SG10201604267RA - Sheet for sealing hollow electronic device, method for producing hollow electronic device package, and hollow electronic device package - Google Patents
Sheet for sealing hollow electronic device, method for producing hollow electronic device package, and hollow electronic device packageInfo
- Publication number
- SG10201604267RA SG10201604267RA SG10201604267RA SG10201604267RA SG10201604267RA SG 10201604267R A SG10201604267R A SG 10201604267RA SG 10201604267R A SG10201604267R A SG 10201604267RA SG 10201604267R A SG10201604267R A SG 10201604267RA SG 10201604267R A SG10201604267R A SG 10201604267RA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic device
- hollow electronic
- device package
- sheet
- sealing
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015108354A JP6283624B2 (en) | 2015-05-28 | 2015-05-28 | Hollow electronic device sealing sheet, hollow electronic device package manufacturing method, and hollow electronic device package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201604267RA true SG10201604267RA (en) | 2016-12-29 |
Family
ID=57453091
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201604267RA SG10201604267RA (en) | 2015-05-28 | 2016-05-26 | Sheet for sealing hollow electronic device, method for producing hollow electronic device package, and hollow electronic device package |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6283624B2 (en) |
CN (1) | CN106206470B (en) |
SG (1) | SG10201604267RA (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018104649A (en) * | 2016-12-28 | 2018-07-05 | 日東電工株式会社 | Resin sheet |
JP7158184B2 (en) * | 2018-06-28 | 2022-10-21 | 日東電工株式会社 | Sealing sheet and method for producing electronic element device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4730652B2 (en) * | 2004-06-02 | 2011-07-20 | ナガセケムテックス株式会社 | Manufacturing method of electronic parts |
JP4772305B2 (en) * | 2004-09-03 | 2011-09-14 | 京セラケミカル株式会社 | Sheet-shaped resin composition for compression molding, resin-encapsulated semiconductor device, and method for manufacturing the same |
KR101148051B1 (en) * | 2005-12-26 | 2012-05-25 | 에스케이케미칼주식회사 | Epoxy resin composition |
JP2008021741A (en) * | 2006-07-11 | 2008-01-31 | Alps Electric Co Ltd | Method for manufacturing electronic components, and metal die for forming electronic component |
WO2011052161A1 (en) * | 2009-10-29 | 2011-05-05 | 日本化薬株式会社 | Curable resin composition for optical semiconductor encapsulation, and cured product of same |
SG11201400967YA (en) * | 2011-09-27 | 2014-09-26 | Nippon Kayaku Kk | Liquid crystal sealing agent, and liquid crystal display cell using same |
JP2013119588A (en) * | 2011-12-07 | 2013-06-17 | Nitto Denko Corp | Epoxy resin composition for sealing electronic component and electronic component device using the same |
WO2013121689A1 (en) * | 2012-02-15 | 2013-08-22 | 株式会社村田製作所 | Electronic part and method of manufacture thereof |
JP6114989B2 (en) * | 2013-02-08 | 2017-04-19 | パナソニックIpマネジメント株式会社 | Method for curing thermosetting resin composition, thermosetting resin composition, prepreg using the same, metal-clad laminate, resin sheet, printed wiring board and sealing material |
JP6643791B2 (en) * | 2013-03-28 | 2020-02-12 | 日東電工株式会社 | Hollow sealing resin sheet and hollow package manufacturing method |
JP6422370B2 (en) * | 2015-03-03 | 2018-11-14 | 日東電工株式会社 | Hollow type electronic device sealing sheet and method for manufacturing hollow type electronic device package |
-
2015
- 2015-05-28 JP JP2015108354A patent/JP6283624B2/en active Active
-
2016
- 2016-05-24 CN CN201610350092.5A patent/CN106206470B/en active Active
- 2016-05-26 SG SG10201604267RA patent/SG10201604267RA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2016225393A (en) | 2016-12-28 |
JP6283624B2 (en) | 2018-02-21 |
CN106206470A (en) | 2016-12-07 |
CN106206470B (en) | 2021-04-06 |
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