JP2008021741A - Method for manufacturing electronic components, and metal die for forming electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a highly sealed electronic component by preventing entry of resin into a function part provided among members, effectively releasing the air within a cavity to external side, and thereby achieving adequate and easier sealing of resin material. <P>SOLUTION: A soft resin material 42 is pressed with a pressing unit 33. In this case, the pressing force of the pressing unit 33 to the resin 42 is regulated so that the resin 42 cannot enter a region of a comb shape electrode provided in a gap B between a base substrate 12 and a mounting substrate 41. Moreover, the entire part of the lower surface 34a of an external frame 34 is formed as an air releasing part (air-vent) 50 in order to effectively escape the air within a cavity 33a to the external side. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method of manufacturing an electronic component such as a surface acoustic wave device, and in particular, can perform resin sealing appropriately and easily, and can manufacture an electronic component having a highly airtight space. The present invention relates to an electronic component manufacturing method and a mold for forming the electronic component.

  Patent Document 1 below discloses a method for manufacturing a surface acoustic wave device. As described in this patent document, the surface acoustic wave device includes a piezoelectric substrate provided on a mounting substrate and a comb-like electrode provided on a surface of the piezoelectric substrate facing the mounting substrate. It is configured. The mounting substrate and the piezoelectric substrate are resin-sealed, and a sealed space having the comb-like electrodes is formed between the substrates.

For example, in Patent Document 1, a space holding member (enclosure 506) is provided so that a space is formed in the portion of the comb-like electrode.
JP 2001-332654 A Japanese Patent Laid-Open No. 7-153871

Transfer molding described in Patent Document 2 is generally used for resin sealing.
However, the transfer mold has a problem in that the pressure is too high, so that a space cannot be appropriately formed in the comb-like electrode portion of the surface acoustic wave device. In the transfer mold, for example, the pressure was about ²⁰ to 50 kg / cm ² .

  For example, it is conceivable as one method to provide a space holding member (enclosure 506) or the like as in Patent Document 1 so that a space is easily formed even by resin sealing. Referring to Japanese Patent Application Laid-Open No. 10-270975 described in Patent Document 1, this document includes a space having a support layer that surrounds the periphery of a comb-like electrode and a lid that covers the support layer. A holding member is provided. In the form of this document, since the comb-like electrode is completely surrounded by the space holding member, there is no room for the sealing resin to enter the region of the comb-like electrode.

  However, even when the space holding member is not provided, it is desired to appropriately form a space in the comb-like electrode portion.

  In addition, when the resin is not molded while pouring the molten resin into the mold, a sheet-like or plate-like resin is mounted in the mold in advance, and the resin is heated and softened to seal the resin. The optimum mold configuration and the pressure at that time are not particularly described in Patent Documents 1 and 2.

  Further, Patent Documents 1 and 2 do not describe how to efficiently release the air in the cavity to the outside at that time. Since the softened resin hardens after a while, proper resin sealing cannot be performed unless air is efficiently released to the outside within a short time. In particular, it was necessary to efficiently release the air in the cavity to the outside under a low pressure, not under a high pressure as in the transfer mold.

  Therefore, the present invention is to solve the above-described conventional problems, and in particular, the resin can be prevented from entering the functional portion provided between the members. Provided is a method for manufacturing a highly airtight electronic component, and a mold for forming the electronic component, which can be efficiently released to the outside, and as a result, can be appropriately and easily sealed with resin. The purpose is that.

The present invention is a method for manufacturing an electronic component that performs resin sealing so that a sealed space is formed between members,
A gap is provided between the members having the functional portion on at least one of the opposing surfaces, and the electronic component before resin sealing in which a plate-like or sheet-like resin is superimposed on the member is placed in a mold having a cavity. ,
In a state where the resin is softened by heating, the resin is pressed by the pressing portion of the mold to flow the resin, thereby forming a sealed space between the members. The pressing force against the resin is set to a pressure at which the resin does not enter the region of the functional portion between the members so as to be positioned in the space.

  In the present invention, as described above, a plate-shaped or sheet-shaped resin is placed in a mold, the resin is softened, and the resin is flowed by a pressing portion of the mold to perform resin sealing. According to the manufacturing method of the present invention, it is possible to appropriately form a space in the functional part and appropriately and easily manufacture an electronic component that does not impede the function of the functional part.

