JP2016536763A - 導電粒子及びブロックコポリマー塗料を用いた固定アレイ異方性導電フィルム - Google Patents

導電粒子及びブロックコポリマー塗料を用いた固定アレイ異方性導電フィルム Download PDF

Info

Publication number
JP2016536763A
JP2016536763A JP2016542006A JP2016542006A JP2016536763A JP 2016536763 A JP2016536763 A JP 2016536763A JP 2016542006 A JP2016542006 A JP 2016542006A JP 2016542006 A JP2016542006 A JP 2016542006A JP 2016536763 A JP2016536763 A JP 2016536763A
Authority
JP
Japan
Prior art keywords
acf
block copolymer
particle
block
conductive particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016542006A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016536763A5 (https=
Inventor
リアン，ロン−チャン
サン，ユハオ
アン，ヂャオ
Original Assignee
トリリオン サイエンス インコーポレイテッド
トリリオン サイエンス インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by トリリオン サイエンス インコーポレイテッド, トリリオン サイエンス インコーポレイテッド filed Critical トリリオン サイエンス インコーポレイテッド
Publication of JP2016536763A publication Critical patent/JP2016536763A/ja
Publication of JP2016536763A5 publication Critical patent/JP2016536763A5/ja
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/447—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from acrylic compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/28—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances natural or synthetic rubbers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0221—Insulating particles having an electrically conductive coating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/074—Connecting or disconnecting of anisotropic conductive adhesives
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/20—Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
    • H10W72/261—Functions other than electrical connecting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24355—Continuous and nonuniform or irregular surface on layer or component [e.g., roofing, etc.]
    • Y10T428/24372—Particulate matter
    • Y10T428/2438—Coated

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2016542006A 2013-09-10 2014-08-30 導電粒子及びブロックコポリマー塗料を用いた固定アレイ異方性導電フィルム Pending JP2016536763A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US14/022,791 US20150072109A1 (en) 2013-09-10 2013-09-10 Fixed-array anisotropic conductive film using conductive particles with block copolymer coating
US14/022,791 2013-09-10
PCT/US2014/053609 WO2015038363A1 (en) 2013-09-10 2014-08-30 Fixed-array anisotropic conductive film using conductive particles with block copolymer coating

Publications (2)

Publication Number Publication Date
JP2016536763A true JP2016536763A (ja) 2016-11-24
JP2016536763A5 JP2016536763A5 (https=) 2017-06-22

Family

ID=52625899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016542006A Pending JP2016536763A (ja) 2013-09-10 2014-08-30 導電粒子及びブロックコポリマー塗料を用いた固定アレイ異方性導電フィルム

Country Status (6)

Country Link
US (2) US20150072109A1 (https=)
JP (1) JP2016536763A (https=)
KR (1) KR20160054588A (https=)
CN (1) CN105517790A (https=)
TW (1) TWI600032B (https=)
WO (1) WO2015038363A1 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017191772A1 (ja) * 2016-05-05 2017-11-09 デクセリアルズ株式会社 フィラー配置フィルム
CN108445397B (zh) * 2018-02-01 2020-08-18 宁德时代新能源科技股份有限公司 绝缘检测电路的参数选取方法和装置、存储介质
CN110544554B (zh) * 2019-08-15 2021-11-16 深圳市华科创智技术有限公司 一种无序共叠透明导电膜及其制备方法
CN110564337B (zh) * 2019-09-12 2021-06-29 天津伟景诺兰达科技有限公司 一种acf导电胶带及其制备工艺和应用
JP7478241B2 (ja) * 2020-07-21 2024-05-02 京セラ株式会社 熱伝導性接着用シート、及び半導体装置
CN116120873A (zh) * 2021-11-15 2023-05-16 华为技术有限公司 颗粒的排列方法、各向异性功能胶膜的制造方法、功能性颗粒及其制造方法
CN115815092B (zh) * 2022-11-24 2023-06-30 电子科技大学 一种具有双层导电网络的超疏水导电无纺布的制备方法和应用

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000178511A (ja) * 1997-07-24 2000-06-27 Sony Chem Corp 多層異方導電性接着剤およびその製造方法
JP2000198880A (ja) * 1998-10-27 2000-07-18 Sekisui Chem Co Ltd 微粒子の被覆方法、被覆微粒子、異方性導電接着剤及び導電接続構造体
JP2001189171A (ja) * 1999-10-12 2001-07-10 Sony Chem Corp 異方性導電接続材料
JP2007217503A (ja) * 2006-02-15 2007-08-30 Asahi Kasei Electronics Co Ltd 異方導電性接着フィルム

