JP2017159318A5 - - Google Patents

Download PDF

Info

Publication number
JP2017159318A5
JP2017159318A5 JP2016045342A JP2016045342A JP2017159318A5 JP 2017159318 A5 JP2017159318 A5 JP 2017159318A5 JP 2016045342 A JP2016045342 A JP 2016045342A JP 2016045342 A JP2016045342 A JP 2016045342A JP 2017159318 A5 JP2017159318 A5 JP 2017159318A5
Authority
JP
Japan
Prior art keywords
laser beam
pulse
pulse laser
waiting time
processing apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016045342A
Other languages
English (en)
Japanese (ja)
Other versions
JP6644421B2 (ja
JP2017159318A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2016045342A priority Critical patent/JP6644421B2/ja
Priority claimed from JP2016045342A external-priority patent/JP6644421B2/ja
Publication of JP2017159318A publication Critical patent/JP2017159318A/ja
Publication of JP2017159318A5 publication Critical patent/JP2017159318A5/ja
Application granted granted Critical
Publication of JP6644421B2 publication Critical patent/JP6644421B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016045342A 2016-03-09 2016-03-09 レーザ加工装置 Expired - Fee Related JP6644421B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2016045342A JP6644421B2 (ja) 2016-03-09 2016-03-09 レーザ加工装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016045342A JP6644421B2 (ja) 2016-03-09 2016-03-09 レーザ加工装置

Publications (3)

Publication Number Publication Date
JP2017159318A JP2017159318A (ja) 2017-09-14
JP2017159318A5 true JP2017159318A5 (enExample) 2019-02-14
JP6644421B2 JP6644421B2 (ja) 2020-02-12

Family

ID=59854544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016045342A Expired - Fee Related JP6644421B2 (ja) 2016-03-09 2016-03-09 レーザ加工装置

Country Status (1)

Country Link
JP (1) JP6644421B2 (enExample)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7519333B2 (ja) * 2021-07-02 2024-07-19 住友重機械工業株式会社 レーザ制御装置及びレーザパルス切出し方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4698092B2 (ja) * 2001-07-11 2011-06-08 住友重機械工業株式会社 ガルバノスキャナ装置及びその制御方法
JP2004322106A (ja) * 2003-04-21 2004-11-18 Sumitomo Heavy Ind Ltd レーザ加工方法およびレーザ加工装置
JP4827650B2 (ja) * 2006-08-09 2011-11-30 住友重機械工業株式会社 レーザ加工方法及び加工装置
TWI608886B (zh) * 2011-07-05 2017-12-21 電子科學工業股份有限公司 用於提供聲光束偏轉器與聲光調變器使用期間之溫度穩定性之系統與方法

Similar Documents

Publication Publication Date Title
CN101578155B (zh) 用于多脉冲激光加工的系统和方法
JP2016516585A5 (enExample)
JP2015529161A5 (enExample)
ATE477876T1 (de) Verfahren und laservorrichtung zum bearbeiten und/oder verbinden von werkstücken mittels laserstrahlung mit leistungswirk- und pilotlaser und mindestens einem diffraktiven optischen element
JP2018012183A5 (ja) ロボット制御装置および挿入方法
MY178429A (en) Method and device for providing through-openings in a substrate and a substrate produced in said manner
JP2016517352A5 (enExample)
JP2007075886A5 (enExample)
TWI583477B (zh) 使用基於雷射放射所控制的射束定位器的雷射機械加工系統及方法
JP2017534458A5 (enExample)
MX2018012693A (es) Dispositivo y procedimiento de marcado laser de una lentilla oftalmica con un pulso laser de longitud de onda y energia por pulsos seleccionados.
CN107249809A (zh) 激光冲击喷丸处理中使用的方法和设备
JP2014223671A5 (ja) レーザ加工方法及びレーザ加工装置
JP2020504675A5 (enExample)
SG11201805682WA (en) Method and device for producing planar modifications in solid bodies
JP6679284B2 (ja) 被加工物上にレーザビームを結像するための装置および方法
MX2018015866A (es) Metodo de procesamiento laser de un material metalico con control de la distribucion de potencia transversal del rayo laser en un plano de trabajo, y una maquina y programa de computacion para la implementacion del metodo.
JP2017159318A5 (enExample)
ZA202303228B (en) Handheld laser system
EP1674189A4 (en) ULTRA SHORT PULSE LASER PROCESSING PROCEDURES
KR102140458B1 (ko) 의료 장치 내에 구멍을 드릴링하기 위한 레이저 시스템
WO2015150668A3 (fr) Procede de marquage en surface d'une piece mecanique par une representation graphique predefinie avec effet de type holographique
WO2012148117A3 (ko) 레이저 분할빔을 이용한 선택적 박막 제거장치
JP6713203B2 (ja) レーザ加工装置
TWI579090B (zh) Laser processing device and laser processing method