JP2016516584A - テーパ制御のためのビーム角度とワークピース移動の連係方法 - Google Patents

テーパ制御のためのビーム角度とワークピース移動の連係方法 Download PDF

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JP2016516584A
JP2016516584A JP2016501337A JP2016501337A JP2016516584A JP 2016516584 A JP2016516584 A JP 2016516584A JP 2016501337 A JP2016501337 A JP 2016501337A JP 2016501337 A JP2016501337 A JP 2016501337A JP 2016516584 A JP2016516584 A JP 2016516584A
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workpiece
beam axis
angle
laser
along
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JP2016501337A
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Japanese (ja)
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JP2016516584A5 (https=
Inventor
チョウ,ハイビン
Original Assignee
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド
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Publication of JP2016516584A publication Critical patent/JP2016516584A/ja
Publication of JP2016516584A5 publication Critical patent/JP2016516584A5/ja
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/384Removing material by boring or cutting by boring of specially shaped holes

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
JP2016501337A 2013-03-15 2014-03-11 テーパ制御のためのビーム角度とワークピース移動の連係方法 Pending JP2016516584A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361793589P 2013-03-15 2013-03-15
US61/793,589 2013-03-15
PCT/US2014/023766 WO2014150604A1 (en) 2013-03-15 2014-03-11 Coordination of beam angle and workpiece movement for taper control

Publications (2)

Publication Number Publication Date
JP2016516584A true JP2016516584A (ja) 2016-06-09
JP2016516584A5 JP2016516584A5 (https=) 2017-02-23

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016501337A Pending JP2016516584A (ja) 2013-03-15 2014-03-11 テーパ制御のためのビーム角度とワークピース移動の連係方法

Country Status (7)

Country Link
US (1) US20140263212A1 (https=)
EP (1) EP2969372A4 (https=)
JP (1) JP2016516584A (https=)
KR (1) KR20150126603A (https=)
CN (1) CN105163897A (https=)
TW (1) TW201434562A (https=)
WO (1) WO2014150604A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020525289A (ja) * 2017-06-27 2020-08-27 レーザー エンジニアリング アプリケーションズ 基板を構造化するための方法、基板と、基板を構造化するための装置とを備えるアセンブリ、ならびにそのような構造を有する基板

