JP6144353B2 - 多段部分的埋込粒子形態を有する改良固定アレイ異方性導電フィルム及びその製造方法 - Google Patents
多段部分的埋込粒子形態を有する改良固定アレイ異方性導電フィルム及びその製造方法 Download PDFInfo
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- JP6144353B2 JP6144353B2 JP2015542733A JP2015542733A JP6144353B2 JP 6144353 B2 JP6144353 B2 JP 6144353B2 JP 2015542733 A JP2015542733 A JP 2015542733A JP 2015542733 A JP2015542733 A JP 2015542733A JP 6144353 B2 JP6144353 B2 JP 6144353B2
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- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/16—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by features of a layer formed of particles, e.g. chips, powder or granules
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- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/10—Interconnection of layers at least one layer having inter-reactive properties
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J7/00—Adhesives in the form of films or foils
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- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/16—Solid spheres
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
Description
(a)粒子の第1固定アレイを接着剤層に転移するステップと、
(b)例えば、加熱処理及び/又は加圧ローラー又はカレンダー処理を用いて所望の部分的埋め込み程度に前記第1アレイを加工するステップと、
(c)粒子の第2固定アレイを前記接着剤に転移するステップと、
(d)前記第2アレイより大きく前記第1アレイが前記接着剤に埋め込まれるように、所望の部分的埋め込み程度に粒子の両アレイを任意に押圧する工程と、
を含む多重転移工程を用いて作製される。
(a)導電性粒子の第1固定非ランダムアレイを分散された導電性粒子を有するACFに転移するステップと、
(b)例えば、加熱処理及び/又は加圧ローラー又はカレンダ加工を用いて所望の部分的埋め込み程度に前記第1アレイを加工するステップと、
を含む多重転移工程を用いて作製される。
特別なアレイ(すなわち点線六角形28で示された第1アレイ及び点線六角形29で示された第2アレイ)中の隣接粒子間のピッチ又は距離は同じピッチである。図4のはめ込みは埋込深さの分布を示すグラフである。このグラフは、分散が明確に異なる埋込深さ(d1及びd2)の2つの粒子のアレイを含む二峰性であることを示す。
本発明のさらなる実施形態である。図5のACF40は図4に示されたACF20とは異なり、第1及び第2アレイを構成する粒子のピッチが異なる。粒子46の第2アレイのピッチを示す点線48は、粒子42のより深い第1アレイ中で隣接する42を接続する点線49よりも短い。
Claims (14)
- (a)実質的に均一な厚さを有する接着剤層と、
(b)前記接着剤層に個々に貼着された複数の導電性粒子とを備え、
前記導電性粒子は、前記接着剤層の表面に第1深さで部分的に若しくは完全に埋め込まれた粒子の第1非ランダムアレイと、前記接着剤層の前記と同じ表面に第2深さで部分的に若しくは完全に埋め込まれた導電性粒子の第2非ランダムアレイとを含み、
前記第1深さは前記第2深さよりも深いことを特徴とする異方性導電性フィルム。 - 前記第1深さと前記第2深さとにおいてそれぞれ粒子の個数のピークを有することを特徴とする請求項1に記載の異方性導電性フィルム。
- 前記導電性粒子の第1非ランダムアレイは約40〜90%埋め込まれ、前記導電性粒子の第2非ランダムアレイは約10〜60%埋め込まれることを特徴とする請求項1または2に記載の異方性導電性フィルム。
- 前記導電性粒子の分散体を含む前記接着剤層の下に、分離非導電性接着剤層をさらに備えることを特徴とする請求項1に記載の異方性導電性フィルム。
- (a)実質的に均一な厚さを有する接着剤層と、
(b)前記接着剤層に個々に貼着された複数の導電性粒子とを備え、
前記導電性粒子は、前記接着剤層の表面に第1深さで部分的に埋め込まれた粒子の第1非ランダムアレイと、前記接着剤層の前記と同じ表面に第2深さで部分的に埋め込まれた導電性粒子の第2非ランダムアレイとを含み、
前記第1深さは前記第2深さよりも深いことを特徴とする異方性導電性フィルム。 - 前記第1深さと前記第2深さとにおいてそれぞれ粒子の個数のピークを有することを特徴とする請求項5に記載の異方性導電性フィルム
- 前記第1非ランダムアレイは、前記第2非ランダムアレイの深さに対して、前記粒子の直径の少なくとも約20%深く埋め込まれることを特徴とする請求項5に記載の異方性導電性フィルム。