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW277152B (https=) * 1994-05-10 1996-06-01 Hitachi Chemical Co Ltd
KR20080027388A (ko) * 2000-10-23 2008-03-26 세키스이가가쿠 고교가부시키가이샤 피복 입자
TW557237B (en) * 2001-09-14 2003-10-11 Sekisui Chemical Co Ltd Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure
US6699941B1 (en) * 2002-11-07 2004-03-02 Kraton Polymers U.S. Llc Block copolymer
US7741397B2 (en) * 2004-03-17 2010-06-22 Dow Global Technologies, Inc. Filled polymer compositions made from interpolymers of ethylene/α-olefins and uses thereof
KR100597391B1 (ko) * 2004-05-12 2006-07-06 제일모직주식회사 절연 전도성 미립자 및 이를 함유하는 이방 전도성 접착필름
US8802214B2 (en) * 2005-06-13 2014-08-12 Trillion Science, Inc. Non-random array anisotropic conductive film (ACF) and manufacturing processes
US20120295098A1 (en) * 2011-05-19 2012-11-22 Trillion Science, Inc. Fixed-array anisotropic conductive film using surface modified conductive particles

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000178511A (ja) * 1997-07-24 2000-06-27 Sony Chem Corp 多層異方導電性接着剤およびその製造方法
JP2000198880A (ja) * 1998-10-27 2000-07-18 Sekisui Chem Co Ltd 微粒子の被覆方法、被覆微粒子、異方性導電接着剤及び導電接続構造体
JP2001189171A (ja) * 1999-10-12 2001-07-10 Sony Chem Corp 異方性導電接続材料
JP2007217503A (ja) * 2006-02-15 2007-08-30 Asahi Kasei Electronics Co Ltd 異方導電性接着フィルム

Also Published As

Publication number Publication date
US20150072109A1 (en) 2015-03-12
TW201526031A (zh) 2015-07-01
WO2015038363A1 (en) 2015-03-19
KR20160054588A (ko) 2016-05-16
CN105517790A (zh) 2016-04-20
TWI600032B (zh) 2017-09-21
US20170004901A1 (en) 2017-01-05

Similar Documents

Publication Publication Date Title
JP2016536763A (ja) 導電粒子及びブロックコポリマー塗料を用いた固定アレイ異方性導電フィルム
TWI527848B (zh) 非隨機異方性導電膠膜及其製程
JP6144353B2 (ja) 多段部分的埋込粒子形態を有する改良固定アレイ異方性導電フィルム及びその製造方法
TW201316357A (zh) 使用經表面改質的導電粒子之固定陣列異方向性導電膜
JP6542843B2 (ja) 異方性導電フィルム、接続構造体、及び接続構造体の製造方法
JP6289831B2 (ja) 導電性接着フィルムの製造方法、導電性接着フィルム、接続体の製造方法
US20140312501A1 (en) Non-random array anisotropic conductive film (acf) and manufacturing processes
CN104822773B (zh) 导电材料及连接结构体
CN101828434A (zh) 粘接剂组合物和使用其的电路连接材料、以及电路部件的连接方法和电路连接体
JP6718280B2 (ja) 導電粒子、異方導電材料及び接続構造体
TW201345091A (zh) 異向性導電連接材料、連接結構體、連接結構體之製造方法及連接方法
JP2009074020A (ja) 異方性導電膜
TWI743560B (zh) 異向性導電膜、連接結構體、及連接結構體之製造方法
CN117296109A (zh) 导电粒子、导电材料及连接结构体
JP2010067360A (ja) 異方性導電膜およびその使用方法
JP4236856B2 (ja) 異方導電性接着剤及びヒートシールコネクター
JP2018515889A (ja) 多段の部分埋設粒子形態を有する改良された固定配列ａｃｆおよびその製造方法
KR100656518B1 (ko) 다층 표면개질된 도전성 미립자, 그의 제조방법 및 이를 이용한 이방 도전성 필름
CN116420225A (zh) 配线形成用部件、使用了配线形成用部件的配线层的形成方法及配线形成部件
JP2004164910A (ja) 異方導電性接着剤
TWI452103B (zh) 電路連接用接著膜及其用途、電路連接構造體及其製造方法、以及電路構件的連接方法
JP2006001284A (ja) 異方導電性接着フィルムの製造方法
JP6705516B2 (ja) 異方導電性フィルムの製造方法
JP2021089894A (ja) 異方導電性フィルム及び接続構造体

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170502

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20170502

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20170516

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20180328

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20180418

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20181107