In this invention, it is preferable to have the following processes.
(A) a lower mold and an upper mold opposed on the lower mold, and at least one of the upper mold or the lower mold is provided with a pressing portion that is movable in the vertical direction, and the upper mold Alternatively, an outer frame portion facing the other counterpart mold is provided around at least one of the lower molds, and the outer frame section extends out of the cavity to the outside so as to be half or more of the area facing the counterpart mold. Prepare a mold with air relief,
Installing the electronic component before the resin sealing in the mold;
(B) The step of pressing the resin by the pressing force with the pressing force, and releasing the air in the cavity from the air escape portion of the outer frame portion to the outside.

  By using the mold shown in the step (a), when the pressure of the pressing portion is low as in the present invention, the air in the cavity can be appropriately released to the outside, and the resin Therefore, it is possible to appropriately seal the resin before curing, and to suppress the generation of voids, and to manufacture a highly airtight electronic component.

  In the present invention, in the step (a), the mold having the outer frame portion formed by dividing the air escape portion into a plurality of parts is prepared, and in the step (b), the inside of the cavity is prepared. It is preferable to let air escape from each air escape portion provided in the outer frame portion to the outside. At this time, the air escape portions are arranged at equal intervals, so that the air in the cavity can be released from the four sides equally and efficiently to the outside, and resin sealing can be performed appropriately. It is preferable.

  Further, in the present invention, in the step (a), the mold having the outer frame portion in which the entire area facing the counterpart mold is an air escape portion is prepared, and in the step (b), More preferably, the air in the cavity is allowed to escape from the entire circumference of the outer frame portion. Thereby, the air in the cavity can be most effectively released to the outside, and the resin sealing can be performed more appropriately.

  Further, in the present invention, only one sheet-like or sheet-like resin is overlaid on an assembly in which a plurality of electronic parts before resin sealing are provided, and a plurality of electronic parts are simultaneously applied by the mold. It is preferable to perform resin sealing because it is possible to easily and appropriately perform resin sealing on a plurality of electronic components, and the structure of the mold can be simplified.

  In the present invention, it is preferable that the electronic component is a surface acoustic wave device, and the functional unit is a comb-like electrode.

Further, the present invention provides a resin-sealed electronic component before resin sealing in which a gap is provided between members having a functional part on at least one opposing surface, and a plate-like or sheet-like resin is superimposed on the member. A mold for forming a sealed space between the members,
A lower mold, an upper mold opposed on the lower mold, a pressing portion provided in at least one of the lower mold and the upper mold and movable in a vertical direction, and a heating mechanism for heating the resin. Have
In a state where the resin is softened by the heating mechanism, when the resin is flowed by pressing the resin by the pressing portion to form a sealed space between the members, the functional portion is in the space. It is possible to set the pressing force against the resin so as to be positioned at a pressure at which the resin does not enter the region of the functional part between the members,
An outer frame portion facing the other counterpart mold is formed around at least one of the lower mold and the upper mold, and an air escape section for escaping the air in the cavity accompanying the movement of the pressing section to the outside, The outer frame portion is formed in an area of more than half of the surface facing the counterpart mold.

  In the present invention, as described above, a plate-shaped or sheet-shaped resin is placed in a mold, the resin is softened, and the resin is flowed by a pressing portion of the mold to perform resin sealing. According to the mold of the present invention, it is possible to appropriately form a space in the functional part and appropriately and easily manufacture an electronic component in which the function of the functional part is not hindered. Furthermore, since the air escape portion is formed in a large area in the outer frame portion, it is possible to appropriately release the air in the cavity to the outside even when the pressure of the pressing portion is low as in the present invention, Resin sealing can be appropriately performed before the resin is cured, and generation of voids can be suppressed and a highly airtight electronic component can be manufactured.

  In this invention, it is preferable that the said air escape part is divided | segmented into plurality and formed in the opposing surface with the said other party type | mold. At this time, it is preferable that the air escape portions are arranged at equal intervals on the surface of the outer frame portion facing the counterpart mold. Thereby, the air in the cavity can be released from the four sides equally and efficiently to the outside, and resin sealing can be performed appropriately, which is preferable.

  In the present invention, it is more preferable that the entire area of the outer frame portion facing the counterpart mold is an air escape portion. Thereby, the air in the cavity can be most effectively released to the outside, and the resin sealing can be performed more appropriately.

  The resin can be prevented from entering the functional part provided between the members, and the air in the cavity can be efficiently released to the outside under low pressure. As a result, the resin can be sealed appropriately and easily. Thus, it is possible to manufacture a highly airtight electronic component without impeding the function of the functional part.

  FIG. 1 is a partial cross-sectional view of a surface acoustic wave device manufactured by a manufacturing method described later, cut from the thickness direction.

