CN216622585U - Circuit board testing device with through hole function - Google Patents
Circuit board testing device with through hole function Download PDFInfo
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- CN216622585U CN216622585U CN202122543963.4U CN202122543963U CN216622585U CN 216622585 U CN216622585 U CN 216622585U CN 202122543963 U CN202122543963 U CN 202122543963U CN 216622585 U CN216622585 U CN 216622585U
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Abstract
The utility model discloses a circuit board testing device with a through hole function, which comprises an upper die and a lower die, wherein the upper die is provided with a through hole; the lower end of the upper die is provided with a first test pin for connecting a bonding pad, a through hole pin for performing through hole operation on the circuit board and a second test pin for connecting the through hole of the circuit board; one end of the second test needle close to the lower die is provided with a through hole part, and the through hole part is fixedly connected with the upper die through a contact part; the cross-sectional area of the through hole part is smaller than that of the contact part; and the lower die is provided with a testing hole matched with the through hole needle and the second testing needle. By arranging the upper die and the lower die, the circuit board can be stably clamped between the upper die and the lower die, and the positioning accuracy of the circuit board in the through hole and test is improved; through setting up through-hole needle and second test needle, through-hole portion and through-hole carry out the through-hole operation to the circuit board simultaneously, contact site and first test needle contact circuit board and carry out the circular telegram test to it, have improved the production efficiency and the yields of circuit board.
Description
Technical Field
The utility model relates to the technical field of circuit board production, in particular to a circuit board testing device with a through hole function.
Background
In the Printed Circuit Board (PCB) manufacturing industry, because the unit price of a single panel is low, the Circuit Board is usually formed by punching. The hole in the punching plate rear plate can generate dust plate scraps, the plate scraps are cleaned by adopting a through hole frame to carry out through hole operation, and then the short circuit or open circuit power-on test is carried out on the circuit board through a test device. At present, most manufacturers finish through hole operation in a manual mode, and green oil is easily scraped in the manual operation process, so that quality hidden danger is generated. In addition, through hole operation and power-on test all need to carry out accurate location to the circuit board, and repeated location operation not only can lead to positional deviation, influences the yields of circuit board, has still reduced the production efficiency of circuit board.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problems, an object of the present invention is to provide a circuit board testing apparatus with a through hole function, which performs power-on test and through hole operation on a circuit board simultaneously, and effectively improves the production efficiency and yield of the circuit board.
The technical scheme adopted by the utility model for solving the problems is as follows:
a circuit board testing device with a through hole function comprises an upper die and a lower die; the lower end of the upper die is provided with a first test pin for connecting a bonding pad, a through hole pin for performing through hole operation on a circuit board and a second test pin for connecting a through hole of the circuit board; one end of the second test needle, which is close to the lower die, is provided with a through hole part, and the through hole part is fixedly connected with the upper die through a contact part; the cross-sectional area of the through hole portion is smaller than that of the contact portion; and the lower die is provided with a test hole matched with the through hole needle and the second test needle.
The circuit board testing device with the through hole function at least has the following beneficial effects: by arranging the upper die and the lower die, the circuit board can be stably clamped between the upper die and the lower die, and the positioning accuracy of the circuit board in the through hole and test is improved; through setting up through-hole needle and second test needle, through-hole portion and through-hole carry out the through-hole operation to the circuit board simultaneously, contact site and first test needle contact circuit board and carry out the circular telegram test to it, have improved the production efficiency and the yields of circuit board.
Furthermore, a positioning column is arranged on the upper die, and a positioning hole matched with the positioning column is arranged on the lower die. Through setting up reference column and locating hole, be convenient for go up mould and bed die and carry out the centre gripping to the circuit board fast, accurately fixed, avoid going up the mould and the condition that the displacement takes place for the bed die, influence the trompil precision of circuit board.
Furthermore, the positioning columns are uniformly distributed on the side face of the upper die. The structure ensures the positioning accuracy of the upper die and the lower die, ensures that the positioning column is stably inserted into the positioning hole in the clamping process of the upper die and the lower die, and improves the hole opening accuracy of the circuit board.
Further, go up the mould with still be equipped with the buffer block between the bed die, be equipped with on the buffer block with first test needle the through-hole needle with the buffer hole of second test needle complex. Through setting up buffer block and gentle punching a hole, under the prerequisite that does not influence the circular telegram test, effectively avoided movable last mould and circuit board direct contact, caused the damage to the circuit board.
