JP2017017184A - 搬送装置及びその制御方法 - Google Patents
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- 238000000034 method Methods 0.000 title claims abstract description 31
- 230000032258 transport Effects 0.000 claims description 93
- 238000001179 sorption measurement Methods 0.000 claims description 10
- 230000003068 static effect Effects 0.000 claims description 10
- 230000005611 electricity Effects 0.000 claims description 5
- 230000008030 elimination Effects 0.000 claims description 4
- 238000003379 elimination reaction Methods 0.000 claims description 4
- 230000003472 neutralizing effect Effects 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 22
- 235000012431 wafers Nutrition 0.000 description 67
- 239000000758 substrate Substances 0.000 description 14
- 238000005452 bending Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 4
- 230000036961 partial effect Effects 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 208000028659 discharge Diseases 0.000 description 3
- 230000000670 limiting effect Effects 0.000 description 3
- 230000002441 reversible effect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 230000002829 reductive effect Effects 0.000 description 1
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- H—ELECTRICITY
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02107—Forming insulating materials on a substrate
- H01L21/02225—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer
- H01L21/0226—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process
- H01L21/02263—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase
- H01L21/02271—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition
- H01L21/02274—Forming insulating materials on a substrate characterised by the process for the formation of the insulating layer formation by a deposition process deposition from the gas or vapour phase deposition by decomposition or reaction of gaseous or vapour phase compounds, i.e. chemical vapour deposition in the presence of a plasma [PECVD]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67766—Mechanical parts of transfer devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
Abstract
【解決手段】第1搬送装置17の静電ピック44をプロセスモジュール12に進入させ、ウエハWを静電ピック44に静電吸着する。第1搬送装置17を駆動してウエハWをロードロックモジュール14へ搬送する際に、静電ピック44を電気的にフロート状態としてウエハWを静電ピック44に静電吸着させた状態を維持し、ウエハWのロードロックモジュール14への搬送が終了した後に静電ピック44を除電し、ウエハWが静電ピック44に静電吸着された状態を解除する。
【選択図】図3
Description
11 トランスファモジュール
12 プロセスモジュール
14 ロードロックモジュール
17 第1搬送装置
22 制御装置
32 第2関節部
41 第1アーム部
42 第2アーム部
44 静電ピック
51 第1ケーブル
52 第2ケーブル
61 端子基台
62,62a,62b,62c 第1端子
63,63a,63b,63c 第2端子
72 第3端子
73 第4端子
75,76 バネ
Claims (8)
- 搬送体を搬送する搬送アームと、
前記搬送アームを駆動する駆動手段と、
前記搬送アームの先端に設けられ、前記搬送体が載置されるピックと、
前記ピックに設けられた内部電極を含み、前記搬送体を前記ピックに静電吸着させる静電吸着手段と、