  The surface acoustic wave device 10 shown in FIG. 1 is used as an element that is very suitable for miniaturizing a filter, a resonator, or a duplexer mounted on, for example, a mobile communication terminal.

  As shown in FIG. 1, the surface acoustic wave device 10 includes a mounting substrate 11, a base substrate 12 formed of a piezoelectric material opposed to the mounting substrate 11, and a side from the upper surface 12 b of the base substrate 12. And a sealing resin 14 for forming a sealed space A formed between the mounting substrate 11 and the base substrate 12.

  At least a pair of comb-like electrodes (IDT (interdigital transducer) electrodes) 15 made of a conductive material is formed on the lower surface 12a of the base substrate 12 (the surface facing the mounting substrate 11). Terminal electrodes 16 and 16 are formed at the ends of the comb-like electrode 15. Although not shown, reflective electrodes are provided on both sides of the pair of comb-like electrodes 15. Here, the “functional part” in the present embodiment is defined as at least the comb-like electrode 15. In addition, it is not excluded that the “functional part” includes not only the comb-like electrode 15 but also a reflective electrode or both the reflective electrode and the terminal electrode 16. The functional unit is formed to be included in the space A. The space A is a vibration space of the comb-like electrode 15.

  The terminal electrode 16 and a land portion (not shown) of the mounting substrate 11 are electrically connected via a bump-shaped connection conductor portion 22. The connection conductor portion 22 is made of, for example, solder.

The base substrate 12 is made of a piezoelectric ceramic material such as LiTaO ₃ or LiNbO ₃ .

  The comb-like electrode 15 has a structure in which, for example, an Al layer or an Al alloy layer is formed, and a protective layer such as Au or TiN is formed on the surface thereof.

A mounting substrate 11 shown in FIG. 1 is an insulating substrate, for example, a multilayer ceramic substrate.
The resin 14 may be a thermosetting resin or a thermoplastic resin. For example, the resin 14 is an epoxy resin or a polyimide resin.

  A method for manufacturing the surface acoustic wave device 10 of the present embodiment will be described with reference to FIGS. In particular, a method for performing resin sealing will be described below.

  As shown in FIG. 2, a mold 30 for resin sealing is prepared. The mold 30 includes a lower mold 31 and an upper mold 32.

  The upper surface 31a of the lower mold 31 is a flattened surface, and the upper surface 31a is an installation surface of the surface acoustic wave device before resin sealing.

  The upper mold 32 includes a pressing portion 33 provided at a central portion and an outer frame portion 34 provided around the pressing portion 33. The pressing portion 33 is movable up and down. In the state of FIG. 2, the pressing portion 33 is in an upward state, and a cavity 33 a is formed between the pressing portion 33 and the lower mold 31. Has been.

The surface acoustic wave device assembly 40 before resin sealing is placed in the cavity 33a.
The surface acoustic wave device assembly 40 before resin sealing is mounted on a single mounting board 41 having a larger plane area than the plurality of base boards 12 via the connection conductors 22 on the mounting board 41 ( The plurality of base substrates 12 that are flip-chip mounted) and a single plate-like resin 42 installed on each base substrate 12 are configured.

  The plate-like resin 42 is a rigid body that does not bend into the space between the base substrates 12 even when arranged on the base substrates 12 as shown in FIG. The viscosity when the resin 42 is softened is high and does not flow unless pressed by the pressing portion 33. The viscosity of the resin 42 is a low viscosity of about 50 to 70 cm as a spiral flow value according to the spiral flow measurement method of JIS K 6911.

  As shown in FIG. 2, the mounting substrate 41 is formed in such a size that the outer peripheral portion just enters under the outer frame portion 34. The planar area of the plate-like resin 42 is equal to or slightly smaller than the planar area of the pressing portion 33.

  As shown in FIG. 2, a gap (open space) B is provided between the mounting substrate 41 and the base substrate 12, and although not shown, the comb is formed on the lower surface of the base substrate 12 as in FIG. A toothed electrode 15 is provided.

  As shown in FIG. 2, the surface acoustic wave device assembly 40 before resin sealing is installed on the upper surface (installation surface) 31 a of the lower mold 31.

  Then, as shown in FIG. 2, the upper mold 32 is set on the lower mold 31. At this time, the lower surface 34 a of the outer frame portion 34 is abutted by a projecting abutting member 31 b provided on the upper surface 31 a of the lower mold 31, and between the outer frame portion 34 and the mounting substrate 41. An air escape portion 50 having a height dimension h is formed. The air escape portion 50 will be described in detail later. The height dimension h is formed in such a size that the resin in the softened state does not flow into the air escape portion 50. The lower surface 34a of the outer frame portion 34 is positioned at a position lower than the surface 42a of the resin 42 that has undergone at least the process of FIG. The abutting member 31b has, for example, a cylindrical shape, and the abutting member 31b is scattered at a plurality of locations on the upper surface 31a of the lower mold 31.

