JP2017032288A - ライン光照射装置 - Google Patents
ライン光照射装置 Download PDFInfo
- Publication number
- JP2017032288A JP2017032288A JP2015149205A JP2015149205A JP2017032288A JP 2017032288 A JP2017032288 A JP 2017032288A JP 2015149205 A JP2015149205 A JP 2015149205A JP 2015149205 A JP2015149205 A JP 2015149205A JP 2017032288 A JP2017032288 A JP 2017032288A
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- Prior art keywords
- slit
- light
- line
- light irradiation
- irradiation device
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/74—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
- F21V29/76—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/8806—Specially adapted optical and illumination features
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
- G01N21/8901—Optical details; Scanning details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
- G01B11/25—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures by projecting a pattern, e.g. one or more lines, moiré fringes on the object
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/644—Heat extraction or cooling elements in intimate contact or integrated with parts of the device other than the semiconductor body
Abstract
Description
第1実施形態のライン光照射装置1は、図1、2、3に示すように、直線状に配列された複数のLED2と、複数のLED2から射出された光を集光する集光レンズ3と、複数のLED2と集光レンズ3との間に配置された第1スリット板12と、集光レンズ3の光射出側に配置された第2スリット板5と、複数のLED2、集光レンズ3、第1スリット板12及び第2スリット板5を収容するケース6とを備える。
第2実施形態のライン光照射装置は、第1スリット板20の構成が第1実施形態と異なっている。しかしそれ以外の部分は第1実施形態と同じであるため、同一の部分には同一の符号を付し、説明を省略する。
第3実施形態のライン光照射装置は、第1スリット板30の構成が第1、2実施形態と異なっている。しかしそれ以外の部分は第1、2実施形態と同じであるため、同一の部分には同一の符号を付し、説明を省略する。
2・・・LED
3・・・集光レンズ
4・・・光遮断板
5・・・第2スリット板
11・・複数のスリット
12・・第1スリット板
13・・放熱フィン
Claims (6)
- ライン状の光を照射するライン光照射装置であって、
直線状に配列された複数のLEDと、
前記各LEDから射出された光を集光する集光部材と、
前記複数のLEDが配列された配列方向に沿って延伸し、前記各LEDから射出された光の一部を通過させる第1スリットが形成された第1スリット部材とを備え、
前記第1スリット部材に、前記配列方向に間隔を隔てて配置された複数の光遮断部材が一体に設けられていることを特徴とするライン光照射装置。 - 前記第1スリット部材は、前記第1スリットが厚み方向に貫通した平板状の部材から構成され、
前記各光遮断部材は、前記第1スリットを横切って前記第1スリット部材の表面に対し起立した板状体から構成されていることを特徴とする請求項1記載のライン光照射装置。 - 前記各光遮断部材は、曲げ加工により、前記第1スリットを横切って前記第1スリット部材の表面に対し起立した状態に形成されていることを特徴とする請求項2記載のライン光照射装置。
- 前記第1スリット部材は、前記第1スリットが厚み方向に貫通した平板状の部材から構成され、
前記各光遮断部材は、前記第1スリットを仕切るようにその内部に配置されていることを特徴とする請求項1記載のライン光照射装置。 - 前記第1スリット部材は、前記複数のLEDと前記集光部材との間に配置され、
前記光遮断部材は、前記集光部材側に配置されていることを特徴とする請求項1、2又は3記載のライン光照射装置。 - 前記集光部材によって集光された光の一部を通過させる第2スリットが形成された第2スリット部材をさらに備えていることを特徴とする請求項1、2、3、4又は5記載のライン光照射装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015149205A JP6540331B2 (ja) | 2015-07-29 | 2015-07-29 | ライン光照射装置 |
PCT/JP2016/068466 WO2017018100A1 (ja) | 2015-07-29 | 2016-06-22 | ライン光照射装置 |
US15/744,036 US20180202800A1 (en) | 2015-07-29 | 2016-06-22 | Linear light irradiation device |
DE112016003401.6T DE112016003401T5 (de) | 2015-07-29 | 2016-06-22 | Vorrichtung für eine lineare Lichtbestrahlung |
