JP6944243B2 - Resin molding mold and resin molding equipment - Google Patents

Description

The present invention relates to a resin molding die and a resin molding apparatus used for molding a resin molded product.

Conventionally, as a resin molding mold used for molding a resin molded product, an ejector pin that can protrude from the mold surface forming the cavity is built in, and the resin molded product molded in the cavity is ejected from the mold surface by this ejector pin. Those configured to be demolded are widely used. In this type of resin molding mold, if dirt such as residual resin adheres to the mold surface, the resin molded product adheres firmly to the mold surface, so the resin molded product is released by the ejector pin. The force (release force) at that time becomes excessive, which may cause damage to the resin molded product and the ejector pin. In particular, in the case of a resin molded product (electronic component) in which the semiconductor element or the like is resin-sealed, a serious defect such as a crack in the internal semiconductor element due to an excessive mold release force may occur.

Therefore, in recent years, a crystal piezoelectric load washer (a form of load cell) is provided at the base end of the ejector pin, and the load applied to the ejector pin at the time of mold release of the resin molded product is measured and measured by this crystal piezoelectric load washer. A mold release force measuring device capable of measuring the mold release force by regarding the maximum value of the load as the mold release force has been proposed (Patent Documents 1 and 2). According to such a mold release force measuring device, theoretically, it is easy to determine whether or not the mold release force is abnormal, so that it is possible to easily determine whether or not a molding abnormality has occurred. ..

Japanese Unexamined Patent Publication No. 2003-236898 Japanese Unexamined Patent Publication No. 2009-96120

However, since the release force measuring device proposed in Patent Documents 1 and 2 uses a crystal piezoelectric load washer as a load measuring means, there is a problem that it is difficult to realize or lacks versatility.

That is, in order to measure the load applied to the ejector pin by the crystal piezoelectric load washer, the crystal piezoelectric load washer is embedded directly below (or directly above) the ejector pin in the mold so as to be coaxial with the ejector pin. There is a need. Generally, when an ejector pin having a diameter of about 1 mm is used, it is necessary to use a crystal piezoelectric load washer having a diameter of at least about 10 mm in order to secure the performance that can withstand the load at the time of mold release. be. Therefore, in the mold release force measuring apparatus proposed in Patent Documents 1 and 2, a crystal piezoelectric load washer having a diameter larger than that of the ejector pin is embedded in the mold. However, depending on the shape of the resin molded product or the like, it is necessary to densely arrange a plurality of ejector pins in one cavity, and in such a resin molding mold in which a plurality of ejector pins are densely arranged. Since the crystal piezoelectric load washer interferes with the adjacent ejector pin, there is a problem that the mold release force measuring device proposed in Patent Documents 1 and 2 cannot be adopted.

Therefore, an object of the present invention is to provide a resin molding die and a resin molding apparatus capable of measuring a mold release force, which are feasible and excellent in versatility.

In order to achieve the above object, the resin molding die according to the present invention is a resin molding die having a mold surface for forming a cavity for resin molding, and is configured to be projectable from the mold surface. The ejector pin that separates the resin molded product molded by the cavity from the mold surface is provided so as to be in contact with the base end portion of the ejector pin, and is received via the ejector pin when the resin molded product is removed from the mold. The mold release force measuring mechanism is provided with a mold release force measuring mechanism capable of measuring a load, and the mold releasing force measuring mechanism has a strain generating body that converts the load into strain and a strain gauge attached to a strain portion of the strain generating body. The strain-causing body has a fixed side end portion fixed to the resin molding die so as not to be relatively movable, a movable side end portion provided so as to come into contact with the base end portion of the ejector pin, and the fixed side. It has a pair of upper and lower parallel beam portions extending from an end portion to the movable side end portion in a direction intersecting the axial direction of the ejector pin, and each of the upper and lower pair of parallel beam portions has the fixed side end portion. A thin portion serving as the strain portion is formed at the boundary portion with the and the movable side end portion, and the strain gauge is attached to the thin portion of the pair of upper and lower parallel beam portions. It is characterized by being.

The resin molding mold according to the present invention has a mold main body having the mold surface on the front surface and a through hole through which the ejector pin can be inserted from the back surface to the mold surface, and the mold main body. The ejector pin is provided at a position aligned with the through hole and is provided so as to be movable back and forth with respect to the back surface of the mold body between the base plate provided on the back surface side and the mold body and the base plate. It is preferable that the ejector pin holder provided with the above is further provided with a heat transfer member provided so as to connect the mold body and the base plate and capable of transferring the heat of the base plate to the mold body. It is preferable that the fixed side end portion of the strained body is fixed to the ejector pin holder, and the ejector pin holder and the strain generating body are provided apart from the base plate.

In the resin molding mold according to the present invention, the ejector pin holder penetrates from the front surface to the back surface at a position consistent with the through hole of the mold body, and can accommodate the base end portion of the ejector pin. A hole is formed, the fixed side end portion of the strain generating body is fixed to the back surface of the ejector pin holder, and the movable side end portion of the strain generating body is the penetration of the ejector pin holder. It is preferable to make contact with the base end portion of the ejector pin in the hole.

Further, in the resin molding die according to the present invention, a plurality of the ejector pins are provided for one cavity, and the strain-causing body and the strain gauge are provided for one cavity. It is preferable that it is provided on at least two or more of the plurality of ejector pins.

The resin molding apparatus according to the present invention is characterized by including the above-mentioned resin molding mold and a transfer mechanism for supplying resin to the cavity.

