JP2016531450A - 集積バックライトユニット - Google Patents

集積バックライトユニット Download PDF

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Publication number
JP2016531450A
JP2016531450A JP2016544049A JP2016544049A JP2016531450A JP 2016531450 A JP2016531450 A JP 2016531450A JP 2016544049 A JP2016544049 A JP 2016544049A JP 2016544049 A JP2016544049 A JP 2016544049A JP 2016531450 A JP2016531450 A JP 2016531450A
Authority
JP
Japan
Prior art keywords
light emitting
waveguide
gap
led
disposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2016544049A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016531450A5 (enExample
Inventor
ピン ワン，
ピン ワン，
ダグラス ハーヴェイ，
ダグラス ハーヴェイ，
タイラー カクダ，
タイラー カクダ，
ロナルド カネシロ，
ロナルド カネシロ，
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
GLO AB
Original Assignee
GLO AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by GLO AB filed Critical GLO AB
Publication of JP2016531450A publication Critical patent/JP2016531450A/ja
Publication of JP2016531450A5 publication Critical patent/JP2016531450A5/ja
Pending legal-status Critical Current

Links

Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/90—Methods of manufacture
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/002—Fastening arrangements intended to retain light sources the fastening means engaging the encapsulation or the packaging of the semiconductor device
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V19/00—Fastening of light sources or lamp holders
    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
    • F21V19/0015—Fastening arrangements intended to retain light sources
    • F21V19/0025—Fastening arrangements intended to retain light sources the fastening means engaging the conductors of the light source, i.e. providing simultaneous fastening of the light sources and their electric connections
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0003—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being doped with fluorescent agents
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0013—Means for improving the coupling-in of light from the light source into the light guide
    • G02B6/0023—Means for improving the coupling-in of light from the light source into the light guide provided by one optical element, or plurality thereof, placed between the light guide and the light source, or around the light source
    • G02B6/0031—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/005—Means for improving the coupling-out of light from the light guide provided by one optical element, or plurality thereof, placed on the light output side of the light guide
    • G02B6/0055—Reflecting element, sheet or layer
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0066—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form characterised by the light source being coupled to the light guide
    • G02B6/0073—Light emitting diode [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
    • H01L21/4814—Conductive parts
    • H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/852—Encapsulations
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0035—Means for improving the coupling-out of light from the light guide provided on the surface of the light guide or in the bulk of it
    • G02B6/004—Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles
    • G02B6/0041—Scattering dots or dot-like elements, e.g. microbeads, scattering particles, nanoparticles provided in the bulk of the light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/0001—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems
    • G02B6/0011—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings specially adapted for lighting devices or systems the light guides being planar or of plate-like form
    • G02B6/0033—Means for improving the coupling-out of light from the light guide
    • G02B6/0056—Means for improving the coupling-out of light from the light guide for producing polarisation effects, e.g. by a surface with polarizing properties or by an additional polarizing elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0362—Manufacture or treatment of packages of encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0363—Manufacture or treatment of packages of optical field-shaping means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/855—Optical field-shaping means, e.g. lenses
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49121—Beam lead frame or beam lead device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Led Device Packages (AREA)
  • Planar Illumination Modules (AREA)
JP2016544049A 2013-09-23 2014-09-22 集積バックライトユニット Pending JP2016531450A (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
US201361881037P 2013-09-23 2013-09-23
US61/881,037 2013-09-23
US201361894466P 2013-10-23 2013-10-23
US61/894,466 2013-10-23
US201361905587P 2013-11-18 2013-11-18
US61/905,587 2013-11-18
US201462035872P 2014-08-11 2014-08-11
US62/035,872 2014-08-11
PCT/US2014/056811 WO2015042537A1 (en) 2013-09-23 2014-09-22 Integrated back light unit

Publications (2)

Publication Number Publication Date
JP2016531450A true JP2016531450A (ja) 2016-10-06
JP2016531450A5 JP2016531450A5 (enExample) 2017-11-02

