JP2017114014A - Resin molding die and resin molding apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin molding die and resin molding apparatus, capable of measuring a mold release force, achievable and excellent in versatility.SOLUTION: A resin molding die includes an ejector pin 44 and a mold release force measurement mechanism 50. The mold release force measurement mechanism 50 includes a strain inducing body 52 for converting a load into a strain and strain gauges stuck on strain portions of the strain inducing body 52. The strain inducing body 52 comprises: a fixed side end portion relatively immovably fixed to a resin molding die; a movable side end portion provided so as to contact a base end portion of the ejector pin 44; and a pair of upper and lower parallel beam portions extended in a direction intersecting the axial direction of the ejector pin from the fixed side end portion to the movable side end portion. The pair of upper and lower parallel beam portions have thin wall portions used as a strain portion and formed in a boundary portion between the fixed side end portion and the beam portions and a boundary portion between the movable side end portion and the beam portions. The strain gauges are stuck on the thin wall portions of the pair of upper and lower parallel beam portions.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a resin molding die and a resin molding apparatus used for molding a resin molded product.

  Conventionally, as a resin mold used for molding a resin molded product, an ejector pin that can be protruded from a mold surface that forms a cavity is built in, and by this ejector pin, a resin molded product molded in the cavity is removed from the mold surface. Those configured to be released from the mold are widely used. In this type of resin molding mold, if dirt such as residual resin adheres to the mold surface, the resin molded product will adhere firmly to the mold surface, so the resin molded product is released from the ejector pin. Force (release force) becomes excessive, and there is a risk of causing damage to the resin molded product or the ejector pin. In particular, in the case of a resin molded product (electronic component) in which a semiconductor element or the like is resin-sealed, it may cause a serious defect such as a crack in the internal semiconductor element due to an excessive release force.

  Therefore, in recent years, a quartz piezoelectric load washer (one form of load cell) is provided at the base end of the ejector pin, and the load applied to the ejector pin when the resin molded product is released by this quartz piezoelectric load washer was measured. There has been proposed a release force measuring device capable of measuring a release force by regarding the maximum load value as a release force (Patent Documents 1 and 2). According to such a release force measuring apparatus, it is theoretically easy to determine whether or not the release force is abnormal, so it is possible to easily determine whether or not a molding abnormality has occurred. .

JP 2003-236898 A JP 2009-96120 A

  However, since the release force measuring devices proposed in Patent Documents 1 and 2 use a crystal piezoelectric load washer as a load measuring means, there is a problem that it is difficult to realize or poor versatility.

  That is, in order to measure the load applied to the ejector pin by the quartz piezoelectric load washer, the quartz piezoelectric load washer is embedded directly below (or directly above) the ejector pin in the mold so as to be coaxial with the ejector pin. There is a need. In general, when an ejector pin having a diameter of, for example, about 1 mm is used, it is necessary to use a quartz piezoelectric load washer having a diameter of at least about 10 mm in order to ensure performance capable of withstanding a load at the time of release. is there. For this reason, in the release force measuring apparatus proposed in Patent Documents 1 and 2, a quartz crystal piezoelectric washer having a diameter larger than that of the ejector pin is embedded in the mold. However, depending on the shape or the like of the resin molded product, it is necessary to arrange a plurality of ejector pins densely in one cavity. In a resin mold in which such a plurality of ejector pins are arranged densely, Since the quartz piezoelectric load washer interferes with an adjacent ejector pin, there is a problem that the release force measuring device proposed in Patent Documents 1 and 2 cannot be employed.

  Accordingly, an object of the present invention is to provide a resin molding die and a resin molding apparatus that can measure the releasing force, are feasible, and have excellent versatility.

  In order to achieve the above object, a resin molding die according to the present invention is a resin molding die having a mold surface for forming a cavity for resin molding, and is configured to protrude from the mold surface. An ejector pin for releasing the resin molded product formed by the cavity from the mold surface and a base end portion of the ejector pin are provided to be received via the ejector pin when the resin molded product is released. A release force measuring mechanism capable of measuring a load, the release force measuring mechanism comprising: a strain body that converts the load into strain; and a strain gauge attached to a strain site of the strain body. The strain body includes a fixed side end fixed to the resin molding die so as not to be relatively movable, a movable side end provided in contact with a base end of the ejector pin, and the fixed side From the end to the movable side end A pair of upper and lower parallel beam portions extending in a direction intersecting the axial direction of the ejector pin, and the pair of upper and lower parallel beam portions are respectively a boundary portion with the fixed side end portion and the movable side end. A thin portion serving as the strain portion is formed at a boundary portion with the portion, and the strain gauges are respectively attached to the thin portions of the pair of upper and lower parallel beam portions.

  A resin molding die according to the present invention has a mold body having the mold surface on the front surface and a through hole through which the ejector pin can be inserted from the back surface to the mold surface, and the mold body. A base plate spaced apart on the back side, and the ejector pin provided at a position aligned with the through-hole between the mold body and the base plate so as to be movable back and forth with respect to the back surface of the mold body It is preferable to further include an ejector pin holder provided with a heat transfer member provided to connect the mold body and the base plate, and capable of transferring the heat of the base plate to the mold body. The fixed-side end portion of the strain body is fixed to the ejector pin holder, and the ejector pin holder and the strain body are provided apart from the base plate. Preferred.