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015023984A1 (en) 2013-08-16 2015-02-19 Electro Scientific Industries, Inc. Laser systems and methods for internally marking thin layers, and articles produced thereby
CN107111293B (zh) * 2014-12-29 2019-11-19 伊雷克托科学工业股份有限公司 经由具有对准特征的独立侧部测量的适应性零件轮廓建立
US10357848B2 (en) 2015-01-19 2019-07-23 General Electric Company Laser machining systems and methods
KR102781391B1 (ko) 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
KR101789185B1 (ko) * 2016-02-05 2017-10-23 주식회사 이오테크닉스 레이저 빔의 경사각을 이용한 레이저 가공방법
CN110139727B (zh) 2016-12-30 2022-04-05 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
DE102017100755A1 (de) * 2017-01-16 2018-07-19 Schott Ag Vorrichtung und Verfahren zur Bearbeitung von Glas- oder Glaskeramikelementen mittels eines Lasers
KR20250039487A (ko) 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
DE102018125436A1 (de) 2018-10-15 2020-04-16 Ewag Ag Verfahren zur materialabtragenden Laserbearbeitung eines Werkstücks
TWI843784B (zh) 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
EP3969220A1 (en) * 2019-05-17 2022-03-23 Corning Incorporated Phase-modified quasi-non-diffracting laser beams for high angle laser processing of transparent workpieces
WO2020251782A1 (en) 2019-06-10 2020-12-17 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
US12583058B2 (en) 2019-09-18 2026-03-24 Lincoln Global, Inc. Surface modification of welding wire drive rolls
CN115551682B (zh) * 2020-05-15 2025-09-12 发那科株式会社 用于激光加工的示教系统以及示教方法
CN114571105B (zh) * 2022-03-11 2023-11-17 苏州思萃声光微纳技术研究所有限公司 一种改进金属贯穿孔的锥角和圆度的激光打孔系统及方法
EP4265369A1 (de) 2022-04-21 2023-10-25 Rollomatic S.A. Verfahren zur laserbasierten bearbeitung eines werkstücks
EP4480628A1 (en) 2023-06-22 2024-12-25 Agathon AG, Maschinenfabrik Laser machining method and device
CN117300395B (zh) * 2023-11-28 2024-02-13 富通尼科技(苏州)有限公司 基于皮秒激光器的陶瓷钻孔方法、系统、设备及存储介质
CN117655563B (zh) * 2024-01-31 2024-05-28 成都沃特塞恩电子技术有限公司 激光切割路径规划方法、装置、电子设备及存储介质
CN117921213B (zh) * 2024-03-24 2024-07-09 成都沃特塞恩电子技术有限公司 控制切缝宽度的激光切割方法、装置及计算机设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03180294A (ja) * 1989-12-08 1991-08-06 Mitsubishi Electric Corp レーザ切断加工機
JP2013086129A (ja) * 2011-10-18 2013-05-13 Mitsuboshi Diamond Industrial Co Ltd レーザビームによるガラス基板加工装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2690184B2 (ja) * 1990-09-20 1997-12-10 ファナック株式会社 レーザ加工装置
US5854751A (en) * 1996-10-15 1998-12-29 The Trustees Of Columbia University In The City Of New York Simulator and optimizer of laser cutting process
US6501045B1 (en) * 2000-04-06 2002-12-31 Resonetics, Inc. Method and apparatus for controlling the taper angle of the walls of laser machined features
US20020066345A1 (en) * 2000-12-06 2002-06-06 Shepherd John D. Waterjet edge cut taper controlling method
US6706998B2 (en) * 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
CN1299873C (zh) * 2002-01-11 2007-02-14 电子科学工业公司 借助激光光斑放大来激光加工工件的方法
JP4527567B2 (ja) * 2005-03-01 2010-08-18 フェトン株式会社 レーザ加工装置及びレーザ加工方法
US20090057282A1 (en) * 2007-08-15 2009-03-05 Chunfu Huang Laser machining method utilizing variable inclination angle
JP4386137B2 (ja) * 2008-02-29 2009-12-16 トヨタ自動車株式会社 レーザ加工装置及びレーザ加工方法
US8119949B2 (en) * 2008-11-26 2012-02-21 Honeywell International Inc. Laser cutting shaped holes by trepanning on the fly
US8338745B2 (en) * 2009-12-07 2012-12-25 Panasonic Corporation Apparatus and methods for drilling holes with no taper or reverse taper
US8410394B2 (en) * 2010-01-08 2013-04-02 Uvtech Systems, Inc. Method and apparatus for processing substrate edges
US20120132629A1 (en) * 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Method and apparatus for reducing taper of laser scribes
JP2012223783A (ja) * 2011-04-18 2012-11-15 Panasonic Corp レーザ加工方法及びレーザ加工装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03180294A (ja) * 1989-12-08 1991-08-06 Mitsubishi Electric Corp レーザ切断加工機
JP2013086129A (ja) * 2011-10-18 2013-05-13 Mitsuboshi Diamond Industrial Co Ltd レーザビームによるガラス基板加工装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020525289A (ja) * 2017-06-27 2020-08-27 レーザー エンジニアリング アプリケーションズ 基板を構造化するための方法、基板と、基板を構造化するための装置とを備えるアセンブリ、ならびにそのような構造を有する基板
JP7245791B2 (ja) 2017-06-27 2023-03-24 レーザー エンジニアリング アプリケーションズ 基板を構造化するための方法、基板と、基板を構造化するための装置とを備えるアセンブリ、ならびにそのような構造を有する基板

Also Published As

Publication number Publication date
CN105163897A (zh) 2015-12-16
TW201434562A (zh) 2014-09-16
EP2969372A1 (en) 2016-01-20
WO2014150604A1 (en) 2014-09-25
KR20150126603A (ko) 2015-11-12
EP2969372A4 (en) 2016-11-16
US20140263212A1 (en) 2014-09-18

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