According to the present invention, it is possible to provide a resin molding die and a resin molding apparatus capable of measuring a mold release force, which are feasible and excellent in versatility.

It is a front perspective view which shows the schematic structure of the resin sealing system which concerns on one Embodiment of this invention. It is a front view which shows typically the resin molding apparatus which concerns on this embodiment. It is a front view which shows schematic the lower mold (resin molding mold) which concerns on this embodiment. It is an enlarged cross-sectional view which shows the schematic structure of the cross section along the line AA'in FIG. 3 in an enlarged manner. FIG. 5 is an enlarged cross-sectional view showing an enlarged schematic configuration of a cross section taken along the line BB'of FIG. FIG. 6A is a schematic configuration diagram showing a strain-causing body at the time of normal operation, and FIG. 6B is a schematic configuration diagram showing a strain-causing body at the time of mold release. FIG. 7A is a schematic cross-sectional view showing a state in which the upper mold is opened after resin sealing molding, and FIG. 7B is a mold release of the resin molded product from the state of FIG. 7A. It is a schematic cross-sectional view which shows the state.

Hereinafter, preferred embodiments for carrying out the present invention will be described with reference to the drawings. It should be noted that the following embodiments do not limit the invention according to each claim, and not all combinations of features described in the embodiments are essential for the means for solving the invention. ..

As shown in FIG. 1, the resin sealing system 1 according to the present embodiment is a work (the present embodiment) for the resin sealing device (resin molding device) 10 for performing resin sealing molding and the resin sealing device 10. The work / tablet supply mechanism 60 for supplying the lead frame W) and the resin tablet, and the resin molded product recovery mechanism 70 for collecting the resin molded product P after resin sealing from the resin sealing device 10 are provided. It is configured to be able to automatically and continuously execute from the supply of the lead frame W and the resin tablet to the sealing device 10 to the collection of the resin molded product P after resin sealing.

The work / tablet supply mechanism 60 and the resin molded product recovery mechanism 70 are provided on a long base 80 extending in the direction of both side surfaces of the resin sealing device 10, and the resin sealing device 10 is substantially in the center of the base 80. It is housed in a storage space formed in a part. Further, in the resin sealing system 1 according to the present embodiment, the work / tablet supply mechanism 60 is arranged on one side surface side (left side in FIG. 1) of the resin sealing device 10 centering on the resin sealing device 10. A resin molded product recovery mechanism 70 is arranged on the other side surface side (right side in FIG. 1) of the resin sealing device 10. That is, in the resin sealing system 1 according to the present embodiment, the lead frame W and the resin tablet are supplied from the region on one end side of the base 80 (the region on the left end side in FIG. 1), and the base 80 is in the longitudinal direction. After resin encapsulation molding was performed in the substantially central region of the above, unnecessary resin (molding at the cal, runner and gate portion) was performed in the region on the other end side of the base 80 (the region on the left end side in FIG. 1). It is configured so that the removal (gate break) of the part) and the recovery of the resin molded product P are performed.

As shown in FIGS. 1 and 2, the resin sealing device 10 includes a rectangular plate-shaped lower platen 12 placed on the floor surface and four tie bars 14 extending upward from the four corners of the lower platen 12. A rectangular plate-shaped upper platen 16 having four corners connected to the upper ends of the four tie bars 14 and four tie bars 14 penetrating the four corners along the tie bar 14 between the lower platen 12 and the upper platen 16. The rectangular plate-shaped moving platen 18 provided so as to be able to move up and down, the elevating mold clamping mechanism 20 provided between the lower platen 12 and the moving platen 18 to raise and lower the moving platen 18, and the resin sealing device 10 are abnormal. It is provided with a notification means (not shown) that issues an alarm when an abnormality occurs or when an abnormality is predicted, and a control unit (not shown) that executes various controls of the resin sealing device 10. As the elevating type clamping mechanism 20, various type clamping mechanisms such as a hydraulic or electric type clamping cylinder and a hydraulic or electric toggle link type clamping mechanism can be adopted. In the resin sealing device 10 according to the present embodiment, the lower platen 12, the tie bar 14, the upper platen 16, the moving platen 18, and the elevating mold clamping mechanism 20 can adopt various known configurations. Therefore, the detailed description thereof will be omitted.

Further, as shown in FIG. 2, the resin sealing device 10 includes a transfer mechanism 22 provided on the upper surface of the moving platen 18 and a resin molding die 26 provided between the upper platen 16 and the transfer mechanism 22. Is further equipped. In the resin sealing device 10 according to the present embodiment, as shown in FIGS. 4 and 5, the transfer mechanism 22 communicates with the cavity C of the resin molding die 26 and accommodates a resin tablet (not shown). A plurality of possible storage pot forming holes 24a (five in the present embodiment) and resin tablets arranged for each storage pot forming hole 24a and housed in the storage pot forming hole 24a are directed toward the cavity C. Since it is possible to employ various known transfer mechanisms including an extruding plunger 24b and a heating means (not shown) for heating the resin molding die 26 and the storage pot forming hole 24a, a detailed description thereof will be given. Is omitted.