  In the resin molding die according to the present invention, the ejector pin holder penetrates from the front surface to the back surface at a position aligned with the through hole of the mold main body, and can penetrate the base end portion of the ejector pin. A hole is formed, and the fixed side end of the strain generating body is fixed to the back surface of the ejector pin holder, and the movable side end of the strain generating body is inserted through the ejector pin holder. It is preferable to make contact with the proximal end portion of the ejector pin in the hole.

  In the resin molding die according to the present invention, a plurality of the ejector pins are provided for one of the cavities, and the strain generating body and the strain gauge are provided for one of the cavities. It is preferable to be provided on at least two of the plurality of ejector pins.

  A resin molding apparatus according to the present invention includes the above-described resin molding die and a transfer mechanism that supplies resin to the cavity.

  ADVANTAGE OF THE INVENTION According to this invention, the mold release force can be measured and the resin molding die and resin molding apparatus which were realizable and excellent in versatility can be provided.

It is a front perspective view showing a schematic structure of a resin sealing system concerning one embodiment of the present invention. It is a front view which shows roughly the resin molding apparatus which concerns on this embodiment. It is a front view which shows roughly the lower mold | type (resin molding metal mold | die) which concerns on this embodiment. It is an expanded sectional view which expands and shows schematic structure of the cross section along the AA 'line of FIG. It is an expanded sectional view which expands and shows schematic structure of the cross section along the BB 'line of FIG. FIG. 6A is a schematic configuration diagram illustrating a strain generating body at a normal time, and FIG. 6B is a schematic configuration diagram illustrating the strain generating body at the time of mold release. FIG. 7A is a schematic cross-sectional view showing a state in which the upper mold is opened after the resin sealing molding, and FIG. 7B is a diagram in which the resin molded product is released from the state of FIG. It is a schematic sectional drawing which shows the state.

  DESCRIPTION OF EMBODIMENTS Hereinafter, preferred embodiments for carrying out the present invention will be described with reference to the drawings. The following embodiments do not limit the invention according to each claim, and all combinations of features described in the embodiments are not necessarily essential to the solution means of the invention. .

  As shown in FIG. 1, a resin sealing system 1 according to this embodiment includes a resin sealing device (resin molding device) 10 that performs resin sealing molding, and a workpiece (this embodiment) with respect to the resin sealing device 10. , A lead frame W) and a work / tablet supply mechanism 60 for supplying a resin tablet, and a resin molded product recovery mechanism 70 for recovering the resin molded product P after resin sealing from the resin sealing device 10. From supply of the lead frame W and the resin tablet to the sealing device 10 to collection of the resin molded product P after resin sealing is configured to be automatically and continuously executable.

  The work / tablet supply mechanism 60 and the resin molded product collection mechanism 70 are provided on a long base 80 extending in the direction of both sides of the resin sealing device 10, and the resin sealing device 10 is substantially at the center of the base 80. It is accommodated in the accommodation space formed in the part. In the resin sealing system 1 according to the present embodiment, the work / tablet supply mechanism 60 is disposed on one side surface (left side in FIG. 1) of the resin sealing device 10 around the resin sealing device 10. A resin molded product recovery mechanism 70 is arranged on the other side surface side (the right side in FIG. 1) of the resin sealing device 10. That is, in the resin sealing system 1 according to the present embodiment, the lead frame W and the resin tablet are supplied from the region on one end side of the base 80 (the region on the left end side in FIG. 1), and the longitudinal direction of the base 80 After the resin sealing molding is performed in the substantially central region of the above, unnecessary resin (a mold cured at the cal, runner and gate portion) in the region on the other end side of the base 80 (the region on the left end side in FIG. 1). Part) is removed (gate break) and the resin molded product P is collected.

  As shown in FIGS. 1 and 2, the resin sealing device 10 includes a rectangular plate-like lower platen 12 placed on a floor surface, and four tie bars 14 extending upward from four corners of the lower platen 12. A rectangular plate-like upper platen 16 having four corners connected to the upper ends of the four tie bars 14, and four tie bars 14 passing through the four corners, along the tie bar 14 between the lower platen 12 and the upper platen 16. The plate-shaped movable platen 18 provided so as to be movable up and down, the lift plate clamping mechanism 20 provided between the lower platen 12 and the movable platen 18 and moving the movable platen 18 up and down, and the resin sealing device 10 are abnormal. And a control unit (not shown) for performing various controls of the resin sealing device 10 are provided. The elevating mold clamping mechanism 20 can employ various mold clamping mechanisms such as a hydraulic or electric mold clamping cylinder and a hydraulic or electric toggle link mold clamping mechanism. In the resin sealing device 10 according to this embodiment, the lower platen 12, the tie bar 14, the upper platen 16, the movable platen 18, and the lifting mold clamping mechanism 20 can employ various known configurations. Therefore, the detailed description is abbreviate | omitted.

  Further, as shown in FIG. 2, the resin sealing device 10 includes a transfer mechanism 22 provided on the upper surface of the movable platen 18, and a resin molding die 26 provided between the upper platen 16 and the transfer mechanism 22. Is further provided. In the resin sealing device 10 according to the present embodiment, the transfer mechanism 22 communicates with the cavity C of the resin molding die 26 and accommodates a resin tablet (not shown) as shown in FIGS. 4 and 5. A plurality of possible (in this embodiment, five) accommodation pot forming hole portions 24a and resin tablets that are arranged for each of the accommodation pot forming hole portions 24a and that are accommodated in the accommodation pot forming hole portion 24a face the cavity C. Since various known transfer mechanisms including a plunger 24b to be pushed out and a heating means (not shown) for heating the resin molding die 26 and the accommodation pot forming hole 24a can be employed, detailed description thereof will be given. Is omitted.