- 前記第1非ランダムアレイは、前記第2非ランダムアレイの深さに対して、前記粒子の直径の少なくとも約30%深く埋め込まれることを特徴とする請求項5に記載の異方性導電性フィルム。
- 請求項1に記載の硬化又は未硬化異方性導電性フィルムを備えることを特徴とする電子装置又はディスプレイ又は部品。
- 前記電子装置は、一体化回路又はプリント回路であることを特徴とする請求項9に記載の電子装置又はディスプレイ又は部品。
- (a)接着剤層の表面に粒子の第1非ランダムアレイを転移するステップと、
(b)前記第1非ランダムアレイを第1深さに部分的に埋め込むステップと、
(c)前記接着剤層の前記表面に粒子の第2非ランダムアレイを転移するステップと、
(d)前記第2非ランダムアレイを第2深さに部分的に埋め込むステップとを備え、
前記第1深さを前記第2深さよりも深くすることを特徴とする多段異方性導電性フィルムの製造方法。 - 前記第1深さと前記第2深さとにおいてそれぞれ粒子の個数のピークを設けることを特徴とする請求項11に記載の多段異方性導電性フィルムの製造方法。
- 前記異方性導電性フィルムは、連続フィルム又はロールの形状であることを特徴とする請求項1に記載の異方性導電性フィルム。
- 前記第1アレイ及び前記第2アレイは、前記連続フィルム又はロールの限定領域内に配置されることを特徴とする請求項13に記載の異方性導電性フィルム。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/678,935 US20140141195A1 (en) | 2012-11-16 | 2012-11-16 | FIXED ARRAY ACFs WITH MULTI-TIER PARTIALLY EMBEDDED PARTICLE MORPHOLOGY AND THEIR MANUFACTURING PROCESSES |
US13/678,935 | 2012-11-16 | ||
PCT/US2013/069770 WO2014078338A1 (en) | 2012-11-16 | 2013-11-13 | IMPROVED FIXED ARRAY ACFs WITH MULTI-TIER PARTIALLY EMBEDDED PARTICLE MORPHOLOGY AND THEIR MANUFACTURING PROCESSES |
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JP2016503566A JP2016503566A (ja) | 2016-02-04 |
JP6144353B2 true JP6144353B2 (ja) | 2017-06-07 |
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JP2015542733A Active JP6144353B2 (ja) | 2012-11-16 | 2013-11-13 | 多段部分的埋込粒子形態を有する改良固定アレイ異方性導電フィルム及びその製造方法 |
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US (1) | US20140141195A1 (ja) |
JP (1) | JP6144353B2 (ja) |
KR (1) | KR101890104B1 (ja) |
CN (1) | CN104582946B (ja) |
TW (1) | TWI585185B (ja) |
WO (1) | WO2014078338A1 (ja) |
Families Citing this family (15)
Publication number | Priority date | Publication date | Assignee | Title |
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US9475963B2 (en) | 2011-09-15 | 2016-10-25 | Trillion Science, Inc. | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
WO2015119136A1 (ja) * | 2014-02-04 | 2015-08-13 | デクセリアルズ株式会社 | 異方性導電フィルム及びその製造方法 |
WO2015192004A1 (en) * | 2014-06-12 | 2015-12-17 | Alpha Metals, Inc. | Sintering materials and attachment methods using same |
WO2016022817A1 (en) * | 2014-08-06 | 2016-02-11 | University Of Utah Research Foundation | Water treatment device |
JP7052254B2 (ja) * | 2016-11-04 | 2022-04-12 | デクセリアルズ株式会社 | フィラー含有フィルム |
US10062660B2 (en) | 2015-03-04 | 2018-08-28 | Trillion Science, Inc. | Anisotropic conductive film including a reflective layer |
US9871177B2 (en) | 2015-03-04 | 2018-01-16 | Trillion Science, Inc. | Anisotropic conductive film (ACF) including a relfective layer |