  The height h is about 30 μm, for example, and the thickness of the plate-like resin 42 is about 0.4 mm, for example.

  The mold 30 is provided with a heating mechanism (not shown), and after the surface acoustic wave device assembly 40 before the resin sealing is installed in the mold 30, the plate-shaped resin is formed by the heating mechanism. 42 is softened. The heating temperature is equal to or higher than the softening point of the resin 42. For example, when the resin 42 is an epoxy resin, the heating temperature is about 120 to 180 ° C.

  Then, the pressing portion 33 is moved downward to press the resin 42 in the softened state downward.

  FIG. 5 is an enlarged cross-sectional view of the surface acoustic wave device assembly 40 before the plate-shaped resin 42 is pressed by the pressing portion 33. When the resin 42 in a softened state is pressed downward by the pressing portion 33, the space C provided between the base substrates 12 on the mounting substrate 41, as shown in FIG. The resin 42 flows to close the space C, and a sealed space A is formed between each base substrate 12 and the mounting substrate 41.

  Further, when the pressing portion 33 presses the resin 42 and the volume of the space A decreases, the pressure in the space A increases. At this time, when the pressing force of the pressing portion 33 against the resin 42 is P1, and the atmospheric pressure in the space A is P2, when the pressing force P1 is almost equal to the atmospheric pressure P2, the pressure is shown in FIGS. Thus, the flow of the resin 42 between the base substrate 12 and the mounting substrate 41 stops.

  A characteristic part of this embodiment is that the pressing force P1 of the pressing portion 33 is a comb-tooth shape that is a functional portion in which the resin 42 is provided in a sealed space A between the base substrate 12 and the mounting substrate 41. The pressure is set so as not to enter the region where the electrode 15 is formed.

  In other words, the pressing force P1 is set so that the pressing force P1 becomes substantially the same as the atmospheric pressure P2 before the resin 42 enters the region where the comb-like electrode 15 is formed.

  Thus, the mounting substrate 41 and each base substrate 12 can be appropriately sealed with resin, and the comb-like electrode 15 that is a functional unit is provided between the mounting substrate 41 and the base substrate 12 appropriately and easily. It is possible to form a closed space A.

  Then, the surface acoustic wave device assembly 40 sealed with resin is taken out from the mold 30 shown in FIG. 3, and the mounting substrate 41 and the resin 42 are cut for each surface acoustic wave device 10. As a cutting method, various methods such as dicing, laser processing, milling by an end mill, dry etching, and wet etching can be used.

  In FIG. 7, the resin 42 enters a part between the base substrate 12 and the mounting substrate 41, but the resin 14 does not enter between the base substrate 12 and the mounting substrate 11 as shown in FIG. 1. It can also be performed by adjusting the pressing force P1, adjusting the resin viscosity, or the like.

  In this embodiment, as shown in FIG. 2, one plate-like resin 42 is arranged on the plurality of base substrates 12, and it is possible to perform resin sealing on the plurality of base substrates 12 at a time. The process can be facilitated.

By the way, although the atmospheric pressure P2 in the space A is higher than atmospheric pressure, it is at most about 1 to 5 kgf / cm ² , so the pressing force P1 is set to a low pressure of about 1 to 5 kgf / cm ² accordingly. There must be.

  Thus, in this embodiment, the pressing force P1 of the pressing portion 33 is set to a low pressure to press the resin 42. At that time, it is important to efficiently release the air in the cavity 33a shown in FIG. 2 to the outside. is there.

  FIG. 4 is a rear view of the upper mold 32. 2 described above is a mold 30 cut in the thickness direction from the line HH shown in FIG. 4 and the surface acoustic wave device assembly before resin sealing installed in the mold 30 as viewed from the arrow direction. 3 is a partial cross-sectional view of a body 40. FIG.

  In this embodiment, as shown in FIG. 2, the entire area of the lower surface 34a of the outer frame portion 34 is located above without touching the mounting substrate 41, and therefore the entire area of the lower surface 34a of the outer frame portion 34. Is an air escape portion (air vent) 50. That is, an air escape portion 50 having a height dimension h is formed in the entire area between the lower surface 34 a of the outer frame portion 34 and the mounting substrate 41. When the mounting substrate 41 does not enter the lower surface 34 a of the outer frame portion 34, the height dimension h is a height between the lower surface 34 a of the outer frame portion 34 and the upper surface 31 a of the lower mold 31. It is prescribed by.