The resin molding die 26 is a so-called multi-pot type molding die, and as shown in FIG. 2, the upper die 28 attached to the lower surface of the upper platen 16 and the upper die 28 attached to the upper part of the transfer mechanism 22. A lower mold 30 capable of forming a cavity C (see FIG. 4) is provided together with the 28. In addition, in FIGS. 2 to 7, the holder blocks 31a to 31c (see FIG. 1) that cover the periphery of the lower mold 30 are not shown for easy understanding. Further, in the resin molding mold 26 according to the present embodiment, the upper mold 28 has a cal portion 29a, a runner portion 29b, a gate portion 29c, and a cavity portion for flowing the resin on the lower surface (mold surface) of the mold main body 28a. Except for minor differences in specifications such as the point where 29d is formed (see FIG. 4), it basically has a vertically symmetrical structure with the lower mold 30, so its explanation and illustration of the internal structure are omitted. do.

As shown in FIGS. 3 and 4, the lower mold 30 is arranged so as to face the mold main body 28a of the upper mold 28, and forms a cavity C for resin molding between the lower mold 30 and the mold main body 28a of the upper mold 28. A possible mold body 32, a base plate 34 provided apart from the back surface (lower surface) side of the mold body 32, and advancing and retreating with respect to the back surface of the mold body 32 between the mold body 32 and the base plate 34. The ejector mechanism 40 provided so as to be movable, the mold body 32 and the base plate 34 are connected and fixed to support the mold body 32 when the press mold is tightened, and the heat of the base plate 34 can be transferred to the mold body 32. It is provided with a heat transfer member (support pillar) 36 configured in the above, and a mold release force measuring mechanism 50 attached to the ejector mechanism 40 so as to be able to measure the mold release force of the resin molded product P at the time of mold release. There is.

As shown in FIG. 4, the mold main body 32 is a rectangular plate-shaped metal member having a mold surface 32a on its surface (upper surface) capable of forming a cavity C together with a cavity portion 29d of the mold main body 28a of the upper mold 28. .. The mold body 32 is formed with a through hole 32b through which the ejector pin 44 can be inserted from the back surface to the mold surface 32a at a position consistent with the ejector pin 44 described later of the ejector mechanism 40.

The base plate 34 is formed of a rectangular plate-shaped metal member and is placed on the upper surface of the transfer mechanism 22. The base plate 34 supports the mold body 32 via the heat transfer member 36, and transfers the heat received from the transfer mechanism 22 to the mold body 32 via the heat transfer member 36 to heat the mold body 32. It is configured to let you. In the resin sealing device 10 according to the present embodiment, the transfer mechanism 22 is provided with a heating means, and the heat of the heating means is transferred to the base plate 34. However, the present invention is not limited to this, and the base plate 34 is not limited to this. A heating means (not shown) may be provided inside the mold body 32 or inside the mold body 32.

The heat transfer member 36 is a support pillar formed of a cylindrical metal member, one end (lower end) of which is fixed to the upper surface of the base plate 34, and the other end (upper end) of the mold body 32. By being fixed to the back surface, the mold body 32 is supported at a position separated from the base plate 34. Further, the heat transfer member 36 is configured to transfer the heat of the base plate 34 heated by the heating means to the mold main body 32 and heat the mold main body 32 to a predetermined temperature. As shown in FIGS. 3 to 5, a plurality of heat transfer members 36 (six in this embodiment) are provided for one cavity C, and these plurality of heat transfer members 36 are provided around each cavity C. By arranging so as to surround the cavity C, it is configured to suppress the bending of the mold main body 32 around each cavity C and suppress the generation of burrs and the like.

As shown in FIGS. 3 and 4, the ejector mechanism 40 includes an ejector pin holder 42 provided between the mold main body 32 and the base plate 34 so as to be movable back and forth with respect to the back surface of the mold main body 32, and a mold. The ejector pin 44 is provided at a position consistent with the through hole 32b of the main body 32, and the ejector pin holder 42 is provided with a driving means (not shown) for moving the ejector pin holder 42 forward and backward with respect to the back surface of the mold main body 32. By advancing the 42 with respect to the back surface of the mold body 32, the ejector pin 44 is projected from the mold surface 32a of the mold body 32, and the resin molded product P formed by the cavity C is transferred to the mold surface of the mold body 32. It is configured to be separated from 32a. The drive means supports the ejector pin holder 42 at a position where the ejector pin holder 42 and the strain generating body 52 attached to the ejector pin holder 42, which will be described later, are separated from the base plate 32, and at the same time, the ejector pin holder 42 is removed when the resin molded product P is released. It is configured to advance toward the mold body 32. In the ejector mechanism 40 according to the present embodiment, various known configurations such as electric motor drive and ejector rod push-up by lowering operation of the press can be adopted as the drive means, and thus the description thereof will be omitted. do.

The ejector pin holder 42 includes an ejector plate 42a in which the ejector pin 44 is projected toward the mold main body 32, and a backing plate 42b attached to the back surface of the ejector plate 42a by a fastener to reinforce the ejector plate 42a. ing. As shown in FIG. 4, the ejector pin holder 42 is formed with a through hole 43 penetrating from the front surface to the back surface at a position consistent with the through hole 32b of the mold main body 32. The through hole 43 has a stepped shape such that the opening diameter on the front surface side of the ejector plate 42a is smaller than the opening diameter on the back surface side of the backing plate 42b, and the base end portion 44b of the ejector pin 44 is inside the through hole 43. Is configured to accommodate. Further, the ejector pin holder 42 is formed with a through hole (not shown) for the heat transfer member through which the heat transfer member 36 penetrates at a position consistent with the heat transfer member 36. The through hole for the heat transfer member has an opening diameter larger than the outer diameter of the heat transfer member 36 so as not to come into contact with the peripheral surface of the heat transfer member 36.

