TW201434562A - 錐度控制之射束角協調及工件運動 - Google Patents

錐度控制之射束角協調及工件運動 Download PDF

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Publication number
TW201434562A
TW201434562A TW103108980A TW103108980A TW201434562A TW 201434562 A TW201434562 A TW 201434562A TW 103108980 A TW103108980 A TW 103108980A TW 103108980 A TW103108980 A TW 103108980A TW 201434562 A TW201434562 A TW 201434562A
Authority
TW
Taiwan
Prior art keywords
workpiece
beam axis
angle
laser
along
Prior art date
Application number
TW103108980A
Other languages
English (en)
Chinese (zh)
Inventor
Haibin Zhang
Original Assignee
Electro Scient Ind Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electro Scient Ind Inc filed Critical Electro Scient Ind Inc
Publication of TW201434562A publication Critical patent/TW201434562A/zh

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Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/0869Devices involving movement of the laser head in at least one axial direction
    • B23K26/0876Devices involving movement of the laser head in at least one axial direction in at least two axial directions
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • B23K26/384Removing material by boring or cutting by boring of specially shaped holes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
TW103108980A 2013-03-15 2014-03-13 錐度控制之射束角協調及工件運動 TW201434562A (zh)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US201361793589P 2013-03-15 2013-03-15

Publications (1)

Publication Number Publication Date
TW201434562A true TW201434562A (zh) 2014-09-16

Family

ID=51522879

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103108980A TW201434562A (zh) 2013-03-15 2014-03-13 錐度控制之射束角協調及工件運動

Country Status (7)

Country Link
US (1) US20140263212A1 (https=)
EP (1) EP2969372A4 (https=)
JP (1) JP2016516584A (https=)
KR (1) KR20150126603A (https=)
CN (1) CN105163897A (https=)
TW (1) TW201434562A (https=)
WO (1) WO2014150604A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636844B (zh) * 2016-02-05 2018-10-01 Eo科技股份有限公司 雷射加工方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015023984A1 (en) 2013-08-16 2015-02-19 Electro Scientific Industries, Inc. Laser systems and methods for internally marking thin layers, and articles produced thereby
CN107111293B (zh) * 2014-12-29 2019-11-19 伊雷克托科学工业股份有限公司 经由具有对准特征的独立侧部测量的适应性零件轮廓建立
US10357848B2 (en) 2015-01-19 2019-07-23 General Electric Company Laser machining systems and methods
KR102781391B1 (ko) 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
CN110139727B (zh) 2016-12-30 2022-04-05 伊雷克托科学工业股份有限公司 用于延长镭射处理设备中的光学器件生命期的方法和系统
DE102017100755A1 (de) * 2017-01-16 2018-07-19 Schott Ag Vorrichtung und Verfahren zur Bearbeitung von Glas- oder Glaskeramikelementen mittels eines Lasers
BE1025341B1 (fr) * 2017-06-27 2019-02-04 LASER ENGINEERING APPLICATIONS S.A. en abrégé LASEA S.A. Méthode pour structurer un substrat
KR20250039487A (ko) 2018-06-05 2025-03-20 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 레이저 가공 장치, 그 작동 방법 및 이를 사용한 작업물 가공 방법
DE102018125436A1 (de) 2018-10-15 2020-04-16 Ewag Ag Verfahren zur materialabtragenden Laserbearbeitung eines Werkstücks
TWI843784B (zh) 2019-01-31 2024-06-01 美商伊雷克托科學工業股份有限公司 雷射加工設備、與設備一起使用的控制器及非暫時性電腦可讀取媒體
EP3969220A1 (en) * 2019-05-17 2022-03-23 Corning Incorporated Phase-modified quasi-non-diffracting laser beams for high angle laser processing of transparent workpieces
WO2020251782A1 (en) 2019-06-10 2020-12-17 Electro Scientific Industries, Inc. Laser processing apparatus, methods of operating the same, and methods of processing workpieces using the same
US12583058B2 (en) 2019-09-18 2026-03-24 Lincoln Global, Inc. Surface modification of welding wire drive rolls
CN115551682B (zh) * 2020-05-15 2025-09-12 发那科株式会社 用于激光加工的示教系统以及示教方法
CN114571105B (zh) * 2022-03-11 2023-11-17 苏州思萃声光微纳技术研究所有限公司 一种改进金属贯穿孔的锥角和圆度的激光打孔系统及方法
EP4265369A1 (de) 2022-04-21 2023-10-25 Rollomatic S.A. Verfahren zur laserbasierten bearbeitung eines werkstücks
EP4480628A1 (en) 2023-06-22 2024-12-25 Agathon AG, Maschinenfabrik Laser machining method and device
CN117300395B (zh) * 2023-11-28 2024-02-13 富通尼科技(苏州)有限公司 基于皮秒激光器的陶瓷钻孔方法、系统、设备及存储介质
CN117655563B (zh) * 2024-01-31 2024-05-28 成都沃特塞恩电子技术有限公司 激光切割路径规划方法、装置、电子设备及存储介质
CN117921213B (zh) * 2024-03-24 2024-07-09 成都沃特塞恩电子技术有限公司 控制切缝宽度的激光切割方法、装置及计算机设备