Family

ID=52689510

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016544049A Pending JP2016531450A (ja) 2013-09-23 2014-09-22 集積バックライトユニット

Country Status (5)

Country Link
US (2) US9726802B2 (enExample)
JP (1) JP2016531450A (enExample)
CN (1) CN104981647A (enExample)
TW (1) TW201516541A (enExample)
WO (1) WO2015042537A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9419185B2 (en) 2014-01-27 2016-08-16 Glo Ab Method of singulating LED wafer substrates into dice with LED device with Bragg reflector
CN104696830A (zh) * 2015-03-30 2015-06-10 合肥京东方光电科技有限公司 一种背光模组、显示装置及背光模组的制作方法
KR101763893B1 (ko) * 2015-06-03 2017-08-01 주식회사 굿엘이디 광원 유닛 및 이의 제조 방법
US10295730B2 (en) 2015-08-18 2019-05-21 Glo Ab Light bar for back light unit containing resistance modulated LED strings
EP3446330A4 (en) 2016-04-22 2019-12-18 Glo Ab DIRECT VIEW DISPLAY WITH A SMALL TILTING ANGLE AND METHOD FOR PRODUCING THE SAME
DE202016102427U1 (de) * 2016-05-06 2017-08-08 Rehau Ag + Co Leuchte
DE202016102425U1 (de) * 2016-05-06 2017-08-09 Rehau Ag + Co Festlegeprofil
US10241253B2 (en) 2017-05-11 2019-03-26 Glo Ab Light bar containing symmetric LED placement and method of making thereof
US11637219B2 (en) 2019-04-12 2023-04-25 Google Llc Monolithic integration of different light emitting structures on a same substrate
TWI701482B (zh) * 2019-07-23 2020-08-11 友達光電股份有限公司 顯示裝置
CN110556458B (zh) * 2019-08-21 2020-09-11 华南师范大学 一种半导体微米线及其制备方法和光纤应力传感器及其制备方法
KR20240171365A (ko) * 2023-05-30 2024-12-09 현대모비스 주식회사 차량용 조명장치

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273185A (ja) * 2003-03-06 2004-09-30 Sharp Corp 面状照明装置およびこれを有する液晶表示装置
WO2005012787A1 (ja) * 2003-07-31 2005-02-10 Omron Corporation 面光源装置
JP2006156643A (ja) * 2004-11-29 2006-06-15 Citizen Electronics Co Ltd 表面実装型発光ダイオード
JP2007043179A (ja) * 2005-08-04 2007-02-15 Samsung Electronics Co Ltd 光発生ユニット、それを有する表示装置及びそれの駆動方法
JP2009252419A (ja) * 2008-04-03 2009-10-29 Minebea Co Ltd 線状光源装置、および面状照明装置
JP2010021131A (ja) * 2008-06-09 2010-01-28 Hitachi Ltd 表示装置及びそれに用いられるバックライトユニット
US20100231112A1 (en) * 2009-03-11 2010-09-16 Han-Ming Lee Backlight module lamp
JP2013084702A (ja) * 2011-10-07 2013-05-09 Fujifilm Corp 半導体発光装置及びその製造方法

