CN107531039B - 具有多层部分嵌入颗粒形态的改良固定阵列acf以及它们的制造方法 - Google Patents
具有多层部分嵌入颗粒形态的改良固定阵列acf以及它们的制造方法 Download PDFInfo
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- CN107531039B CN107531039B CN201580079973.1A CN201580079973A CN107531039B CN 107531039 B CN107531039 B CN 107531039B CN 201580079973 A CN201580079973 A CN 201580079973A CN 107531039 B CN107531039 B CN 107531039B
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- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29199—Material of the matrix
- H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
- H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/06—Polymers
- H01L2924/078—Adhesive characteristics other than chemical
- H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
- H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Manufacturing Of Electrical Connectors (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Non-Insulated Conductors (AREA)
Abstract
Description
Claims (11)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US14/712,093 | 2015-05-14 | ||
US14/712,093 US9475963B2 (en) | 2011-09-15 | 2015-05-14 | Fixed array ACFs with multi-tier partially embedded particle morphology and their manufacturing processes |
PCT/US2015/040297 WO2016182586A1 (en) | 2015-05-14 | 2015-07-14 | Improved fixed array acfs with multi-tier partially embedded particle morphology and their manufacturing processes |
Publications (2)
Publication Number | Publication Date |
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CN107531039A CN107531039A (zh) | 2018-01-02 |
CN107531039B true CN107531039B (zh) | 2020-03-10 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201580079973.1A Active CN107531039B (zh) | 2015-05-14 | 2015-07-14 | 具有多层部分嵌入颗粒形态的改良固定阵列acf以及它们的制造方法 |
Country Status (5)
Country | Link |
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JP (1) | JP2018515889A (zh) |
KR (1) | KR20180008635A (zh) |
CN (1) | CN107531039B (zh) |
TW (1) | TW201639709A (zh) |
WO (1) | WO2016182586A1 (zh) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
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KR102322222B1 (ko) * | 2017-09-28 | 2021-11-05 | 주식회사 엘지에너지솔루션 | 요철 구조 표면을 갖는 금속층을 포함하는 파우치형 전지케이스 |
CN110277186B (zh) * | 2019-06-27 | 2021-04-30 | 陈先彬 | 一种具有固定阵列的acf及其加工方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110075226A (ko) * | 2009-12-28 | 2011-07-06 | 주식회사 효성 | 이방 도전성 접착필름 및 그 제조 방법 |
CN103562331A (zh) * | 2011-05-19 | 2014-02-05 | 兆科学公司 | 使用表面改性导电颗粒的固定阵列的各向异性导电膜 |
CN104582946A (zh) * | 2012-11-16 | 2015-04-29 | 兆科学公司 | 具有多层部分包埋颗粒形态的改进的固定阵列各向异性导电膜及其制造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20010008169A1 (en) * | 1998-06-30 | 2001-07-19 | 3M Innovative Properties Company | Fine pitch anisotropic conductive adhesive |
KR101056435B1 (ko) * | 2009-10-05 | 2011-08-11 | 삼성모바일디스플레이주식회사 | 이방성 도전 필름 및 이를 포함하는 표시 장치 |
US9102851B2 (en) * | 2011-09-15 | 2015-08-11 | Trillion Science, Inc. | Microcavity carrier belt and method of manufacture |
KR101375298B1 (ko) * | 2011-12-20 | 2014-03-19 | 제일모직주식회사 | 전도성 미립자 및 이를 포함하는 이방 전도성 필름 |
KR102125464B1 (ko) * | 2013-10-17 | 2020-06-23 | 삼성디스플레이 주식회사 | 이방성 도전 필름을 포함하는 표시 장치 및 이의 제조 방법 |
-
2015
- 2015-07-14 WO PCT/US2015/040297 patent/WO2016182586A1/en active Application Filing
- 2015-07-14 KR KR1020177036004A patent/KR20180008635A/ko not_active Application Discontinuation
- 2015-07-14 JP JP2017559562A patent/JP2018515889A/ja active Pending
- 2015-07-14 CN CN201580079973.1A patent/CN107531039B/zh active Active
- 2015-07-22 TW TW104123634A patent/TW201639709A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20110075226A (ko) * | 2009-12-28 | 2011-07-06 | 주식회사 효성 | 이방 도전성 접착필름 및 그 제조 방법 |
CN103562331A (zh) * | 2011-05-19 | 2014-02-05 | 兆科学公司 | 使用表面改性导电颗粒的固定阵列的各向异性导电膜 |
CN104582946A (zh) * | 2012-11-16 | 2015-04-29 | 兆科学公司 | 具有多层部分包埋颗粒形态的改进的固定阵列各向异性导电膜及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
WO2016182586A1 (en) | 2016-11-17 |
JP2018515889A (ja) | 2018-06-14 |
KR20180008635A (ko) | 2018-01-24 |
CN107531039A (zh) | 2018-01-02 |
TW201639709A (zh) | 2016-11-16 |
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