  The resin molding die 26 is a so-called multi-pot molding die, and as shown in FIG. 2, an upper die 28 attached to the lower surface of the upper platen 16 and an upper portion of the transfer mechanism 22. 28 and a lower mold 30 capable of forming a cavity C (see FIG. 4). In FIGS. 2 to 7, the holder blocks 31 a to 31 c (see FIG. 1) that cover the periphery of the lower mold 30 are omitted for easy understanding. In the resin molding die 26 according to the present embodiment, the upper die 28 includes a cull portion 29a, a runner portion 29b, a gate portion 29c, and a cavity portion for allowing the resin to flow on the lower surface (mold surface) of the die body 28a. Except for minor differences in specifications (see FIG. 4) such as the point where 29d is formed, the structure is basically symmetrical with the lower mold 30, so the description and illustration of the internal structure are omitted. To do.

  As shown in FIGS. 3 and 4, the lower mold 30 is disposed to face the mold body 28 a of the upper mold 28, and forms a resin molding cavity C between the upper mold 28 and the mold body 28 a. A possible mold body 32, a base plate 34 spaced apart on the back surface (lower surface) side of the mold body 32, and the back and forth of the mold body 32 between the mold body 32 and the base plate 34. The ejector mechanism 40 provided in a movable manner, the mold body 32 and the base plate 34 are connected and fixed to support the mold body 32 when the press mold is clamped, and the heat of the base plate 34 can be transmitted to the mold body 32. And a release force measuring mechanism 50 attached to the ejector mechanism 40 and configured to measure the release force when the resin molded product P is released. Have

  As shown in FIG. 4, the mold body 32 is a rectangular plate-shaped metal member having a mold surface 32 a on the surface (upper surface) capable of forming a cavity C together with the cavity portion 29 d of the mold body 28 a of the upper mold 28. . A through hole 32b through which the ejector pin 44 can be inserted from the back surface to the mold surface 32a is formed in the mold main body 32 at a position aligned with an ejector pin 44 described later of the ejector mechanism 40.

  The base plate 34 is formed from a rectangular plate-shaped metal member and is placed on the upper surface of the transfer mechanism 22. The base plate 34 supports the mold main body 32 via the heat transfer member 36 and transmits heat received from the transfer mechanism 22 to the mold main body 32 via the heat transfer member 36 to heat the mold main body 32. It is configured to let you. In the resin sealing device 10 according to this embodiment, the transfer mechanism 22 is provided with heating means, and the heat of the heating means is transferred to the base plate 34. However, the present invention is not limited to this, and the base plate 34 is not limited thereto. It is good also as a structure by which a heating means (not shown) is provided in the inside of the inside of the mold body 32.

  The heat transfer member 36 is a support pillar formed of a cylindrical metal member. One end (lower end) is fixed to the upper surface of the base plate 34, and the other end (upper end) is the mold main body 32. By being fixed to the back surface, the mold body 32 is supported at a position spaced from the base plate 34. The heat transfer member 36 is configured to transmit the heat of the base plate 34 heated by the heating means to the mold body 32 and to heat the mold body 32 to a predetermined temperature. As shown in FIGS. 3 to 5, a plurality of heat transfer members 36 (six in this embodiment) are provided for one cavity C, and the plurality of heat transfer members 36 are provided around each cavity C. By being arranged so as to surround, the bending of the mold body 32 around each cavity C is suppressed, and the generation of burrs and the like is suppressed.

  As shown in FIGS. 3 and 4, the ejector mechanism 40 includes an ejector pin holder 42 provided between the mold body 32 and the base plate 34 so as to be movable back and forth with respect to the back surface of the mold body 32, and a mold. The ejector pin 44 is provided with an ejector pin 44 disposed at a position aligned with the through hole 32b of the main body 32, and drive means (not shown) for moving the ejector pin holder 42 forward and backward relative to the back surface of the mold main body 32. 42, the ejector pin 44 is protruded from the mold surface 32a of the mold body 32 by advancing the back surface of the mold body 32, and the resin molded product P molded by the cavity C is used as the mold surface of the mold body 32. It is comprised so that it may release from 32a. The drive means supports the ejector pin holder 42 at a position where an ejector pin holder 42 and a later-described strain body 52 attached to the ejector pin holder 42 are separated from the base plate 32, and holds the ejector pin holder 42 when the resin molded product P is released. It is configured to advance toward the mold body 32. In the ejector mechanism 40 according to the present embodiment, various known configurations such as an electric motor drive and an ejector rod push-up by a press lowering operation can be adopted as the drive means, and the description thereof is omitted. To do.

