JP2016225393A - Hollow electronic device sealing sheet, method for manufacturing hollow electronic device package, and hollow electronic device package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hollow electronic device sealing sheet capable of suppressing variations in the amount of resin entering a hollow portion between an electronic device and an adherend for each package.SOLUTION: In the hollow electronic device sealing sheet, the measurement of a storage modulus of a sample is started and a time T from the start to the storage modulus of 10 MPa is 400 seconds or less.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a sheet for sealing a hollow electronic device, a method for manufacturing an empty electronic device package, and a hollow electronic device package.

  Conventionally, when a hollow electronic device package having a hollow structure between an electronic device and a substrate is resin-sealed to produce a hollow electronic device package, a sheet-shaped sealing resin is often used. Yes (see, for example, Patent Document 1).

JP 2006-19714 A

  As a manufacturing method of the package, a sheet-shaped sealing resin is disposed on one or a plurality of electronic devices disposed on an adherend, and then the direction in which the electronic device and the sheet-shaped sealing resin are brought close to each other There is a method in which the electronic device is embedded in a sheet-shaped sealing resin by applying pressure to the sheet, and then the sheet-shaped sealing resin is thermally cured.

  When the above-described method is adopted, a part of the sealing resin enters the hollow portion between the electronic device and the adherend. However, there has been a problem that the variation in the amount of penetration is large for each package.

The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a hollow that can suppress the amount of resin entering the hollow portion between the electronic device and the adherend from being varied for each package. It is providing the sheet | seat for type | mold electronic devices sealing.
It is another object of the present invention to provide a method for manufacturing a hollow electronic device package capable of suppressing the amount of resin entering the hollow portion between the electronic device and the adherend from being varied for each package.
Moreover, it is providing the hollow type electronic device package which has the said sheet | seat for hollow type electronic device sealing.

  In order to achieve the above object, the present inventor first conducted intensive research on the reason why the amount of resin entering the hollow portion varies from package to package. As a result, when the above-described method is adopted, after embedding the electronic device in the sealing resin, at the time of thermosetting, first, a part of the sealing resin becomes low viscosity due to heat and flows into the hollow part. After entering, it was found that the resin became highly viscous with thermosetting, and the resin entry was stopped. The amount of resin flow at the time of thermosetting was greatly different for each package, and it was found difficult to control.

  The inventors of the present application have found that the above-mentioned problems can be solved by adopting the following configuration, and have completed the present invention.

That is, the hollow electronic device sealing sheet according to the present invention is characterized in that a time T measured by the following gel time measurement method is 400 seconds or less.
<Method for measuring gel time>
Preparing a sample for gel time measurement X, and
Step Y of starting measurement of the storage elastic modulus of the sample under the following measurement conditions and measuring time T from the start until the storage elastic modulus becomes 10 MPa.
<Measurement conditions>
Measuring device: Rheometer Measuring temperature: 170 ° C
Measuring method: Parallel plate method Plate diameter: 8mm
Mode: Constant temperature Strain: 0.05%
Frequency: 1Hz
Gap: 0.8mm

The measurement temperature at the time T (gel time) measurement is set to 170 ° C. in the manufacture of the hollow electronic device package using the hollow electronic device sealing sheet. The curing temperature is assumed.
According to the said structure, since time T (gel time) is 400 seconds or less, it can be said that the rate of increase in viscosity at 170 ° C. is relatively fast. Therefore, if the sheet for sealing a hollow electronic device is used, the amount of resin intrusion in the hollow portion between the electronic device and the adherend after the electronic device is embedded and until the thermosetting is completed ( (Movement amount) can be reduced.
Thus, according to the said structure, in manufacture of an actual hollow type electronic device package, the movement amount of the resin at the time of thermosetting which cannot control the approach amount of the resin to a hollow part can be suppressed. As a result, it is possible to suppress variation in the amount of resin entering the hollow portion from package to package.

  In the said structure, it is preferable that the viscosity in 90 degreeC before thermosetting is 400 kPa * s or less.

  When the viscosity at 90 ° C. before thermosetting is 400 kPa · s or less, the viscosity when embedding an electronic device is reasonably low. Therefore, at the time of embedding, the resin can enter the hollow part between the electronic device and the adherend. In the actual manufacture of the hollow electronic device package, the amount of resin entering the hollow portion is relatively easy to control. That is, according to the above-described configuration, the resin can enter the hollow portion at the time of embedding in which it is easy to control the amount of the resin entering the hollow portion, and the amount of resin movement during thermosetting that is difficult to control is suppressed. be able to. As a result, it is possible to further suppress the amount of resin entering the hollow portion from being varied for each package.

In the said structure, it is preferable that the storage elastic modulus in 25 degreeC after thermosetting is 8 * 10 < ⁹ > Pa or less.

When the storage elastic modulus at 25 ° C. after thermosetting is 8 × 10 ⁹ Pa or less, the elasticity is relatively low, so that the warpage of the package can be suppressed.

In addition, a method for manufacturing a hollow electronic device package according to the present invention includes:
A step of preparing a laminate in which an electronic device is fixed on an adherend via bumps;
Preparing the hollow electronic device sealing sheet; and
Arranging the hollow electronic device sealing sheet on the electronic device of the laminate; and
Embedding the electronic device in the hollow electronic device sealing sheet by hot pressing;
After the step of embedding, the method further comprises a step of thermosetting the hollow electronic device sealing sheet to obtain a sealing body.

  According to the said structure, since the said sheet | seat for hollow type electronic device sealing is used, the moving amount | distance of resin at the time of thermosetting which cannot control the approach amount of resin to a hollow part can be suppressed. As a result, it is possible to suppress variation in the amount of resin entering the hollow portion from package to package.

In addition, the hollow electronic device package according to the present invention,
It has the sheet | seat for said hollow type electronic device sealing.

According to the said structure, since it has the said sheet | seat for hollow type electronic device sealing, it is suppressed that the quantity of resin which penetrates into a hollow part varies for every package.

It is a cross-sectional schematic diagram of the sheet | seat for hollow type electronic device sealing which concerns on this embodiment. (A) is a cross-sectional schematic diagram for demonstrating the procedure which measures the approach amount X1 and the approach amount Y1, (b) is the top view. It is a cross-sectional schematic diagram for demonstrating the procedure which measures the approach amount X1 and the approach amount Y1. It is a cross-sectional schematic diagram for demonstrating the procedure which measures the approach amount X1 and the approach amount Y1. It is a cross-sectional schematic diagram for demonstrating the procedure which measures the approach amount X1 and the approach amount Y1. It is the elements on larger scale of FIG. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the hollow type electronic device package which concerns on this embodiment. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the hollow type electronic device package which concerns on this embodiment. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the hollow type electronic device package which concerns on this embodiment. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the hollow type electronic device package which concerns on this embodiment. It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the hollow type electronic device package which concerns on this embodiment.