As shown in FIG. 4, the ejector pin 44 is a stepped pin member including a pin portion 44a extending toward the mold body 32 and a base end portion 44b formed having a diameter larger than that of the pin portion 44a. .. The pin portion 44a has an axial length so as to be substantially flush with the mold surface 32a of the mold main body 32 when the ejector pin holder 42 is located at the standby position (position shown in FIG. 4). doing. Further, the pin portion 44a has an outer diameter smaller than the opening diameter on the surface side of the through hole 43 of the ejector pin holder 42 and substantially equal to the opening diameter of the through hole 32b of the mold main body 32. The base end portion 44b has an outer diameter larger than the opening diameter on the front surface side of the through hole 43 of the ejector pin holder 42 and smaller than the opening diameter on the back surface side of the through hole 43 of the ejector pin holder 42. .. The ejector pin 44 has the ejector pin holder in a state where the base end portion 44b is housed in the through hole 43 of the ejector pin holder 42 and the pin portion 44a protrudes toward the mold body 32 through the through hole 43. The base end portion 44b is narrowed by the stepped portion of the through hole 43 of the 42 and the movable side end portion 52b of the strain generating body 52 described later of the mold release force measuring mechanism 50, so that the base end portion 44b is attached to the ejector pin holder 42. There is. A plurality of ejector pins 44 (two in the present embodiment) are provided for one cavity C, and the plurality of ejector pins 44 are configured to evenly release the resin molded product P.

The release force measuring mechanism 50 is a so-called reverbal load cell, and as shown in FIG. 4, detects a strain generating body 52 that deforms in proportion to a load received from the ejector pin 44 and a deformation amount of the strain generating body 52. It is provided with strain gauges 54a to 54d. The strain generating body 52 is attached to the ejector pin holder 42 so as to come into contact with the base end portion 44b of the ejector pin 44, and the strain gauges 54a to 54d are the four strained portions of the straining body 52 (thin portion 53a described later). ~ 53d) are attached to each. The release force measuring mechanism 50 is arranged for each ejector pin 44, and in this embodiment, two are arranged for each cavity C as shown in FIGS. 4 and 5. As shown in FIG. 5, each mold release force measuring mechanism 50 is provided in a gap between a plurality of heat transfer members 36 so as not to interfere with other adjacent mold release force measuring mechanisms 50 and the heat transfer member 36, respectively. There is. Hereinafter, specific configurations of the strain generating body 52 and the strain gauges 54a to 54d will be described.

As shown in FIG. 6A, the strain-causing body 52 is a plate-shaped member having a substantially L-shaped vertical cross section, which is erected so as to be perpendicular to the lower surface of the ejector pin holder 42, and is L-shaped. An iron array-shaped notch is formed in the horizontally extending portion of the ejector pin holder 42, and the vertically extending portion of the L-shape comes into contact with the base end portion 44b of the ejector pin 44 in the through hole 43 of the ejector pin holder 42. The vicinity of the end of the L-shaped horizontally extending portion is fixed to the back surface of the ejector pin holder 42 so as to be cantilevered. Specifically, the strain generating body 52 includes a fixed side end portion 52a fixed to the back surface of the ejector pin holder 42, a movable side end portion 52b provided so as to come into contact with the base end portion 44b of the ejector pin 44, and the movable side end portion 52b. It has a pair of upper and lower parallel beam portions 52c and 52d extending from the fixed side end portion 52a to the movable side end portion 52b in a direction intersecting the axial direction of the ejector pin 44. In the strain generating body 52, the movable side end portion 52b extends from the lower surface of the base end portion 44b of the ejector pin 44 along the axial direction of the ejector pin 44, and a pair of upper and lower parallel beam portions 52c and 52d form the movable side end portion 52b. A shape that extends from the vicinity of the lower end of the ejector pin 44 along a direction orthogonal to the axial direction of the ejector pin 44, and the fixed side end portion 52a extends continuously in the same direction as the pair of upper and lower parallel beam portions 52c and 52d, that is, a substantially L shape. Is formed in.

As shown in FIGS. 4 and 6A, the fixed side end portion 52a is fixed to the back surface of the ejector pin holder 42 by a fastener so as to be immovable relative to the entire lower mold 30. The movable side end portion 52b is configured such that the upper end portion thereof contacts the lower surface of the base end portion 44b of the ejector pin 44 and the lower end portion side thereof is continuous with one end portions of a pair of upper and lower parallel beam portions 52c and 52d. The pair of upper and lower parallel beam portions 52c and 52d are deformed at the boundary portion with the fixed side end portion 52a and the boundary portion with the movable side end portion 52b, respectively, with a load from the ejector pin 44 (distortion portion). The semicircular thin portions 53a to 53d are formed, whereby the pair of upper and lower parallel beam portions 52c and 52d, the fixed side end portion 52a, and the movable side end portion 52b cut into an iron array shape. The notch is configured to be defined. At the locations where the strain gauges 54a to 54d are attached to the thin portions 53a to 53d of the pair of upper and lower parallel beam portions 52c and 52d, the attachment positions (center positions) of the strain gauges 54a to 54d are set at the positions where the strain gauges 54a to 54d are attached. A ruled line (not shown) for identification is processed, and is configured to improve the workability and accuracy of the work of attaching the strain gauges 54a to 54d.