  Thus, by configuring the entire area of the lower surface 34a of the outer frame portion 34 as the air escape portion 50, the air in the cavity 33a is changed when the state shown in FIG. 2 is shifted to the resin pressurization state shown in FIG. It is possible to escape from the air escape portion 50 to the outside efficiently. Therefore, the entire resin 42 can be appropriately pressed with the pressing force P1, and a sealed space A having the comb-like electrode 15 is formed between the base substrate 12 and the mounting substrate 41 before the resin 42 is cured. In addition, it is possible to manufacture a surface acoustic wave device having high airtightness without generating voids in the resin 42. Further, since the atmospheric pressure P2 in the space A becomes higher than the atmospheric pressure, the moisture contained in the resin 42 is more easily released outward than in the space A, and the deterioration of the comb-like electrode 15 is suppressed. it can.

  As shown in FIG. 4, if the entire area of the lower surface 34a of the outer frame portion 34 is configured as an air escape portion 50, the air in the cavity 33a can be released to the outside with the highest efficiency.

Hereinafter, the form of the air escape part different from FIG. 4 will be described.
8 is a rear view of the upper die 61 having a form different from that in FIG. 4, and FIG. 9 is a diagram showing the inside of the die 60 and the die 60 as viewed from the direction of the arrow cut along the line DD in FIG. It is a fragmentary sectional view of the surface acoustic wave device aggregate 40 before resin sealing installed in. In the form shown in FIGS. 8 and 9, the other parts are the same except that the form shown in FIGS.

  As shown in FIGS. 8 and 9, for example, a columnar protruding portion 64 that protrudes in the direction of the lower mold 63 is formed on the lower surface 62 a of the outer frame portion 62. The protrusion 64 is in contact with the mounting substrate 41 and presses the mounting substrate 41 toward the lower mold 63. Therefore, the mounting substrate 41 is clamped at a predetermined position on the upper surface (installation surface) 63 a of the lower mold 63 by the protrusion 64. In the form shown in FIGS. 8 and 9, the entire area of the lower surface 62 a of the outer frame part 62 excluding the protruding part 64 is an air escape part (air vent) 65.

  It is preferable that a plurality of the protrusions 64 are provided. When the protrusions 64 are provided at equal intervals, the entire mounting substrate 41 can be properly clamped. The “equal interval” here refers to a state in which, for example, the distance to each protrusion 64 and the angle formed between each protrusion 64 are equal when the inner center O of the outer frame 62 is the apex.

  In the form shown in FIGS. 8 and 9, the area functions as the air escape portion 65 with only a few of the protrusions 64 interspersed. It is possible to efficiently release the air in the cavity 33a to the outside. It is preferable that three or more protrusions 64 are provided. Further, as shown in FIG. 8, when the lower surface 62a of the outer frame portion 62 is a frame body surrounded by a plurality of belt-like surfaces having a predetermined width and extending linearly, the projecting portions 64 are formed on each belt-like surface. It is preferable that at least one is provided.

  In the form shown in FIGS. 8 and 9, the abutting portion is not formed on the upper surface 63a of the lower mold 63 as shown in FIG. In the form shown in FIGS. 8 and 9, the protrusion 64 is formed, so that the formation of the abutting portion is not particularly necessary.

  10 is a rear view of the upper die 71 having a different form from those in FIGS. 4 and 8, and FIG. 11 is a portion of the die 70 cut in the thickness direction from the line EE shown in FIG. It is sectional drawing. In the form shown in FIGS. 9 and 10, the other parts are the same except that the form shown in FIGS. 1 to 4 is different from the form of the outer frame portion and the lower mold.

  As shown in FIG. 10, when viewed from the back side, the lower surface 72a of the outer frame portion 72 has a width opposite to each side end portion 33b of the pressing portion 33, and the width of each side end portion 33b. A recessed air escape portion 73 formed with substantially the same width is formed from the side end portion 33b toward the outside, and the lower surface 72a of the outer frame portion 72 other than the air escape portion 73 is The clamp 76 is formed in a convex shape in the direction of the upper surface 74 a of the lower die 74. In FIG. 10, the location of the air escape portion 73 is indicated by hatching.

  The mounting substrate 41 is clamped at a predetermined position on the upper surface 74 a of the lower mold 74 by the clamp portion 76.