  The ejector pin holder 42 includes an ejector plate 42a in which an ejector pin 44 projects toward the mold body 32, and a backing plate 42b attached to the back surface of the ejector plate 42a by a fastener and reinforcing the ejector plate 42a. ing. As shown in FIG. 4, the ejector pin holder 42 is formed with a through hole 43 penetrating from the front surface to the back surface at a position aligned with the through hole 32 b of the mold body 32. The through-hole 43 has a stepped shape such that the opening diameter on the front surface side of the ejector plate 42a is smaller than the opening diameter on the back surface side of the backing plate 42b, and the base end portion 44b of the ejector pin 44 in the inside thereof. Can be accommodated. Further, the ejector pin holder 42 is formed with a heat transfer member through hole (not shown) through which the heat transfer member 36 penetrates at a position aligned with the heat transfer member 36. The through hole for heat transfer member has an opening diameter larger than the outer diameter of the heat transfer member 36 so as not to contact the peripheral surface of the heat transfer member 36.

  As shown in FIG. 4, the ejector pin 44 is a stepped pin member including a pin portion 44a extending toward the mold main body 32 and a base end portion 44b formed with a larger diameter than the pin portion 44a. . The pin portion 44a has an axial length that is substantially flush with the mold surface 32a of the mold body 32 in a state where the ejector pin holder 42 is located at the standby position (position shown in FIG. 4). doing. The pin portion 44 a has an outer diameter that is smaller than the opening diameter on the surface side of the through hole 43 of the ejector pin holder 42 and substantially equal to the opening diameter of the through hole 32 b of the mold body 32. The base end portion 44 b has an outer diameter that is larger than the opening diameter on the front surface side of the through hole 43 of the ejector pin holder 42 and smaller than the opening diameter on the back surface side of the through hole 43 of the ejector pin holder 42. . The ejector pin 44 is configured such that the base end portion 44b is accommodated in the through hole 43 of the ejector pin holder 42 and the pin portion 44a protrudes toward the mold body 32 through the through hole 43. The base end portion 44b is held between the stepped portion of the through-hole 43 of the 42 and the movable side end portion 52b of the strain-generating body 52, which will be described later, of the release force measuring mechanism 50, thereby being attached to the ejector pin holder 42. Yes. A plurality (two in this embodiment) of ejector pins 44 are provided for one cavity C, and the resin molded product P is evenly released by the plurality of ejector pins 44.

  The release force measuring mechanism 50 is a so-called Robertal type load cell, and as shown in FIG. 4, a strain generating body 52 that is deformed in proportion to a load received from the ejector pin 44 and a deformation amount of the strain generating body 52 are detected. Strain gauges 54a to 54d. The strain body 52 is attached to the ejector pin holder 42 so as to come into contact with the base end portion 44b of the ejector pin 44, and the strain gauges 54a to 54d are provided with four strain sites (thin portions 53a described later) of the strain body 52. To 53d). The release force measuring mechanisms 50 are arranged for each ejector pin 44. In this embodiment, two release force measuring mechanisms 50 are arranged for each cavity C as shown in FIGS. As shown in FIG. 5, each release force measuring mechanism 50 is provided in a gap between the plurality of heat transfer members 36 so as not to interfere with another adjacent release force measurement mechanism 50 and the heat transfer member 36. Yes. Hereinafter, specific configurations of the strain generating body 52 and the strain gauges 54a to 54d will be described.

  As shown in FIG. 6A, the strain body 52 is a plate-like member having a substantially L-shaped vertical section that is erected so as to be perpendicular to the lower surface of the ejector pin holder 42. A notch in the form of an iron array is formed at a portion extending in the horizontal direction of the L-shaped portion, and a portion extending in the L-shaped vertical direction is in contact with the base end portion 44 b of the ejector pin 44 in the through hole 43 of the ejector pin holder 42. The vicinity of the end of the L-shaped portion extending in the horizontal direction is fixed to the back surface of the ejector pin holder 42 so as to be cantilevered. Specifically, the strain body 52 includes a fixed-side end portion 52a fixed to the back surface of the ejector pin holder 42, a movable-side end portion 52b provided in contact with the base end portion 44b of the ejector pin 44, A pair of upper and lower parallel beam portions 52c and 52d extending in a direction crossing the axial direction of the ejector pin 44 from the fixed side end 52a to the movable side end 52b is provided. The strain generating body 52 has a movable side end portion 52b extending from the lower surface of the base end portion 44b of the ejector pin 44 along the axial direction of the ejector pin 44, and a pair of upper and lower parallel beam portions 52c and 52d are movable side end portions 52b. A shape extending from the vicinity of the lower end of the ejector pin 44 along the direction orthogonal to the axial direction of the ejector pin 44, and the fixed-side end portion 52a continuously extending in the same direction with the pair of upper and lower parallel beam portions 52c and 52d, that is, substantially L-shaped Is formed.

  As shown in FIGS. 4 and 6A, the fixed side end 52 a is fixed to the back surface of the ejector pin holder 42 with a fastener so that it cannot move relative to the entire lower mold 30. The movable end 52b is configured such that its upper end contacts the lower surface of the base end 44b of the ejector pin 44 and its lower end continues to one end of the pair of upper and lower parallel beam portions 52c and 52d. A pair of upper and lower parallel beam portions 52c and 52d are deformed in accordance with the load from the ejector pin 44 at the boundary portion with the fixed side end portion 52a and the boundary portion with the movable side end portion 52b (distortion portion). The semi-circular thin portions 53a to 53d are formed, so that a pair of upper and lower parallel beam portions 52c and 52d, a fixed-side end portion 52a, and a movable-side end portion 52b are cut into an iron array shape. The notch is configured to be defined. The positions where the strain gauges 54a to 54d in the thin portions 53a to 53d of the pair of upper and lower parallel beam portions 52c and 52d are attached are the positions (center positions) to which the strain gauges 54a to 54d are attached, respectively, during the manufacturing process. A marking line (not shown) for specifying is processed, and is configured to improve workability and accuracy of the attaching work of the strain gauges 54a to 54d.

