SG10201601597WA - Sheet for sealing hollow electronic device and method for producing hollow electronic device package - Google Patents
Sheet for sealing hollow electronic device and method for producing hollow electronic device packageInfo
- Publication number
- SG10201601597WA SG10201601597WA SG10201601597WA SG10201601597WA SG10201601597WA SG 10201601597W A SG10201601597W A SG 10201601597WA SG 10201601597W A SG10201601597W A SG 10201601597WA SG 10201601597W A SG10201601597W A SG 10201601597WA SG 10201601597W A SG10201601597W A SG 10201601597WA
- Authority
- SG
- Singapore
- Prior art keywords
- electronic device
- hollow electronic
- sheet
- sealing
- device package
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000007789 sealing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015041066A JP6422370B2 (en) | 2015-03-03 | 2015-03-03 | Hollow type electronic device sealing sheet and method for manufacturing hollow type electronic device package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201601597WA true SG10201601597WA (en) | 2016-10-28 |
Family
ID=56845521
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201601597WA SG10201601597WA (en) | 2015-03-03 | 2016-03-02 | Sheet for sealing hollow electronic device and method for producing hollow electronic device package |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6422370B2 (en) |
CN (1) | CN105938817A (en) |
SG (1) | SG10201601597WA (en) |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6283624B2 (en) * | 2015-05-28 | 2018-02-21 | 日東電工株式会社 | Hollow electronic device sealing sheet, hollow electronic device package manufacturing method, and hollow electronic device package |
JP2018104649A (en) * | 2016-12-28 | 2018-07-05 | 日東電工株式会社 | Resin sheet |
WO2021010209A1 (en) | 2019-07-12 | 2021-01-21 | 日東電工株式会社 | Sealing resin sheet |
JPWO2021010204A1 (en) | 2019-07-12 | 2021-01-21 | ||
JPWO2021010207A1 (en) | 2019-07-12 | 2021-01-21 | ||
JPWO2021010208A1 (en) | 2019-07-12 | 2021-01-21 | ||
JPWO2021010205A1 (en) | 2019-07-12 | 2021-01-21 | ||
CN114080427B (en) | 2019-07-12 | 2023-08-25 | 日东电工株式会社 | resin sheet for sealing |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5035580B2 (en) * | 2001-06-28 | 2012-09-26 | ナガセケムテックス株式会社 | Surface acoustic wave device and manufacturing method thereof |
JP5083161B2 (en) * | 2008-04-16 | 2012-11-28 | 株式会社村田製作所 | Electronic component manufacturing method and manufacturing apparatus |
JP2012054363A (en) * | 2010-08-31 | 2012-03-15 | Kyocera Chemical Corp | Sealing method of electronic component |
KR20130079311A (en) * | 2010-05-26 | 2013-07-10 | 교세라 케미카르 가부시키가이샤 | Sheet-like resin composition, circuit component using the sheet-like resin composition, method for sealing electronic component, method for connecting electronic component, method for affixing electronic component, composite sheet, electronic component using the composite sheet, electronic device, and method for producing composite sheet |
JP6643791B2 (en) * | 2013-03-28 | 2020-02-12 | 日東電工株式会社 | Hollow sealing resin sheet and hollow package manufacturing method |
-
2015
- 2015-03-03 JP JP2015041066A patent/JP6422370B2/en active Active
-
2016
- 2016-03-02 CN CN201610118460.3A patent/CN105938817A/en active Pending
- 2016-03-02 SG SG10201601597WA patent/SG10201601597WA/en unknown
Also Published As
Publication number | Publication date |
---|---|
JP2016162909A (en) | 2016-09-05 |
JP6422370B2 (en) | 2018-11-14 |
CN105938817A (en) | 2016-09-14 |
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