JP2017050071A - フレキシブル有機el表示装置 - Google Patents
フレキシブル有機el表示装置 Download PDFInfo
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- JP2017050071A JP2017050071A JP2015170629A JP2015170629A JP2017050071A JP 2017050071 A JP2017050071 A JP 2017050071A JP 2015170629 A JP2015170629 A JP 2015170629A JP 2015170629 A JP2015170629 A JP 2015170629A JP 2017050071 A JP2017050071 A JP 2017050071A
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- 229920005989 resin Polymers 0.000 claims abstract description 59
- 239000011347 resin Substances 0.000 claims abstract description 59
- 238000007789 sealing Methods 0.000 claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 47
- 230000005540 biological transmission Effects 0.000 claims abstract description 7
- 150000002484 inorganic compounds Chemical class 0.000 claims description 15
- 229910010272 inorganic material Inorganic materials 0.000 claims description 15
- 239000011256 inorganic filler Substances 0.000 claims description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- 229920005672 polyolefin resin Polymers 0.000 claims description 4
- 229920000219 Ethylene vinyl alcohol Polymers 0.000 claims description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 13
- 230000004888 barrier function Effects 0.000 abstract description 13
- 239000001301 oxygen Substances 0.000 abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 abstract description 13
- 238000000034 method Methods 0.000 abstract description 5
- 239000010410 layer Substances 0.000 description 61
- 239000000463 material Substances 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 5
- 238000001723 curing Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 230000000903 blocking effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011342 resin composition Substances 0.000 description 3
- 229910021536 Zeolite Inorganic materials 0.000 description 2
- HNPSIPDUKPIQMN-UHFFFAOYSA-N dioxosilane;oxo(oxoalumanyloxy)alumane Chemical compound O=[Si]=O.O=[Al]O[Al]=O HNPSIPDUKPIQMN-UHFFFAOYSA-N 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000012044 organic layer Substances 0.000 description 2
- 230000035699 permeability Effects 0.000 description 2
- -1 polyethylene terephthalate Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000010457 zeolite Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 1
- 239000000292 calcium oxide Substances 0.000 description 1
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000000593 degrading effect Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000013008 moisture curing Methods 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
- C08K3/013—Fillers, pigments or reinforcing additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
- C08L23/0846—Copolymers of ethene with unsaturated hydrocarbons containing other atoms than carbon or hydrogen atoms
- C08L23/0853—Vinylacetate
- C08L23/0861—Saponified vinylacetate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
- C08L75/04—Polyurethanes
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/842—Containers
- H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
- H10K77/111—Flexible substrates
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Polymers & Plastics (AREA)
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
特許文献2には、窒化シリコン又は酸窒化シリコンからなるガスバリア層で、電極に接続されている接続配線の端面、その接続配線と発光素子との表面を覆った有機EL表示装置が提案されている。
特許文献3には、対向する第1の基板と第2の基板との間に設けられた有機EL素子を有する画素部と、画素部の外周を囲むように設けられ、樹脂からなる第1のシール材と、第1の基板及び第2の基板の側面の少なくとも一方と接し、且つ第1の基板と第2の基板との隙間に充填され、金属からなる第2シール材とを有する有機EL表示装置が提案されている。
図1は、本発明に係るフレキシブル有機EL表示装置の模式断面図である。図1に示すように、フレキシブル有機EL表示装置10は、フレキシブル基板11と、フレキシブル基板11上に配置された無機膜12と、無機膜12上に配置された有機EL素子13と、有機EL素子13を覆う封止層14と、封止層14上に配置された封止基板15と、封止層14の端部及び封止基板15の端部を少なくとも含む側面に形成された樹脂シール層16とを備える。
Claims (5)
- フレキシブル基板と、前記フレキシブル基板上に配置された無機膜と、前記無機膜上に配置された有機EL素子と、前記有機EL素子を覆う封止層と、前記封止層上に配置された封止基板と、前記封止層の端部及び前記封止基板の端部を少なくとも含む側面に形成された樹脂シール層とを備えるフレキシブル有機EL表示装置であって、前記樹脂シール層が、10g/m2/day以下の水蒸気透過率を有することを特徴とするフレキシブル有機EL表示装置。
- 前記樹脂シール層が、アクリル樹脂、ウレタン樹脂、エポキシ樹脂、エチレン−ビニルアルコール共重合樹脂、ポリオレフィン樹脂及び液晶ポリマー樹脂からなる群から選択されるベース樹脂と、無機フィラーとを含有することを特徴とする請求項1に記載のフレキシブル有機EL表示装置。
- 前記無機フィラーが、板状無機化合物及び水分捕捉無機化合物からなる群から選択される少なくとも一種であることを特徴とする請求項2に記載のフレキシブル有機EL表示装置。
