KR20130079311A - Sheet-like resin composition, circuit component using the sheet-like resin composition, method for sealing electronic component, method for connecting electronic component, method for affixing electronic component, composite sheet, electronic component using the composite sheet, electronic device, and method for producing composite sheet - Google Patents

Abstract

A sheet-like resin composition comprising (A) a liquid bisphenol-type epoxy resin, (B) a softening point of a solid-state polyfunctional epoxy resin having a softening point of 70 ° C. or lower, and (C) an epoxy resin as essential components, wherein (A) / (B ) Mass ratio is 10/90 to 30/70.

Description

Sheet-like resin composition, a circuit component using the said sheet-like resin composition, the sealing method, the connection method, and the fixing method of an electronic component, and a composite sheet, the electronic component using the said composite sheet, and the manufacturing method of an electronic device, a composite sheet {SHEET -LIKE RESIN COMPOSITION, CIRCUIT COMPONENT USING THE SHEET COMPOSITE SHEET}

The present invention provides a sheet-like resin composition, a circuit component using the sheet-like resin composition, a sealing method, a connection method and a fixing method, and a composite sheet, an electronic component using the composite sheet, an electronic device, and a composite sheet. It is about a method.

Conventionally, what consists of thermosetting resin compositions, such as an epoxy resin composition, is known as an adhesive sheet used for the field of electronic components (for example, refer patent document 1). However, the conventional adhesive sheet is not excellent in handling property or strength, and also is not excellent in embedding of the adhesive sheet into the adhesive region. Moreover, when processing the electronic component to which the conventional adhesive sheet adhered, peeling may arise in the said adhesive sheet, and the adhesive sheet with high adhesive force is calculated | required.

Moreover, the prepreg which consists of a fiber base material and a thermosetting resin composition, for example, a glass epoxy prepreg, is also used as an adhesive sheet (for example, refer patent document 2). Although the prepreg has relatively good handling properties and strength, the prepreg is not excellent in embedding in the adhesive region, and the electronic components that can be used are also limited. In addition, the manufacture of a prepreg generally requires an exclusive large coating machine, and also requires an organic solvent.

As a sealing material, a thin resin sheet made of a thermosetting resin, preferably an epoxy resin, is covered to cover the entire surface of the semiconductor mounted on the substrate surface, and then heated, and the thin resin sheet is softened to give viscosity and adhesive force to the thin resin sheet. A method of adhering a semiconductor to the substrate surface, curing the softened thin resin sheet after the heat treatment, and sealing the semiconductor is disclosed (see Patent Documents 3 to 5).

Although the technique of patent document 3-patent document 5 is a technique of sealing an electronic element using resin for sheet-like sealing, although the use of an epoxy resin is preferable as a thermosetting resin of a sealing material, it is described in the kind of epoxy resin and a sealing material. There is no description at all about the other compounding component to be used. In such a technique, there is a problem that warpage or torsion tends to occur in the cured product of the sealing resin, and when the melt viscosity of the sealing resin is high, there is a high possibility of occurrence of voids due to poor filling of the resin into the electronic device details. .

Japanese Laid-Open Patent Publication No. 2002-60720 Japanese Patent Laid-Open No. 2-102281 Japanese Laid-Open Patent Publication No. 2003-249510 Japanese Unexamined Patent Publication No. 10-125825 Japanese Laid-Open Patent Publication No. 2003-249510

The present invention can be produced without the need for a large-scale coating equipment like a conventional adhesive sheet, and can be produced without the use of an organic solvent. It aims at providing the sheet-like resin composition which can be easily performed. Moreover, an object of this invention is to provide the circuit component using the said sheet-like resin composition. Moreover, an object of this invention is to provide the sealing method, the connection method, and the fixing method of the electronic component using the said sheet-like resin composition. Moreover, an object of this invention is to provide the composite sheet using the said sheet-like resin composition, the electronic component and electronic device using the said composite sheet, and the manufacturing method of the said composite sheet.

The sheet-like resin composition of this invention contains (A) liquid bisphenol-type epoxy resin, (B) softening point of solid state polyfunctional epoxy resin which is 70 degrees C or less, and (C) hardening | curing agent for epoxy resins as an essential component. As (A) / (B), the mass ratio is characterized in that 10/90 to 30/70.

The circuit component of the present invention is characterized by being sealed or bonded by the sheet-like resin composition of the present invention.