  Embodiments of the present invention will be described below with reference to the drawings. However, the present invention is not limited only to these embodiments.

(Hollow type electronic device sealing sheet)
FIG. 1 is a schematic cross-sectional view of a hollow electronic device sealing sheet according to the present embodiment. As shown in FIG. 1, a hollow electronic device sealing sheet 11 (hereinafter also referred to as “sealing sheet 11”) is typically laminated on a separator 11 a such as a polyethylene terephthalate (PET) film. Provided in state. The separator 11a may be subjected to a mold release process in order to easily peel off the sealing sheet 11.

  In addition, although this embodiment demonstrates the case where a separator is laminated | stacked only on one side of the sheet | seat for hollow type electronic device sealing, this invention is not limited to this example, The sheet | seat for hollow type electronic device sealing Separator may be laminated on both sides. In this case, one separator can be peeled off immediately before use. In the present invention, the hollow electronic device sealing sheet may be provided as a single unit of the hollow electronic device sealing sheet without being laminated on the separator. Further, other layers may be laminated on the hollow electronic device sealing sheet as long as they do not contradict the spirit of the present invention.

  The sealing sheet 11 has a time T measured by the following gel time measurement method of 400 seconds or less. The time T (gel time) is preferably 380 seconds or less, and more preferably 350 seconds or less. Moreover, although the said time T is so preferable that it is short, it is 120 second or more, for example.

<Method for measuring gel time>
Preparing a sample for gel time measurement X, and
Step Y of starting measurement of the storage elastic modulus of the sample under the following measurement conditions and measuring time T from the start until the storage elastic modulus becomes 10 MPa.

<Measurement conditions>
Measuring device: Rheometer Measuring temperature: 170 ° C
Measuring method: Parallel plate method Plate diameter: 8mm
Mode: Constant temperature Strain: 0.05%
Frequency: 1Hz
Gap: 0.8mm

Since time T is 400 seconds or less, it can be said that the rate of increase in viscosity at 170 ° C. is relatively fast. Therefore, if the sealing sheet 11 is used, the amount of resin entering (moving amount) in the hollow portion between the electronic device and the adherend after the electronic device is embedded and until the thermosetting is completed. Can be reduced.
Thus, according to the sheet 11 for sealing, in the manufacture of an actual hollow electronic device package, it is possible to suppress the amount of movement of the resin at the time of thermosetting in which it is difficult to control the amount of the resin entering the hollow portion. . As a result, it is possible to suppress variation in the amount of resin entering the hollow portion from package to package.
Examples of the method for controlling the time T include selecting the type and amount of a curing accelerator described later, using a polyfunctionalized epoxy resin, and using a polyfunctionalized phenol resin. .

The sealing sheet 11 preferably has a viscosity at 90 ° C. before thermosetting of 400 kPa · s or less. The viscosity at 90 ° C. before the thermosetting is more preferably 150 kPa · s or more and 380 kPa · s or less, and further preferably 200 kPa · s or more and 350 kPa · s or less. When the viscosity at 90 ° C. before the thermosetting is 400 kPa · s or less, the viscosity when embedding an electronic device is reasonably low. Therefore, at the time of embedding, the resin can enter the hollow part between the electronic device and the adherend. In the actual manufacture of the hollow electronic device package, the amount of resin entering the hollow portion is relatively easy to control. In other words, according to the sealing sheet 11, the resin can enter the hollow portion during embedding in which it is easy to control the amount of resin entering the hollow portion, and the amount of resin movement during thermosetting that is difficult to control. Can be suppressed. As a result, it is possible to further suppress the amount of resin entering the hollow portion from being varied for each package.
On the other hand, when the viscosity at 90 ° C. before the thermosetting is 150 kPa · s or more, an excessive amount of penetration during embedding can be prevented.

  As a method for controlling the viscosity at 90 ° C. of the sealing sheet 11, a method for adjusting the kind and content of the following thermoplastic resin, the content of the inorganic filler, and the like, and for forming the sealing sheet 11. The method etc. which adjust with the stirring conditions at the time of varnish or kneaded material preparation of this are mentioned.

The sheet 11 for sealing preferably has a storage elastic modulus at 25 ° C. of 8 × 10 ⁹ Pa or less after thermosetting, more preferably 1 × 10 ⁵ Pa or more and 1 × 10 ⁹ Pa or less, More preferably, it is 1 × 10 ⁶ Pa or more and 8 × 10 ⁸ Pa or less. When the storage elastic modulus at 25 ° C. after thermosetting is 8 × 10 ⁹ Pa or less, the elasticity is relatively low, so that the warpage of the package can be suppressed. Moreover, long-term reliability can be ensured that the storage elastic modulus at 25 ° C. after thermosetting is 1 × 10 ⁵ Pa or more.

  Examples of a method for controlling the storage elastic modulus at 25 ° C. after the thermosetting of the sealing sheet 11 include a method of adjusting by an addition amount of an inorganic filler and an addition amount of a thermoplastic resin.

  In the sealing sheet 11, the entry amount X1 measured by the following steps A to G is preferably 0 μm or more and 30 μm or less, more preferably 3 μm or more and 25 μm or less, and 5 μm or more and 23 μm or less. More preferably. Moreover, it is preferable that the value (Y1-X1) which subtracted the approach amount X1 from the approach amount Y1 is 30 micrometers or less, It is more preferable that it is 15 micrometers or less, It is further more preferable that it is 10 micrometers or less.

Step A for preparing a dummy chip mounting substrate in which four dummy chips having the following specifications are mounted on a glass substrate (length 6 cm, width 10 cm, thickness 1.3 mm) via resin bumps,
Step B for preparing a sample of a sheet for sealing a hollow electronic device having a size of 2 cm in length, 2 cm in width and 210 μm in thickness,
Placing the sample on the dummy chip of the dummy chip mounting substrate;
Embedding the dummy chip in the sample under the following embedding conditions:
Step E after the step D, measuring the amount X1 of resin that constitutes the sample into the hollow portion between the dummy chip and the glass substrate,
After the step E, it is left in a hot air dryer at 170 ° C. for 2 hours, and the sample is thermally cured to obtain a sealed body sample, and F
Step G of measuring an amount Y1 of the resin entering the hollow portion in the sealing body sample.
<Dummy chip specifications>
A resin bump having a chip size of 3 mm in length, 3 mm in width, 200 μm in thickness, and 50 μm in height is formed. Distance W between adjacent chips: 0.5mm
<Embedding conditions>
Pressing method: Flat plate press Temperature: 90 ° C
Applied pressure: 1.2 MPa
Degree of vacuum during pressing: 10 torr
Press time: 1 minute

  Hereinafter, an approach amount X1 and a method for obtaining a value obtained by subtracting the approach amount X1 from the approach amount Y1 will be described.

