JP2017159318A5 - - Google Patents
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- JP2017159318A5 JP2017159318A5 JP2016045342A JP2016045342A JP2017159318A5 JP 2017159318 A5 JP2017159318 A5 JP 2017159318A5 JP 2016045342 A JP2016045342 A JP 2016045342A JP 2016045342 A JP2016045342 A JP 2016045342A JP 2017159318 A5 JP2017159318 A5 JP 2017159318A5
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- Japan
- Prior art keywords
- laser beam
- pulse
- pulse laser
- waiting time
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000000034 method Methods 0.000 claims description 7
- 230000003287 optical Effects 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 2
Description
本発明の一観点によると、
パルスレーザビームを出力するレーザ光源と、
前記パルスレーザビームの進行方向を偏向させることにより、加工対象物上において前記パルスレーザビームの入射位置を移動させるビーム偏向器と、
前記レーザ光源と前記ビーム偏向器との間の前記パルスレーザビームの経路に配置され、前記パルスレーザビームに光学的作用を及ぼす光学素子と、
前記パルスレーザビームの出力タイミング、及び前記ビーム偏向器の動作を制御する制御装置と
を有し、
前記制御装置は、
前記ビーム偏向器を制御して前記パルスレーザビームの入射位置を目標位置まで移動させる手順と、
前記パルスレーザビームの入射位置が目標位置に整定された後、前記レーザ光源から1つのレーザパルスを出力させる手順と
を繰り返し、
ある判定時刻に、前記判定時刻より前のモニタ期間における前記パルスレーザビームの平均パワーに基づいて、前記パルスレーザビームの入射位置が目標位置に整定された時点から、前記レーザ光源に発振開始の指令を送出するまでの待ち時間の値を決定し、前記判定時刻より後の反映期間において、決定された前記待ち時間の値に基づいて前記手順を繰り返すレーザ加工装置が提供される。
According to one aspect of the invention,
A laser light source that outputs a pulsed laser beam ;
By deflecting the traveling direction before Symbol pulsed laser beam, a beam deflector for moving the incident position of the pulsed laser beam on the machining object,
An optical element disposed in a path of the pulse laser beam between the laser light source and the beam deflector and exerting an optical action on the pulse laser beam;
A control device for controlling the output timing of the pulse laser beam and the operation of the beam deflector;
The control device includes:
A procedure for controlling the beam deflector to move the incident position of the pulsed laser beam to a target position;
After the incident position of the pulse laser beam is set to the target position, the procedure of outputting one laser pulse from the laser light source is repeated.
Based on the average power of the pulse laser beam in the monitoring period before the determination time at a certain determination time, the laser light source is instructed to start oscillation from the time when the incident position of the pulse laser beam is set to the target position. A laser processing apparatus is provided that determines a value of a waiting time until the signal is sent and repeats the procedure based on the determined waiting time value in a reflection period after the determination time.
Claims (6)
前記パルスレーザビームの進行方向を偏向させることにより、加工対象物上において前記パルスレーザビームの入射位置を移動させるビーム偏向器と、
前記レーザ光源と前記ビーム偏向器との間の前記パルスレーザビームの経路に配置され、前記パルスレーザビームに光学的作用を及ぼす光学素子と、
前記パルスレーザビームの出力タイミング、及び前記ビーム偏向器の動作を制御する制御装置と
を有し、
前記制御装置は、
前記ビーム偏向器を制御して前記パルスレーザビームの入射位置を目標位置まで移動させる手順と、
前記パルスレーザビームの入射位置が目標位置に整定された後、前記レーザ光源から1つのレーザパルスを出力させる手順と
を繰り返し、
ある判定時刻に、前記判定時刻より前のモニタ期間における前記パルスレーザビームの平均パワーに基づいて、前記パルスレーザビームの入射位置が目標位置に整定された時点から、前記レーザ光源に発振開始の指令を送出するまでの待ち時間の値を決定し、前記判定時刻より後の反映期間において、決定された前記待ち時間の値に基づいて前記手順を繰り返すレーザ加工装置。 A laser light source that outputs a pulsed laser beam ;
By deflecting the traveling direction before Symbol pulsed laser beam, a beam deflector for moving the incident position of the pulsed laser beam on the machining object,
An optical element disposed in a path of the pulse laser beam between the laser light source and the beam deflector and exerting an optical action on the pulse laser beam;
A control device for controlling the output timing of the pulse laser beam and the operation of the beam deflector;
The control device includes:
A procedure for controlling the beam deflector to move the incident position of the pulsed laser beam to a target position;
After the incident position of the pulse laser beam is set to the target position, the procedure of outputting one laser pulse from the laser light source is repeated.