The sealing method of the electronic component of this invention is a sealing method of the electronic component which coats and heat-cures the electronic component mounted on the board | substrate with the sheet-like resin composition of this invention, and coat | covers the said electronic component with the said sheet-like resin composition. And sealing a periphery of the contact portion between the electronic component and the substrate to form a gap between the electronic component and the substrate.

The connection method of the electronic component of this invention is a method of electrically connecting the board | substrate which has a 1st electrode for a connection, and the electronic component which has a 2nd electrode for a connection through the said 1st electrode and the said 2nd electrode, The sheet of this invention It is characterized by including the process of electrically connecting the said electronic component to the said board | substrate using an upper resin composition.

The method for fixing an electronic component of the present invention is a method of fixing an electronic component to a substrate or a housing, wherein the sheet-like resin composition of the present invention is disposed in contact with the substrate or the housing and the electronic component, and the substrate or the housing is provided. And the electronic component are fixed with the sheet-like resin composition.

The composite sheet of this invention has a fiber base layer which has the resin layer which has the sheet-like resin composition of this invention, and the fiber base material formed in close contact with at least one main surface of the said resin layer.

The electronic component of this invention is arrange | positioned on the surface of an electronic component body and at least one part of the said electronic component body, and has the composite sheet of this invention which insulates the said surface, It is characterized by the above-mentioned. An electronic device of the present invention is characterized by having an electronic component and the composite sheet of the present invention for sealing the electronic component.

The method for producing a composite sheet of the present invention comprises the steps of kneading the components of the thermosetting resin composition at a temperature of 50 ℃ to 110 ℃ to obtain a kneaded material, the kneaded material is supplied to one side of the fiber base or the kneaded material After supplying between a pair of fiber base materials, it is characterized by having the process of integrally shape | molding integrally in a sheet form and pressing a kneaded material and the said fiber base material, and obtaining a composite sheet.

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing which shows schematic structure of 1st Embodiment of a composite sheet.
It is sectional drawing which shows schematic structure of 2nd Embodiment of a composite sheet.
3 is a cross-sectional view showing a schematic configuration of a conventional prepreg.
It is explanatory drawing explaining 1st Embodiment of the manufacturing method of a composite sheet.
It is explanatory drawing explaining 2nd Embodiment of the manufacturing method of a composite sheet.
It is explanatory drawing explaining 3rd Embodiment of the manufacturing method of a composite sheet.
It is explanatory drawing explaining 4th Embodiment of the manufacturing method of a composite sheet.
8 is a cross-sectional schematic diagram showing an example showing a state in which a seal or a gap is filled with a sealing material around a gap formed between a substrate and the mounted electronic component.
9 is a flowchart for explaining a method of connecting electronic components.
10 is a flowchart for explaining a method for connecting electronic components.
It is process drawing for demonstrating the connection method of an electronic component.
It is process drawing for demonstrating the connection method of an electronic component.
It is process drawing for demonstrating the connection method of an electronic component.
It is a front view for demonstrating 1st Embodiment of the fixing method of an electronic component.
It is a side view for demonstrating 1st Embodiment of the fixing method of an electronic component.
It is a front view for demonstrating 1st Embodiment of the fixing method of an electronic component.
It is a front view for demonstrating 2nd Embodiment of the fixing method of an electronic component.
It is a side view for demonstrating 2nd Embodiment of the fixing method of an electronic component.
It is a front view for demonstrating 2nd Embodiment of the fixing method of an electronic component.
It is sectional drawing which shows an example of the electronic component body to which a composite sheet is applied.
It is sectional drawing which shows an example of the electronic component to which a composite sheet was applied.
It is sectional drawing which shows the other example of the electronic component to which the composite sheet was applied.

First, the sheet-like resin composition of this invention is demonstrated.

[Sheet-shaped resin composition]

The sheet-like resin composition of the present invention is a sheet-like resin composition containing (A) a liquid bisphenol-type epoxy resin, (B) a softening point of a solid-state polyfunctional epoxy resin having a softening point of 70 ° C. or less, and a curing agent for (C) an epoxy resin as essential components. The mass ratio of (A) / (B) is 10/90 to 30/70. It is preferable that the sheet-like resin composition of this invention contains 10 mass%-80 mass% of (D) inorganic filler, and it is preferable to contain (E) flame retardant further.

