JP2016522569A - 強誘電体メモリ装置 - Google Patents
強誘電体メモリ装置 Download PDFInfo
- Publication number
- JP2016522569A JP2016522569A JP2016508221A JP2016508221A JP2016522569A JP 2016522569 A JP2016522569 A JP 2016522569A JP 2016508221 A JP2016508221 A JP 2016508221A JP 2016508221 A JP2016508221 A JP 2016508221A JP 2016522569 A JP2016522569 A JP 2016522569A
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- Prior art keywords
- ferroelectric
- unit
- polymer
- vdf
- polymers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F214/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen
- C08F214/18—Monomers containing fluorine
- C08F214/22—Vinylidene fluoride
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/14—Organic dielectrics
- H01G4/18—Organic dielectrics of synthetic material, e.g. derivatives of cellulose
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors (thin- or thick-film circuits; capacitors without a potential-jump or surface barrier specially adapted for integrated circuits, details thereof, multistep manufacturing processes therefor)
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G7/00—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture
- H01G7/06—Capacitors in which the capacitance is varied by non-mechanical means; Processes of their manufacture having a dielectric selected for the variation of its permittivity with applied voltage, i.e. ferroelectric capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B51/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors
- H10B51/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
- H10B53/30—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors characterised by the memory core region
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/01—Manufacture or treatment
- H10D30/021—Manufacture or treatment of FETs having insulated gates [IGFET]
- H10D30/0415—Manufacture or treatment of FETs having insulated gates [IGFET] of FETs having ferroelectric gate insulators
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/701—IGFETs having ferroelectric gate insulators, e.g. ferroelectric FETs
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/01—Manufacture or treatment
- H10D64/031—Manufacture or treatment of data-storage electrodes
- H10D64/033—Manufacture or treatment of data-storage electrodes comprising ferroelectric layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D64/00—Electrodes of devices having potential barriers
- H10D64/60—Electrodes characterised by their materials
- H10D64/66—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes
- H10D64/68—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator
- H10D64/689—Electrodes having a conductor capacitively coupled to a semiconductor by an insulator, e.g. MIS electrodes characterised by the insulator, e.g. by the gate insulator having ferroelectric layers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/20—Organic diodes
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/151—Copolymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B51/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory transistors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B53/00—Ferroelectric RAM [FeRAM] devices comprising ferroelectric memory capacitors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/682—Capacitors having no potential barriers having dielectrics comprising perovskite structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K19/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
- H10K19/202—Integrated devices comprising a common active layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K85/00—Organic materials used in the body or electrodes of devices covered by this subclass
- H10K85/10—Organic polymers or oligomers
- H10K85/141—Organic polymers or oligomers comprising aliphatic or olefinic chains, e.g. poly N-vinylcarbazol, PVC or PTFE
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Semiconductor Memories (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Formation Of Insulating Films (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR1353571A FR3004854B1 (fr) | 2013-04-19 | 2013-04-19 | Dispositif de memoire ferroelectrique |
| FR1353571 | 2013-04-19 | ||
| PCT/FR2014/050926 WO2014170606A1 (fr) | 2013-04-19 | 2014-04-16 | Dispositif de memoire ferroelectrique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016522569A true JP2016522569A (ja) | 2016-07-28 |
| JP2016522569A5 JP2016522569A5 (enExample) | 2017-04-27 |
Family
ID=48782411
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016508221A Pending JP2016522569A (ja) | 2013-04-19 | 2014-04-16 | 強誘電体メモリ装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US10199384B2 (enExample) |
| EP (1) | EP2987178A1 (enExample) |
| JP (1) | JP2016522569A (enExample) |
| KR (1) | KR20150145257A (enExample) |
| CN (1) | CN105283945B (enExample) |
| FR (1) | FR3004854B1 (enExample) |
| WO (1) | WO2014170606A1 (enExample) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10636471B2 (en) | 2016-04-20 | 2020-04-28 | Micron Technology, Inc. | Memory arrays, ferroelectric transistors, and methods of reading and writing relative to memory cells of memory arrays |