Based on the average power of the pulse laser beam in the monitoring period before the determination time at a certain determination time, the laser light source is instructed to start oscillation from the time when the incident position of the pulse laser beam is set to the target position. The laser processing apparatus which determines the value of the waiting time until the time is transmitted and repeats the procedure based on the determined waiting time value in the reflection period after the determination time.
前記加工対象物の表面が、前記ビーム偏向器の動作によって前記パルスレーザビームの入射位置を移動させることが可能な大きさの複数のブロックに区分されており、
前記制御装置は、
前記複数のブロックのうち1つを前記ビーム偏向器の照射可能範囲に配置して、前記照射可能範囲に配置された前記ブロック内の全ての目標位置のレーザ加工を行う手順と、
前記照射可能範囲に配置された前記ブロック内の全ての目標位置の加工が終了した後、前記ステージを制御して、未加工の前記ブロックを前記照射可能範囲に配置する手順と
を繰り返し、
1つの前記ブロックの加工が終了した後、次の前記ブロックの加工を行うまでの間の前記判定時刻において、前記待ち時間の値を決定する請求項2または3に記載のレーザ加工装置。 And a stage for holding the workpiece at a position where the pulsed laser beam is incident,
The surface of the workpiece is divided into a plurality of blocks having a size capable of moving the incident position of the pulse laser beam by the operation of the beam deflector,
The control device includes:
Placing one of the plurality of blocks in an irradiable range of the beam deflector, and performing laser processing of all target positions in the block arranged in the irradiable range;
After processing of all target positions in the block arranged in the irradiable range is completed, the stage is controlled to repeat the procedure of placing the unprocessed block in the irradiable range,
The laser processing apparatus according to claim 2 or 3 , wherein a value of the waiting time is determined at the determination time after processing of one block is completed and processing of the next block is performed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016045342A JP6644421B2 (en) | 2016-03-09 | 2016-03-09 | Laser processing equipment |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2016045342A JP6644421B2 (en) | 2016-03-09 | 2016-03-09 | Laser processing equipment |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017159318A JP2017159318A (en) | 2017-09-14 |
JP2017159318A5 true JP2017159318A5 (en) | 2019-02-14 |
JP6644421B2 JP6644421B2 (en) | 2020-02-12 |
Family
ID=59854544
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2016045342A Active JP6644421B2 (en) | 2016-03-09 | 2016-03-09 | Laser processing equipment |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP6644421B2 (en) |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4698092B2 (en) * | 2001-07-11 | 2011-06-08 | 住友重機械工業株式会社 | Galvano scanner device and control method thereof |
JP2004322106A (en) * | 2003-04-21 | 2004-11-18 | Sumitomo Heavy Ind Ltd | Laser beam machining method, and laser beam machining apparatus |
JP4827650B2 (en) * | 2006-08-09 | 2011-11-30 | 住友重機械工業株式会社 | Laser processing method and processing apparatus |
TWI608886B (en) * | 2011-07-05 | 2017-12-21 | 電子科學工業股份有限公司 | Systems and methods for providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use |
-
2016
- 2016-03-09 JP JP2016045342A patent/JP6644421B2/en active Active
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