[(A) component]

In the sheet-like resin composition of this invention, a liquid bisphenol-type epoxy resin is used as (A) component. As said liquid bisphenol type epoxy resin, what is necessary is just a liquid bisphenol type compound which has two or more epoxy groups in 1 molecule, and there is no restriction | limiting in particular, For example, bisphenol A type and bisphenol F type are preferable. Among them, a liquid bisphenol-A epoxy resin is preferably used, and specific examples thereof include "R140P" manufactured by Mitsui Chemical Co., Ltd. (Epoxy equivalent 188), "DER383" manufactured by Dow Chemical Company, and "Epicoat # 807" manufactured by Japan Epoxy Resin Co., Ltd. (Epoxy equivalent 170) and the like are used. These liquid bisphenol-type epoxy resins may be used individually by 1 type, and may be used in combination of 2 or more type. In the present invention, the liquid bisphenol-type epoxy resin refers to a bisphenol-type epoxy resin having a liquid phase at 25 ° C.

[Component (B)] [

In the sheet-like resin composition of this invention, a solid polyfunctional epoxy resin whose softening point is 70 degrees C or less is used as (B) component. As this softening point of a solid polyfunctional epoxy resin of 70 degrees C or less, the mixture of the biphenyl skeleton containing aralkyl type epoxy resin represented by following General formula (1) is mentioned, for example. In the following formula (1), m represents an integer of 1 to 4.

Moreover, the mixture etc. of the dicyclopentadiene type epoxy resin represented by following General formula (2) are mentioned. In the following formula (2), n represents an integer of 1 to 10.

In addition, the softening point of these solid polyfunctional epoxy resins is the value measured by the following method.

<Measurement of softening point>

The sample is filled into a prescribed ring based on JISK2207, and is horizontally supported in a water bath or a glycerin bath, and a bath is provided every minute with a prescribed sphere at the center of the sample. It is the temperature read when the sample wrapped up the sphere and it contacted the bottom plate of the hospitality by raising at the rate of degreeC.

As a commercial item of the solid polyfunctional epoxy resin whose said softening point is 70 degrees C or less, "NC3000 (softening point 57 degreeC)", "NC3000H (softening point 70 degreeC)" by Nippon Kayaku Co., etc. are used preferably.

In the present invention, (A) a liquid bisphenol-type epoxy resin and (B) a solid polyfunctional epoxy resin having a softening point of 70 ° C. or lower are used in combination, that is, two kinds of epoxy resins having different melting points are blended to form a sheet at a room temperature and a high temperature. The sheet-like resin composition which shows liquid behavior can be obtained.

In this invention, it is required that the mass ratio of said (A) / (B) exists in the range of 10 / 90-30 / 70. If the liquid epoxy resin is less than the above range or the softening point of the solid epoxy resin is more than 70 ° C., the sheet is cracked or crushed, which is not preferable. In addition, when the liquid epoxy resin is more than the above range or the softening point of the solid epoxy resin is too low, it becomes difficult to form the sheet. From such a viewpoint, the mass ratio of (A) / (B) is more preferably in the range of 15/85 to 25/75, and the lower limit of the softening point of the solid epoxy resin is usually about 40 ° C.

[Component (C)] [

In the sheet-like resin composition of this invention, the hardening | curing agent for epoxy resins is used as (C) component. There is no restriction | limiting in particular as this hardening | curing agent for epoxy resins, Arbitrary thing can be suitably selected and used out of what is conventionally used as a hardening | curing agent of an epoxy resin, For example, an amine type, a phenol type, an acid anhydride type, etc. are mentioned. As an amine-type hardening | curing agent, aromatic diamine, such as dicyandiamide, m-phenylenediamine, 4,4'- diamino diphenylmethane, 4,4'- diamino diphenyl sulfone, m-xylylenediamine, etc. Preferred examples thereof include phenol novolak resins, cresol novolak resins, bisphenol A novolak resins, triazine-modified phenol novolak resins, and the like. Moreover, as an acid anhydride type hardening | curing agent, For example, alicyclic acid anhydrides, such as methylhexahydro phthalic anhydride, aromatic acid anhydrides, such as phthalic anhydride, aliphatic acid anhydrides, such as aliphatic dibasic acid anhydride (PAPA), chloric acid anhydrides, etc. Halogen-based acid anhydrides; and the like. These hardeners may be used individually by 1 type, and may be used in combination of 2 or more type. The amount of the curing agent for epoxy resins is usually about 0.5 to 1.5 equivalents, preferably 0.7 to 1.3 equivalents, in terms of equivalent ratios to the epoxy resins of the components (A) and (B), in terms of balance between curability and cured resin physical properties. Is selected from the range.

