5 (en)
EP3504945A4 (en) Laser optical fiber tray
FR3025676B1 (en) METHOD OF SELECTING MODES / HEARTS FOR TRANSMISSION ON OPTICAL FIBERS OF THE MULTI-MODE / MULTI-HEART TYPE
WO2015053694A3 (en) An apparatus for controlling a laser probe
DK3572870T3 (en) Method for entangled photon distribution with spatially divided de-multiplexing
JP2016070801A5 (en) measuring device
WO2017209422A3 (en) Spectrometer capable of analyzing composition of subject and electronic apparatus including same