  By configuring the strain generating body 52 in this way, when a load is applied via the ejector pin 44 at the time of mold release, as shown in FIG. 6B, the upper parallel beam portion 52c is movable. The thin part 53a on the side end part 52b side and the thin part 53d on the fixed side end part 52a side of the lower parallel beam part 52d are distorted in the compression direction, and the thin part on the fixed side end part 52a side of the upper parallel beam part 52c. 53b and the thin part 53c on the movable side end 52b side of the lower parallel beam part 52d are configured to be distorted in the extending direction.

  The strain gauges 54a to 54d are configured so that the electric resistance changes according to the strain, and as shown in FIGS. 6A and 6B, the movable side end 52b of the upper parallel beam portion 52c. The first strain gauge 54a attached to the thin portion 53a on the side, the second strain gauge 54b attached to the thin portion 53b on the fixed side end portion 52a side of the upper parallel beam portion 52c, and the lower parallel portion. The third strain gauge 54c attached to the thin portion 53c on the movable side end 52b side of the beam portion 52d, and the thin portion 53d on the fixed side end portion 52a side of the lower parallel beam portion 52d. 4 strain gauges 54d. These four strain gauges 54a to 54d are connected to each other so as to constitute a Wheatstone bridge circuit (not shown).

  A Wheatstone bridge circuit formed for each release force measuring mechanism 50 is electrically connected to a data collection / analysis means (not shown) and an electrical amplifier via an amplifier (not shown) and an A / D converter (not shown). It is connected to the. In this embodiment, a plurality of mold release force measuring mechanisms 50, amplifiers and A / D converters, and a common data collection and analysis means can collectively measure mold release forces at the time of mold release in all cavities C. A mold release force measuring device is configured.

  The data collection and analysis means is composed of, for example, a personal computer, calculates strain values based on the resistance values of the strain gauges 54a to 54d, and on the movable side of the strain generating body 52 via the ejector pins 44 based on the strain values. The load applied to the end portion 52b, that is, the mold release force at the time of mold release is measured.

  The data collection and analysis unit is configured to determine a release failure based on the measured load (release force) and to output a notification signal to the notification unit when it is determined that the release is defective. Specifically, the data collection and analysis means, for example, (1) a single value of the measured load (release force), (2) real time of the load (release force) measured within a predetermined cycle or time Average value, (3) difference between measured load (release force) and previous average value, (4) rate of increase of measured load (release force), (5) average value calculated in real time Or when the variation (difference) in the load (release force) measured by a plurality of release force measuring mechanisms 50 exceeds a predetermined set value (threshold value). It is comprised so that it may determine with a type defect. In particular, according to the determination method of (6) above, it is possible to detect local dirt in one cavity C, to predict or identify the dirt spot, and to easily attach dirt. It is also possible to perform trend analysis of places and the like.

  The notification means is configured to issue an alarm when receiving a notification signal from the data collection analysis means. As an aspect of the alarm by such an informing means, in addition to an aspect in which an alarm sound is sounded, for example, an aspect in which a lamp or the like is lit, a display screen or resin provided in the resin sealing device 10 A mode for displaying a message on a display screen of a personal computer or the like connected to the sealing device 10, a mode for visually informing a mode such as a mode in which a part or the whole of the display screen blinks or lights in a predetermined color, etc. It is possible to adopt as appropriate. Such an alarm by the notification means enables the operator to recognize the occurrence of dirt on the mold surface 32a (necessity of cleaning), and damage or appearance of the resin molded product P due to defective release. Defects can be predicted.

  As shown in FIG. 4, the resin sealing device 10 according to the present embodiment having the above-described configuration adds molten mold material by the plunger 24b with the lead frame W sandwiched between the upper mold 28 and the lower mold 30. By pressing and flowing in the order of the cull part 29a → runner part 29b → gate part 29c → cavity part 29d of the upper mold 28 and thermosetting, the electronic component arranged in the cavity C is molded, and the resin molded product P Is configured to manufacture. In addition, the resin sealing device 10 according to the present embodiment lowers the lower plate 30 from the upper die 28 by lowering the movable platen 18 after completion of the molding of the electronic component, and in parallel or synchronously with this, The resin molded product P is released from the mold surface of the upper mold 28 by an ejector mechanism (not shown) built in the mold 28. Furthermore, as shown in FIG. 7A, the resin sealing device 10 according to the present embodiment separates the lower mold 30 from the upper mold 28 and then ejects the ejector mechanism 40 as shown in FIG. 7B. Thus, the resin molded product P is released from the mold surface 32a of the lower mold 30. The resin sealing device 10 according to the present embodiment also releases the resin molded product P from the mold surface of the upper mold 28 and releases the resin molded product P from the mold surface 32a of the lower mold 30. The release force is measured or monitored in real time by a release force measuring mechanism 50 (release force measuring device), and when a release failure is detected, an alarm is issued by an informing means.