  FIG. 2A is a schematic cross-sectional view for explaining a procedure for measuring the approach amount X1 and the approach amount Y1, and FIG. 2B is a plan view thereof. 3-5 is a cross-sectional schematic diagram for demonstrating the procedure which measures the approach amount X1 and the approach amount Y1. FIG. 6 is a partially enlarged view of FIG.

(Step A)
In Step A, as shown in FIGS. 2A and 2B, four dummy chips 113 are mounted on a glass substrate 112 (length 6 cm, width 10 cm, thickness 1.3 mm) via resin bumps 113a. The prepared dummy chip mounting substrate 115 is prepared. The specifications of the dummy chip 113 are as follows. More specifically, the dummy chip mounting substrate 115 is prepared by the method described in the embodiments.
<Specifications of dummy chip 113>
A resin bump 113a having a chip size of 3 mm in length, 3 mm in width, 200 μm in thickness, and 50 μm in height is formed. Distance W between adjacent chips: 0.5mm

(Step B)
In Step B, as shown in FIG. 3, a sample 111 having a size of 2 cm in length, 2 cm in width, and 210 μm in thickness is prepared. The sample 111 is made of the same material as the sealing sheet 11 and has a size of 2 cm in length, 2 cm in width, and 210 μm in thickness. In the present embodiment, a case where the sample 111 is stacked on the separator 111a will be described. For example, the sample 111 can be prepared by first creating the sealing sheet 11 having a length of 10 cm or more, a width of 10 cm or more, and a thickness of 220 μm, and then cutting the sheet into a size of 2 cm in length, 2 cm in width, and 210 μm in thickness. it can. The sealing sheet 11 itself does not have to be 2 cm in length, 2 cm in width, and 210 μm in thickness.

(Step C)
In step C, as shown in FIG. 4, the sample 111 is placed on the dummy chip 113 of the dummy chip mounting substrate 115. For example, the dummy chip mounting substrate 115 is disposed on the lower heating plate 122 with the surface to which the dummy chip 113 is fixed facing upward, and the sample 111 is disposed on the surface of the dummy chip 113. In this step, the dummy chip mounting substrate 115 may be first disposed on the lower heating plate 122, and then the sample 111 may be disposed on the dummy chip mounting substrate 115, or the sample 111 may be disposed on the dummy chip mounting substrate 115. A laminate in which the dummy chip mounting substrate 115 and the sample 111 are laminated may be disposed on the lower heating plate 122 after being laminated first.

(Step D)
After step C, in step D, as shown in FIG. 5, the dummy chip 113 is embedded (sealed) in the sample 111 under the following embedding conditions. Specifically, the dummy chip 113 is embedded in the sample 111 by hot pressing with the lower heating plate 122 and the upper heating plate 124 included in the flat plate press under the following embedding conditions. Then, it is left at atmospheric pressure and room temperature (25 ° C.). The leaving time is within 24 hours.
<Embedding conditions>
Pressing method: Flat plate press Temperature: 90 ° C
Applied pressure: 1.2 MPa
Degree of vacuum during pressing: 10 torr
Press time: 1 minute

(Step E)
After step D, in step E, the amount X1 of resin that forms the sample 111 into the hollow portion 114 between the dummy chip 113 and the glass substrate 112 is measured (see FIG. 6). The approach amount X1 is the maximum reach distance of the resin that has entered the hollow portion 114 from the end portion of the dummy chip 113.

(Step F)
After Step E, the structure in which the dummy chip 113 is embedded in the sample 111 is left in a hot air dryer at 170 ° C. for 2 hours, and the sample 111 is thermally cured to obtain a sealed sample.

(Step G)
After the step F, the amount Y1 of the resin entering the hollow portion 114 in the sealing body sample is measured. The amount of entry Y1 is the maximum reachable distance of the resin that has entered the hollow portion 114 from the end of the dummy chip 113.

  Thereafter, a value obtained by subtracting the approach amount X1 from the approach amount Y1 is obtained.

  As described above, the approach amount X1 and the method for obtaining the value obtained by subtracting the approach amount X1 from the approach amount Y1 have been described.

As described above, the sealing sheet 11 preferably has an entry amount X1 measured by the procedure of Step A to Step G of 0 μm or more and 30 μm or less. Moreover, it is preferable that the value which subtracted the said approach amount X1 from the approach amount Y1 is 30 micrometers or less.
When the penetration amount X1 is not less than 0 μm and not more than 30 μm, the hollow portion between the electronic device and the adherend when the electronic device is embedded in the sealing sheet 11 in the production of an actual hollow electronic device package It is possible to allow the resin to appropriately enter.
In addition, when the value obtained by subtracting the entry amount X1 from the entry amount Y1 is 30 μm or less, the resin in the hollow portion when the sealing sheet 11 is thermally cured in the actual manufacture of the hollow electronic device package. Flow can be suppressed.
Note that the physical properties of the sealing sheet 11 are evaluated using the approach amount X1 and the value obtained by subtracting the approach amount X1 from the approach amount Y1, assuming the manufacture of an actual hollow electronic device package. This is for evaluation under conditions. However, the conditions in these evaluations may naturally differ from the conditions in the actual manufacturing of the hollow electronic device package.

  Moreover, it is preferable that the said approach amount Y1 is 90 micrometers or less, and it is more preferable that it is 60 micrometers or less. In a hollow electronic device package, an active surface formed on a bump or an electronic device is often provided on the inner side by 90 μm or more in the direction of the hollow portion from the end of the electronic device. Therefore, if the amount of penetration Y1 is 60 μm or less, it is possible to function reliably as a hollow electronic device package.

  It is preferable that the sealing sheet 11 includes an epoxy resin and a phenol resin. Thereby, favorable thermosetting is obtained.

  The epoxy resin is not particularly limited. For example, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, modified bisphenol A type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol F type epoxy resin, dicyclopentadiene type Various epoxy resins such as an epoxy resin, a phenol novolac type epoxy resin, and a phenoxy resin can be used. These epoxy resins may be used alone or in combination of two or more.

  From the viewpoint of ensuring the toughness of the epoxy resin after curing and the reactivity of the epoxy resin, it is preferably a solid at an ordinary temperature with an epoxy equivalent of 150 to 250, a softening point or a melting point of 50 to 130 ° C. From the viewpoint of reliability, bisphenol F type epoxy resin, bisphenol A type epoxy resin, biphenyl type epoxy resin and the like are more preferable.