- 前記樹脂シール層が、1GPa以下のヤング率を有することを特徴とする請求項1〜3の何れか一項に記載のフレキシブル有機EL表示装置。
- 前記樹脂シール層と前記フレキシブル基板との界面、前記樹脂シール層と前記無機膜との界面、前記樹脂シール層と前記封止層との界面及び前記樹脂シール層と前記封止基板との界面のせん断強度が0.5kgf/cm2以上であり、且つそれらの界面のピール強度が0.2N/10mm以上であることを特徴とする請求項1〜4の何れか一項に記載のフレキシブル有機EL表示装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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JP2015170629A JP6650704B2 (ja) | 2015-08-31 | 2015-08-31 | フレキシブル有機el表示装置 |
KR1020160098622A KR101774281B1 (ko) | 2015-08-31 | 2016-08-02 | 플렉서블 유기 el 표시 장치 |
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JP2015170629A JP6650704B2 (ja) | 2015-08-31 | 2015-08-31 | フレキシブル有機el表示装置 |
Publications (2)
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JP2017050071A true JP2017050071A (ja) | 2017-03-09 |
JP6650704B2 JP6650704B2 (ja) | 2020-02-19 |
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JP2015170629A Active JP6650704B2 (ja) | 2015-08-31 | 2015-08-31 | フレキシブル有機el表示装置 |
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KR (1) | KR101774281B1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2020098304A (ja) * | 2018-12-19 | 2020-06-25 | エルジー ディスプレイ カンパニー リミテッド | 表示装置および表示装置の製造方法 |
WO2020196826A1 (ja) * | 2019-03-28 | 2020-10-01 | 味の素株式会社 | 樹脂組成物および樹脂シート |
US11260638B2 (en) | 2019-08-29 | 2022-03-01 | Shpp Global Technologies B.V. | Transparent, flexible, impact resistant, multilayer film comprising polycarbonate copolymers |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102451388B1 (ko) * | 2021-03-22 | 2022-10-06 | 엘지디스플레이 주식회사 | 배리어성이 부여된 용융압출수지를 사용한 유기전자장치 봉지재용 접착 필름, 이를 이용한 유기전자장치 봉지재 및 그 제조 방법 |
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JP2001139933A (ja) * | 1999-08-12 | 2001-05-22 | Mitsui Chemicals Inc | シール剤用光硬化型樹脂組成物およびシール方法 |
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JP2016526265A (ja) * | 2013-05-21 | 2016-09-01 | エルジー・ケム・リミテッド | 有機電子装置 |
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JP2005019082A (ja) | 2003-06-24 | 2005-01-20 | Totoku Electric Co Ltd | フレキシブル表示素子 |
JP5119865B2 (ja) | 2007-11-02 | 2013-01-16 | セイコーエプソン株式会社 | 有機エレクトロルミネッセンス装置、電子機器 |
TW201529709A (zh) * | 2009-01-23 | 2015-08-01 | Ajinomoto Kk | 樹脂組成物 |
KR20140029202A (ko) | 2012-08-28 | 2014-03-10 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 표시 장치 |
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- 2015-08-31 JP JP2015170629A patent/JP6650704B2/ja active Active
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- 2016-08-02 KR KR1020160098622A patent/KR101774281B1/ko active IP Right Grant
Patent Citations (7)
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JP2001139933A (ja) * | 1999-08-12 | 2001-05-22 | Mitsui Chemicals Inc | シール剤用光硬化型樹脂組成物およびシール方法 |
JP2008138041A (ja) * | 2006-11-30 | 2008-06-19 | Nippon Zeon Co Ltd | ノルボルネン系開環重合体水素化物および板状フィラーを含有する樹脂組成物、並びに成形体 |
JP2011222334A (ja) * | 2010-04-09 | 2011-11-04 | Dainippon Printing Co Ltd | 熱伝導性封止部材および素子 |
JP2014532769A (ja) * | 2011-10-21 | 2014-12-08 | テーザ・ソシエタス・ヨーロピア | 特に電子的装置のカプセル化のための接着剤 |
JP2014063723A (ja) * | 2012-08-28 | 2014-04-10 | Semiconductor Energy Lab Co Ltd | 表示装置及びその作製方法 |
JP2016526265A (ja) * | 2013-05-21 | 2016-09-01 | エルジー・ケム・リミテッド | 有機電子装置 |
KR20150024757A (ko) * | 2013-08-27 | 2015-03-09 | 엘지디스플레이 주식회사 | 유기발광 표시장치와 그 밀봉 방법 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2020098304A (ja) * | 2018-12-19 | 2020-06-25 | エルジー ディスプレイ カンパニー リミテッド | 表示装置および表示装置の製造方法 |
JP7423184B2 (ja) | 2018-12-19 | 2024-01-29 | エルジー ディスプレイ カンパニー リミテッド | 表示装置および表示装置の製造方法 |
WO2020196826A1 (ja) * | 2019-03-28 | 2020-10-01 | 味の素株式会社 | 樹脂組成物および樹脂シート |
JP2020158739A (ja) * | 2019-03-28 | 2020-10-01 | 味の素株式会社 | 樹脂組成物および樹脂シート |
CN113646171A (zh) * | 2019-03-28 | 2021-11-12 | 味之素株式会社 | 树脂组合物及树脂片材 |
US11260638B2 (en) | 2019-08-29 | 2022-03-01 | Shpp Global Technologies B.V. | Transparent, flexible, impact resistant, multilayer film comprising polycarbonate copolymers |
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Publication number | Publication date |
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KR101774281B1 (ko) | 2017-09-04 |
KR20170026126A (ko) | 2017-03-08 |
JP6650704B2 (ja) | 2020-02-19 |
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