  As shown in FIG. 1, the work / tablet supply mechanism 60 includes a work / tablet transport device 62 that transports the lead frame W (work) and the resin tablet between the upper mold 28 and the lower mold 30 of the resin sealing device 10. A rack 64 that houses a plurality of lead frames W, a work supply device (pusher) 66 that sends the lead frames W housed in the rack 64 one by one to the work / tablet transport device 62, and a work / tablet transport device The tablet supply device 68 that supplies the resin tablet to 62, the work / tablet transport device 62, the drive unit (not shown) provided in the work supply device 66, and the tablet supply device 68, and the respective drive units are synchronized. Alternatively, a control unit (not shown) that controls in an asynchronous state is provided. The work / tablet supply mechanism 60 is configured to automatically execute the supply of the lead frame W and the resin tablet to the resin sealing device 10 under the control of the control unit.

  As shown in FIG. 1, the resin molded product recovery mechanism 70 includes a carry-out device 72 for carrying out a resin molded product P with unnecessary resin from the resin sealing device 10, and unnecessary resin molded integrally with the resin molded product P. A gate break device 74 that separates unnecessary resin from the resin molded product P by pressing from above, a collection container 76 that collects the separated and dropped unnecessary resin, and a resin molded product P from which unnecessary resin has been removed is collected. Resin molded product collection device 78, drive unit 72, gate break device 74 and drive unit (not shown) provided in resin molded product collection device 78, and each drive unit are controlled synchronously or asynchronously. And a control unit (not shown). The resin molded product collection device 78 includes a transport device 78a provided so as to be capable of reciprocating between a gate break position and a resin molded product collection position, a rack 78b from which the resin molded product P is collected, and a resin molded product collection position. A delivery device (pusher) 78c for delivering the resin molded product P mounted on the transport device 78a that has reached the rack 78b is provided. The resin molded product recovery mechanism 70 is controlled by the control unit to carry out the resin molded product P with unnecessary resin from the resin sealing device 10, remove unnecessary resin from the resin molded product P, and remove unnecessary resin. The resin molded product P can be automatically collected.

  Next, operation | movement of the resin sealing system 1 which concerns on this embodiment is demonstrated. In addition, the operation | movement of the following resin sealing systems 1 is performed by drive-controlling each component based on the program previously memorize | stored in the memory | storage part.

  First, the lead frames W are sent out one by one from the rack 64 toward the work / tablet transport device 62 by the work supply device 66. In parallel with this, a plurality (five in this embodiment) of resin tablets are delivered from the tablet supply device 68 to the work / tablet transport device 62. When the lead frame W and the resin tablet are delivered to the work tablet transport device 62, the work tablet transport device 62 moves into the resin sealing device 10 while holding the received lead frame W and resin tablet, The lead frame W is placed on the mold body 32 of the lower mold 30 and the resin tablet is dropped into the accommodation pot forming hole 24 a of the transfer mechanism 22.

  When the lead frame W and the resin tablet are delivered to the resin sealing device 10, the resin sealing device 10 performs resin sealing molding. Specifically, the resin sealing device 10 is a mold that is melted in the accommodation pot forming hole portion 24a in a state where the lead frame W is sandwiched between the upper die 28 and the lower die 30 so that the electronic component is located in the cavity C. The resin molded product P is transfer molded by causing the material to flow into the cavity C by the plunger 24b and thermosetting the mold material flowing into the cavity C. In addition, the resin sealing device 10 is built in the upper mold 28 in parallel with or in synchronization with the lower mold 30 by lowering the movable platen 18 after the molding of the electronic components is completed and lowering the movable platen 18. The resin molded product P is released from the mold surface of the upper mold 28 by the ejector mechanism. Further, in the resin sealing device 10 according to the present embodiment, after the lower mold 30 is separated from the upper mold 28, the resin molded product P is released from the mold surface 32 a of the lower mold 30 by the ejector mechanism 40. At this time, the resin sealing device 10 measures or monitors the release force when releasing the resin molded product P in real time by the release force measuring mechanism 50 (release force measuring device), and detects a release failure. When this happens, an alarm is issued by the notification means.

  The carry-out device 72 collects the resin molded product P with unnecessary resin in the resin sealing device 10 and conveys it toward the gate break device 74. When the resin molded product P with unnecessary resin reaches the gate break device 74 by the carry-out device 72, the gate break device 74 causes the unnecessary resin adhering to the resin molded product P to be separated from the resin molded product P by pressing from above. Thus, the unnecessary resin dropped is collected in the collection container 76. Further, the resin molded product P from which unnecessary resin has been removed is collected by the resin molded product collection device 78.

  And the resin molding P is automatically manufactured continuously by performing the above process repeatedly.

  As described above, the resin molding die 26 according to the present embodiment is a resin molding die having a mold surface 32a for forming a cavity C for resin molding, and is configured to protrude from the mold surface 32a. The ejector pin 44 for releasing the resin molded product P formed by the cavity C from the mold surface 32a and the base end portion 44b of the ejector pin 44 are provided so as to come into contact with the ejector pin 44 when the resin molded product P is released. A release force measuring mechanism 50 capable of measuring a load received via the strain. The release force measuring mechanism 50 includes a strain generating body 52 that converts the load into strain, and a strain portion (thin portion) of the strain generating body 52. 53a to 53d), and the strain generating body 52 includes a fixed-side end portion 52a fixed to the resin molding die 26 so as not to be relatively movable, and a base end of the ejector pin 44. Part 4 and a pair of upper and lower parallel beam portions 52c and 52d extending in a direction intersecting the axial direction of the ejector pin 44 from the fixed side end 52a to the movable side end 52b. Each of the pair of upper and lower parallel beam portions 52c and 52d is formed with thin portions 53a to 53d serving as distortion portions at the boundary portion with the fixed side end portion 52a and the boundary portion with the movable side end portion 52b, respectively. The strain gauges 54a to 54d are attached to the thin portions 53a to 53d of the pair of upper and lower parallel beam portions 52c and 52d, respectively.