[Arbitrary component: Curing accelerator for epoxy resin]

In the sheet-like resin composition of this invention, the hardening accelerator for epoxy resins can be contained as needed in the range which does not impair the effect of this invention. There is no restriction | limiting in particular as this hardening accelerator for epoxy resins, Arbitrary things can be suitably selected and used out of what is conventionally used as a hardening accelerator of an epoxy resin. For example, aromatic dimethylurea, aliphatic dimethylurea, 3- (3,4-dichlorophenyl) -1,1-dimethylurea (DCMU), 3- (3-chloro-4-methylphenyl) -1,1 as urea Ureas such as dimethyl urea and 2,4-bis (3,3-dimethyl ureide) toluene, 2-ethyl-4-methylimidazole, 1-benzyl-2-methylimidazole, and 2-methyl Imidazole compounds such as midazole, 2-ethylimidazole, 2-isopropylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 2,4,6-tris (dimethyl Aminomethyl phenol, a boron trifluoride amine complex, a triphenyl phosphine, etc. These hardening accelerators may be used individually by 1 type, and may be used in combination of 2 or more types. The use amount of is usually about 0.1 parts by mass to about 10 parts by mass with respect to 100 parts by mass of the epoxy resin of the components (A) and (B), in terms of balance of curing acceleration and cured resin physical properties. 0.4 is selected in a range of 5 parts by mass to the mass.

[Component (D)] [

In the sheet-like resin composition of this invention, an inorganic filler can be contained as (D) component. There is no restriction | limiting in particular as this inorganic filler, For example, silica, such as fused silica grind | pulverized by the ball mill etc., spherical silica obtained by flame melting, spherical silica manufactured by the sol-gel method, etc .; Alumina; Metal hydrates such as aluminum hydroxide and magnesium hydroxide; Titanium oxide; What is normally used, such as carbon black, can be used. These may be used individually by 1 type and may be used in combination of 2 or more type. It is preferable that the mass average particle diameter of the said inorganic filler exists in the range of 4 micrometers-30 micrometers from a viewpoint of workability and filling efficiency at the time of manufacture. In addition, this mass average particle diameter is the value measured by the laser diffraction scattering system (for example, Shimadzu Corporation, apparatus name: SALD-3100).

As said inorganic filler, spherical silica is preferable, for example, "FB-959 (mass average particle diameter: 25 micrometers)" made by Denki Chemical Co., Ltd. is preferable. It is preferable that content of the said inorganic filler is 10 mass%-80 mass% based on resin composition whole quantity. Here, when it is not set as the composite sheet mentioned later, ie, when a fiber base material is not provided in a sheet-like resin composition, it is preferable that they are 50 mass%-80 mass%. When not providing a fibrous base material, when sealing an electronic component using a sheet-like resin composition with content set to 50 mass% or more, it can suppress effectively the curvature and torsion which generate | occur | produce in hardened | cured material. In addition, it is possible to effectively suppress the occurrence of cracks and dents in the sheet-like resin composition, the fluidity at the time of melting, and the occurrence of unfilled sites around the parts at 80 mass% or less. On the other hand, when it is set as a composite sheet, curvature etc. of cured | curing material can be suppressed as content is 10 mass% or more. Moreover, when it is set as a composite sheet, since content can be 50 mass% or less, the fluidity | liquidity at the time of melting can be improved, and generation | occurrence | production of an unfilled location can be suppressed, and it is preferable. Moreover, when a metal hydrate is used as an inorganic filler, it also functions as a flame retardant.

[Arbitrary Component: Coupling Agent]

In the sheet-like resin composition of this invention, a coupling agent can be contained as needed from a filler viewpoint. As a coupling agent, a silane type, titanate type, aluminum type, etc. are mentioned, A silane coupling agent is preferable among these. Examples of the silane coupling agent include γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ- (2-aminoethylaminopropyltrimethoxysilane, and γ- (2-aminoethyl) aminopropyltri. Oxysilane, γ-anilinopropyltrimethoxysilane, γ-anilinopropyltriethoxysilane, N-β- (N-vinylbenzylaminoethyl) -γ-aminopropyltrimethoxysilane and N-β- ( Aminosilane compounds, such as N-vinylbenzylaminoethyl)-(gamma) -aminopropyl triethoxysilane, are used preferably.The content of the said silane coupling agent is about 0.03 mass%-about 5.0 mass% based on whole resin composition, Preferably Preferably from 0.1% by mass to 2.5% by mass.