By being configured in this way, the strain-causing body 52 can move the upper parallel beam portion 52c as shown in FIG. 6B when a load is applied via the ejector pin 44 at the time of mold release. The thin portion 53a on the side end 52b side and the thin portion 53d on the fixed side end 52a side of the lower parallel beam portion 52d are distorted in the compression direction, and the thin portion on the fixed side end 52a side of the upper parallel beam portion 52c. The thin portion 53c on the movable side end portion 52b side of the 53b and the lower parallel beam portion 52d is configured to be distorted in the stretching direction.

The strain gauges 54a to 54d are configured so that the electric resistance changes according to the strain, and as shown in FIGS. 6A and 6B, the movable side end portion 52b of the upper parallel beam portion 52c is formed. The first strain gauge 54a attached to the thin portion 53a on the side, the second strain gauge 54b attached to the thin portion 53b on the fixed side end 52a side of the upper parallel beam portion 52c, and the lower parallel The third strain gauge 54c attached to the thin portion 53c on the movable side end 52b side of the beam portion 52d and the thin portion 53d attached to the thin portion 53d on the fixed side end 52a side of the lower parallel beam portion 52d. It consists of 4 strain gauges 54d. These four strain gauges 54a-54d are connected to each other to form a Wheatstone bridge circuit (not shown).

The Wheatstone bridge circuit formed for each release force measuring mechanism 50 is electrically connected to a data acquisition analysis means (not shown) via an amplifier (not shown) and an A / D converter (not shown), respectively. It is connected to the. In the present embodiment, a plurality of mold release force measuring mechanisms 50, an amplifier and an A / D converter, and a common data collection and analysis means can collectively measure the mold release force at the time of mold release in all cavities C. A release force measuring device is configured.

The data collection and analysis means includes, for example, a personal computer, calculates a strain value based on the resistance values of the strain gauges 54a to 54d, and based on this strain value, the movable side of the strain generating body 52 via the ejector pin 44. It is configured to measure the load applied to the end portion 52b, that is, the mold release force at the time of mold release.

Further, the data collection / analysis means is configured to determine a mold release defect based on the measured load (release force), and if it is determined to be a mold release defect, output a notification signal to the notification means. Specifically, the data collection and analysis means may be, for example, (1) a sporadic value of the measured load (molding force), and (2) real-time of the load (molding force) measured within a predetermined cycle or a predetermined time. Average value, (3) Difference between the measured load (release force) value and the immediately preceding average value, (4) Measured load (release force) increase rate, (5) Real-time calculated average value When the rate of increase of, or (6) the variation (difference) of the load (release force) measured by a plurality of release force measuring mechanisms 50, etc. exceeds a predetermined set value (threshold), the release is performed. It is configured to be judged as a mold defect. In particular, according to the determination method (6) above, local dirt in one cavity C can be detected, the dirt portion can be predicted or specified, and dirt is likely to adhere. It is also possible to analyze the tendency of places and the like.

The notification means is configured to issue an alarm when it receives a notification signal from the data collection / analysis means. As the mode of the alarm by such a notification means, in addition to the mode of aural notification by emitting an alarm sound, for example, a mode of lighting a lamp or the like, a display screen provided in the resin sealing device 10, or a resin. A mode of displaying a message on a display screen of a personal computer or the like connected to the sealing device 10, a mode of visually notifying a part or the whole of the display screen by blinking or lighting in a predetermined color, and the like. It can be adopted as appropriate. The alarm by such a notification means enables the operator to recognize the occurrence of dirt (necessity of cleaning) on the mold surface 32a, and the damage and appearance of the resin molded product P due to the defective mold release. It is possible to predict defects.

As shown in FIG. 4, the resin sealing device 10 according to the present embodiment having the above configuration applies the molten mold material by the plunger 24b in a state where the lead frame W is sandwiched between the upper mold 28 and the lower mold 30. The electronic parts arranged in the cavity C are molded by pressing and flowing in the order of the cal part 29a → runner part 29b → gate part 29c → cavity part 29d of the upper mold 28 and thermosetting, and the resin molded product P. Is configured to manufacture. Further, in the resin sealing device 10 according to the present embodiment, after the molding of the electronic component is completed, the moving platen 18 is lowered to separate the lower mold 30 from the upper mold 28, and the lower mold 30 is separated from the upper mold 28, and the upper mold 30 is moved in parallel with or in synchronization with the upper mold 28. The ejector mechanism (not shown) built into the mold 28 is configured to release the resin molded product P from the mold surface of the upper mold 28. Further, in the resin sealing device 10 according to the present embodiment, as shown in FIG. 7 (a), after separating the lower mold 30 from the upper mold 28, as shown in FIG. 7 (b), the ejector mechanism 40 It is configured to release the resin molded product P from the mold surface 32a of the lower mold 30. Further, the resin sealing device 10 according to the present embodiment is used when the resin molded product P is released from the mold surface of the upper mold 28 and when the resin molded product P is released from the mold surface 32a of the lower mold 30. The mold release force is measured or monitored in real time by the release force measuring mechanism 50 (release force measuring device), and when a mold release defect is detected, an alarm is issued by a notification means.