  As described above, since the resin molding die 26 according to the present embodiment includes the release force measuring mechanism 50, it is possible to detect a release failure. It is possible to recognize the possibility of occurrence of dirt (necessity of cleaning), breakage of the resin molded product P due to defective release, poor appearance, and the like. Such an advantage is automatic, from the supply of the lead frame W and the resin tablet to the resin sealing device 10 to the collection of the resin molded product P after the resin sealing, like the resin sealing system 1 according to the present embodiment. This is particularly effective in a fully automatic system that executes continuously.

  Further, the resin molding die 26 according to the present embodiment is configured to measure the load of the ejector pin 44 by a release force measuring mechanism 50 (Roberval type load cell) mainly extending in a direction intersecting the axial direction of the ejector pin 44. Therefore, compared to the case of using a large-diameter quartz piezoelectric load washer that needs to be embedded directly under the ejector pin 44, the number of installed release force measuring mechanisms 50 and the degree of freedom of arrangement can be improved. it can. That is, according to the resin mold 26 according to the present embodiment, the extending directions of the release force measuring mechanisms 50 are shifted so that adjacent release force measuring mechanisms 50 do not interfere with each other. Therefore, for example, it is possible to realize a configuration in which the release force measuring mechanism 50 is provided on all of the ejector pins 44 that are densely provided.

  In addition, as described above, the resin molding die 26 according to the present embodiment has the mold surface 32a on the front surface, and the through hole 32b into which the ejector pin 44 can be inserted from the back surface to the mold surface 32a. A mold main body 32, a base plate 34 spaced apart on the back side of the mold main body 32, and a back and forth movement with respect to the back surface of the mold main body 32 between the mold main body 32 and the base plate 34. An ejector pin holder 42 in which an ejector pin 44 is arranged at a position aligned with the through hole 32b, a mold body 32, and a base plate 34 are provided so as to be connected to each other, and heat from the base plate 34 can be transmitted to the mold body 32. And a fixed-side end portion 52a of the strain generating body 52 is fixed to the ejector pin holder 42. The ejector pin holder 42 and the strain generating body 52 are It is disposed away from the base plate 34.

  According to such a resin molding die 26, it is possible to reduce the influence of heat on the release force measuring mechanism 50. That is, in the mold release force measuring apparatus proposed in Patent Documents 1 and 2, it is necessary to embed a quartz piezoelectric load washer in a high-temperature mold, and the measurement value is easily affected by the heat of the mold. However, there is a problem that the reliability of the mold is not sufficient, and the release force measuring device is liable to be deteriorated. In contrast, in the resin molding die 26 according to the present embodiment, the base plate 34 in which the strain body 52 provided with the strain gauges 54a to 54d and the ejector pin holder 42 provided with the strain body 52 are heated. As a result, it is possible to reduce the influence of heat on the release force measuring mechanism 50 as compared with the case of using a conventional quartz piezoelectric load washer that needs to be embedded directly under the ejector pin 44. It becomes possible. In particular, in the release force measuring mechanism 50 according to the present embodiment, the strain-generating body 52 is formed of a plate-like member that is erected vertically on the lower surface of the ejector pin holder 42, so that the ejector pin holder 42 Since the contact area (heat transfer area) can be reduced and the heat dissipation area can be increased, there is a further advantage of excellent heat dissipation.

  Furthermore, in the mold release force measuring device proposed in Patent Documents 1 and 2, it is necessary to embed a crystal piezoelectric load washer in the mold, so that the wiring space for the mold release force measuring apparatus is secured in the mold. Difficult to do. On the other hand, in the resin molding die 26 according to the present embodiment, the space between the mold body 32 and the base plate 34 can be used as a wiring space, so that a sufficient wiring space can be secured. It becomes possible.

  The preferred embodiment of the present invention has been described above, but the technical scope of the present invention is not limited to the scope described in the above-described embodiment. Various modifications or improvements can be added to the above embodiments.

  For example, in the above-described embodiment, the work / tablet supply mechanism 60 is arranged on one side surface of the resin sealing device 10 around the resin sealing device 10, and the resin is provided on the other side surface of the resin sealing device 10. Although the description has been given assuming that the molded product recovery mechanism 70 is disposed, the present invention is not limited to this, and the layout relationship of the resin sealing device 10, the work / tablet supply mechanism 60, and the resin molded product recovery mechanism 70 should be changed as appropriate. Is possible. In addition, the configuration and arrangement of each component in the work / tablet supply mechanism 60 and the resin molded product collection mechanism 70 can be changed as appropriate.

  In the embodiment described above, the resin molding apparatus is described as the resin sealing apparatus 10 that performs resin sealing molding. However, the present invention is not limited to this, and may be, for example, an injection molding apparatus.

  In the above-described embodiments, the workpiece to be resin-sealed is described as being the lead frame W. However, the present invention is not limited to this, and may be an electronic component board on which an electronic component is mounted. In this case, the mold release force measuring mechanism 50 according to this embodiment may be provided only in a mold that forms a cavity between the upper mold and the lower mold with the electronic component substrate.