| US10403440B2 (en) | 2016-12-02 | 2019-09-03 | Carver Scientific, Inc. | Capacitive energy storage device |
| ES2909846T3 (es) | 2017-06-16 | 2022-05-10 | Carrier Corp | Sistema electrocalórico de transferencia de calor que comprende copolímeros |
| CN110444397B (zh) * | 2019-07-26 | 2022-06-21 | 上海工程技术大学 | 一种线电极结构的有机铁电薄膜电容器及其制备方法 |
| CN115053292A (zh) * | 2020-03-17 | 2022-09-13 | 华为技术有限公司 | 平面存储器、立体存储器以及电子设备 |
| EP4567054B1 (en) | 2020-06-30 | 2025-12-17 | Novocure GmbH | Flexible transducer arrays with a polymer insulating layer for applying tumor treating fields (ttfields) |
| US12108605B2 (en) * | 2022-08-19 | 2024-10-01 | Taiwan Semiconductor Manufacturing Company, Ltd. | Memory device and method of forming the same |
| CN121270771A (zh) * | 2025-12-10 | 2026-01-06 | 华中科技大学 | 一种铁电聚合物及交联改性制备铁电聚合物的方法 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02265906A (ja) * | 1989-04-07 | 1990-10-30 | Daikin Ind Ltd | 高分子誘電体材料 |
| US6355749B1 (en) * | 2000-06-02 | 2002-03-12 | The Penn State Research Foundation | Semicrystalline ferroelectric fluoropolymers and process for preparing same |
| JP2007525337A (ja) * | 2003-12-22 | 2007-09-06 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 強誘電性ポリマー層のパターニング方法 |
| JP2007324543A (ja) * | 2006-06-05 | 2007-12-13 | Seiko Epson Corp | 記憶素子の製造方法、記憶素子、記憶装置、および電子機器、ならびにトランジスタの製造方法 |
| JP2010528471A (ja) * | 2007-05-22 | 2010-08-19 | レイクスユニヴェルシテイト フローニンゲン | 強誘電体デバイスおよび可変調注入障壁 |
| WO2012084579A1 (en) * | 2010-12-22 | 2012-06-28 | Solvay Specialty Polymers Italy S.P.A. | Vinylidene fluoride and trifluoroethylene polymers |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2538157A1 (fr) | 1982-12-15 | 1984-06-22 | Saint Louis Inst | Procede et dispositif pour polariser des materiaux ferroelectriques |
| US6787238B2 (en) * | 1998-11-18 | 2004-09-07 | The Penn State Research Foundation | Terpolymer systems for electromechanical and dielectric applications |
| NO20005980L (no) | 2000-11-27 | 2002-05-28 | Thin Film Electronics Ab | Ferroelektrisk minnekrets og fremgangsmåte ved dens fremstilling |
| AU2003281556A1 (en) * | 2002-07-23 | 2004-02-09 | Matsushita Electric Industrial Co., Ltd. | Ferroelectric gate device |
| WO2004078814A2 (en) * | 2003-03-04 | 2004-09-16 | Honeywell International Inc. | Fluorinated polymers, methods of production and uses in ferroelectric devices thereof |
| NO324809B1 (no) * | 2005-05-10 | 2007-12-10 | Thin Film Electronics Asa | Fremgangsmate til dannelse av ferroelektriske tynnfilmer, bruk av fremgangsmaten og et minne med et minnemateriale av ferroelektrisk oligomer |
| NO324539B1 (no) * | 2005-06-14 | 2007-11-19 | Thin Film Electronics Asa | Fremgangsmate i fabrikasjonen av en ferroelektrisk minneinnretning |
| CN101356603B (zh) * | 2005-12-28 | 2012-11-21 | 宾夕法尼亚州研究基金会 | 基于作为介质材料的独特聚(1,1-二氟乙烯)共聚物和三元共聚物的快速放电和高效率的高电能密度聚合物电容器 |
| US7842390B2 (en) | 2006-10-03 | 2010-11-30 | The Penn State Research Foundation | Chain end functionalized fluoropolymers having good electrical properties and good chemical reactivity |
| WO2009005555A2 (en) * | 2007-04-11 | 2009-01-08 | The Penn State Research Foundation | Methods to improve the efficiency and reduce the energy losses in high energy density capacitor films and articles comprising the same |
| CN101471180A (zh) * | 2007-12-28 | 2009-07-01 | 中国科学院上海技术物理研究所 | 一种三元铁电聚合物薄膜材料的制备方法 |
| FR2944285B1 (fr) * | 2009-04-09 | 2011-11-25 | Francois Bauer | Procede de fabrication de terpolymeres a base de vdf, trfe et cfe ou ctfe |
-
2013
- 2013-04-19 FR FR1353571A patent/FR3004854B1/fr not_active Expired - Fee Related
-
2014
- 2014-04-16 US US14/785,544 patent/US10199384B2/en not_active Expired - Fee Related
- 2014-04-16 KR KR1020157033074A patent/KR20150145257A/ko not_active Ceased
- 2014-04-16 JP JP2016508221A patent/JP2016522569A/ja active Pending
- 2014-04-16 EP EP14725226.6A patent/EP2987178A1/fr not_active Withdrawn
- 2014-04-16 WO PCT/FR2014/050926 patent/WO2014170606A1/fr not_active Ceased
- 2014-04-16 CN CN201480034917.1A patent/CN105283945B/zh not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02265906A (ja) * | 1989-04-07 | 1990-10-30 | Daikin Ind Ltd | 高分子誘電体材料 |
| US6355749B1 (en) * | 2000-06-02 | 2002-03-12 | The Penn State Research Foundation | Semicrystalline ferroelectric fluoropolymers and process for preparing same |
| JP2007525337A (ja) * | 2003-12-22 | 2007-09-06 | コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ | 強誘電性ポリマー層のパターニング方法 |
| JP2007324543A (ja) * | 2006-06-05 | 2007-12-13 | Seiko Epson Corp | 記憶素子の製造方法、記憶素子、記憶装置、および電子機器、ならびにトランジスタの製造方法 |
| JP2010528471A (ja) * | 2007-05-22 | 2010-08-19 | レイクスユニヴェルシテイト フローニンゲン | 強誘電体デバイスおよび可変調注入障壁 |
| WO2012084579A1 (en) * | 2010-12-22 | 2012-06-28 | Solvay Specialty Polymers Italy S.P.A. | Vinylidene fluoride and trifluoroethylene polymers |
Also Published As
| Publication number | Publication date |
|---|---|
| FR3004854A1 (fr) | 2014-10-24 |
| US10199384B2 (en) | 2019-02-05 |
| CN105283945A (zh) | 2016-01-27 |
| US20160071852A1 (en) | 2016-03-10 |
| KR20150145257A (ko) | 2015-12-29 |
| WO2014170606A1 (fr) | 2014-10-23 |
| FR3004854B1 (fr) | 2015-04-17 |
| EP2987178A1 (fr) | 2016-02-24 |
| CN105283945B (zh) | 2019-10-08 |
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