  The phenol resin is not particularly limited as long as it causes a curing reaction with the epoxy resin. For example, a phenol novolac resin, a phenol aralkyl resin, a biphenyl aralkyl resin, a dicyclopentadiene type phenol resin, a cresol novolak resin, a resole resin, or the like is used. These phenolic resins may be used alone or in combination of two or more.

  From the viewpoint of reactivity with the epoxy resin, it is preferable to use a phenol resin having a hydroxyl group equivalent of 70 to 250 and a softening point of 50 to 110 ° C., and in particular, from the viewpoint of high curing reactivity and low cost. A phenol novolac resin can be preferably used. From the viewpoint of reliability, low hygroscopic materials such as phenol aralkyl resins and biphenyl aralkyl resins can also be suitably used.

  From the viewpoint of curing reactivity, the blending ratio of the epoxy resin and the phenol resin is blended so that the total number of hydroxyl groups in the phenol resin is 0.7 to 1.5 equivalents with respect to 1 equivalent of the epoxy group in the epoxy resin. Preferably, it is 0.9 to 1.2 equivalents.

  The lower limit of the total content of the epoxy resin and the phenol resin in the sealing sheet 11 is preferably 2% by weight or more, and more preferably 3% by weight or more. Adhesive force with respect to an electronic device, a board | substrate, etc. is acquired favorably as it is 5.0 weight% or more. On the other hand, the upper limit of the total content is preferably 25% by weight or less, and more preferably 20% by weight or less. When the content is 25% by weight or less, the hygroscopicity of the sealing sheet can be reduced.

  It is preferable that the sealing sheet 11 includes a thermoplastic resin. Thereby, the heat resistance of the obtained sealing sheet, flexibility, and intensity | strength can be improved.

  As thermoplastic resins, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplasticity Polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET and PBT, polyamideimide resin, fluorine resin, styrene-isobutylene-styrene block copolymer, etc. Can be mentioned. These thermoplastic resins can be used alone or in combination of two or more. Especially, an acrylic resin is preferable from a viewpoint that a flexibility is easy to obtain and a dispersibility with an epoxy resin is favorable.

  The acrylic resin is not particularly limited, and includes one or two or more esters of acrylic acid or methacrylic acid having a linear or branched alkyl group having 30 or less carbon atoms, particularly 4 to 18 carbon atoms. Examples thereof include a polymer (acrylic copolymer) as a component. Examples of the alkyl group include a methyl group, ethyl group, propyl group, isopropyl group, n-butyl group, t-butyl group, isobutyl group, amyl group, isoamyl group, hexyl group, heptyl group, cyclohexyl group, 2- Examples include an ethylhexyl group, an octyl group, an isooctyl group, a nonyl group, an isononyl group, a decyl group, an isodecyl group, an undecyl group, a lauryl group, a tridecyl group, a tetradecyl group, a stearyl group, an octadecyl group, and a dodecyl group.

  The glass transition temperature (Tg) of the acrylic resin is preferably 50 ° C. or lower, more preferably −70 to 20 ° C., and further preferably −50 to 0 ° C. By setting the temperature to 50 ° C. or less, the sheet can have flexibility.

  Among the acrylic resins, those having a weight average molecular weight of 50,000 or more are preferable, those having 100,000 to 2,000,000 are more preferable, and those having 300,000 to 1,600,000 are more preferable. Within the above numerical range, the viscosity and flexibility of the sealing sheet 11 can be further increased. The weight average molecular weight is a value measured by GPC (gel permeation chromatography) and calculated in terms of polystyrene.

  In addition, the other monomer forming the polymer is not particularly limited, and examples thereof include acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Carboxyl group-containing monomers such as acid anhydride monomers such as maleic anhydride or itaconic anhydride, 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4- (meth) acrylic acid 4- Hydroxybutyl, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate or (4-hydroxymethylcyclohexyl) -Methyla Hydroxyl group-containing monomers such as relate, styrene sulfonic acid, allyl sulfonic acid, 2- (meth) acrylamide-2-methylpropane sulfonic acid, (meth) acrylamide propane sulfonic acid, sulfopropyl (meth) acrylate or (meth) Examples thereof include sulfonic acid group-containing monomers such as acryloyloxynaphthalene sulfonic acid, and phosphoric acid group-containing monomers such as 2-hydroxyethylacryloyl phosphate. Among these, from the viewpoint that the viscosity of the sealing sheet 11 can be increased by reacting with the epoxy resin, it contains at least one of a carboxyl group-containing monomer, a glycidyl group (epoxy group) -containing monomer, and a hydroxyl group-containing monomer. preferable.

  The content of the thermoplastic resin in the sealing sheet 11 is preferably 8% by weight or more, and more preferably 10% by weight or more. When the content is 8% by weight or more, the flexibility and flexibility of the sealing sheet can be obtained. The content of the thermoplastic resin in the sealing sheet 11 is preferably 20% by weight or less, and more preferably 18% by weight or less. Adhesiveness of the sheet | seat for sealing with respect to an electronic device or a board | substrate is favorable in it being 18 weight% or less.

  It is preferable that the sealing sheet 11 contains an inorganic filler.

  The inorganic filler is not particularly limited, and various conventionally known fillers can be used. For example, quartz glass, talc, silica (such as fused silica and crystalline silica), alumina, aluminum nitride, nitriding Examples thereof include silicon and boron nitride powders. These may be used alone or in combination of two or more. Among these, silica and alumina are preferable, and silica is more preferable because the linear expansion coefficient can be satisfactorily reduced.

  As silica, silica powder is preferable, and fused silica powder is more preferable. Examples of the fused silica powder include spherical fused silica powder and crushed fused silica powder. From the viewpoint of fluidity, spherical fused silica powder is preferable.

  It is preferable that the sealing sheet 11 contains an inorganic filler in the range of 69 to 86% by volume. The content is more preferably 75% by volume or more, and still more preferably 78% by volume or more. When the inorganic filler is contained in the range of 69 to 86% by volume, the thermal expansion coefficient can be made closer to the SAW chip 13. As a result, package warpage can be suppressed. Furthermore, when the inorganic filler is contained within the range of 69 to 86% by volume, the water absorption rate can be lowered.

  When the inorganic filler is silica, the content of the inorganic filler can also be described in units of “wt%”. The content of silica in the sealing sheet 11 is preferably 60 to 88% by weight, and more preferably 70 to 85% by weight.

The average particle size of the inorganic filler is preferably 20 μm or less, more preferably 0.1 to 15 μm, and particularly preferably 0.5 to 10 μm. preferable.
Further, as the inorganic filler, two or more inorganic fillers having different average particle diameters may be used. When two or more kinds of inorganic fillers having different average particle diameters are used, the above-mentioned “average particle diameter of the inorganic filler is 20 μm or less” means that the average particle diameter of the whole inorganic filler is 20 μm or less.