As shown in FIG. 1, the work / tablet supply mechanism 60 includes a work / tablet transfer device 62 that conveys the lead frame W (work) and the resin tablet between the upper mold 28 and the lower mold 30 of the resin sealing device 10. , A rack 64 that accommodates a plurality of lead frames W, a work supply device (pusher) 66 that sends out the lead frames W accommodated in the rack 64 one by one to the work / tablet transfer device 62, and a work / tablet transfer device. A tablet supply device 68 that supplies a resin tablet to 62, a drive unit (not shown) provided in each of the work / tablet transfer device 62, the work supply device 66, and the tablet supply device 68, and each drive unit are synchronized. Alternatively, it is equipped with a control unit (not shown) that controls in an asynchronous state. The work / tablet supply mechanism 60 is configured to be able to automatically supply the lead frame W and the resin tablet to the resin sealing device 10 under the control of the control unit.

As shown in FIG. 1, the resin molded product recovery mechanism 70 includes a unloading device 72 that carries out the resin molded product P with unnecessary resin from the resin sealing device 10, and an unnecessary resin that is integrally molded with the resin molded product P. The gate break device 74 that separates the unnecessary resin from the resin molded product P by pressing from above, the recovery container 76 that collects the separated and dropped unnecessary resin, and the resin molded product P from which the unnecessary resin has been removed. The resin molded product recovery device 78, the unloading device 72, the gate break device 74, and the drive units (not shown) provided in the resin molded product recovery device 78, respectively, and each drive unit are controlled synchronously or asynchronously. It is equipped with a control unit (not shown). The resin molded product recovery device 78 is provided at a transfer device 78a provided so as to be reciprocally movable between the gate break position and the resin molded product collection position, a rack 78b for collecting the resin molded product P, and a resin molded product collection position. It is provided with a delivery device (pusher) 78c that feeds the resin molded product P mounted on the delivered transfer device 78a to the rack 78b. The resin molded product recovery mechanism 70 is controlled by the control unit to carry out the resin molded product P with unnecessary resin from the resin sealing device 10, remove the unnecessary resin from the resin molded product P, and remove the unnecessary resin. It is configured so that the recovery of the resin molded product P can be automatically performed.

Next, the operation of the resin sealing system 1 according to the present embodiment will be described. The following operations of the resin sealing system 1 are executed by driving and controlling each component based on a program stored in the storage unit in advance.

First, the work supply device 66 sends out the lead frames W one by one from the rack 64 toward the work / tablet transfer device 62. In parallel with this, a plurality of (five in this embodiment) resin tablets are delivered from the tablet supply device 68 to the work / tablet transfer device 62. When the lead frame W and the resin tablet are delivered to the work / tablet transfer device 62, the work / tablet transfer device 62 moves into the resin sealing device 10 while holding the received lead frame W and the resin tablet. The lead frame W is placed on the mold body 32 of the lower mold 30, and the resin tablet is dropped into the accommodation pot forming hole 24a of the transfer mechanism 22.

When the lead frame W and the resin tablet are delivered to the resin sealing device 10, the resin sealing device 10 executes the resin sealing molding. Specifically, in the resin sealing device 10, the lead frame W is sandwiched between the upper mold 28 and the lower mold 30 so that the electronic component is located in the cavity C, and the mold is melted in the accommodating pot forming hole 24a. The resin molded product P is transferred by causing the material to flow into the cavity C by the plunger 24b and thermally curing the molding material that has flowed into the cavity C. Further, the resin sealing device 10 is incorporated in the upper mold 28 in parallel with or in synchronization with the lower mold 30 being separated from the upper mold 28 by lowering the moving platen 18 after the molding of the electronic component is completed. The resin molded product P is released from the mold surface of the upper mold 28 by the ejector mechanism. Further, in the resin sealing device 10 according to the present embodiment, after separating the lower mold 30 from the upper mold 28, the resin molded product P is released from the mold surface 32a of the lower mold 30 by the ejector mechanism 40. At this time, the resin sealing device 10 measures or monitors the mold release force when the resin molded product P is released in real time by the release force measuring mechanism 50 (release force measuring device), and detects a mold release defect. When this happens, an alarm is issued by the notification means.

The unloading device 72 collects the resin molded product P with unnecessary resin in the resin sealing device 10 and conveys it toward the gate break device 74. When the resin molded product P with unnecessary resin reaches the gate break device 74 by the unloading device 72, the gate break device 74 separates the unnecessary resin adhering to the resin molded product P from the resin molded product P by pressing it from above. , The unnecessary resin that has fallen due to this is collected in the collection container 76. Further, the resin molded product recovery device 78 recovers the resin molded product P from which unnecessary resin has been removed.

Then, by repeatedly executing the above steps, the resin molded product P is automatically and continuously manufactured.

As described above, the resin molding mold 26 according to the present embodiment is a resin molding mold having a mold surface 32a for forming the cavity C for resin molding, and is configured to be projectable from the mold surface 32a. The ejector pin 44 that separates the resin molded product P molded by the cavity C from the mold surface 32a is provided so as to come into contact with the base end portion 44b of the ejector pin 44. The mold release force measuring mechanism 50 is provided with a mold release force measuring mechanism 50 capable of measuring the load received via the mold removing force measuring mechanism 50. The strain gauges 54a to 54d attached to 53a to 53d) are provided, and the strain generating body 52 has a fixed side end portion 52a fixed to the resin molding die 26 so as not to be relatively movable, and a base end of the ejector pin 44. A pair of upper and lower parallel beam portions 52c extending in a direction intersecting the axial direction of the ejector pin 44 from the fixed side end portion 52a to the movable side end portion 52b, and the movable side end portion 52b provided in contact with the portion 44b. The pair of upper and lower parallel beam portions 52c and 52d have 52d, and thin portions 53a to 53d serving as distortion portions are formed at the boundary portion with the fixed side end portion 52a and the boundary portion with the movable side end portion 52b, respectively. The strain gauges 54a to 54d are formed, and the strain gauges 54a to 54d are attached to the thin portions 53a to 53d of the pair of upper and lower parallel beam portions 52c and 52d, respectively.