[Component (E)] [

In the sheet-like resin composition of this invention, it is preferable to use a flame retardant as (E) component. There is no restriction | limiting in particular as said flame retardant, For example, a phosphorus compound, a metal hydrate, etc. can be used. Examples of the phosphorus compound include (a) a phosphazene compound, (b) 9,10-dihydro-9-oxa-10-phosphazanthrene-10-oxide or a derivative thereof, (c) a phosphate ester compound, (d Phosphate esteramides).

The phosphazene compound of (a) is substantially free of halogen, and a phosphazene compound having a melting point of 80 ° C or higher is preferably used in view of heat resistance, moisture resistance, flame resistance, chemical resistance, and the like. Specific examples thereof include cyclophosphazene oligomers represented by the following general formula (3).

In said Formula (3), R <^1> and R <^2> respectively independently represents the organic group which does not contain a hydrogen atom or a halogen, and k represents the integer of 3-10. In Chemical Formula 3, R ¹ , R ² As an organic group which does not contain a halogen, a C1-C10 alkoxyl group, a phenoxy group, an amino group, an allyl group, etc. are mentioned, for example. As such a phosphazene compound, "SPB-100" made from Ozu Chemical Co., Ltd. is mentioned, for example.

Said (b) 9,10-dihydro-9-oxa-10-phosphazanthrene-10-oxide has the structure shown by following General formula (4).

In addition, examples of the derivative thereof include (2,5-dihydroxyphenyl) -10H-9-oxa-10-phosphaphenanthrene-10-oxide represented by the formula (5).

In addition, the compound represented by the said Formula (4) is "SANKO-HCA" [SANKO Co., Ltd. brand name], and the compound represented by the said Formula (5) is "SANKO HCA-HQ" [SANKO Co., Ltd. brand name] It can be obtained as. Moreover, SANKO M-Acid-AH "(the Sanko Corporation make, brand name) is marketed as a derivative.

As said phosphate ester compound (c), it is esterified using polyhydric phenols, such as addition type phosphate esters, such as a triphenyl phosphate and a cresyl diphenyl phosphate, or resorcin, and monohydric phenols, such as a phenol and a cresol, Condensed phosphate esters &quot; PX &quot; in which at least one hydroxyl group of the polyhydric phenol is left as a reactive free group, or a free hydroxyl group of reactive phosphate esters such as &quot; RDP &quot; -200 "[manufactured by Daihachi Chemical Co., Ltd., brand name], etc. are mentioned.

In addition, the phosphate esteramide of (d) includes a binding mode of phosphate ester and phosphate amide, and includes JP-A-2001-139823, JP-A-2000-154277, and JP-A-10-A. The phosphate esteramide of Unexamined-Japanese-Patent No. 8-59888, Unexamined-Japanese-Patent No. 63-235363, etc. can be used. Condensed phosphate esteramides are mentioned as preferable phosphate esteramide. Examples of such phosphate esteramides include N- (diaryloxyphosphinyl) substituted alkyleneamines, bis to tetrakis [(diaryloxyphosphinyl) amino] substituted aromatic compounds, and N- (cyclic alkylenedioxy). Phosphinyl) substituted alkyleneamines, bis-tetrakis ((cyclic alkylenedioxyphosphinyl) amino] substituted aromatic compounds, N- (cyclic arylenedioxyphosphinyl) substituted alkyleneamines, bis-tetrakis [(cyclic Arylenedioxyphosphinyl) amino] substituted aromatic compounds, 3,9-bis (N-substituted amino) -2,4,8,10-tetraoxa-3,9-diphosphaspiro [5.5] -undecane- 3,9-dioxide etc. are mentioned. Phosphate esteramide can be obtained as a brand name "phosphate esteramide type flame retardant SP series (for example, SP-601, SP-670, SP-703, SP-720, etc.)" [manufactured by Shikoku Segoyo Co., Ltd.]. have.

On the other hand, aluminum hydroxide and magnesium hydroxide are used as a kind of metal hydrate, and "H42M" by Showa Denko is used suitably as an aluminum hydroxide compound, for example.