  The shape of the inorganic filler is not particularly limited, and may be any shape such as a spherical shape (including an ellipsoidal shape), a polyhedron shape, a polygonal column shape, a flat shape, and an indeterminate shape. From the viewpoint of achieving a high filling state and appropriate fluidity, a spherical shape is preferred.

The inorganic filler contained in the sealing sheet 11 preferably has two peaks in the particle size distribution measured by a laser diffraction scattering method. Such an inorganic filler can be obtained, for example, by mixing two kinds of inorganic fillers having different average particle diameters. When an inorganic filler having two peaks in the particle size distribution is used, the inorganic filler can be filled at a high density. As a result, it is possible to increase the content of the inorganic filler.
The two peaks are not particularly limited, but the peak on the larger particle size side is preferably in the range of 3 to 30 μm, and the peak on the smaller particle size side is preferably in the range of 0.1 to 1 μm. . When the two peaks are within the numerical range, the content of the inorganic filler can be further increased.
Specifically, the particle size distribution is obtained by the following method.
(A) The sealing sheet 11 is put into a crucible and ignited at 700 ° C. for 2 hours in an air atmosphere to be incinerated.
(B) The obtained ash content is dispersed in pure water and subjected to ultrasonic treatment for 10 minutes, and the particle size distribution using a laser diffraction scattering type particle size distribution measuring device (“LS 13 320”; wet method) manufactured by Beckman Coulter, Inc. (Volume basis) is obtained.
The composition of the sealing sheet 11 is an organic component other than the inorganic filler, and substantially all the organic components are burned away by the above-described strong heat treatment. Therefore, the obtained ash is regarded as the inorganic filler and the measurement is performed. Do. The average particle size can be calculated simultaneously with the particle size distribution.

  The sealing sheet 11 is preferably surface-treated in advance with an inorganic filler with a silane coupling agent.

  The silane coupling agent is not particularly limited as long as it has a methacryloxy group or an acryloxy group and can perform a surface treatment of the inorganic filler. Specific examples of the silane coupling agent include 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltriethoxysilane, methacryloxy. Examples include octyltrimethoxysilane and methacryloxyoctyltriethoxysilane. Of these, 3-methacryloxypropyltrimethoxysilane is preferable from the viewpoint of reactivity and cost.

  When the surface of the inorganic filler is treated with a silane coupling agent, outgas (for example, methanol) is generated. Therefore, if the inorganic filler is surface-treated with a silane coupling agent in advance before the sealing sheet 11 is formed, a certain amount of outgas can be eliminated at this stage. As a result, the amount of outgas trapped in the sheet at the time of producing the sealing sheet 11 can be suppressed, and the generation of voids can be reduced.

When the sealing sheet 11 contains an inorganic filler surface-treated in advance with a compound having a methacryloxy group or an acryloxy group as a silane coupling agent, the inorganic filler is added to 100 parts by weight of the inorganic filler. On the other hand, it is preferable that the surface treatment is performed in advance with 0.5 to 2 parts by weight of a silane coupling agent.
If the surface treatment of the inorganic filler is performed with the silane coupling agent, the viscosity of the sealing sheet 11 can be suppressed from becoming too large. However, if the amount of the silane coupling agent is large, the outgas generation amount increases. . Therefore, even if the inorganic filler is surface-treated in advance, the performance of the sealing sheet 11 is deteriorated by the outgas generated when the sealing sheet 11 is formed. On the other hand, if the amount of the silane coupling agent is small, the viscosity may become too large. Therefore, if the inorganic filler is surface-treated in advance with 0.5 to 2 parts by weight of the silane coupling agent with respect to 100 parts by weight of the inorganic filler, the viscosity can be suitably reduced and the performance degradation due to outgassing can be reduced. Can be suppressed.

The sealing sheet 11 contains a methacryloxy group as a silane coupling agent or an inorganic filler that has been surface-treated in advance with a compound having an acryloxy group, and the inorganic filler has an average particle size. When using a mixture of two types of inorganic fillers having different diameters, it is preferable to surface-treat at least the inorganic filler having a smaller average particle diameter with a silane coupling agent in advance. Since the inorganic filler having a smaller average particle diameter has a larger specific surface area, an increase in viscosity can be further suppressed.
Moreover, when using what mixed two types of inorganic fillers from which an average particle diameter differs as said inorganic filler, both the inorganic filler with a smaller average particle diameter and the larger inorganic filler are previously made into silane. It is more preferable to surface-treat with a coupling agent. In this case, the increase in viscosity can be further suppressed.

  It is preferable that the sealing sheet 11 includes a curing accelerator.

The curing accelerator is not particularly limited as long as the curing of the epoxy resin and the phenol resin is allowed to proceed, but one that can set the reaction start temperature to 130 ° C. or less is preferable. Examples of such a curing accelerator include 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2,4-diamino-6- [2′-methylimidazolyl- (1 ′)]-ethyl-s-. A triazine etc. can be mentioned. If a curing accelerator capable of setting the reaction start temperature to 130 ° C. or lower is used, thermal curing starts at 130 ° C. or lower. Therefore, after the electronic device is embedded, The amount of resin entering (moving) in the hollow portion between the adherend and the adherend can be further reduced. Of these, 2-phenyl-4-methyl-5-hydroxymethylimidazole is preferred from the viewpoint of reaction temperature and storage stability.
In this specification, the reaction start temperature refers to the temperature at which exotherm starts in DSC measurement (not the temperature at the intersection of the tangent at the inflection point from the reaction start to the peak and the baseline).

  As for content of a hardening accelerator, 0.1-5 weight part is preferable with respect to a total of 100 weight part of an epoxy resin and a phenol resin.

  The sheet | seat 11 for sealing may contain a flame retardant component as needed. This can reduce the expansion of combustion when ignition occurs due to component short-circuiting or heat generation. As the flame retardant composition, for example, various metal hydroxides such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, complex metal hydroxides; phosphazene flame retardants, etc. should be used. Can do.

  It is preferable that the sealing sheet 11 contains a pigment. The pigment is not particularly limited, and examples thereof include carbon black.

  The content of the pigment in the sealing sheet 11 is preferably 0.1 to 2% by weight. When the content is 0.1% by weight or more, good marking properties can be obtained. The intensity | strength of the sheet | seat for sealing after hardening can be ensured as it is 2 weight% or less.

  In addition to the above components, other additives can be appropriately blended in the resin composition as necessary.

  Although the thickness of the sheet | seat 11 for sealing is not specifically limited, For example, it is 100-2000 micrometers. An electronic device can be favorably sealed as it is in the said range.

