JP2017139249A - 基板搬送方法及び基板処理システム - Google Patents
基板搬送方法及び基板処理システム Download PDFInfo
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/682—Mask-wafer alignment
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- H—ELECTRICITY
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- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
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Abstract
【解決手段】ウエハが搬送される際に回転する基板処理システムにおいて、直進方向座標系において特定されたウエハのエッジ上の各点の位置を、直進方向座標系に対するフォーク28座標系の回転角θfだけ回転移動させる。これにより、直進方向座標系において特定されたウエハのエッジ上の各点の位置からフォーク座標系におけるウエハのエッジ上の各点の位置を特定することができ、もって、フォーク座標系においてウエハの中心Cwの位置を正確に算出することができる。
【選択図】図6
Description
10 基板処理システム
18 搬送アーム
19 センサユニット
19a,19b 光学センサ
28 フォーク
Claims (4)
- 基板を把持する把持部を有する搬送系と、前記基板の搬送軌道上に配置されたセンサとを備え、前記搬送系は前記基板を搬送する際に前記基板を回転させる基板処理システムにおける基板搬送方法であって、
前記基板の縁部が前記センサの対面を横切るときの前記把持部の位置、並びに、前記センサの位置に基づいて前記基板の縁部の位置を特定する第1のステップと、
前記特定された前記基板の縁部の位置から前記基板の回転の影響を除去する第2のステップとを有することを特徴とする基板搬送方法。 - 前記第2のステップでは、前記特定された前記基板の縁部の位置を前記基板の回転角だけ回転移動させることを特徴とする請求項1記載の基板搬送方法。
- 前記搬送系は1リンク形式の搬送アームであることを特徴とする請求項1又は2記載の基板搬送方法。
- 基板を把持する把持部を有する搬送系と、前記基板の搬送軌道上に配置されたセンサと、制御部とを備え、前記搬送系は前記基板を搬送する際に前記基板を回転させる基板処理システムであって、
前記制御部は、前記基板の縁部が前記センサの対面を横切るときの前記把持部の位置、並びに、前記センサの位置に基づいて前記基板の縁部の位置を特定し、前記特定された前記基板の縁部の位置から前記基板の回転の影響を除去することを特徴とする基板処理システム。
Priority Applications (4)
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JP2016016863A JP6574715B2 (ja) | 2016-02-01 | 2016-02-01 | 基板搬送方法及び基板処理システム |
US15/414,703 US10319622B2 (en) | 2016-02-01 | 2017-01-25 | Substrate conveying method and substrate processing system |
TW106102804A TWI705035B (zh) | 2016-02-01 | 2017-01-25 | 基板搬送方法及基板處理系統 |
KR1020170012439A KR101901509B1 (ko) | 2016-02-01 | 2017-01-26 | 기판 반송 방법 및 기판 처리 시스템 |
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JP2016016863A JP6574715B2 (ja) | 2016-02-01 | 2016-02-01 | 基板搬送方法及び基板処理システム |
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JP2017139249A true JP2017139249A (ja) | 2017-08-10 |
JP6574715B2 JP6574715B2 (ja) | 2019-09-11 |
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US (1) | US10319622B2 (ja) |
JP (1) | JP6574715B2 (ja) |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20180122370A (ko) * | 2016-03-30 | 2018-11-12 | 도쿄엘렉트론가부시키가이샤 | 기판 반송 방법 및 기판 처리 시스템 |
JP2021530366A (ja) * | 2018-07-03 | 2021-11-11 | パーシモン テクノロジーズ コーポレイションPersimmon Technologies, Corp. | ロボットペイロード位置の決定及び補正のためのシステム及び方法 |
WO2023204143A1 (ja) * | 2022-04-20 | 2023-10-26 | 川崎重工業株式会社 | 基板搬送ロボットの制御装置及び基板搬送ロボットの制御方法 |
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US9640418B2 (en) * | 2015-05-15 | 2017-05-02 | Suss Microtec Lithography Gmbh | Apparatus, system, and method for handling aligned wafer pairs |
CN110668188B (zh) * | 2018-07-03 | 2021-07-30 | 日本电产三协株式会社 | 工业用机器人 |
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JPS6149205A (ja) * | 1984-08-16 | 1986-03-11 | Seiko Instr & Electronics Ltd | ロボツト制御方式 |
JPH0630012B2 (ja) | 1985-09-20 | 1994-04-20 | 株式会社日立製作所 | 産業用ロボツトの制御方法 |
JP2683208B2 (ja) * | 1993-01-28 | 1997-11-26 | アプライド マテリアルズ インコーポレイテッド | ロボット機構を用いた搬入および搬出のためのワークピース位置合わせ方法および装置 |
JP4199432B2 (ja) | 2001-03-30 | 2008-12-17 | 芝浦メカトロニクス株式会社 | ロボット装置及び処理装置 |
JP2004193344A (ja) | 2002-12-11 | 2004-07-08 | Tokyo Electron Ltd | 基板搬送装置及び基板搬送方法 |
JP5940342B2 (ja) | 2011-07-15 | 2016-06-29 | 東京エレクトロン株式会社 | 基板搬送装置、基板処理システムおよび基板搬送方法、ならびに記憶媒体 |
JP2015005682A (ja) * | 2013-06-24 | 2015-01-08 | シンフォニアテクノロジー株式会社 | 搬送ロボット、円盤状搬送対象物の搬送方法 |
JP6316082B2 (ja) * | 2014-04-30 | 2018-04-25 | 株式会社Screenホールディングス | 基板処理装置および基板処理方法 |
JP6281554B2 (ja) | 2015-10-15 | 2018-02-21 | 株式会社安川電機 | 教示治具、ロボット、教示システムおよび教示方法 |
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Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20180122370A (ko) * | 2016-03-30 | 2018-11-12 | 도쿄엘렉트론가부시키가이샤 | 기판 반송 방법 및 기판 처리 시스템 |
KR102128674B1 (ko) | 2016-03-30 | 2020-07-08 | 도쿄엘렉트론가부시키가이샤 | 기판 반송 방법 및 기판 처리 시스템 |
US11545381B2 (en) | 2016-03-30 | 2023-01-03 | Tokyo Electron Limited | Substrate transporting method and substrate processing system |
JP2021530366A (ja) * | 2018-07-03 | 2021-11-11 | パーシモン テクノロジーズ コーポレイションPersimmon Technologies, Corp. | ロボットペイロード位置の決定及び補正のためのシステム及び方法 |
JP7455800B2 (ja) | 2018-07-03 | 2024-03-26 | パーシモン テクノロジーズ コーポレイション | ロボットペイロード位置の決定及び補正のためのシステム及び方法 |
WO2023204143A1 (ja) * | 2022-04-20 | 2023-10-26 | 川崎重工業株式会社 | 基板搬送ロボットの制御装置及び基板搬送ロボットの制御方法 |
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TW201728516A (zh) | 2017-08-16 |
US10319622B2 (en) | 2019-06-11 |
TWI705035B (zh) | 2020-09-21 |
US20170221748A1 (en) | 2017-08-03 |
KR101901509B1 (ko) | 2018-09-21 |
KR20170091518A (ko) | 2017-08-09 |
JP6574715B2 (ja) | 2019-09-11 |
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