  10 and 11, the area ratio of the air escape portion (air vent) 73 occupying the lower surface 72a of the outer frame portion 72 is smaller than that of the embodiments shown in FIGS. 1 to 9, but at least the lower surface 72a. The air escape portion 73 is formed in an area of more than half of the area.

In the form shown in FIGS. 10 and 11, the air escape portions 73 are formed separately, and each air escape portion 73 faces the side end portion 33 b of the pressing portion 33 when viewed from the back side. Is formed. Therefore, even if the pressing force P1 of the pressing portion 33 against the resin 42 is a low pressure of about 1 to 5 kgf / cm ² when the state is changed from the state shown in FIG. 2 to the resin pressing state shown in FIG. Can be evenly released from each side of the outer frame portion 72 through the air escape portion 73, and a comb is formed between the base substrate 12 and the mounting substrate 41 before the resin 42 is cured. A sealed space A having the tooth-like electrodes 15 can be formed, and a highly air-tight surface acoustic wave device can be manufactured without generating voids in the resin 42.

  10 and 11, no abutting portion is formed on the upper surface 74a of the lower mold 74 as shown in FIG. In the form shown in FIGS. 10 and 11, the clamp portion 76 is formed, so that the abutment portion is not particularly required.

  12 is a rear view of the upper die 81 in a form different from that of FIGS. 4, 8, and 10. FIG. 13 is a die cut in the thickness direction from the FF line shown in FIG. FIG. In the form shown in FIGS. 12 and 13, the other parts are the same except that the form shown in FIGS.

  In the embodiment shown in FIG. 12, the air escape portions 83 formed on the lower surface 82a of the outer frame portion 82 are divided and formed as in the embodiment shown in FIG. 10, but the formation positions of the air escape portions 83 are shown in FIG. Is different. The air escape portion 83 is formed in a recessed shape, and a portion other than the air escape portion 83 is a clamp portion 85 protruding in the direction of the upper surface 84a of the lower mold 84, and the mounting substrate 41 is moved by the clamp portion 85 to the lower mold. 84 is clamped to the upper surface 84a of 84. In FIG. 12, the location of the air escape portion 83 is indicated by hatching.

  12 and 13, the air escape portion 83 occupies at least half of the area of the lower surface 82a of the outer frame portion 82 as in the embodiments shown in FIGS.

  In the form shown in FIGS. 12 and 13, the air escape portion 83 is divided and formed. Clamp portions 85 having the same width are provided between the air escape portions 83, and the air escape portions 83 are formed at equal intervals around the lower surface 82 a of the outer frame portion 82. . Thus, by making the air escape portion 83 more than half of the lower surface 82a of the outer frame portion 82 and further forming the air escape portions 83 at equal intervals, the air in the cavity is evenly distributed even under a low pressure. Thus, a sealed space A having comb-like electrodes 15 can be formed between the base substrate 12 and the mounting substrate 41 before the resin 42 is cured, and voids are formed in the resin 42. It is possible to manufacture a surface acoustic wave device that does not generate and is highly airtight.

  The form of the air escape portion is not limited to the above. For example, in FIG. 10, the width dimension of each air escape portion 73 is constant from the inner side (the pressing portion 33 side) to the outer side, but may be different. For example, the width dimension of the air escape portion is widened from the inside to the outside. 10 and 12, the number of the air escape portions that are divided is four, but the number of air escape portions is not limited.

  The width dimension w of the air escape portion (air vent) and the height dimension h of the air escape portion can be obtained from the following equations.

Where V is the amount of air to be discharged from the cavity, μ is the viscosity coefficient of air (0.0182 × 10 ⁻³ Pa · s (25 ° C.)), w is the width dimension of the air escape portion, and h is , The height dimension between the air escape portion and the mounting substrate, Δp is the pressing force P1−atmospheric pressure, x is the length of the air escape portion, and t is one tenth of the resin gel time (the resin flows sufficiently) L is the length of the entire circumference of the cavity.

  The above symbols will be described mainly with reference to FIG. The width dimension w of the air escape portion is the total width of each air escape portion on the inner peripheral side of the outer frame portion, for example, w = w1 + w2 + w3 + w4 in the form shown in FIG. As described in FIG. 2, the height dimension h is a height dimension between the air escape portion and the mounting board. When the mounting substrate 41 is not provided under the outer frame portion, the height is defined by the height dimension between the air escape portion and the upper surface of the lower mold. The length X of the air escape portion is a length that becomes the maximum in a linear distance from the inner periphery side to the outer periphery side of the outer frame portion at the portion where the air escape portion is formed. The circumferential length L of the cavity is the same as the circumferential length of the side end portion of the pressing portion 33. V is a value obtained by subtracting the amount of air of 1 atm confined between the resin 42 and the mounting substrate 41 as shown in FIG. 6 from the volume of air remaining in the cavity at the beginning of molding.