Further, the buffer block is made of PVC. PVC has the advantage that insulating properties is good and compressive capacity is strong, and the buffer block is made by PVC and can effectively protect the circuit board, and the pressure of mould application on the circuit board is too big on avoiding, has also provided insulation protection, improves the production yields of circuit board.
Further, the through hole portion, the contact portion, the first test pin, and the through hole pin are all cylinders. The structure ensures the contact area of the first test pin, the through hole pin and the second test pin with the circuit board, and improves the test accuracy of the circuit board test device.
Further, the diameter of the cross section of the through hole part and the through hole needle is between 0.5mm and 0.7mm, and the diameter of the cross section of the first test needle is between 0.2mm and 0.4 mm. The structure ensures that the through hole part and the through hole needle can quickly and stably pass through the circuit board, and the through hole with the corresponding size is reserved on the circuit board, so that the through hole accuracy of the circuit board testing device is improved.
Further, the diameter of the cross section of the contact portion is 0.8mm to 1 mm. The structure ensures that the contact part can be stably attached to the periphery of the through hole, and further is communicated with an internal circuit of the circuit board, and the test precision of the circuit board test device is ensured.
Further, the cross-sections of the through-hole portion and the top portion of the through-hole needle are gradually reduced in a direction away from the upper die. The structure effectively reduces the contact area of the through hole part and the through hole pin with the circuit board, ensures that the circuit board testing device can quickly and accurately carry out through hole operation on the circuit board, and avoids damaging the circuit board.
Further, the first test needle, the through-hole needle and the second test needle are all made of beryllium copper. The beryllium copper has the advantages of high strength and high conductivity, and the first test needle, the through-hole needle and the second test needle are all made of beryllium copper, so that the accuracy of the power-on test is improved, the through-hole success rate of the circuit board test device is ensured, and the yield of the circuit board is improved.
The circuit board testing device with the through hole function has the beneficial effects that: by arranging the upper die and the lower die, the circuit board can be stably clamped between the upper die and the lower die, and the positioning accuracy of the circuit board in the through hole and test is improved; through the arrangement of the through hole needle and the second test needle, the contact part and the first test needle contact the circuit board and perform power-on test on the circuit board while the through hole part and the through hole perform through hole operation on the circuit board, so that the production efficiency and the yield of the circuit board are improved; by arranging the positioning columns and the positioning holes, the circuit board can be clamped and fixed quickly and accurately by the upper die and the lower die, and the problem that the punching precision of the circuit board is influenced by the displacement of the upper die and the lower die is avoided; through setting up buffer block and gentle punching a hole, under the prerequisite that does not influence the circular telegram test, effectively avoided movable last mould and circuit board direct contact, caused the damage to the circuit board.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model.
Drawings
The above and additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
FIG. 1 is a top view of a circuit board testing device with a through hole function according to an embodiment of the present invention;
fig. 2 is a side view of a circuit board testing device with a through hole function according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
Referring to fig. 1 and 2, an embodiment of the present invention provides a circuit board testing apparatus with a through hole function, including an upper die 100 and a lower die 200; the lower end of the upper die 100 is provided with a first test pin 110 for connecting a pad, a through-hole pin 120 for performing through-hole operation on a circuit board, and a second test pin 130 for connecting a through-hole of the circuit board; one end of the second test pin 130 close to the lower die 200 is provided with a through hole part 131, and the through hole part 131 is fixedly connected with the upper die 100 through a contact part 132; the cross-sectional area of the through hole portion 131 is smaller than that of the contact portion 132; the lower mold 200 is provided with a test hole 210 to be engaged with the through-hole pin 120 and the second test pin 130.
By arranging the upper die 100 and the lower die 200, the circuit board can be stably clamped between the upper die 100 and the lower die 200, and the positioning accuracy of the circuit board for through hole and test is improved; by arranging the through-hole pin 120 and the second test pin 130, the contact portion 132 and the first test pin 110 contact the circuit board and perform an energization test on the circuit board while the through-hole portion 131 and the through-hole pin 120 perform a through-hole operation on the circuit board, thereby improving the production efficiency and the yield of the circuit board.
Referring to fig. 2, another embodiment, since the first test pins 110 are used only to contact pads on the surface of the circuit board, and the second test pins 130 and the via pins 120 need to pass through the circuit board and perform a via operation thereon, the heights of the second test pins 130 and the via pins 120 are greater than the height of the first test pins 110.
