JP2016516584A - テーパ制御のためのビーム角度とワークピース移動の連係方法 - Google Patents
テーパ制御のためのビーム角度とワークピース移動の連係方法 Download PDFInfo
- Publication number
- JP2016516584A JP2016516584A JP2016501337A JP2016501337A JP2016516584A JP 2016516584 A JP2016516584 A JP 2016516584A JP 2016501337 A JP2016501337 A JP 2016501337A JP 2016501337 A JP2016501337 A JP 2016501337A JP 2016516584 A JP2016516584 A JP 2016516584A
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- beam axis
- angle
- laser
- along
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/0869—Devices involving movement of the laser head in at least one axial direction
- B23K26/0876—Devices involving movement of the laser head in at least one axial direction in at least two axial directions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/361—Removing material for deburring or mechanical trimming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
- B23K26/384—Removing material by boring or cutting by boring of specially shaped holes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361793589P | 2013-03-15 | 2013-03-15 | |
| US61/793,589 | 2013-03-15 | ||
| PCT/US2014/023766 WO2014150604A1 (en) | 2013-03-15 | 2014-03-11 | Coordination of beam angle and workpiece movement for taper control |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2016516584A true JP2016516584A (ja) | 2016-06-09 |
| JP2016516584A5 JP2016516584A5 (https=) | 2017-02-23 |
Family
ID=51522879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2016501337A Pending JP2016516584A (ja) | 2013-03-15 | 2014-03-11 | テーパ制御のためのビーム角度とワークピース移動の連係方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140263212A1 (https=) |
| EP (1) | EP2969372A4 (https=) |
| JP (1) | JP2016516584A (https=) |
| KR (1) | KR20150126603A (https=) |
| CN (1) | CN105163897A (https=) |
| TW (1) | TW201434562A (https=) |
| WO (1) | WO2014150604A1 (https=) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020525289A (ja) * | 2017-06-27 | 2020-08-27 | レーザー エンジニアリング アプリケーションズ | 基板を構造化するための方法、基板と、基板を構造化するための装置とを備えるアセンブリ、ならびにそのような構造を有する基板 |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015023984A1 (en) | 2013-08-16 | 2015-02-19 | Electro Scientific Industries, Inc. | Laser systems and methods for internally marking thin layers, and articles produced thereby |
| CN107111293B (zh) * | 2014-12-29 | 2019-11-19 | 伊雷克托科学工业股份有限公司 | 经由具有对准特征的独立侧部测量的适应性零件轮廓建立 |
| US10357848B2 (en) | 2015-01-19 | 2019-07-23 | General Electric Company | Laser machining systems and methods |
| KR102781391B1 (ko) | 2015-09-09 | 2025-03-17 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들 |
| KR101789185B1 (ko) * | 2016-02-05 | 2017-10-23 | 주식회사 이오테크닉스 | 레이저 빔의 경사각을 이용한 레이저 가공방법 |
| CN110139727B (zh) | 2016-12-30 | 2022-04-05 | 伊雷克托科学工业股份有限公司 | 用于延长镭射处理设备中的光学器件生命期的方法和系统 |
| DE102017100755A1 (de) * | 2017-01-16 | 2018-07-19 | Schott Ag | Vorrichtung und Verfahren zur Bearbeitung von Glas- oder Glaskeramikelementen mittels eines Lasers |
| KR20250039487A (ko) | 2018-06-05 | 2025-03-20 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법 |
| DE102018125436A1 (de) | 2018-10-15 | 2020-04-16 | Ewag Ag | Verfahren zur materialabtragenden Laserbearbeitung eines Werkstücks |
| TWI843784B (zh) | 2019-01-31 | 2024-06-01 | 美商伊雷克托科學工業股份有限公司 | 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體 |
| EP3969220A1 (en) * | 2019-05-17 | 2022-03-23 | Corning Incorporated | Phase-modified quasi-non-diffracting laser beams for high angle laser processing of transparent workpieces |
| WO2020251782A1 (en) | 2019-06-10 | 2020-12-17 | Electro Scientific Industries, Inc. | Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
| US12583058B2 (en) | 2019-09-18 | 2026-03-24 | Lincoln Global, Inc. | Surface modification of welding wire drive rolls |
| CN115551682B (zh) * | 2020-05-15 | 2025-09-12 | 发那科株式会社 | 用于激光加工的示教系统以及示教方法 |
| CN114571105B (zh) * | 2022-03-11 | 2023-11-17 | 苏州思萃声光微纳技术研究所有限公司 | 一种改进金属贯穿孔的锥角和圆度的激光打孔系统及方法 |