  The sealing sheet 11 may have a single layer structure or a multilayer structure in which two or more sealing sheets are laminated.

[Method for producing sheet for encapsulating hollow electronic device]
The sealing sheet 11 is prepared by dissolving and dispersing a resin or the like for forming the sealing sheet 11 in an appropriate solvent to adjust the varnish, and applying the varnish on the separator 11a to a predetermined thickness. After forming the coating film, the coating film can be formed by drying under predetermined conditions. It does not specifically limit as a coating method, For example, roll coating, screen coating, gravure coating, etc. are mentioned. As drying conditions, for example, the drying temperature is 70 to 160 ° C. and the drying time is 1 to 30 minutes.
As another method, after the varnish is applied on a support to form a coating film, the coating film may be dried under the drying conditions to form the sealing sheet 11. Thereafter, the sealing sheet 11 is bonded to the separator 11a together with the support. In particular, when the sealing sheet 11 includes a thermoplastic resin (acrylic resin), an epoxy resin, and a phenol resin, all of these are dissolved in a solvent, and then applied and dried. Examples of the solvent include methyl ethyl ketone, ethyl acetate, toluene and the like.
The sealing sheet 11 may be manufactured by kneading extrusion. As a method for producing by kneading extrusion, for example, a kneaded product is prepared by melt-kneading each component for forming the sealing sheet 11 with a known kneader such as a mixing roll, a pressure kneader, or an extruder. And a method of plasticizing the obtained kneaded material to form a sheet.
Specifically, the encapsulating sheet can be formed by extrusion molding without cooling the kneaded product after melt-kneading while keeping the high temperature state. Such an extrusion method is not particularly limited, and examples thereof include a T-die extrusion method, a roll rolling method, a roll kneading method, a co-extrusion method, and a calendar molding method. The extrusion temperature is preferably at least the softening point of each component described above, and is 40 to 150 ° C., preferably 50 to 140 ° C., more preferably 70 to 120 ° C., considering the thermosetting property and moldability of the epoxy resin. is there. As described above, the sealing sheet 11 can be formed.

[Method of manufacturing hollow electronic device package]
The manufacturing method of the hollow electronic device package according to the present embodiment is as follows:
A step of preparing a laminate in which an electronic device is fixed on an adherend via bumps;
A step of preparing a sheet for sealing a hollow electronic device;
Arranging the hollow electronic device sealing sheet on the electronic device of the laminate; and
Embedding the electronic device in the hollow electronic device sealing sheet by hot pressing;
After the embedding step, the method includes at least a step of thermosetting the hollow electronic device sealing sheet to obtain a sealing body.

  The adherend is not particularly limited, and examples thereof include a printed wiring board, a ceramic substrate, a silicon substrate, and a metal substrate. In the present embodiment, the SAW chip 13 mounted on the printed wiring board 12 is hollow-sealed with the sealing sheet 11 to produce a hollow package. The SAW chip 13 is a chip having a SAW (Surface Acoustic Wave) filter. That is, in this embodiment, a case where the electronic device of the present invention is a chip having a SAW (Surface Acoustic Wave) filter will be described.

  7 to 11 are schematic cross-sectional views for explaining the method for manufacturing the hollow electronic device package according to this embodiment.

(Process of preparing a laminate)
In the method for manufacturing a hollow package according to this embodiment, first, a laminate 15 in which a plurality of SAW chips 13 (SAW filters 13) are mounted on a printed wiring board 12 is prepared (see FIG. 7). The SAW chip 13 can be formed by dicing a piezoelectric crystal on which predetermined comb-shaped electrodes are formed by a known method. For mounting the SAW chip 13 on the printed wiring board 12, a known device such as a flip chip bonder or a die bonder can be used. The SAW chip 13 and the printed wiring board 12 are electrically connected via bumps 13a. In addition, a hollow portion 14 is maintained between the SAW chip 13 and the printed wiring board 12 so as not to inhibit the propagation of surface acoustic waves on the surface of the SAW filter. The distance (width of the hollow portion) between the SAW chip 13 and the printed wiring board 12 can be set as appropriate, and is generally about 10 to 100 μm.

(Process for preparing a sheet for sealing a hollow electronic device)
Moreover, in the manufacturing method of the hollow package which concerns on this embodiment, the sheet | seat 11 for sealing (refer FIG. 1) is prepared.

(Process of arranging a sheet for sealing a hollow electronic device)
Next, as shown in FIG. 8, the laminated body 15 is disposed on the lower heating plate 22 with the surface on which the SAW chip 13 is fixed facing upward, and the sealing sheet 11 is disposed on the surface of the SAW chip 13. Place. In this step, the laminated body 15 may be first disposed on the lower heating plate 22, and then the sealing sheet 11 may be disposed on the laminated body 15, and the sealing sheet 11 may be disposed on the laminated body 15. A laminate obtained by laminating first and then laminating the laminate 15 and the sealing sheet 11 may be disposed on the lower heating plate 22.

(Process of embedding an electronic device in a sheet for sealing a hollow electronic device)
Next, as shown in FIG. 9, the SAW chip 13 is embedded in the sealing sheet 11 by hot pressing with the lower heating plate 22 and the upper heating plate 24. The lower heating plate 22 and the upper heating plate 24 may be provided in a flat plate press. The sealing sheet 11 functions as a sealing resin for protecting the SAW chip 13 and its accompanying elements from the external environment.

  This embedding step is preferably performed so that the amount X2 of the resin constituting the sealing sheet 11 enters the hollow portion 14 between the SAW filter 13 and the printed wiring board 12 is 0 μm or more and 40 μm or less. The entry amount X2 is preferably 0 μm or more and 30 μm or less. The method of setting the ingress amount X2 to 0 μm or more and 40 μm or less can be achieved by adjusting the viscosity of the sealing sheet 11 or adjusting hot press conditions. More specifically, for example, there is a method of setting the pressure and the temperature higher.

  Specifically, the hot press conditions for embedding the SAW chip 13 in the sealing sheet 11 vary depending on the viscosity of the sealing sheet 11, but the temperature is preferably 40 to 150 ° C., more preferably It is 60-120 degreeC, a pressure is 0.1-10 MPa, for example, Preferably it is 0.2-5 MPa, and time is 0.3-10 minutes, for example, Preferably it is 0.5-5 minutes. Examples of the hot press method include a parallel plate press and a roll press. Of these, a parallel plate press is preferable. By setting the hot press condition within the above numerical range, the approach amount X2 can be easily within the numerical range.