In this invention, the said flame retardant may be used individually by 1 type, and may be used in combination of 2 or more type. Moreover, although the content is based also on the kind of flame retardant, it is preferable that it is 5 mass%-50 mass% based on resin resin whole quantity from the point of balance of flame retardance and other physical properties, More preferably, it is 10 mass%-40 mass%. More preferably, they are 10 mass%-35 mass%.

[Other optional ingredients]

In the sheet-like resin composition of the present invention, powders such as silicone rubber or silicone gel, silicone-modified epoxy resins, phenol resins, methyl methacrylate-butadiene-styrene copolymers as other optional components within the range of not impairing the effects of the present invention. Low stress agents such as thermoplastic resins; diluents for viscosity lowering such as n-butylglycidyl ether, phenylglycidyl ether, styrene oxide, t-butylphenylglycidyl ether, dicyclopentadiene diepoxide, phenol, cresol and t-butylphenol; Wetting agents, antifoaming agents, such as a nonionic surfactant, a fluorine-type surfactant, and silicone oil, etc. can be contained suitably.

[Manufacturing method of sheet-like resin composition]

Although there is no restriction | limiting in particular in the preparation method of the sheet-like resin composition of this invention, For example, it can prepare as follows. First, the above-mentioned (A) liquid bisphenol-type epoxy resin, (B) solid-state polyfunctional epoxy resin whose softening point is 70 degrees C or less, and (C) hardening | curing agent for epoxy resins, and various arbitrary components used as needed are used for a high speed mixer, etc. After mixing uniformly, the mixture is sufficiently kneaded with a kneader, a double roll, a continuous kneading apparatus or the like. As kneading temperature, about 50 to 110 degreeC is preferable. After cooling the resin composition thus obtained, the sheet-like resin composition of the present invention is produced by pressing under a condition of a temperature of about 50 ° C to 100 ° C and a pressure of 0.5 MPa to 1.5 MPa with a molding machine. Although the thickness of a sheet-like resin composition is based also on a use, it is about 0.1 mm-2.0 mm normally, Preferably it is 0.1 mm-1.0 mm.

Such sheet-like resin composition has favorable handleability and moldability in itself, and has less curvature and torsion of the cured product. According to such a sheet-like resin composition, since an electronic component can be sealed easily by laminating | stacking on an electronic element and heating, for example, manufacture can be performed simply by simplifying a sealing process. Moreover, since it can seal without sacrificing the function of the electronic element which has an electronic functional part, without requiring a large scale facility, manufacturing cost can be reduced.

[Composite Sheet]

In the sheet-like resin composition of this invention, a fiber base material can be provided in at least one main surface, and it can be set as a composite sheet.

1: is sectional drawing which shows schematic structure of 1st Embodiment of a composite sheet, and FIG. 2 is sectional drawing which shows schematic structure of 2nd Embodiment of a composite sheet. 3 is sectional drawing which shows schematic structure of the conventional prepreg.

The composite sheet 1 has a fiber base material on one or both main surfaces of the resin layer 2 having a sheet-like resin composition, as shown in FIG. 1 (a) or FIG. 2 (a), for example. The fiber base layer 3 is formed in close contact. Moreover, the release film 4 which consists of polyethylene terephthalate etc. is provided in the both main surface of the composite sheet 1, for example. The release film 4 is peeled off during use, and the composite sheet 1 is attached to the electronic component body or the like to manufacture the electronic component in the state shown in FIG. 1 (b) or FIG. 2 (b), for example. Is used.

In the composite sheet 1, the fiber base layer 3 is closely formed on at least one main surface of the resin layer 2. According to such a composite sheet 1, the fiber base layer 3 is formed on the main surface, so that the handle and the strength are excellent, and the fiber base layer does not require a large-scale facility and undergoes a complicated process. It can be produced without. Moreover, when it adheres to an electronic component body and is used for manufacture of an electronic component, peeling and a crack generation | occurrence | production at the time of processing to an electronic component, especially cutting can be suppressed, and the yield of an electronic component can be improved.

3 is a cross-sectional view showing a conventional prepreg 50. The conventional prepreg 50 has the fiber base material 51, and the fiber base 51 has the structure which the thermosetting resin composition 52 was impregnated. In the conventional prepreg 50, in order to impregnate the fibrous base material 51 with the thermosetting resin composition 52, large-scale facilities, such as an impregnation tank, are needed, and the organic solvent etc. are also needed. According to the composite sheet 1 of the present invention, the fiber base layer 3 is formed in close contact with the main surface of the resin layer 2, and as described later, the fibrous base material is supplied to the surface of the sheet-like resin composition and pressed. Or by supplying and pressing a melt made of a constituent material of the sheet-like resin composition to the surface of the fibrous substrate, and having a fibrous substrate can be produced without requiring a large-scale facility and without a complicated process. Can be.