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6712481B2 (en) 1995-06-27 2004-03-30 Solid State Opto Limited Light emitting panel assemblies
US20040070990A1 (en) * 2002-10-01 2004-04-15 Witold Szypszak LED illuminator and method of manufacture
JP4161713B2 (ja) * 2002-12-27 2008-10-08 カシオ計算機株式会社 面状照明装置
TWI351566B (en) * 2003-01-15 2011-11-01 Semiconductor Energy Lab Liquid crystal display device
US8270061B2 (en) 2003-11-01 2012-09-18 Silicon Quest Kabushiki-Kaisha Display apparatus using pulsed light source
US8128272B2 (en) 2005-06-07 2012-03-06 Oree, Inc. Illumination apparatus
RU2419741C2 (ru) 2005-11-21 2011-05-27 Конинклейке Филипс Электроникс Н.В. Оптическая система
JP4585481B2 (ja) 2006-04-28 2010-11-24 株式会社 日立ディスプレイズ Ｌｅｄバックライト及びそれを用いた液晶表示装置
US20070263409A1 (en) * 2006-05-09 2007-11-15 Mok Thye L Light guide plate with reflective light mixing
US7607814B2 (en) 2006-05-24 2009-10-27 3M Innovative Properties Company Backlight with symmetric wedge shaped light guide input portion with specular reflective surfaces
US20090128781A1 (en) 2006-06-13 2009-05-21 Kenneth Li LED multiplexer and recycler and micro-projector incorporating the Same
KR20090023688A (ko) 2006-06-14 2009-03-05 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 조명 장치 및 그 제조 방법
US8414173B2 (en) * 2007-07-27 2013-04-09 Sharp Kabushiki Kaisha Illumination device and display device
TWI367579B (en) * 2007-12-10 2012-07-01 Harvatek Corp Led chip package structure with a high-efficiency light-emitting effect
TWI389294B (zh) * 2008-03-07 2013-03-11 宏齊科技股份有限公司 A package structure for manufacturing a light emitting diode chip which reduces the luminous efficiency of a phosphor due to high temperature and a method of manufacturing the same
KR20110028307A (ko) * 2008-05-29 2011-03-17 크리 인코포레이티드 근거리장 영역 혼합을 갖는 광원
JP5196551B2 (ja) 2008-06-09 2013-05-15 Ｎｅｃライティング株式会社 発光装置
US8755005B2 (en) 2008-09-24 2014-06-17 Koninklijke Philips N.V. Thin edge backlight with LEDS optically coupled to the back surface
US8651711B2 (en) * 2009-02-02 2014-02-18 Apex Technologies, Inc. Modular lighting system and method employing loosely constrained magnetic structures
JP2011065010A (ja) 2009-09-18 2011-03-31 Panasonic Corp 画像形成装置
DE102009047481A1 (de) 2009-12-04 2011-06-09 Osram Gesellschaft mit beschränkter Haftung Leuchtmodul
US9632239B2 (en) 2011-03-10 2017-04-25 Lite-On Electronics (Guangzhou) Limited Linear light source, light guide, and optical scanning module
TWI427242B (zh) 2011-03-10 2014-02-21 Lite On Electronics Guangzhou 線性光源、導光體及光學掃描模組
US20130258216A1 (en) 2012-03-30 2013-10-03 Shin-Gwo Shiue Pico projection light system
US9677721B2 (en) 2012-12-21 2017-06-13 Flex-N-Gate Advanced Product Development, Llc Optical light pipe with uniform lit intensity

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004273185A (ja) * 2003-03-06 2004-09-30 Sharp Corp 面状照明装置およびこれを有する液晶表示装置
WO2005012787A1 (ja) * 2003-07-31 2005-02-10 Omron Corporation 面光源装置
JP2006156643A (ja) * 2004-11-29 2006-06-15 Citizen Electronics Co Ltd 表面実装型発光ダイオード
JP2007043179A (ja) * 2005-08-04 2007-02-15 Samsung Electronics Co Ltd 光発生ユニット、それを有する表示装置及びそれの駆動方法
JP2009252419A (ja) * 2008-04-03 2009-10-29 Minebea Co Ltd 線状光源装置、および面状照明装置
JP2010021131A (ja) * 2008-06-09 2010-01-28 Hitachi Ltd 表示装置及びそれに用いられるバックライトユニット
US20100231112A1 (en) * 2009-03-11 2010-09-16 Han-Ming Lee Backlight module lamp
JP2013084702A (ja) * 2011-10-07 2013-05-09 Fujifilm Corp 半導体発光装置及びその製造方法

Also Published As

Publication number Publication date
US20150085524A1 (en) 2015-03-26
US9726802B2 (en) 2017-08-08
US20150085521A1 (en) 2015-03-26
US10101518B2 (en) 2018-10-16
CN104981647A (zh) 2015-10-14
WO2015042537A1 (en) 2015-03-26
TW201516541A (zh) 2015-05-01

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