WO2012148117A3 - Selective thin film removal apparatus using divided laser beams - Google Patents

Selective thin film removal apparatus using divided laser beams Download PDF

Info

Publication number
WO2012148117A3
WO2012148117A3 PCT/KR2012/002928 KR2012002928W WO2012148117A3 WO 2012148117 A3 WO2012148117 A3 WO 2012148117A3 KR 2012002928 W KR2012002928 W KR 2012002928W WO 2012148117 A3 WO2012148117 A3 WO 2012148117A3
Authority
WO
WIPO (PCT)
Prior art keywords
unit
head
thin film
removal apparatus
film removal
Prior art date
Application number
PCT/KR2012/002928
Other languages
French (fr)
Korean (ko)
Other versions
WO2012148117A2 (en
Inventor
김수찬
이시영
이찬구
배현섭
Original Assignee
위아코퍼레이션 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 위아코퍼레이션 주식회사 filed Critical 위아코퍼레이션 주식회사
Publication of WO2012148117A2 publication Critical patent/WO2012148117A2/en
Publication of WO2012148117A3 publication Critical patent/WO2012148117A3/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B23K26/0676—Dividing the beam into multiple beams, e.g. multifocusing into dependently operating sub-beams, e.g. an array of spots with fixed spatial relationship or for performing simultaneously identical operations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/50—Working by transmitting the laser beam through or within the workpiece
    • B23K26/57—Working by transmitting the laser beam through or within the workpiece the laser beam entering a face of the workpiece from which it is transmitted through the workpiece material to work on a different workpiece face, e.g. for effecting removal, fusion splicing, modifying or reforming
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0823—Devices involving rotation of the workpiece
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/0869—Devices involving movement of the laser head in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/26—Bombardment with radiation
    • H01L21/263—Bombardment with radiation with high-energy radiation
    • H01L21/268—Bombardment with radiation with high-energy radiation using electromagnetic radiation, e.g. laser radiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Abstract

Disclosed is a selective thin film removal apparatus using divided laser beams. The thin film removal apparatus of the present invention includes: a beam generating unit for generating an excimer laser beam of a deep UV wavelength; two or more head units for outputting divided beams by dividing the laser beam; a head supporting unit for enabling the head units to move linearly from an upper part of a processing target; a stage which is located at a lower part of each head unit and can be moved on a plane; and a head driving unit for independently moving each head unit from the heat supporting unit to set a location of each head unit. Additionally, the head unit includes: a beam shutter for enabling on/off of the divided beams; a beam homogenizer for improving the uniformity of the divided beams at an upper end of the processing target; and a projection lens unit for reducing the divided beams at an upper part of the processing target.
PCT/KR2012/002928 2011-04-25 2012-04-18 Selective thin film removal apparatus using divided laser beams WO2012148117A2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020110038392A KR20120120670A (en) 2011-04-25 2011-04-25 Selective thin film removeing device using splitted laser beam
KR10-2011-0038392 2011-04-25

Publications (2)

Publication Number Publication Date
WO2012148117A2 WO2012148117A2 (en) 2012-11-01
WO2012148117A3 true WO2012148117A3 (en) 2013-01-03

Family

ID=47072865

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2012/002928 WO2012148117A2 (en) 2011-04-25 2012-04-18 Selective thin film removal apparatus using divided laser beams

Country Status (2)

Country Link
KR (1) KR20120120670A (en)
WO (1) WO2012148117A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10388098B2 (en) 2014-02-07 2019-08-20 Korea Institute Of Machinery & Materials Apparatus and method of processing anti-counterfeiting pattern, and apparatus and method of detecting anti-counterfeiting pattern
WO2020018153A1 (en) * 2018-07-16 2020-01-23 Applied Materials, Inc Adapter for image projection system installation in photolithography system
KR102180010B1 (en) * 2019-04-25 2020-11-19 세메스 주식회사 Apparatus and method for treating substrate
KR102270936B1 (en) * 2019-06-17 2021-07-01 세메스 주식회사 Substrate processing method and substrate processing apparatus
CN110883420B (en) * 2019-12-24 2022-01-18 深圳市斯普莱特激光科技有限公司 High-intelligent double-laser-head laser processing equipment
CN114453829A (en) * 2021-06-30 2022-05-10 江西应用科技学院 Rapid forming method and device for multi-axis and axis variable component