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0757427B2 (ja) * 1989-12-08 1995-06-21 三菱電機株式会社 レーザ切断加工機
JP2690184B2 (ja) * 1990-09-20 1997-12-10 ファナック株式会社 レーザ加工装置
US5854751A (en) * 1996-10-15 1998-12-29 The Trustees Of Columbia University In The City Of New York Simulator and optimizer of laser cutting process
US6501045B1 (en) * 2000-04-06 2002-12-31 Resonetics, Inc. Method and apparatus for controlling the taper angle of the walls of laser machined features
US20020066345A1 (en) * 2000-12-06 2002-06-06 Shepherd John D. Waterjet edge cut taper controlling method
US6706998B2 (en) * 2002-01-11 2004-03-16 Electro Scientific Industries, Inc. Simulated laser spot enlargement
CN1299873C (zh) * 2002-01-11 2007-02-14 电子科学工业公司 借助激光光斑放大来激光加工工件的方法
JP4527567B2 (ja) * 2005-03-01 2010-08-18 フェトン株式会社 レーザ加工装置及びレーザ加工方法
US20090057282A1 (en) * 2007-08-15 2009-03-05 Chunfu Huang Laser machining method utilizing variable inclination angle
JP4386137B2 (ja) * 2008-02-29 2009-12-16 トヨタ自動車株式会社 レーザ加工装置及びレーザ加工方法
US8119949B2 (en) * 2008-11-26 2012-02-21 Honeywell International Inc. Laser cutting shaped holes by trepanning on the fly
US8338745B2 (en) * 2009-12-07 2012-12-25 Panasonic Corporation Apparatus and methods for drilling holes with no taper or reverse taper
US8410394B2 (en) * 2010-01-08 2013-04-02 Uvtech Systems, Inc. Method and apparatus for processing substrate edges
US20120132629A1 (en) * 2010-11-30 2012-05-31 Electro Scientific Industries, Inc. Method and apparatus for reducing taper of laser scribes
JP2012223783A (ja) * 2011-04-18 2012-11-15 Panasonic Corp レーザ加工方法及びレーザ加工装置
JP5922906B2 (ja) * 2011-10-18 2016-05-24 三星ダイヤモンド工業株式会社 レーザビームによるガラス基板加工装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI636844B (zh) * 2016-02-05 2018-10-01 Eo科技股份有限公司 雷射加工方法

Also Published As

Publication number Publication date
CN105163897A (zh) 2015-12-16
EP2969372A1 (en) 2016-01-20
WO2014150604A1 (en) 2014-09-25
KR20150126603A (ko) 2015-11-12
EP2969372A4 (en) 2016-11-16
JP2016516584A (ja) 2016-06-09
US20140263212A1 (en) 2014-09-18

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