  The “resin gel time” is the time from the start of heating the resin to the gelation (curing).

  For example, in the form shown in FIG. 12, the width dimension w of the air escape portion is smaller than the length L of the entire circumference of the cavity, and the above formula 1 is established.

  When the width dimension w of the air escape portion and the length L of the entire circumference of the cavity are the same, the mathematical formula of Formula 2 is established, for example, in the form shown in FIG.

In this embodiment, the pressing force P1 is set to a low pressure of about 1 to 5 kgf / cm ^{2. In} such a case, the width dimension w and the height of the air escape portion (air vent) are set so as to satisfy the expressions 1 and 2 above. If the dimension h and the like are defined, the air in the cavity can be released to the outside in a time of 1/10 or less of the resin gel time, and resin sealing can be performed appropriately.

  FIG. 14 shows a surface acoustic wave device 90 having a different form from that of FIG. In FIG. 14, a space holding member 91 is provided on the lower surface 12a of the base substrate 12, and a comb-like electrode 15 as a functional part is provided in a space G formed between the space holding member 91 and the lower surface 12a. It has been. The space holding member 91 has open ends on the front side and the heel side, and the open ends are covered with resin 93.

  Terminal electrodes 16, 16 formed at the end of the comb-like electrode 15 are electrically connected to the contact 92 through the connection conductor 22, and the upper surface, the side surface and the side surface of the base substrate 12 excluding the space G The lower surface is sealed with resin 93. The lower surface of the resin 93 is a flat surface, and the lower surface (mounting surface) of the contact 92 is exposed from the lower surface of the resin 93. In the form shown in FIG. 14, the mounting substrate 11 is not required as in FIG. 1, and the surface acoustic wave device 90 can be reduced in thickness.

  The resin sealing shown in FIG. 14 also uses the above-described mold, so that the resin sealing is performed under a low pressure where the resin 93 does not enter the region where the comb-like electrode 15 is formed in the space G. In addition, the air in the cavity can be efficiently released to the outside even under such a low pressure, and the resin sealing can be performed appropriately and easily.

  In this embodiment, the resin 42 may be a sheet instead of a plate before sealing in FIG. In the resin sheet, when the resin sheet is installed on each base substrate 12 shown in FIG. 2, the resin sheet may be bent in the space between the base substrates. If this mold is used, the air in the cavity can be efficiently released to the outside under a low pressure, and resin sealing with excellent airtightness can be performed appropriately and easily.

  Moreover, although the said form demonstrated using the surface acoustic wave device 10 as an example of an electronic component, this form is not restricted to this. That is, any other electronic component manufacturing method can be used as long as a space sealed by resin sealing is provided between the members, and a functional unit is provided on at least one opposing surface side in the space. Applicable.

  In the above, the upper mold 32 is provided with the outer frame portion 34 having the pressing portion 33 and the air escape portion. However, the pressing portion, the outer frame portion, or the pressing portion, and the outer frame portion are located on the lower side. The structure provided in the type | mold 31 may be sufficient.

Partial sectional view of the surface acoustic wave device manufactured by the manufacturing method of the present embodiment cut from the thickness direction, A partial cross-sectional view of a die used for manufacturing a surface acoustic wave device and a surface acoustic wave device assembly before resin sealing, cut from the thickness direction, The fragmentary sectional view which cut | disconnected the metal mold | die and the resin-sealed surface acoustic wave device aggregate | assembly showing the process performed after FIG. 2 from the thickness direction, FIG. 2 is a rear view of the upper mold of the mold shown in FIG. Partial enlarged sectional view of the surface acoustic wave device assembly before resin sealing cut from the thickness direction, The partial expanded sectional view which shows the next process of FIG. 5, and shows the surface acoustic wave device assembly in the middle of resin sealing, FIG. 6 is a partial enlarged cross-sectional view showing the next step of FIG. 6 and showing a resin-sealed surface acoustic wave device assembly; FIG. 4 is a rear view of an upper mold having a different form from FIG. FIG. 8 is a partial cross-sectional view of a mold cut in the thickness direction from the DD line shown in FIG. 8 and viewed from the arrow direction, and a surface acoustic wave device assembly before resin sealing installed in the mold; FIG. 4 and FIG. The fragmentary sectional view of the metal mold | die cut | disconnected in the thickness direction from the EE line shown in FIG. FIG. 4, FIG. 8, and FIG. FIG. 12 is a partial cross-sectional view of a mold cut in the thickness direction from the FF line shown in FIG. 12 and viewed from the direction of the arrow, and a surface acoustic wave device assembly before resin sealing installed in the mold; FIG. 1 is a partial cross-sectional view of a surface acoustic wave device having a shape different from that in FIG.