WO2016182586A1 (en) * | 2015-05-14 | 2016-11-17 | Trillion Science, Inc. | Improved fixed array acfs with multi-tier partially embedded particle morphology and their manufacturing processes |
KR102421771B1 (ko) | 2015-07-06 | 2022-07-18 | 삼성디스플레이 주식회사 | 이방성 도전 필름 및 그 제조방법 |
US11390059B2 (en) * | 2015-12-18 | 2022-07-19 | 3M Innovative Properties Company | Decorative article featuring a microscopic periodic pattern and methods of making the same |
KR102513996B1 (ko) | 2016-03-15 | 2023-03-24 | 삼성디스플레이 주식회사 | 표시 장치 |
WO2017191772A1 (ja) * | 2016-05-05 | 2017-11-09 | デクセリアルズ株式会社 | フィラー配置フィルム |
JP7274810B2 (ja) * | 2016-05-05 | 2023-05-17 | デクセリアルズ株式会社 | 異方性導電フィルム |
CN110277186B (zh) * | 2019-06-27 | 2021-04-30 | 陈先彬 | 一种具有固定阵列的acf及其加工方法 |
KR20210121799A (ko) * | 2020-03-31 | 2021-10-08 | 동우 화인켐 주식회사 | 도전성 필름 적층체 및 이의 제조 방법 |
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JP2553491B2 (ja) * | 1985-02-15 | 1996-11-13 | カシオ計算機株式会社 | 電子部品の接合方法 |
JP3154713B2 (ja) * | 1990-03-16 | 2001-04-09 | 株式会社リコー | 異方性導電膜およびその製造方法 |
KR100478060B1 (ko) * | 1996-08-08 | 2005-03-23 | 니토 덴코 가부시키가이샤 | 이방 도전성 필름 및 그 제조 방법 |
US6352923B1 (en) * | 1999-03-01 | 2002-03-05 | United Microelectronics Corp. | Method of fabricating direct contact through hole type |
US7081675B2 (en) * | 2004-08-16 | 2006-07-25 | Telephus Inc. | Multilayered anisotropic conductive adhesive for fine pitch |
US8802214B2 (en) * | 2005-06-13 | 2014-08-12 | Trillion Science, Inc. | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
US20060280912A1 (en) * | 2005-06-13 | 2006-12-14 | Rong-Chang Liang | Non-random array anisotropic conductive film (ACF) and manufacturing processes |
JP4735229B2 (ja) * | 2005-12-12 | 2011-07-27 | 住友ベークライト株式会社 | 異方導電性フィルム |
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2012
- 2012-11-16 US US13/678,935 patent/US20140141195A1/en not_active Abandoned
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2013
- 2013-11-13 JP JP2015542733A patent/JP6144353B2/ja active Active
- 2013-11-13 WO PCT/US2013/069770 patent/WO2014078338A1/en active Application Filing
- 2013-11-13 CN CN201380045329.3A patent/CN104582946B/zh active Active
- 2013-11-13 KR KR1020157009890A patent/KR101890104B1/ko active IP Right Grant
- 2013-11-15 TW TW102141566A patent/TWI585185B/zh active
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CN104582946B (zh) | 2017-12-15 |
CN104582946A (zh) | 2015-04-29 |
TW201433619A (zh) | 2014-09-01 |
WO2014078338A1 (en) | 2014-05-22 |
KR101890104B1 (ko) | 2018-08-22 |
KR20150087191A (ko) | 2015-07-29 |
JP2016503566A (ja) | 2016-02-04 |
US20140141195A1 (en) | 2014-05-22 |
TWI585185B (zh) | 2017-06-01 |
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