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11226770A (en) * 1998-02-12 1999-08-24 Isuzu Motors Ltd Laser machining head
KR20040092728A (en) * 2003-04-28 2004-11-04 주식회사 한택 Method and apparatus for acoustic wave device using a laser
KR20050075288A (en) * 2004-01-15 2005-07-20 캐논 가부시끼가이샤 Driving apparatus, exposure apparatus, and device manufacturing method
KR20060066324A (en) * 2004-12-13 2006-06-16 삼성전자주식회사 Apparatus for manufacturing lcd and method of manufacturing lcd using the same
KR100824962B1 (en) * 2006-10-25 2008-04-28 주식회사 코윈디에스티 Apparatus and method for cutting substrate using ultrafast frequency laser
KR100992621B1 (en) * 2008-08-27 2010-11-05 주식회사 엘티에스 A system for patterning a light guid plate for a backlight unit using a high power laser
KR20110040343A (en) * 2009-10-14 2011-04-20 주식회사 한광옵토 Laser irradiation apparatus

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11226770A (en) * 1998-02-12 1999-08-24 Isuzu Motors Ltd Laser machining head
KR20040092728A (en) * 2003-04-28 2004-11-04 주식회사 한택 Method and apparatus for acoustic wave device using a laser
KR20050075288A (en) * 2004-01-15 2005-07-20 캐논 가부시끼가이샤 Driving apparatus, exposure apparatus, and device manufacturing method
KR20060066324A (en) * 2004-12-13 2006-06-16 삼성전자주식회사 Apparatus for manufacturing lcd and method of manufacturing lcd using the same
KR100824962B1 (en) * 2006-10-25 2008-04-28 주식회사 코윈디에스티 Apparatus and method for cutting substrate using ultrafast frequency laser
KR100992621B1 (en) * 2008-08-27 2010-11-05 주식회사 엘티에스 A system for patterning a light guid plate for a backlight unit using a high power laser
KR20110040343A (en) * 2009-10-14 2011-04-20 주식회사 한광옵토 Laser irradiation apparatus

Also Published As

Publication number Publication date
KR20120120670A (en) 2012-11-02
WO2012148117A2 (en) 2012-11-01

Similar Documents

Publication Publication Date Title
WO2012148117A3 (en) Selective thin film removal apparatus using divided laser beams
WO2012091316A3 (en) Laser processing apparatus
WO2012177743A3 (en) Novel thermal processing apparatus
WO2012085638A8 (en) Laser apparatus and extreme ultraviolet light generation system including the laser apparatus
WO2012107815A3 (en) Laser apparatus, extreme ultraviolet light generation system, method for controlling the laser apparatus, and method for generating the extreme ultraviolet light
WO2012118322A3 (en) Apparatus for projecting a grid pattern
WO2013033710A3 (en) Laser based computer controlled dental preparation system
SG11201806983VA (en) Exposure system, exposure device and exposure method
WO2013180884A3 (en) System and method to optimize extreme ultraviolet light generation
EP2716397A4 (en) Laser working head, laser working device, optical system for laser working device, laser working method, and laser focusing method
WO2015124372A3 (en) Lithographic system
EP3252745A4 (en) Laser projection display device, and method for controlling laser light source driving unit used for same
SG11201805682WA (en) Method and device for producing planar modifications in solid bodies
EP2837460A3 (en) Laser irradiation apparatus
SG138540A1 (en) Semiconductor cutting device, semiconductor cutting method, semiconductor cutting system, laser cutting device and laser cutting method
EP2744052A4 (en) Laser light source unit, control method for same, and device and method for generating photoacoustic image
EA201490242A1 (en) MARKING DEVICE, INCLUDING A MULTIPLE OF LASERS, AS WELL AS A DEVIATION MEANS AND TELESCOPIC MEANS FOR EACH LASER
MY162473A (en) A laser apparatus and a method of directing laser to a workpiece surface
WO2016099758A8 (en) Variable radius mirror dichroic beam splitter module for extreme ultraviolet source
GB2428492B (en) Optical apparatus for control of laser beam by providing lateral adjustment of lens groups
WO2013189605A3 (en) Laser scribing system
EP3156167A4 (en) Beam splitter, laser generator and excimer laser annealing device
WO2012005479A3 (en) Apparatus for laser processing a light guide plate and having constant light path distance of a laser beam
TW200602147A (en) Apparatus for cutting nonmetal
MX2019006806A (en) Apparatus and method for printing roll cleaning.

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12776873

Country of ref document: EP

Kind code of ref document: A2

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12776873

Country of ref document: EP

Kind code of ref document: A2