SG10201600482XA - Sheet for sealing hollow electronic device - Google Patents
Sheet for sealing hollow electronic deviceInfo
- Publication number
- SG10201600482XA SG10201600482XA SG10201600482XA SG10201600482XA SG10201600482XA SG 10201600482X A SG10201600482X A SG 10201600482XA SG 10201600482X A SG10201600482X A SG 10201600482XA SG 10201600482X A SG10201600482X A SG 10201600482XA SG 10201600482X A SG10201600482X A SG 10201600482XA
- Authority
- SG
- Singapore
- Prior art keywords
- sheet
- electronic device
- sealing hollow
- hollow electronic
- sealing
- Prior art date
Links
- 238000007789 sealing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/315—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed the encapsulation having a cavity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Laminated Bodies (AREA)
- Sealing Material Composition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015011009A JP6379051B2 (en) | 2015-01-23 | 2015-01-23 | Hollow electronic device sealing sheet |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201600482XA true SG10201600482XA (en) | 2016-08-30 |
Family
ID=56512731
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201600482XA SG10201600482XA (en) | 2015-01-23 | 2016-01-21 | Sheet for sealing hollow electronic device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6379051B2 (en) |
CN (1) | CN105826278B (en) |
SG (1) | SG10201600482XA (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6933463B2 (en) * | 2016-12-28 | 2021-09-08 | 日東電工株式会社 | Resin sheet |
WO2018163408A1 (en) * | 2017-03-10 | 2018-09-13 | 三菱電機エンジニアリング株式会社 | Resonance-type power transmission device and resonance-type power transfer system |
CN113675101B (en) * | 2021-10-20 | 2021-12-21 | 深圳新声半导体有限公司 | Method for chip packaging and chip particles |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5035580B2 (en) * | 2001-06-28 | 2012-09-26 | ナガセケムテックス株式会社 | Surface acoustic wave device and manufacturing method thereof |
JP4519762B2 (en) * | 2005-11-21 | 2010-08-04 | リンテック株式会社 | Manufacturing method of resin-encapsulated semiconductor device |
JP4872587B2 (en) * | 2006-10-12 | 2012-02-08 | 日立化成工業株式会社 | Sealing film and semiconductor device using the same |
JP2008108782A (en) * | 2006-10-23 | 2008-05-08 | Nec Electronics Corp | Electronic equipment and manufacturing method thereof |
JP5435685B2 (en) * | 2007-02-28 | 2014-03-05 | ナミックス株式会社 | Resin film for sealing |
KR101216783B1 (en) * | 2010-06-02 | 2012-12-28 | 미쓰이 가가쿠 토세로 가부시키가이샤 | Sheet for protecting surface of semiconductor wafer, semiconductor device manufacturing method and semiconductor wafer protection method using sheet |
WO2012026431A1 (en) * | 2010-08-23 | 2012-03-01 | 積水化学工業株式会社 | Bonding sheet and method for mounting semiconductor chip |
JP5802400B2 (en) * | 2011-02-14 | 2015-10-28 | 日東電工株式会社 | Resin sheet for sealing, semiconductor device using the same, and method for manufacturing the semiconductor device |
JP2014179593A (en) * | 2013-02-15 | 2014-09-25 | Nitto Denko Corp | Sealing sheet for semiconductor elements, semiconductor device, and method for manufacturing semiconductor device |
JP6643791B2 (en) * | 2013-03-28 | 2020-02-12 | 日東電工株式会社 | Hollow sealing resin sheet and hollow package manufacturing method |
JP5735036B2 (en) * | 2013-05-23 | 2015-06-17 | 日東電工株式会社 | Electronic component device manufacturing method and laminated sheet |
-
2015
- 2015-01-23 JP JP2015011009A patent/JP6379051B2/en active Active
-
2016
- 2016-01-21 SG SG10201600482XA patent/SG10201600482XA/en unknown
- 2016-01-21 CN CN201610040558.1A patent/CN105826278B/en active Active
Also Published As
Publication number | Publication date |
---|---|
JP6379051B2 (en) | 2018-08-22 |
JP2016136566A (en) | 2016-07-28 |
CN105826278A (en) | 2016-08-03 |
CN105826278B (en) | 2020-02-21 |
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