JP2017055031A - ワイヤ接続方法と端子 - Google Patents
ワイヤ接続方法と端子 Download PDFInfo
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Abstract
【解決手段】端子10にワイヤ50を接続する方法であり、上面側治具101と下面側治具102の間に端子10を挟んで位置決めし、位置決めされている端子10の表面に露出している導体30(または31)にワイヤ50を接続する。上面側治具101と上面11の接触範囲と下面側治具102と下面12の接触範囲が重複する範囲を受圧範囲21としたときに、受圧範囲外では、導体30と導体31の間に絶縁体40が介在する積層構造が存在しており、受圧範囲21では導体30と導体31の間に絶縁体40が介在する積層構造が存在していない。
【選択図】図3
Description
端子の構成は上記の実施例に限定されるものではない。例えば、図7に示す端子10では、第1導体31が板状に形成されている。y方向における絶縁体40の両側面403、403の全体が外部に露出している。絶縁体40の両側面403、403が第1導体31によって覆われていない。
3 :リードフレーム
10 :端子
11 :上面
12 :下面
21 :受圧範囲(第1範囲、不在範囲)
22 :非受圧範囲(第2範囲、存在範囲)
30 :導体
31 :第1導体
32 :第2導体
40 :絶縁体
50 :ワイヤ
51 :半導体基板
52 :信号電極
101 :上面側治具
102 :下面側治具
111 :押圧面
121 :押圧面
311 :上面
313 :側面
323 :側面
401 :上面
403 :側面
Claims (3)
- 端子とワイヤを接続する方法であって、
前記端子の一部を上面側治具と下面側治具の間に挟みこんで前記端子を位置決めする工程と、
位置決めされている前記端子の表面に露出している導体と前記ワイヤを接続する工程を備えており、
前記上面側治具と前記端子の上面との接触範囲と前記下面側治具と前記端子の下面との接触範囲が重複する範囲を受圧範囲としたときに、受圧範囲外では第1導体と第2導体の間に絶縁体が介在する積層構造が存在しており、前記受圧範囲では第1導体と第2導体の間に絶縁体が介在する積層構造が存在していない、ことを特徴するワイヤ接続方法。 - 上面と下面を有する端子であり、
前記上面または前記下面を平面視したときに、第1導体と第2導体の間に絶縁体が介在する積層構造が存在する存在範囲と、第1導体と第2導体の間に絶縁体が介在する積層構造が存在しない不在範囲とが混在している端子。 - 前記不在範囲における上下面間の距離が、前記存在範囲における上下面間の距離よりも長いことを特徴とする請求項2に記載の端子。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015179352A JP6330765B2 (ja) | 2015-09-11 | 2015-09-11 | ワイヤ接続方法と端子 |
US15/227,601 US9716077B2 (en) | 2015-09-11 | 2016-08-03 | Wire connecting method and terminal |
CN201610811738.5A CN106971950B (zh) | 2015-09-11 | 2016-09-08 | 电线连接方法与端子 |
US15/626,814 US20170287869A1 (en) | 2015-09-11 | 2017-06-19 | Wire connecting method and terminal |
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JP2015179352A JP6330765B2 (ja) | 2015-09-11 | 2015-09-11 | ワイヤ接続方法と端子 |
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JP2017055031A true JP2017055031A (ja) | 2017-03-16 |
JP6330765B2 JP6330765B2 (ja) | 2018-05-30 |
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JP (1) | JP6330765B2 (ja) |
CN (1) | CN106971950B (ja) |
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JP4564937B2 (ja) * | 2006-04-27 | 2010-10-20 | 日立オートモティブシステムズ株式会社 | 電気回路装置及び電気回路モジュール並びに電力変換装置 |
DE102008016427B4 (de) * | 2008-03-31 | 2018-01-25 | Globalfoundries Dresden Module One Limited Liability Company & Co. Kg | Drahtbonden auf reaktiven Metalloberflächen einer Metallisierung eines Halbleiterbauelements durch Vorsehen einer Schutzschicht |
JP2011222738A (ja) * | 2010-04-09 | 2011-11-04 | Renesas Electronics Corp | 半導体装置の製造方法 |
JP5970348B2 (ja) * | 2012-11-16 | 2016-08-17 | ルネサスエレクトロニクス株式会社 | 半導体装置 |
JP6511979B2 (ja) * | 2015-06-18 | 2019-05-15 | 富士電機株式会社 | 半導体装置及び半導体装置の製造方法 |
-
2015
- 2015-09-11 JP JP2015179352A patent/JP6330765B2/ja not_active Expired - Fee Related
-
2016
- 2016-08-03 US US15/227,601 patent/US9716077B2/en active Active
- 2016-09-08 CN CN201610811738.5A patent/CN106971950B/zh not_active Expired - Fee Related
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2017
- 2017-06-19 US US15/626,814 patent/US20170287869A1/en not_active Abandoned
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WO1981003396A1 (en) * | 1980-05-12 | 1981-11-26 | Ncr Co | Integrated circuit package with multi-contact pins |
JPS5998543A (ja) * | 1982-11-26 | 1984-06-06 | Hitachi Ltd | 半導体装置 |
JPS63188945U (ja) * | 1987-05-26 | 1988-12-05 | ||
JPH02129738U (ja) * | 1989-03-31 | 1990-10-25 | ||
JPH0376260A (ja) * | 1989-08-18 | 1991-04-02 | Mitsubishi Electric Corp | 半導体集積回路 |
JPH0446544U (ja) * | 1990-08-21 | 1992-04-21 | ||
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JP2004273979A (ja) * | 2003-03-12 | 2004-09-30 | Renesas Technology Corp | 超音波接合装置および方法 |
Also Published As
Publication number | Publication date |
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CN106971950A (zh) | 2017-07-21 |
US20170077063A1 (en) | 2017-03-16 |
US9716077B2 (en) | 2017-07-25 |
CN106971950B (zh) | 2019-11-26 |
JP6330765B2 (ja) | 2018-05-30 |
US20170287869A1 (en) | 2017-10-05 |
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