In another embodiment, the upper mold 100 is provided with a positioning column 140, and the lower mold 200 is provided with a positioning hole 220 matched with the positioning column 140. Through setting up reference column 140 and locating hole 220, be convenient for go up mould 100 and bed die 200 and carry out fast, accurately the circuit board centre gripping fixed, avoid going up the condition that mould 100 and bed die 200 take place the displacement, influence the trompil precision of circuit board.
In another embodiment, the positioning pillars 140 are uniformly distributed on the side surface of the upper mold 100. The structure ensures the positioning accuracy of the upper die 100 and the lower die 200, ensures that the positioning column 140 is stably inserted into the positioning hole 220 in the clamping process of the upper die 100 and the lower die 200, and improves the hole opening accuracy of the circuit board.
In another embodiment, a buffer block 300 is further disposed between the upper mold 100 and the lower mold 200, and a buffer hole 310 is disposed on the buffer block 300 and is engaged with the first test pin 110, the through-hole pin 120, and the second test pin 130. Through setting up buffer block 300 and the hole 310 that punches slowly, under the prerequisite that does not influence the circular telegram test, effectively avoided movable mould 100 and circuit board direct contact, caused the damage to the circuit board.
In another embodiment, the buffer block 300 is made of PVC. PVC has the advantage that insulating properties is good and compressive capacity is strong, and buffer block 300 is made by PVC and can effectively protect the circuit board, avoids last mould 100 to exert the too big pressure on the circuit board, has also provided insulation protection, improves the production yields of circuit board.
In another embodiment, the through hole part 131, the contact part 132, the first test pin 110, and the through hole pin 120 are all cylindrical bodies. The structure ensures the contact area of the first test pin 110, the through hole pin 120 and the second test pin with the circuit board, and improves the test accuracy of the circuit board test device.
In another embodiment, the diameter of the cross-section of the through hole part 131 and the through hole needle 120 is 0.5mm to 0.7mm, and the diameter of the cross-section of the first test needle 110 is 0.2mm to 0.4 mm. Specifically, in the present embodiment, the diameter of the cross section of the through-hole part 131 and the through-hole pin 120 is 0.6mm, and the diameter of the cross section of the first test pin 110 is 0.6 mm. The structure ensures that the through hole part 131 and the through hole pin 120 can quickly and stably pass through the circuit board, and a through hole with a corresponding size is reserved on the circuit board, so that the through hole accuracy of the circuit board testing device is improved.
In another embodiment, the cross-section of the contact portion 132 has a diameter of 0.8mm to 1 mm. Specifically, in the present embodiment, the diameter of the cross section of the contact portion 132 is 0.9 mm. The structure ensures that the contact part 132 can be stably attached to the periphery of the through hole, and further is communicated with an internal circuit of the circuit board, and the test precision of the circuit board test device is ensured.
In another embodiment, the cross-sections of the top portions of the via part 131 and the via pin 120 are gradually reduced in a direction away from the upper mold 100. The structure effectively reduces the contact area between the through hole part 131 and the through hole pin 120 and the circuit board, ensures that the circuit board testing device can quickly and accurately carry out through hole operation on the circuit board, and avoids damaging the circuit board.
In another embodiment, the first test needle 110, the through-hole needle 120, and the second test needle 130 are made of beryllium copper. The beryllium copper has the advantages of high strength and high conductivity, and the first test needle 110, the through-hole needle 120 and the second test needle 130 are all made of beryllium copper, so that the accuracy of the power-on test is improved, the through-hole success rate of the circuit board test device is ensured, and the yield of the circuit board is improved.
The working principle of the present invention is further explained below.
In the testing process, firstly, according to the testing point position and the through hole position of the circuit board to be tested, a first testing pin 110, a through hole pin 120 and a second testing pin 130 are respectively fixed at corresponding positions on an upper die 100; the first test needle 110 is opposite to a bonding pad on the surface of the circuit board, the through hole needle 120 is opposite to the position of a through hole to be tested, and the second test needle 130 is opposite to the position of the through hole to be tested; then, the lower mold 200 is provided with the test holes 210 which are engaged with the via pins 120 and the second test pins 130; a buffer block 300 is arranged at the lower end of the upper die 100, and a buffer hole 310 matched with the first test pin 110, the through-hole pin 120 and the second test pin 130 is arranged in the buffer block 300; then, the circuit board which is subjected to the punching and washing operations is placed on the lower die 200, the upper die 100 is inserted into the positioning hole 220 through the positioning column 140 through the driving device, and the circuit board is pressed on the lower die 200; at this time, the first test pin 110 contacts with the pad on the surface of the circuit board and performs a power-on test; the via pin 120 directly penetrates the circuit board, and a via hole for fixing or positioning a device is formed on the circuit board; the through hole portion 131 of the second test pin 130 penetrates through the circuit board to form a via hole communicated with the internal circuit, and the contact portion 132 is in contact with the via hole and connected with the internal circuit of the circuit board because the via hole is located at the intersection of the wires needing to be communicated on each layer of the circuit board, so that the circuit on each layer of the circuit board can be subjected to short circuit or open circuit electrification test after electrification. The whole testing process is efficient and controllable, the through hole operation is carried out while the testing operation is carried out, the through hole flow after the board punching can be reduced, green oil scraping caused by manual through holes is effectively avoided, the labor cost is also saved, the production efficiency is improved, and the quality qualification rate of the circuit board is greatly improved.