As described above, the resin molding mold 26 according to the present embodiment is provided with the mold release force measuring mechanism 50, so that it is possible to detect a mold release defect. It is possible to recognize the possibility of dirt generation (necessity of cleaning), damage to the resin molded product P due to poor mold release, and poor appearance. Such an advantage is that, as in the resin sealing system 1 according to the present embodiment, the process from supplying the lead frame W and the resin tablet to the resin sealing device 10 to collecting the resin molded product P after resin sealing is automatically performed. This is especially effective in a fully automated system that runs continuously.

Further, the resin molding mold 26 according to the present embodiment is configured to measure the load of the ejector pin 44 by a mold release force measuring mechanism 50 (roversal type load cell) mainly extending in a direction intersecting the axial direction of the ejector pin 44. Therefore, as compared with the case of using a large-diameter crystal piezoelectric load cell that needs to be embedded directly under the ejector pin 44, it is possible to improve the number of installations and the degree of freedom of arrangement of the release force measuring mechanism 50. can. That is, according to the resin molding die 26 according to the present embodiment, the extending directions of the mold release force measuring mechanisms 50 are staggered so that the adjacent mold release force measuring mechanisms 50 do not interfere with each other. Therefore, for example, it is possible to realize a configuration in which the release force measuring mechanism 50 is provided on all of a plurality of ejector pins 44 that are densely provided.

Further, as described above, the resin molding die 26 according to the present embodiment has a mold surface 32a on the front surface, and a through hole 32b through which the ejector pin 44 can be inserted is formed from the back surface to the mold surface 32a. The mold main body 32, the base plate 34 provided apart from the back surface side of the mold main body 32, and the mold main body 32 and the base plate 34 are provided so as to be movable back and forth with respect to the back surface side of the mold main body 32. The ejector pin holder 42 in which the ejector pin 44 is arranged at a position consistent with the through hole 32b is provided so as to connect the mold main body 32 and the base plate 34, and the heat of the base plate 34 can be transferred to the mold main body 32. A thermal member 36 is further provided, and the fixed side end portion 52a of the strain generating body 52 is fixed to the ejector pin holder 42, and the ejector pin holder 42 and the strain generating body 52 are provided apart from the base plate 34. There is.

According to such a resin molding die 26, it is possible to reduce the influence of heat on the mold release force measuring mechanism 50. That is, in the mold release force measuring apparatus proposed in Patent Documents 1 and 2, it is necessary to embed the crystal piezoelectric load washer in a high temperature mold, and it is easily affected by the heat of the mold. There is a problem that the reliability of the device is not sufficient and the release force measuring device is likely to be deteriorated. On the other hand, in the resin molding die 26 according to the present embodiment, the strain generating body 52 provided with the strain gauges 54a to 54d and the ejector pin holder 42 provided with the strain generating body 52 generate high heat of the base plate 34. By being provided apart from the ejector pin 44, the influence of heat on the mold release force measuring mechanism 50 can be reduced as compared with the case of using a conventional crystal piezoelectric load washer that needs to be embedded directly under the ejector pin 44. It will be possible. In particular, in the mold release force measuring mechanism 50 according to the present embodiment, the strain generating body 52 is formed of a plate-shaped member vertically erected on the lower surface of the ejector pin holder 42, so that the strain generating body 52 is connected to the ejector pin holder 42. Since the contact area (heat transfer area) can be reduced and the heat dissipation area can be increased, there is a further advantage of excellent heat dissipation.

Further, in the mold release force measuring device proposed in Patent Documents 1 and 2, since it is necessary to embed the crystal piezoelectric load washer in the mold, the wiring space of the mold release force measuring device is secured in the mold. Difficult to do. On the other hand, in the resin molding mold 26 according to the present embodiment, the space between the mold main body 32 and the base plate 34 can be used as a wiring space, so that a sufficient wiring space can be secured. It will be possible.

Although the preferred embodiments of the present invention have been described above, the technical scope of the present invention is not limited to the scope described in the above-described embodiments. Various changes or improvements can be made to each of the above embodiments.

For example, in the above-described embodiment, the work / tablet supply mechanism 60 is arranged on one side surface side of the resin sealing device 10 with the resin sealing device 10 as the center, and the resin is arranged on the other side surface side of the resin sealing device 10. Although it has been described that the molded product recovery mechanism 70 is arranged, the arrangement is not limited to this, and the arrangement relationship of the resin sealing device 10, the work / tablet supply mechanism 60, and the resin molded product recovery mechanism 70 may be appropriately changed. Is possible. Further, the configuration and arrangement of each component inside the work / tablet supply mechanism 60 and the inside of the resin molded product recovery mechanism 70 can be changed as appropriate.

In the above-described embodiment, the resin molding device has been described as the resin sealing device 10 that performs resin sealing molding, but the present invention is not limited to this, and an injection forming device may be used, for example.

In the above-described embodiment, the work to be sealed with the resin is described as the lead frame W, but the present invention is not limited to this, and an electronic component substrate on which electronic components are mounted may be used. In this case, the mold release force measuring mechanism 50 according to the present embodiment may be provided only in the mold forming the cavity between the upper mold and the lower mold and the electronic component substrate.