前記静電吸着手段及び前記駆動手段を制御する制御手段と、を備え、
前記制御手段は、前記静電吸着手段及び前記駆動手段を制御して、前記搬送体を前記ピックに静電吸着した後に、前記内部電極を電気的にフロート状態とすることにより前記搬送体が前記ピックに静電吸着された状態を維持して、前記搬送体を前記搬送アームにより搬送することを特徴とする搬送装置。 - 前記搬送アームは、
少なくとも1つのアーム部と、
前記アーム部を回転自在に保持する関節部と、を備え、
前記関節部は、
環状の端子と、
前記環状の端子を保持する基台と、を有し、
前記アーム部は、
別の端子と、
前記別の端子を前記環状の端子へ当接させる付勢手段と、を有し、
前記アーム部を前記関節部を中心として回転させたときに、前記別の端子は前記環状の端子の周方向に前記環状の端子に対して摺動することを特徴とする請求項1記載の搬送装置。 - 搬送体を搬送する搬送アームと、
前記搬送アームを駆動する駆動手段と、
前記搬送アームの先端に設けられ、前記搬送体が載置されるピックと、
前記ピックに設けられた内部電極を含み、前記搬送体を前記ピックに静電吸着させる静電吸着手段と、
前記静電吸着手段を制御する制御手段と、
前記搬送体の搬送元と搬送先のそれぞれに前記ピックがあるときに前記制御手段と前記内部電極とを導通させ、前記ピックを前記搬送元から前記搬送先へ移動させる間は前記制御手段と前記内部電極との間の導通が切れるように構成された端子部と、を備え、
前記制御手段は、前記静電吸着手段を制御して、前記ピックが前記搬送元にあるときに前記搬送体を前記ピックに静電吸着させ、前記ピックが前記搬送先にあるときに前記ピックの除電を行い、前記ピックが前記搬送元から前記搬送先へ移動する間は、前記端子部により前記内部電極が電気的にフロート状態となることにより前記搬送体が前記ピックに静電吸着された状態が維持されることを特徴とする搬送装置。 - 前記搬送アームは、
少なくとも1つのアーム部と、
前記アーム部を回転自在に保持する関節部と、を備え、
前記端子部は、
前記関節部に設けられた端子基台と、
同一円周上の所定位置に配置されるように前記端子基台の一面に設けられた複数の端子と、
前記アーム部に設けられた別の端子と、
前記別の端子を前記端子基台の前記一面に当接させる付勢手段と、を有し、
前記アーム部が前記関節部を中心として回転するときに前記別の端子が前記同一円周上を周方向に移動することにより、前記複数の端子と前記別の端子との接触状態と非接触状態とが切り替わり、
前記複数の端子と前記別の端子とが接触状態にあるときに、前記制御手段と前記内部電極とが導通し、前記複数の端子と前記別の端子とが非接触状態にあるときに、前記制御手段と前記内部電極との間の導通が切れることを特徴とする請求項3記載の搬送装置。 - 前記付勢手段による付勢力に抗して前記別の端子を前記端子基台の前記一面から浮き上がらせることによって前記複数の端子と前記別の端子とを非接触状態とする浮上手段を有することを特徴とする請求項4記載の搬送装置。
- 前記搬送アームを一方向に進退可能に保持し、前記一方向に所定の間隔で配置された複数の端子を有する保持手段を備え、
前記搬送アームは、
別の端子と、
前記別の端子を前記保持手段において前記複数の端子が配置された面に当接させる付勢手段と、を有し、
前記一方向での前記搬送アームの進退に伴って前記別の端子が前記一方向に移動することにより、前記複数の端子と前記別の端子との接触状態と非接触状態とが切り替わり、
前記複数の端子と前記別の端子とが接触状態にあるときに、前記制御手段と前記内部電極とが導通し、前記複数の端子と前記別の端子とが非接触状態にあるときに、前記制御手段と前記内部電極との間の導通が切れることを特徴とする請求項3記載の搬送装置。 - 前記制御手段は、前記搬送体の搬送中は、前記ピックに静電吸着力を発生させるための電圧信号を前記複数の端子へ印加し続けることを特徴とする請求項4乃至6のいずれか1項に記載の搬送装置。
- 搬送体を搬送元から搬送先へ搬送する搬送装置の制御方法であって、
前記搬送元において、搬送アームに設けられたピックに前記搬送体を載置する載置ステップと、
前記ピックに設けられた内部電極に電圧を印加することにより前記ピックに静電吸着力を発生させ、前記搬送体を前記ピックに静電吸着させる静電吸着ステップと、
前記搬送体を前記搬送先へ搬送するために前記搬送アームを駆動する駆動ステップと、
前記搬送体の搬送中に前記内部電極を電気的にフロート状態として、前記搬送体を前記ピックに静電吸着させた状態を維持する静電吸着維持ステップと、
前記搬送体の前記搬送先への搬送が終了した後に前記ピックを除電する除電ステップと、を有することを特徴とする搬送装置の制御方法。
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JP2015132614A JP6513508B2 (ja) | 2015-07-01 | 2015-07-01 | 搬送装置、その制御方法及び基板処理システム |
KR1020160081100A KR102338237B1 (ko) | 2015-07-01 | 2016-06-28 | 반송 장치 및 그 제어 방법 |
US15/196,222 US10586729B2 (en) | 2015-07-01 | 2016-06-29 | Transfer device and control method thereof |
TW108139646A TWI706907B (zh) | 2015-07-01 | 2016-06-29 | 搬送裝置 |
TW105120432A TWI679160B (zh) | 2015-07-01 | 2016-06-29 | 搬送裝置及其控制方法,以及基板處理系統 |
US16/774,197 US11075106B2 (en) | 2015-07-01 | 2020-01-28 | Transfer device |
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Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883832A (ja) * | 1994-07-13 | 1996-03-26 | Shinko Electric Co Ltd | 電力供給装置 |