In view of improving the adhesion and followability of the sealing sheet 11 to the SAW chip 13 and the printed wiring board 12, it is preferable to press the sheet under reduced pressure.
As the pressure reduction conditions, the pressure is, for example, 0 to 20 Torr, preferably 5 to 10 Torr, and the pressure reduction holding time (time from the pressure reduction start to the press start) is, for example, 5 to 600 seconds, preferably 10 to 300 seconds.

(Separator peeling process)
Next, when the sealing sheet 11 is used with the separator attached to one side as in this embodiment, the separator 11a is peeled off (see FIG. 10).

(Process to obtain a sealed body by thermosetting)
Next, the sealing sheet 11 is obtained by thermosetting the sealing sheet 11.
In the step of obtaining the sealing body, when the amount of the resin entering the hollow portion 14 in the state after the step of obtaining the sealing body 25 is Y2, the entry amount X2 is subtracted from the entry amount Y2. It is preferable to carry out such that the value is 30 μm or less. The value obtained by subtracting the entry amount X2 from the entry amount Y2 is preferably 25 μm or less. As a method of setting the value obtained by subtracting the entry amount X2 from the entry amount Y2 to be 30 μm or less, the viscosity before curing of the sealing sheet 11 is adjusted, or the sealing rate is increased so that the curing rate at the time of heating is increased. This can be achieved by adjusting the constituent material of the sheet 11. Specifically, it can be achieved, for example, by selecting the curing accelerator.

Specifically, although the heat curing conditions vary depending on the viscosity and the constituent materials of the sealing sheet 11, the heating temperature is preferably 100 ° C. or higher, more preferably 120 ° C. or higher. On the other hand, the upper limit of the heating temperature is preferably 200 ° C. or lower, more preferably 180 ° C. or lower. The heating time is preferably 10 minutes or more, more preferably 30 minutes or more. On the other hand, the upper limit of the heating time is preferably 180 minutes or less, more preferably 120 minutes or less. Moreover, you may pressurize as needed, Preferably it is 0.1 Mpa or more, More preferably, it is 0.5 Mpa or more. On the other hand, the upper limit is preferably 10 MPa or less, more preferably 5 MPa or less.
By setting the conditions of the thermosetting treatment within the above numerical range, the flow distance of the resin between the embedding process and after the thermosetting process, that is, the value obtained by subtracting the entry amount X2 from the entry amount Y2 is set to 30 μm or less. easy.

  When only one SAW filter 13 as an electronic device is sealed, the sealing body 25 can be made into one hollow electronic device package. Further, when the plurality of SAW filters 13 are sealed together, each of the SAW filters can be divided into one hollow electronic device package. That is, when the plurality of SAW filters 13 are collectively sealed as in this embodiment, the following configuration may be further performed.

(Dicing process)
You may dice the sealing body 25 after a thermosetting process (refer FIG. 6). Thereby, the hollow package 18 (hollow type electronic device package) in units of the SAW chip 13 can be obtained.

(Board mounting process)
If necessary, a substrate mounting step can be performed in which bumps are formed on the hollow package 18 and mounted on a separate substrate (not shown). For mounting the hollow package 18 on the substrate, a known device such as a flip chip bonder or a die bonder can be used.

In the above-described embodiment, the case where the hollow electronic device of the present invention is the SAW chip 13 which is a semiconductor chip having a movable part has been described. However, the hollow electronic device of the present invention is not limited to this example as long as it has a hollow portion between the adherend and the electronic device. For example, it may be a semiconductor chip having MEMS (Micro Electro Mechanical Systems) such as a pressure sensor and a vibration sensor as the movable part.
Further, in the above-described embodiment, the case where the electronic device is embedded with a parallel plate press using the hollow electronic device sealing sheet has been described. However, the present invention is not limited to this example, and the vacuum in a vacuum state is used. In the chamber, the laminate of the electronic device and the hollow electronic device sealing sheet is sealed with a release film, and then a gas at atmospheric pressure or higher is introduced into the chamber so that the electronic device is sealed with the hollow electronic device. It may be embedded in the thermosetting sealing sheet of the stop sheet. Specifically, the electronic device may be embedded in the thermosetting sealing sheet of the hollow electronic device sealing sheet by the method described in JP2013-52424A.

  In the following, preferred embodiments of the present invention will be described in detail by way of example. However, the materials, blending amounts, and the like described in the examples are not intended to limit the scope of the present invention only to those unless otherwise specified.

The components of the sealing sheet used in the examples will be described.
Epoxy resin: YSLV-80XY manufactured by Nippon Steel Chemical Co., Ltd. (bisphenol F type epoxy resin, epkin equivalent 200 g / eq., Softening point 80 ° C.)
Phenol resin: LVR8210DL (Novolak-type phenol resin, hydroxyl group equivalent 104 g / eq., Softening point 60 ° C.) manufactured by Gunei Chemical
Curing accelerator A: 2P4MHZ-PW (2-phenyl-4-hydroxymethyl-5-methylimidazole) manufactured by Shikoku Kasei Kogyo Co., Ltd.
Curing accelerator B: 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazole) manufactured by Shikoku Kasei Kogyo Co., Ltd.
Thermoplastic resin: HME-2006M (manufactured by Negami Kogyo Co., Ltd. (carboxyl group-containing acrylate copolymer, weight average molecular weight: about 600,000, glass transition temperature (Tg): −35 ° C.)
Carbon black: # 20 manufactured by Mitsubishi Chemical
Inorganic filler A: SMCC1 (average particle size 5 μm, surface-treated pear) manufactured by Admatex
Inorganic filler B: SC220G-SMJ (average particle size 0.5 mm) manufactured by Admatechs Co., Ltd., which was surface-treated with 3-methacryloxypropyltrimethoxysilane (product name: KBM-503 manufactured by Shin-Etsu Chemical Co., Ltd.). Surface treatment with 1 part by weight of silane coupling agent with respect to 100 parts by weight of inorganic filler B.

[Creation of Electronic Device Sealing Sheets According to Examples and Comparative Examples]
According to the compounding ratio of the sealing sheet described in Table 1, each component was dissolved and dispersed in methyl ethyl ketone as a solvent to obtain a varnish having a concentration of 85% by weight. This varnish was applied on a silicone release-treated separator and then dried at 110 ° C. for 5 minutes. Thereby, a sheet having a thickness of 52.5 μm was obtained. Four layers of this sheet were laminated to produce a sealing sheet for hollow sealing having a thickness of 210 μm.

(Measurement of viscosity of sealing sheet at 90 ° C)
The viscosity at 90 ° C. of the sealing sheets prepared in Examples and Comparative Examples was measured by a parallel plate method using a rheometer (MAAKE III, manufactured by HAAKE). More specifically, the viscosity was measured three times under the conditions of a gap of 0.8 mm, a parallel plate diameter of 8 mm, a frequency of 1 Hz, a strain of 0.05%, and a 90 ° C. isothermal condition, and the average was taken as the viscosity at 90 ° C. The results are shown in Table 1.