| EP4265369A1 (de) | 2022-04-21 | 2023-10-25 | Rollomatic S.A. | Verfahren zur laserbasierten bearbeitung eines werkstücks |
| EP4480628A1 (en) | 2023-06-22 | 2024-12-25 | Agathon AG, Maschinenfabrik | Laser machining method and device |
| CN117300395B (zh) * | 2023-11-28 | 2024-02-13 | 富通尼科技(苏州)有限公司 | 基于皮秒激光器的陶瓷钻孔方法、系统、设备及存储介质 |
| CN117655563B (zh) * | 2024-01-31 | 2024-05-28 | 成都沃特塞恩电子技术有限公司 | 激光切割路径规划方法、装置、电子设备及存储介质 |
| CN117921213B (zh) * | 2024-03-24 | 2024-07-09 | 成都沃特塞恩电子技术有限公司 | 控制切缝宽度的激光切割方法、装置及计算机设备 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03180294A (ja) * | 1989-12-08 | 1991-08-06 | Mitsubishi Electric Corp | レーザ切断加工機 |
| JP2013086129A (ja) * | 2011-10-18 | 2013-05-13 | Mitsuboshi Diamond Industrial Co Ltd | レーザビームによるガラス基板加工装置 |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2690184B2 (ja) * | 1990-09-20 | 1997-12-10 | ファナック株式会社 | レーザ加工装置 |
| US5854751A (en) * | 1996-10-15 | 1998-12-29 | The Trustees Of Columbia University In The City Of New York | Simulator and optimizer of laser cutting process |
| US6501045B1 (en) * | 2000-04-06 | 2002-12-31 | Resonetics, Inc. | Method and apparatus for controlling the taper angle of the walls of laser machined features |
| US20020066345A1 (en) * | 2000-12-06 | 2002-06-06 | Shepherd John D. | Waterjet edge cut taper controlling method |
| US6706998B2 (en) * | 2002-01-11 | 2004-03-16 | Electro Scientific Industries, Inc. | Simulated laser spot enlargement |
| CN1299873C (zh) * | 2002-01-11 | 2007-02-14 | 电子科学工业公司 | 借助激光光斑放大来激光加工工件的方法 |
| JP4527567B2 (ja) * | 2005-03-01 | 2010-08-18 | フェトン株式会社 | レーザ加工装置及びレーザ加工方法 |
| US20090057282A1 (en) * | 2007-08-15 | 2009-03-05 | Chunfu Huang | Laser machining method utilizing variable inclination angle |
| JP4386137B2 (ja) * | 2008-02-29 | 2009-12-16 | トヨタ自動車株式会社 | レーザ加工装置及びレーザ加工方法 |
| US8119949B2 (en) * | 2008-11-26 | 2012-02-21 | Honeywell International Inc. | Laser cutting shaped holes by trepanning on the fly |
| US8338745B2 (en) * | 2009-12-07 | 2012-12-25 | Panasonic Corporation | Apparatus and methods for drilling holes with no taper or reverse taper |
| US8410394B2 (en) * | 2010-01-08 | 2013-04-02 | Uvtech Systems, Inc. | Method and apparatus for processing substrate edges |
| US20120132629A1 (en) * | 2010-11-30 | 2012-05-31 | Electro Scientific Industries, Inc. | Method and apparatus for reducing taper of laser scribes |
| JP2012223783A (ja) * | 2011-04-18 | 2012-11-15 | Panasonic Corp | レーザ加工方法及びレーザ加工装置 |
-
2014
- 2014-03-11 EP EP14767505.2A patent/EP2969372A4/en not_active Withdrawn
- 2014-03-11 JP JP2016501337A patent/JP2016516584A/ja active Pending
- 2014-03-11 WO PCT/US2014/023766 patent/WO2014150604A1/en not_active Ceased
- 2014-03-11 US US14/205,200 patent/US20140263212A1/en not_active Abandoned
- 2014-03-11 CN CN201480015595.6A patent/CN105163897A/zh active Pending
- 2014-03-11 KR KR1020157022909A patent/KR20150126603A/ko not_active Withdrawn
- 2014-03-13 TW TW103108980A patent/TW201434562A/zh unknown
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03180294A (ja) * | 1989-12-08 | 1991-08-06 | Mitsubishi Electric Corp | レーザ切断加工機 |
| JP2013086129A (ja) * | 2011-10-18 | 2013-05-13 | Mitsuboshi Diamond Industrial Co Ltd | レーザビームによるガラス基板加工装置 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2020525289A (ja) * | 2017-06-27 | 2020-08-27 | レーザー エンジニアリング アプリケーションズ | 基板を構造化するための方法、基板と、基板を構造化するための装置とを備えるアセンブリ、ならびにそのような構造を有する基板 |
| JP7245791B2 (ja) | 2017-06-27 | 2023-03-24 | レーザー エンジニアリング アプリケーションズ | 基板を構造化するための方法、基板と、基板を構造化するための装置とを備えるアセンブリ、ならびにそのような構造を有する基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105163897A (zh) | 2015-12-16 |
| TW201434562A (zh) | 2014-09-16 |
| EP2969372A1 (en) | 2016-01-20 |
| WO2014150604A1 (en) | 2014-09-25 |
| KR20150126603A (ko) | 2015-11-12 |
| EP2969372A4 (en) | 2016-11-16 |
| US20140263212A1 (en) | 2014-09-18 |
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