  In the above-described embodiment, two ejector pins 44 are provided for one cavity C. However, the present invention is not limited to this, and only one or three or more may be provided. It is also good.

  In the above-described embodiment, it has been described that the release force measuring mechanism 50 (the strain generating body 52 and the strain gauges 54a to 54d) is provided for all the ejector pins 44. However, the present invention is not limited to this. It is sufficient that at least one release force measuring mechanism 50 is provided for the plurality of cavities C, and an ejector pin 44 that does not include the release force measuring mechanism 50 may be provided. That is, the release force measuring mechanism 50 (the strain-generating body 52 and the strain gauges 54a to 54d) may be configured to be provided on all of one or a plurality of ejector pins 44 provided for one cavity C. It is good also as a structure provided in one of the two or more ejector pins 44 provided with respect to one cavity C, and among the three or more ejector pins 44 provided with respect to one cavity C It is good also as a structure provided in two or more. Further, the configuration is not limited to the configuration in which the release force measuring mechanism 50 is provided for all the cavities C in the resin molding die 26, and a configuration in which a cavity C in which the release force measuring mechanism 50 is not provided may exist. . Thus, even when there is a cavity C where the release force measuring mechanism 50 is not provided, it is possible to sample the release force. In these cases, the ejector pin 44 not provided with the release force measuring mechanism 50 (the strain-generating body 52 and the strain gauges 54a to 54d) is configured such that the base end portion 44b is embedded in the ejector pin holder 42. be able to.

  In the above-described embodiment, the thin portions 53a to 53d of the strain generating body 52 are formed in a semicircular shape, so that the strain generating body 52 is shaped like an iron array (a shape in which perfect circular openings are connected by narrow grooves). Although the description has been given assuming that the notch is defined, the shape of the notch formed in the strain body 52 is not particularly limited, for example, a shape in which both ends of an oval shape or a square shape are connected by narrow grooves. Various shapes such as (barbell shape) can be employed. That is, the strain generating body 52 is formed with thin portions 53a to 53d which are strained portions at the boundary portion between the pair of upper and lower parallel beam portions 52c and 52d with the fixed side end portion 52a and the boundary portion with the movable side end portion 52b, respectively. The shape of the thin portions 53a to 53d is not particularly limited.

  DESCRIPTION OF SYMBOLS 1 Resin sealing system, 10 Resin molding apparatus, 22 Transfer mechanism, 26 Resin mold, 28 Upper mold, 30 Lower mold, 32 Mold main body, 32a Mold surface, 32b Through hole of mold main body, 34 Base plate, 36 Heat transfer member, 42 Ejector pin holder, 43 Ejector pin holder through hole, 44 Ejector pin, 44b Ejector pin base end, 50 Release force measuring mechanism, 52 Strain generator, 52a Fixed side end, 52b Movable side End, 52c, 52d Parallel beam part, 53a to 53d Thin part, 54a to 54d Strain gauge, C cavity, P resin molded product, W lead frame

Claims (5)

A resin mold having a mold surface for forming a cavity for resin molding,
An ejector pin configured to protrude from the mold surface, and to release the resin molded product molded by the cavity from the mold surface;
A release force measuring mechanism provided so as to be in contact with a base end portion of the ejector pin, and capable of measuring a load received through the ejector pin when releasing the resin molded product;
The mold release force measuring mechanism includes a strain body that converts the load into strain, and a strain gauge attached to a strain site of the strain body,
The strain body includes a fixed side end fixed to the resin molding die so as not to be relatively movable, a movable side end provided in contact with a base end of the ejector pin, and the fixed side end. A pair of upper and lower parallel beam portions extending in a direction intersecting with the axial direction of the ejector pin over the movable side end portion,
Each of the pair of upper and lower parallel beam portions is formed with a thin portion that becomes the distortion portion at a boundary portion with the fixed side end portion and a boundary portion with the movable side end portion,
The strain gauges are respectively attached to the thin portions of the pair of upper and lower parallel beam portions. A mold main body having the mold surface on the front surface, and a through hole into which the ejector pin can be inserted from the back surface to the mold surface;
A base plate spaced apart on the back side of the mold body;
An ejector pin holder provided between the mold body and the base plate so as to be movable back and forth with respect to the back surface of the mold body, the ejector pin holder being disposed at a position aligned with the through hole;
A heat transfer member provided to connect the mold body and the base plate, and capable of transferring heat of the base plate to the mold body;
The fixed-side end portion of the strain body is fixed to the ejector pin holder,
The resin molding die according to claim 1, wherein the ejector pin holder and the strain generating body are provided apart from the base plate. The ejector pin holder penetrates from the front surface to the back surface at a position aligned with the through hole of the mold body, and a through hole capable of accommodating the base end portion of the ejector pin is formed.
The fixed-side end portion of the strain body is fixed to the back surface of the ejector pin holder,
The resin molding die according to claim 2, wherein the movable side end of the strain generating body is in contact with a base end of the ejector pin in the through hole of the ejector pin holder. A plurality of the ejector pins are provided for one of the cavities,
The said strain body and the said strain gauge are provided in at least 2 or more of these several ejector pins provided with respect to one said cavity. The Claim 1 characterized by the above-mentioned. The resin molding die described. The resin molding die according to any one of claims 1 to 4,
And a transfer mechanism for supplying resin to the cavity.

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