JP2016225407A5 - - Google Patents

Download PDF

Info

Publication number
JP2016225407A5
JP2016225407A5 JP2015108711A JP2015108711A JP2016225407A5 JP 2016225407 A5 JP2016225407 A5 JP 2016225407A5 JP 2015108711 A JP2015108711 A JP 2015108711A JP 2015108711 A JP2015108711 A JP 2015108711A JP 2016225407 A5 JP2016225407 A5 JP 2016225407A5
Authority
JP
Japan
Prior art keywords
liquid level
molten solder
lead
semiconductor device
solder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2015108711A
Other languages
English (en)
Japanese (ja)
Other versions
JP2016225407A (ja
JP6501618B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2015108711A priority Critical patent/JP6501618B2/ja
Priority claimed from JP2015108711A external-priority patent/JP6501618B2/ja
Publication of JP2016225407A publication Critical patent/JP2016225407A/ja
Publication of JP2016225407A5 publication Critical patent/JP2016225407A5/ja
Application granted granted Critical
Publication of JP6501618B2 publication Critical patent/JP6501618B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2015108711A 2015-05-28 2015-05-28 はんだ被膜形成装置、はんだ被膜形成方法および半導体装置 Expired - Fee Related JP6501618B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2015108711A JP6501618B2 (ja) 2015-05-28 2015-05-28 はんだ被膜形成装置、はんだ被膜形成方法および半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015108711A JP6501618B2 (ja) 2015-05-28 2015-05-28 はんだ被膜形成装置、はんだ被膜形成方法および半導体装置

Publications (3)

Publication Number Publication Date
JP2016225407A JP2016225407A (ja) 2016-12-28
JP2016225407A5 true JP2016225407A5 (https=) 2018-04-05
JP6501618B2 JP6501618B2 (ja) 2019-04-17

Family

ID=57748396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2015108711A Expired - Fee Related JP6501618B2 (ja) 2015-05-28 2015-05-28 はんだ被膜形成装置、はんだ被膜形成方法および半導体装置

Country Status (1)

Country Link
JP (1) JP6501618B2 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117226210A (zh) * 2023-09-25 2023-12-15 湖南省华芯医疗器械有限公司 一种高密度引脚的焊接方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6155993A (ja) * 1984-08-27 1986-03-20 富士通株式会社 部品の予備半田付け方法
JPS61189869A (ja) * 1985-02-18 1986-08-23 Tamura Seisakusho Co Ltd はんだ付け装置
JPH0286152A (ja) * 1988-09-22 1990-03-27 Hitachi Ltd はんだディップ装置
JPH02277753A (ja) * 1989-04-20 1990-11-14 Senju Metal Ind Co Ltd はんだメッキ方法およびその装置
JPH04196572A (ja) * 1990-11-28 1992-07-16 Seiko Epson Corp 半導体装置のはんだ被覆方法
JPH05347373A (ja) * 1992-06-12 1993-12-27 Seiko Epson Corp 半導体素子実装構造とその半田付け方法

Similar Documents

Publication Publication Date Title
US20170088454A1 (en) Method for reducing warpage occurring in glass sheet due to chemical strengthening treatment, method for producing glass sheet for chemical strengthening, and method for producing chemically strengthened glass sheet
CN107408560A (zh) 玻璃基板和包括所述玻璃基板的显示设备
CN104900571B (zh) 基板升降销及基板处理装置
WO2014185971A3 (en) Overflow molten metal transfer pump with gas and flux introduction
KR20160051124A (ko) 고무장갑 제조용 침지장치
WO2015038367A3 (en) Forming through wafer vias in glass
WO2016011644A1 (zh) 湿法刻蚀装置及其刻蚀方法
CN104772261A (zh) 一种涂布机及其控制方法
CN104419891A (zh) 对准掩模组件方法
CN111673390A (zh) 一种操作简单的led路灯灯杆加工工艺
JP2018049199A5 (https=)
JP2016225407A5 (https=)
RU2010103217A (ru) Стекловаренная печь и способ получения стеклянной продукции
JP2017530929A5 (https=)
CN106537575A (zh) 基板移送装置
MY188860A (en) Substrate for mounting semiconductor element, semiconductor device and optical semiconductor device, and method for manufacturing same
CN202351589U (zh) 干燥装置
CN207344309U (zh) 一种光学镜片上盘装置
CN105195397A (zh) 真空干燥系统和真空干燥方法
CN204550745U (zh) 晶圆电镀前处理装置
CN204400132U (zh) 取料理料装置
JP6501618B2 (ja) はんだ被膜形成装置、はんだ被膜形成方法および半導体装置
JP2015054769A5 (https=)
CN105990181A (zh) 顶针机构和除气腔室
TW201641000A (zh) 電子零件沾銀加工方法