JP2017041631A5 - - Google Patents

Download PDF

Info

Publication number
JP2017041631A5
JP2017041631A5 JP2016152437A JP2016152437A JP2017041631A5 JP 2017041631 A5 JP2017041631 A5 JP 2017041631A5 JP 2016152437 A JP2016152437 A JP 2016152437A JP 2016152437 A JP2016152437 A JP 2016152437A JP 2017041631 A5 JP2017041631 A5 JP 2017041631A5
Authority
JP
Japan
Prior art keywords
main body
electrostatic chuck
corner
radially outer
edge seal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016152437A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017041631A (ja
JP7018703B2 (ja
Filing date
Publication date
Priority claimed from US14/836,202 external-priority patent/US20170047238A1/en
Application filed filed Critical
Publication of JP2017041631A publication Critical patent/JP2017041631A/ja
Publication of JP2017041631A5 publication Critical patent/JP2017041631A5/ja
Application granted granted Critical
Publication of JP7018703B2 publication Critical patent/JP7018703B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

JP2016152437A 2015-08-10 2016-08-03 静電チャック用の凸形の内面を有する環状エッジシール Active JP7018703B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US201562203118P 2015-08-10 2015-08-10
US62/203,118 2015-08-10
US14/836,202 2015-08-26
US14/836,202 US20170047238A1 (en) 2015-08-10 2015-08-26 Annular edge seal with convex inner surface for electrostatic chuck

Publications (3)

Publication Number Publication Date
JP2017041631A JP2017041631A (ja) 2017-02-23
JP2017041631A5 true JP2017041631A5 (cg-RX-API-DMAC7.html) 2019-09-12
JP7018703B2 JP7018703B2 (ja) 2022-02-14

Family

ID=57994425

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016152437A Active JP7018703B2 (ja) 2015-08-10 2016-08-03 静電チャック用の凸形の内面を有する環状エッジシール

Country Status (6)

Country Link
US (1) US20170047238A1 (cg-RX-API-DMAC7.html)
JP (1) JP7018703B2 (cg-RX-API-DMAC7.html)
KR (1) KR102689596B1 (cg-RX-API-DMAC7.html)
CN (1) CN106449504B (cg-RX-API-DMAC7.html)
SG (2) SG10202001170TA (cg-RX-API-DMAC7.html)
TW (1) TWI716430B (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11127619B2 (en) 2016-06-07 2021-09-21 Applied Materials, Inc. Workpiece carrier for high power with enhanced edge sealing
CN107195578B (zh) * 2017-07-17 2019-11-29 北京北方华创微电子装备有限公司 静电卡盘
CN109881184B (zh) * 2019-03-29 2022-03-25 拓荆科技股份有限公司 具有静电力抑制的基板承载装置
CN120202538A (zh) * 2022-09-16 2025-06-24 朗姆研究公司 保护衬底支撑件的弹性加压密封件盖带
KR20250064814A (ko) * 2023-11-03 2025-05-12 피에스케이 주식회사 기판 지지 유닛 및 기판 처리 장치

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980018986A (ko) * 1996-08-26 1998-06-05 조셉 제이. 스위니 정전기 척을 사용하여 제품을 냉각하기 위한 방법 및 장치(method and apparatus for cooling a workpiece using an electrostatic chuck)
US6982178B2 (en) 2002-06-10 2006-01-03 E Ink Corporation Components and methods for use in electro-optic displays
JP4458995B2 (ja) 2004-09-10 2010-04-28 京セラ株式会社 ウェハ支持部材
JP2009024712A (ja) 2007-07-17 2009-02-05 Nok Corp 密封装置
US9543181B2 (en) * 2008-07-30 2017-01-10 Taiwan Semiconductor Manufacturing Company, Ltd. Replaceable electrostatic chuck sidewall shield
US8794638B2 (en) * 2009-02-27 2014-08-05 Halliburton Energy Services, Inc. Sealing array for high temperature applications
CN201973238U (zh) 2010-09-26 2011-09-14 北京北方微电子基地设备工艺研究中心有限责任公司 密封圈及应用该密封圈的等离子体加工设备
JP5920655B2 (ja) * 2011-02-25 2016-05-18 東レ株式会社 樹脂注入成形装置およびそれを用いたｒｔｍ成形方法
US9869392B2 (en) 2011-10-20 2018-01-16 Lam Research Corporation Edge seal for lower electrode assembly
US9859142B2 (en) * 2011-10-20 2018-01-02 Lam Research Corporation Edge seal for lower electrode assembly
US10090211B2 (en) 2013-12-26 2018-10-02 Lam Research Corporation Edge seal for lower electrode assembly
TWI613753B (zh) 2015-02-16 2018-02-01 靜電吸附承盤側壁之改良密封件

Similar Documents

Publication Publication Date Title
JP2017041631A5 (cg-RX-API-DMAC7.html)
US10978334B2 (en) Sealing structure for workpiece to substrate bonding in a processing chamber
US7992877B2 (en) Non contact substrate chuck
US8501283B2 (en) Methods for depositing bevel protective film
CN105793974B (zh) 用于较小晶片及晶片片段的晶片载具
JP2013539913A5 (ja) 静電デチャックを行う装置及び方法、並びに、半導体ウェハを処理するチャンバ
TWI660247B (zh) Substrate holding member
CN104282610B (zh) 承载装置及等离子体加工设备
JP2018078284A5 (cg-RX-API-DMAC7.html)
CN106449504B (zh) 用于静电卡盘的具有凸状内表面的环形边缘密封件
SG11201909803PA (en) Electronic component mounting apparatus
CN109478525A (zh) 基板载体
US20160254176A1 (en) Positive Pressure Bernoulli Wand with Coiled Path
JP2014187213A (ja) 吸着部材、これを用いた真空吸着装置および冷却装置ならびに吸着部材の製造方法
US20220102186A1 (en) Wafer placement table and method of manufacturing the same
TWI844329B (zh) 靜電吸盤
TW202345277A (zh) 用於製造系統機器人的靜電端效器
CN110797258A (zh) 晶片与晶片键合方法和晶片与晶片键合系统
CN105895566A (zh) 托盘、承载装置及半导体加工设备
WO2020013013A1 (ja) 搬送用ハンド
TWM513453U (zh) 晶圓傳輸裝置
JPWO2020081644A5 (cg-RX-API-DMAC7.html)
US20230079207A1 (en) Semiconductor manufacturing apparatus
CN207542221U (zh) 用于搬运晶片衬底的机器人手指及末端执行器
CN106449512A (zh) 用于超薄硅片加工的工艺夹具