JP2011071294A (ja) * | 2009-09-25 | 2011-04-07 | Tokyo Electron Ltd | 静電吸着部材、静電吸着部材保持機構、搬送モジュール、半導体製造装置及び搬送方法 |
JP2012514544A (ja) * | 2009-01-11 | 2012-06-28 | アプライド マテリアルズ インコーポレイテッド | ロボットおよびロボットの電気エンドエフェクタに電気的に接続するシステム、装置、および方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63162176A (ja) * | 1986-12-24 | 1988-07-05 | フアナツク株式会社 | 水平関節型ロボツトの第1ア−ム構造 |
US5069524A (en) * | 1988-03-07 | 1991-12-03 | Honda Giken Kogyo Kabushiki Kaisha | Robot hand optical fiber connector coupling assembly |
US4990022A (en) * | 1988-03-07 | 1991-02-05 | Honda Giken Kogyo Kabushiki Kaisha | Robot hand coupling assembly |
EP0858867A3 (en) * | 1989-10-20 | 1999-03-17 | Applied Materials, Inc. | Robot apparatus |
US5293107A (en) * | 1993-02-24 | 1994-03-08 | Fanuc Robotics North America, Inc. | Motorized rotary joint and method of constructing a modular robot utilizing same |
US5523662A (en) * | 1994-05-02 | 1996-06-04 | Engineering Services, Inc. | Modular, expandable and reconfigurable robot |
KR100342837B1 (ko) * | 1999-08-31 | 2002-07-02 | 이철환 | 자동차용 자동 등화스위치 |
JP4150992B2 (ja) * | 2000-04-07 | 2008-09-17 | 日本サーボ株式会社 | ステップリング付同軸出力中空軸減速体を有する回転電機 |
JP3607929B2 (ja) * | 2001-01-31 | 2005-01-05 | ビー・エル・オートテック株式会社 | ロータリジョイント |
KR20100053005A (ko) * | 2008-11-12 | 2010-05-20 | 삼성전자주식회사 | 조인트유닛의 전기연결장치와 이를 구비한 로봇 |
KR101554514B1 (ko) * | 2009-01-21 | 2015-09-21 | 삼성전자 주식회사 | 로봇용 전원공급유닛 및 이를 갖는 로봇 |
JP2011077288A (ja) | 2009-09-30 | 2011-04-14 | Tokyo Electron Ltd | 搬送装置 |
CN103094166B (zh) * | 2011-10-31 | 2015-04-15 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 晶圆承载装置及具有它的半导体处理设备 |
US20180114528A1 (en) | 2016-10-26 | 2018-04-26 | IPsoft Incorporated | Systems and methods for generic flexible dialogue management |
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Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0883832A (ja) * | 1994-07-13 | 1996-03-26 | Shinko Electric Co Ltd | 電力供給装置 |
JP2012514544A (ja) * | 2009-01-11 | 2012-06-28 | アプライド マテリアルズ インコーポレイテッド | ロボットおよびロボットの電気エンドエフェクタに電気的に接続するシステム、装置、および方法 |
JP2011071294A (ja) * | 2009-09-25 | 2011-04-07 | Tokyo Electron Ltd | 静電吸着部材、静電吸着部材保持機構、搬送モジュール、半導体製造装置及び搬送方法 |
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JP6513508B2 (ja) | 2019-05-15 |
TW201713588A (zh) | 2017-04-16 |
TWI679160B (zh) | 2019-12-11 |
US11075106B2 (en) | 2021-07-27 |
KR20170004870A (ko) | 2017-01-11 |
KR102338237B1 (ko) | 2021-12-10 |
TW202010699A (zh) | 2020-03-16 |
TWI706907B (zh) | 2020-10-11 |
US20170004992A1 (en) | 2017-01-05 |
US20200161163A1 (en) | 2020-05-21 |
US10586729B2 (en) | 2020-03-10 |
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