In the above-described embodiment, two ejector pins 44 are provided for one cavity C, but the present invention is not limited to this, and only one ejector pin 44 may be provided, or three or more ejector pins 44 may be provided. May be.

In the above-described embodiment, it has been described that the release force measuring mechanism 50 (distortion body 52 and strain gauges 54a to 54d) is provided for all the ejector pins 44, but the present invention is not limited to this, and one or one of them is provided. It suffices that at least one mold release force measuring mechanism 50 is provided for the plurality of cavities C, and there may be an ejector pin 44 in which the mold release force measuring mechanism 50 is not provided. That is, the release force measuring mechanism 50 (distortion body 52 and strain gauges 54a to 54d) may be provided in all of one or a plurality of ejector pins 44 provided in one cavity C. It may be configured to be provided in one of two or more ejector pins 44 provided in one cavity C, or among three or more ejector pins 44 provided in one cavity C. It may be configured to be provided in two or more of. Further, the configuration is not limited to the configuration in which the mold release force measuring mechanism 50 is provided for all the cavities C in the resin molding mold 26, and the configuration may include the cavity C in which the mold release force measuring mechanism 50 is not provided. .. Even when there is a cavity C in which the release force measuring mechanism 50 is not provided, the release force can be sampled. In these cases, the ejector pin 44 to which the release force measuring mechanism 50 (distortion body 52 and strain gauges 54a to 54d) is not provided has a configuration in which the base end portion 44b is embedded in the ejector pin holder 42. be able to.

In the above-described embodiment, the thin portions 53a to 53d of the strain generating body 52 are formed in a semicircular shape, so that the strain generating body 52 has an iron array shape (a shape in which both ends of a perfect circle are connected by a narrow groove). Although the notch has been described as being defined, the shape of the notch formed in the strain generating body 52 is not particularly limited, and for example, a shape in which both end openings having an oval shape or a quadrangular shape are connected by a narrow groove. It is possible to adopt various shapes such as (barbell shape). That is, in the strain generating body 52, thin portions 53a to 53d serving as strain portions are formed at the boundary portion between the upper and lower parallel beam portions 52c and 52d and the fixed side end portion 52a and the boundary portion with the movable side end portion 52b, respectively. The shapes of the thin portions 53a to 53d are not particularly limited as long as they are formed.

1 Resin sealing system, 10 Resin molding equipment, 22 Transfer mechanism, 26 Resin molding mold, 28 Upper mold, 30 Lower mold, 32 Mold body, 32a mold surface, 32b Mold body through hole, 34 Base plate, 36 Heat transfer member, 42 ejector pin holder, 43 ejector pin holder through hole, 44 ejector pin, 44b ejector pin base end, 50 release force measuring mechanism, 52 strain generator, 52a fixed side end, 52b movable side End part, 52c, 52d parallel beam part, 53a to 53d thin part, 54a to 54d strain gauge, C cavity, P resin molded product, W lead frame

Claims (5)

A resin molding die having a mold surface for forming a cavity for resin molding.
An ejector pin that is configured to be projectable from the mold surface and that separates the resin molded product formed by the cavity from the mold surface.
A mold release force measuring mechanism provided so as to come into contact with the base end portion of the ejector pin and capable of measuring the load received via the ejector pin when the resin molded product is released .
A mold body having the mold surface on the front surface and having a through hole through which the ejector pin can be inserted from the back surface to the mold surface.
An ejector pin holder is provided so as to be movable back and forth with respect to the back surface of the mold body, and the ejector pin is arranged at a position consistent with the through hole .
The release force measuring mechanism includes a strain generating body that converts the load into strain and a strain gauge attached to a strain portion of the strain generating body.
The strain- causing body is formed from a fixed side end portion fixed to the ejector pin holder so as not to be relatively movable, a movable side end portion provided so as to contact the base end portion of the ejector pin, and the fixed side end portion. It has a pair of upper and lower parallel beam portions extending in a direction intersecting the axial direction of the ejector pin over the movable side end portion.
In the pair of upper and lower parallel beam portions, a thin portion serving as the strain portion is formed at the boundary portion with the fixed side end portion and the boundary portion with the movable side end portion, respectively.
A resin molding die, wherein the strain gauge is attached to each of the thin portions of the pair of upper and lower parallel beam portions. A base plate provided apart from the rear surface side of the front Kikin die body,
Before provided to connect the Kikin type body and the base plate, the heat of the base plate further comprises a heat transfer member which can be transmitted to the mold body,
Before Symbol ejector pin holder and said strain generating body, a resin molding die according to claim 1, characterized in that is disposed away from the base plate. The ejector pin holder penetrates from the front surface to the back surface at a position consistent with the through hole of the mold body, and a through hole capable of accommodating the base end portion of the ejector pin is formed.
The fixed side end portion of the strain generating body is fixed to the back surface of the ejector pin holder.
The resin molding die according to claim 1 or 2, wherein the movable end portion of the strain-causing body is in contact with the base end portion of the ejector pin in the through hole of the ejector pin holder. Mold. A plurality of ejector pins are provided for one cavity.
The strain-causing body and the strain gauge are provided in at least two or more of the plurality of ejector pins provided for one cavity, according to any one of claims 1 to 3. The resin molding mold described. The resin molding die according to any one of claims 1 to 4 and
A resin molding apparatus including a transfer mechanism for supplying resin to the cavity.

Images