JP2016540892A5 - - Google Patents

Download PDF

Info

Publication number
JP2016540892A5
JP2016540892A5 JP2016536676A JP2016536676A JP2016540892A5 JP 2016540892 A5 JP2016540892 A5 JP 2016540892A5 JP 2016536676 A JP2016536676 A JP 2016536676A JP 2016536676 A JP2016536676 A JP 2016536676A JP 2016540892 A5 JP2016540892 A5 JP 2016540892A5
Authority
JP
Japan
Prior art keywords
chamber
line
deposition
arrangement
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2016536676A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016540892A (ja
JP6647202B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/EP2013/075850 external-priority patent/WO2015082022A1/en
Publication of JP2016540892A publication Critical patent/JP2016540892A/ja
Publication of JP2016540892A5 publication Critical patent/JP2016540892A5/ja
Application granted granted Critical
Publication of JP6647202B2 publication Critical patent/JP6647202B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2016536676A 2013-12-06 2013-12-06 堆積アレンジメント、堆積装置、及びこれらの操作方法 Active JP6647202B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/EP2013/075850 WO2015082022A1 (en) 2013-12-06 2013-12-06 Depositing arrangement, deposition apparatus and methods of operation thereof

Publications (3)

Publication Number Publication Date
JP2016540892A JP2016540892A (ja) 2016-12-28
JP2016540892A5 true JP2016540892A5 (enExample) 2017-02-09
JP6647202B2 JP6647202B2 (ja) 2020-02-14

Family

ID=49886884

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016536676A Active JP6647202B2 (ja) 2013-12-06 2013-12-06 堆積アレンジメント、堆積装置、及びこれらの操作方法

Country Status (7)

Country Link
US (1) US20170022598A1 (enExample)
EP (1) EP3077567B1 (enExample)
JP (1) JP6647202B2 (enExample)
KR (1) KR102137181B1 (enExample)
CN (2) CN105874095A (enExample)
TW (1) TWI652363B (enExample)
WO (1) WO2015082022A1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018103137A (ja) * 2016-12-28 2018-07-05 セイコーエプソン株式会社 液体吐出装置、方法およびコンピュータープログラム
US20210147975A1 (en) * 2018-04-18 2021-05-20 Applied Materials, Inc. Evaporation source for deposition of evaporated material on a substrate, deposition apparatus, method for measuring a vapor pressure of evaporated material, and method for determining an evaporation rate of an evaporated material
EP3895236B1 (en) * 2018-12-12 2025-08-13 Elevated Materials Germany GmbH Free-span coating systems and methods
WO2020251696A1 (en) 2019-06-10 2020-12-17 Applied Materials, Inc. Processing system for forming layers
US11624113B2 (en) * 2019-09-13 2023-04-11 Asm Ip Holding B.V. Heating zone separation for reactant evaporation system
KR102615500B1 (ko) * 2019-10-21 2023-12-19 가부시키가이샤 아루박 막 형성장치
CN115279935A (zh) * 2020-03-26 2022-11-01 应用材料公司 蒸发源、具有蒸发源的沉积设备及其方法
KR102859881B1 (ko) * 2020-11-18 2025-09-12 주식회사 엘지화학 유기발광다이오드의 증착장치
RU2765222C1 (ru) * 2020-12-30 2022-01-26 Тхе Баттериес Сп. з о.о. Способ формирования пленки LiCoO2 и устройство для его реализации
CN116670321A (zh) * 2021-01-15 2023-08-29 应用材料公司 用于提供液化材料的设备、用于配量液化材料的配量系统及方法
CN113215535B (zh) * 2021-05-21 2022-11-22 泊肃叶科技(沈阳)有限公司 一种蒸发速率智能可调的蒸发镀膜机
CN120548781A (zh) * 2022-10-28 2025-08-26 提升材料德国有限公司 多孔介质蒸发器
CN119651320A (zh) * 2023-09-15 2025-03-18 中国科学院大连化学物理研究所 一种大流量碱金属原子蒸气生产装置

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2664852A (en) * 1950-04-27 1954-01-05 Nat Res Corp Vapor coating apparatus
JPH01234560A (ja) * 1988-03-11 1989-09-19 Ulvac Corp 蒸着装置における低融点蒸発材の供給方法及び装置
US5135817A (en) * 1988-07-06 1992-08-04 Kabushiki Kaisha Kobe Seiko Sho Zn-Mg alloy vapor deposition plated metals of high corrosion resistance, as well as method of producing them
JPH02118064A (ja) * 1988-10-27 1990-05-02 Mitsubishi Heavy Ind Ltd 真空蒸着装置
JPH0372037A (ja) * 1989-08-14 1991-03-27 Toshiba Corp 金属蒸気発生装置
JPH06291040A (ja) * 1992-03-03 1994-10-18 Rintetsuku:Kk 液体気化供給方法と液体気化供給器
JPH06322501A (ja) * 1993-05-12 1994-11-22 Nippon Steel Corp スリットノズル溶融メッキ法における溶融金属の吐出量制御方法
US5492724A (en) * 1994-02-22 1996-02-20 Osram Sylvania Inc. Method for the controlled delivery of vaporized chemical precursor to an LPCVD reactor
WO1999016929A1 (en) * 1997-09-26 1999-04-08 Advanced Technology Materials, Inc. Liquid reagent delivery system
JP4338246B2 (ja) * 1998-11-27 2009-10-07 キヤノンアネルバ株式会社 Cu−CVDプロセス用原料とCu−CVD装置
LV13383B (en) * 2004-05-27 2006-02-20 Sidrabe As Method and device for vacuum vaporization metals or alloys
WO2006083929A2 (en) * 2005-02-03 2006-08-10 Applied Materials, Inc. A physical vapor deposition plasma reactor with rf source power applied to the target
FR2900070B1 (fr) * 2006-04-19 2008-07-11 Kemstream Soc Par Actions Simp Dispositif d'introduction ou d'injection ou de pulverisation d'un melange de gaz vecteur et de composes liquides et procede de mise en oeuvre dudit dispositif.
US20110308453A1 (en) * 2008-01-31 2011-12-22 Applied Materials, Inc. Closed loop mocvd deposition control
EP2831305B1 (en) * 2012-03-30 2016-03-02 Tata Steel Nederland Technology B.V. Method and apparatus for feeding liquid metal to an evaporator device

Similar Documents

Publication Publication Date Title
JP2016540892A5 (enExample)
JP6647202B2 (ja) 堆積アレンジメント、堆積装置、及びこれらの操作方法
TWI609979B (zh) 蒸發器、沉積裝置、沉積設備、及其操作方法
KR100302609B1 (ko) 온도가변 가스 분사 장치
CN111065760B (zh) 紊流涡旋多区前体汽化器
JP6158025B2 (ja) 成膜装置及び成膜方法
EP3241923B1 (en) Linear evaporation source
JP7572475B2 (ja) 真空チャンバ内で基板をコーティングするための気相堆積装置及び方法
JP5013591B2 (ja) 真空蒸着装置
JP6982695B2 (ja) 蒸着源及び真空処理装置
KR100805354B1 (ko) 액체 원료 기화 장치
KR102235339B1 (ko) 대면적용 선형 증발원
TWI839614B (zh) 液體材料驟蒸發坩堝、蒸氣沉積設備及用於塗覆真空腔室內的基板的方法