(Measurement of reaction start temperature)
Using differential scanning calorimetry (DSC), the sealing sheets according to Examples and Comparative Examples were heated from 0 ° C. to 250 ° C. under a temperature rising rate of 3 ° C./min, and a DSC curve (vertical axis: Heat flow, horizontal axis: temperature). Next, the temperature at which the exotherm of the DSC curve started was read and used as the reaction start temperature. The results are shown in Table 1.

(Measurement of storage modulus at 25 ° C after thermosetting)
The sealing sheets produced in the examples and comparative examples were thermally cured at 150 ° C. for 1 hour. In the present specification, the “storage elastic modulus at 25 ° C. after thermosetting” refers to the storage elastic modulus at 25 ° C. after thermosetting at 150 ° C. for 1 hour.
Next, the storage elastic modulus at 25 ° C. after the thermosetting of the sealing sheet was measured. The results are shown in Table 1.
Here, the storage elastic modulus is obtained by cutting the sealing sheet into a strip shape having a thickness of 200 μm, a width of 5 mm, and a length of 50 mm with a cutter knife, and using a dynamic viscoelasticity measuring device (DMA) at 25 ° C. and a frequency of 1 It is the value of the tensile storage modulus E ′ when measured under the condition of 0.0 Hz.

(Evaluation of resin penetration into package hollow)
<Step A>
First, a dummy chip mounting substrate was prepared in which four dummy chips having the following specifications were mounted on a glass substrate (length 6 cm, width 10 cm, thickness 1.3 mm) via resin bumps. The gap width between the glass substrate and the dummy chip was 50 μm.
<Dummy chip specifications>
A resin bump (resin material: acrylic resin) having a chip size of 3 mm in length, 3 mm in width, and 200 μm in thickness, 50 μm in height and 10 μm in diameter is formed. The number of bumps per chip is 60 bumps. Bumps are arranged at a pitch of 25 μm. The material of the dummy chip is a silicon wafer. The distance W between adjacent chips is 0.5 mm.

Specifically, the dummy chip mounting substrate was prepared by mounting the dummy chip on the glass substrate under the following bonding conditions.
<Bonding conditions>
Equipment: manufactured by Panasonic Electric Works Co., Ltd. Bonding conditions: 200 ° C., 3N, 1 second, ultrasonic output 2W

<Step B>
The 210-μm-thick sealing sheet prepared in the above Examples and Comparative Examples was cut into 2 cm length and 2 cm width to make a sample.

<Step C>
The sample was placed on the dummy chip of the dummy chip mounting substrate.

<Step D>
The dummy chip was embedded in the sample under the following embedding conditions.
<Embedding conditions>
Pressing method: Flat plate press Temperature: 90 ° C
Applied pressure: 1.2 MPa
Degree of vacuum during pressing: 10 torr
Press time: 1 minute

<Step E>
After opening to atmospheric pressure, the amount X1 of resin that constitutes the sample into the hollow portion between the dummy chip and the glass substrate was measured. Specifically, the amount X1 of the resin entering the hollow portion between the dummy chip and the ceramic substrate was measured using a product name “Digital Microscope” (200 times) manufactured by KEYENCE Corporation. The resin ingress amount X1 was determined by measuring the maximum reach distance of the resin that entered the hollow portion from the end of the SAW chip, and this was defined as the resin ingress amount X1. In addition, when there was no entry and the hollow portion spread outside the SAW chip, the resin entry amount was expressed as minus (in this example and the comparative example, there was no minus).

<Step F>
After Step E, it was left in a hot air dryer at 170 ° C. for 2 hours. Thereby, the said sample was thermosetted and the sealing body sample was obtained.

<Step G>
Thereafter, the amount Y1 of the resin entering the hollow portion in the sealed sample was measured. The measuring method is the same as the approach amount X1.

  Thereafter, a value obtained by subtracting the approach amount X1 from the approach amount Y1 was obtained. The results are shown in Table 1. The case where the value obtained by subtracting the approach amount X1 from the approach amount Y1 was 25 μm or less was evaluated as “◯”, and the case where the value was larger than 25 μm was evaluated as “X”. The results are shown in Table 1.

(Measurement of gel time)
First, a sample for gel time measurement was prepared for the sealing sheets of Examples and Comparative Examples (Step X). Next, measurement of the storage elastic modulus of the sample was started under the following measurement conditions, and a time T from the start until the storage elastic modulus became 10 MPa was measured (step Y). The results are shown in Table 1.
<Measurement conditions>
Measuring device: Rheometer (HAAKE, MARS III)
Measurement temperature: 170 ° C
Measuring method: Parallel plate method Plate diameter: 8mm
Mode: Constant temperature Strain: 0.05%
Frequency: 1Hz
Gap: 0.8mm

11 Hollow electronic device sealing sheet (sealing sheet)
13 SAW filter (electronic device)
DESCRIPTION OF SYMBOLS 14 Hollow part 15 Laminated body 18 Hollow type electronic device package 25 Sealing body 112 Glass substrate 113 Dummy chip 113a Resin bump 114 Hollow part 115 Dummy chip mounting board

Claims (5)

A sheet for sealing a hollow electronic device, wherein a time T measured by the following gel time measurement method is 400 seconds or less.
<Method for measuring gel time>
Preparing a sample for gel time measurement X, and
Step Y of starting measurement of the storage elastic modulus of the sample under the following measurement conditions and measuring time T from the start until the storage elastic modulus becomes 10 MPa.
<Measurement conditions>
Measuring device: Rheometer Measuring temperature: 170 ° C
Measuring method: Parallel plate method Plate diameter: 8mm
Mode: Constant temperature Strain: 0.05%
Frequency: 1Hz
Gap: 0.8mm   The sheet for sealing a hollow electronic device according to claim 1, wherein the viscosity at 90 ° C. before thermosetting is 400 kPa · s or less. The sheet for sealing a hollow electronic device according to claim 1, wherein the storage elastic modulus at 25 ° C. after thermosetting is 8 × 10 ⁹ Pa or less. A step of preparing a laminate in which an electronic device is fixed on an adherend via bumps;
Preparing a sheet for sealing a hollow electronic device according to any one of claims 1 to 3,
Arranging the hollow electronic device sealing sheet on the electronic device of the laminate; and
Embedding the electronic device in the hollow electronic device sealing sheet by hot pressing;
A method for producing a hollow electronic device package, comprising: after the embedding step, thermally curing the hollow electronic device sealing sheet to obtain a sealed body. A hollow electronic device package comprising the sheet for sealing a hollow electronic device according to claim 1.

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