As can be seen from the above description, according to the circuit board testing device with a through hole function of the present invention, by providing the upper mold 100 and the lower mold 200, the circuit board can be stably clamped between the upper mold 100 and the lower mold 200, so as to improve the positioning accuracy of the circuit board for performing the through hole and the test; by arranging the through hole pin 120 and the second test pin 130, the contact part 132 and the first test pin 110 contact the circuit board and perform power-on test on the circuit board while the through hole part 131 and the through hole pin 120 perform through hole operation on the circuit board, so that the production efficiency and the yield of the circuit board are improved; by arranging the positioning columns 140 and the positioning holes 220, the circuit board can be clamped and fixed quickly and accurately by the upper die 100 and the lower die 200, and the problem that the circuit board opening precision is influenced by the displacement of the upper die 100 and the lower die 200 is avoided; through setting up buffer block 300 and the hole 310 that punches slowly, under the prerequisite that does not influence the circular telegram test, effectively avoided movable mould 100 and circuit board direct contact, caused the damage to the circuit board.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of those skilled in the art without departing from the gist of the present invention.
Claims (10)
1. A circuit board testing device with a through hole function is characterized by comprising an upper die and a lower die; the lower end of the upper die is provided with a first test pin for connecting a bonding pad, a through hole pin for performing through hole operation on a circuit board and a second test pin for connecting a through hole of the circuit board; one end of the second test needle, which is close to the lower die, is provided with a through hole part, and the through hole part is fixedly connected with the upper die through a contact part; the cross-sectional area of the through hole portion is smaller than that of the contact portion; and the lower die is provided with a test hole matched with the through hole needle and the second test needle.
2. The testing device for the circuit board with the through hole function according to claim 1, wherein a positioning column is arranged on the upper die, and a positioning hole matched with the positioning column is arranged on the lower die.
3. The device for testing the circuit board with the through hole function according to claim 2, wherein the positioning pillars are uniformly distributed on the side surface of the upper die.
4. The testing device for the circuit board with the through hole function according to claim 1, wherein a buffer block is further arranged between the upper die and the lower die, and buffer holes matched with the first testing pins, the through hole pins and the second testing pins are formed in the buffer block.
5. A circuit board testing device with through hole function according to claim 4, characterized in that said buffer block is made of PVC.
6. The device for testing the circuit board with the through hole function according to claim 1, wherein the through hole portion, the contact portion, the first test pin and the through hole pin are all cylindrical.
7. A circuit board testing device with through hole function according to claim 6, characterized in that the diameter of the cross section of said through hole part and said through hole needle ranges from 0.5mm to 0.7mm, and the diameter of the cross section of said first testing needle ranges from 0.2mm to 0.4 mm.
8. The device for testing a circuit board with a through hole function according to claim 6, wherein the diameter of the cross section of the contact portion is between 0.8mm and 1 mm.
9. A circuit board testing device with through hole function according to claim 1, characterized in that the cross section of the top of the through hole part and the through hole pin is gradually reduced along the direction away from the upper die.
10. The device for testing the circuit board with the through hole function according to claim 9, wherein the first test pin, the through hole pin and the second test pin are made of beryllium copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122543963.4U CN216622585U (en) | 2021-10-21 | 2021-10-21 | Circuit board testing device with through hole function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122543963.4U CN216622585U (en) | 2021-10-21 | 2021-10-21 | Circuit board testing device with through hole function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216622585U true CN216622585U (en) | 2022-05-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122543963.4U Active CN216622585U (en) | 2021-10-21 | 2021-10-21 | Circuit board testing device with through hole function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216622585U (en) |
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2021
- 2021-10-21 CN CN202122543963.4U patent/CN216622585U/en active Active
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