Explanation of symbols

10, 90 Surface acoustic wave device 11, 41 Mounting substrate 12 Base substrate 14, 42, 93 Resin 15 Comb electrode 22 Connection conductor 30, 60, 70, 80 Mold 31, 63, 74, 84 Lower die 32, 61, 71, 81 Upper mold 33 Press part 33a Cavity 34, 62, 72, 82 Outer frame part 40 Surface acoustic wave device aggregate 50, 65, 73, 83 Air escape part (air vent)
64 Protrusions 76, 85 Clamping portion 91 Space holding member 92 Contacts A, B, C, G Space P1 Pressing force P2 Pressure (in space A)

Claims (11)

A method of manufacturing an electronic component that performs resin sealing so that a sealed space is formed between members,
A gap is provided between the members having the functional portion on at least one of the opposing surfaces, and the electronic component before resin sealing in which a plate-like or sheet-like resin is superimposed on the member is placed in a mold having a cavity. ,
In a state where the resin is softened by heating, the resin is pressed by the pressing portion of the mold to flow the resin, thereby forming a sealed space between the members. The method of manufacturing an electronic component, wherein the pressing force against the resin is set to a pressure at which the resin does not enter the region of the functional portion between the members so as to be positioned in the space. The manufacturing method of the electronic component of Claim 1 which has the following processes.
(A) a lower mold and an upper mold opposed on the lower mold, and at least one of the upper mold or the lower mold is provided with a pressing portion that is movable in the vertical direction, and the upper mold Alternatively, an outer frame portion facing the other counterpart mold is provided around at least one of the lower molds, and the outer frame section extends out of the cavity to the outside so as to be half or more of the area facing the counterpart mold. Prepare a mold with air relief,
Installing the electronic component before the resin sealing in the mold;
(B) The step of pressing the resin by the pressing force with the pressing force, and releasing the air in the cavity from the air escape portion of the outer frame portion to the outside.   In the step (a), the mold having the outer frame portion formed by dividing the air escape portion into a plurality of parts is prepared, and in the step (b), the air in the cavity is The method of manufacturing an electronic component according to claim 2, wherein the air escape portions provided in the outer frame portion are escaped to the outside.   The method of manufacturing an electronic component according to claim 3, wherein the air escape portions are arranged at equal intervals.   In the step (a), the mold having the outer frame portion in which the entire surface facing the counterpart die is an air escape portion is prepared, and in the step (b), air in the cavity is prepared. The manufacturing method of the electronic component of Claim 2 which escapes outside from the perimeter of the said outer frame part to the exterior.   Only one sheet-like or sheet-like resin is superimposed on an assembly provided with a plurality of electronic components before resin sealing, and resin sealing is performed on a plurality of electronic components at once by the mold. The method for manufacturing an electronic component according to claim 1.   The method of manufacturing an electronic component according to claim 1, wherein the electronic component is a surface acoustic wave device, and the functional unit is a comb-like electrode. A gap is provided between members having a functional part on at least one of the opposing surfaces, and an electronic component before resin sealing in which a plate-like or sheet-like resin is superimposed on the member is resin-sealed between the members. A mold for forming a sealed space,
A lower mold, an upper mold opposed on the lower mold, a pressing portion provided in at least one of the lower mold and the upper mold and movable in a vertical direction, and a heating mechanism for heating the resin. Have
In a state where the resin is softened by the heating mechanism, when the resin is flowed by pressing the resin by the pressing portion to form a sealed space between the members, the functional portion is in the space. It is possible to set the pressing force against the resin so as to be positioned at a pressure at which the resin does not enter the region of the functional part between the members,
An outer frame portion facing the other counterpart mold is formed around at least one of the lower mold and the upper mold, and an air escape section for escaping the air in the cavity accompanying the movement of the pressing section to the outside, The mold is characterized in that it is formed in an area of half or more of the surface of the outer frame portion facing the counterpart mold.   The mold according to claim 8, wherein the air escape portion is formed by being divided into a plurality of surfaces facing the counterpart mold.   The mold according to claim 9, wherein the air escape portions are arranged at equal intervals on a surface of the outer frame portion facing the counterpart die.   The metal mold | die of Claim 8 by which the whole region of the opposing surface with the said other mold | type of the said outer frame part is made into the air escape part.

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