CN201680043978.3A CN107850421A (zh) | 2015-07-29 | 2016-06-22 | 线形光照射装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015149205A JP6540331B2 (ja) | 2015-07-29 | 2015-07-29 | ライン光照射装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017032288A true JP2017032288A (ja) | 2017-02-09 |
JP6540331B2 JP6540331B2 (ja) | 2019-07-10 |
Family
ID=57884256
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015149205A Active JP6540331B2 (ja) | 2015-07-29 | 2015-07-29 | ライン光照射装置 |
Country Status (5)
Country | Link |
---|---|
US (1) | US20180202800A1 (ja) |
JP (1) | JP6540331B2 (ja) |
CN (1) | CN107850421A (ja) |
DE (1) | DE112016003401T5 (ja) |
WO (1) | WO2017018100A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6256244B2 (ja) * | 2014-07-31 | 2018-01-10 | 住友電気工業株式会社 | 超電導線材 |
JP7114859B2 (ja) * | 2017-03-23 | 2022-08-09 | 日本電気株式会社 | 汚れ検知装置、端末装置、及び汚れ検知方法 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002280799A (ja) * | 2001-03-21 | 2002-09-27 | Fuji Mach Mfg Co Ltd | リード位置検出方法,電気部品装着方法およびリード位置検出装置 |
JP2008298667A (ja) * | 2007-06-01 | 2008-12-11 | Fujifilm Corp | 透明膜検査装置 |
JP3174511U (ja) * | 2012-01-12 | 2012-03-22 | 輝鵬 曾 | 発光ダイオード照明器具 |
JP2013525992A (ja) * | 2010-05-10 | 2013-06-20 | レオテク エレクトロニクス コーポレーション | Led照明光の切り換えシールド |
WO2013099981A1 (ja) * | 2011-12-27 | 2013-07-04 | シーシーエス株式会社 | ライン光照射装置 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20020013564A1 (en) * | 1999-12-28 | 2002-01-31 | Kubalek Richard William | Perforated feminine sanitary protection device |
KR101624279B1 (ko) * | 2012-10-24 | 2016-05-25 | 호야 칸데오 옵트로닉스 가부시키가이샤 | 광 조사 장치 |
CN103901707B (zh) * | 2012-12-28 | 2016-02-24 | 深圳市光峰光电技术有限公司 | 发光装置及相关投影系统 |
CN103092006B (zh) * | 2013-01-25 | 2015-02-18 | 中国科学院上海光学精密机械研究所 | 光刻照明系统 |
-
2015
- 2015-07-29 JP JP2015149205A patent/JP6540331B2/ja active Active
-
2016
- 2016-06-22 US US15/744,036 patent/US20180202800A1/en not_active Abandoned
- 2016-06-22 WO PCT/JP2016/068466 patent/WO2017018100A1/ja active Application Filing
- 2016-06-22 CN CN201680043978.3A patent/CN107850421A/zh active Pending
- 2016-06-22 DE DE112016003401.6T patent/DE112016003401T5/de not_active Withdrawn
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002280799A (ja) * | 2001-03-21 | 2002-09-27 | Fuji Mach Mfg Co Ltd | リード位置検出方法,電気部品装着方法およびリード位置検出装置 |
JP2008298667A (ja) * | 2007-06-01 | 2008-12-11 | Fujifilm Corp | 透明膜検査装置 |
JP2013525992A (ja) * | 2010-05-10 | 2013-06-20 | レオテク エレクトロニクス コーポレーション | Led照明光の切り換えシールド |
WO2013099981A1 (ja) * | 2011-12-27 | 2013-07-04 | シーシーエス株式会社 | ライン光照射装置 |
JP3174511U (ja) * | 2012-01-12 | 2012-03-22 | 輝鵬 曾 | 発光ダイオード照明器具 |
Also Published As
Publication number | Publication date |
---|---|
US20180202800A1 (en) | 2018-07-19 |
WO2017018100A1 (ja) | 2017-02-02 |
DE112016003401T5 (de) | 2018-04-12 |
JP6540331B2 (ja) | 2019-07-10 |
CN107850421A (zh) | 2018-03-27 |
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