As for the ratio of resin part of the composite sheet 1, 65 to 93 volume% is preferable. By setting the proportion of the resin powder to 65% by volume to 93% by volume, the adhesive force of the composite sheet 1 is sufficiently satisfied, and the resin sheet from the composite sheet 1 and the curvature during the curing of the composite sheet 1 are suppressed. It is possible to improve the peeling resistance and the crack resistance.

That is, when the proportion of the resin powder is less than 65% by volume, since the proportion of the resin powder is small, the embedding of the composite sheet 1 into an adhesive region where sealing or insulation is performed, for example, a recess between the electrodes, becomes insufficient. There exists a possibility that it may not be able to fully suppress peeling and the generation | occurrence | production of a crack at the time of the process to an electronic component, especially cutting. On the other hand, when the ratio of resin content exceeds 93 volume%, there are many resins which adhered to the surface of a fiber base material, and since the outflow of resin increases, soaking out of an adhesive area increases, and also to the composite sheet 1 Cracks tend to occur.

In addition, the ratio of resin powder means the ratio to the volume of the resin composition of the whole composite sheet 1. Here, a resin composition means the resin composition which is a structural component of a sheet-like resin composition. The proportion [volume%] of the resin powder can be obtained by the following formula.

Resin fraction [volume%]

= {(Thickness of composite sheet [μm] -mass of fiber base [g / m 2] / specific gravity of fiber [g / cm 3])

  / Thickness of composite sheet [μm]} × 100

For example, the composite sheet 1 has one glass cross as a fiber base material, the thickness of the composite sheet 1 is 160 [µm], the mass of glass cross is 48 [g / m 2], and the specific gravity of the glass is In the case of 2.54 [g / cm <3>], it is calculated | required as follows.

Resin fraction [volume%]

= {(160 [μm] -48 [g / m 2] /2.54 [g / cm 3]) / 160 [μm]} × 100

= 88

As for the thickness of the resin layer 2, 30 micrometers-500 micrometers are preferable. When thickness is less than 30 micrometers, the handling property in the single-piece | unit of the sheet-like resin composition used for forming the resin layer 2 is not excellent, for example. Moreover, when manufacturing the electronic component by adhering the composite sheet 1 to the electronic component body, there exists a possibility that the composite sheet 1 may peel from an electronic component at the time of the process of an electronic component, especially cutting. On the other hand, when it exceeds 500 micrometers, a crack arises easily in the resin layer 2, and also thinning of an electronic component becomes difficult.

As for the thickness of the fiber base layer 3, 30 micrometers-180 micrometers are preferable. In the case of less than 30 micrometers, the handling property in the single fiber base material used for formation of the fiber base layer 3 is not excellent. On the other hand, when it exceeds 180 micrometers, it is difficult to impregnate resin in the whole fiber base material.

Although the thickness of the composite sheet 1 can be suitably selected according to the thickness of the resin layer 2, the fiber base layer 3, or the use of the composite sheet 1, 100 micrometers-500 micrometers are preferable normally.

Moreover, as for the plasticity in normal temperature (25 degreeC) of the resin composition which comprises the resin layer 2, 60-90 are preferable. When the plasticity is less than 60, the flow of the resin composition cannot be suppressed, soaking out of the adhesive region is increased, and it is connected to poor appearance or contamination around the adhesive region. Moreover, when plasticity exceeds less than 90, the void of an adhesion | attachment area | region increases, and there exists a possibility that a poor adhesion or a poor charging may arise. In addition, the plasticity in this specification is measured with the parallel plate plasticity meter based on the method based on JISK6249.

The fiber base layer 3 is formed in close contact with at least one main surface of the resin layer 2. It is preferable that the fiber base material which comprises the fiber base layer 3 is impregnated with the resin composition which is a structural component of the sheet-like resin composition which comprises the resin layer 2 in at least one part of the space | gap, and especially the number of whole gaps It is preferable that the thermosetting resin composition which comprises the ground layer 2 is impregnated. That is, it is preferable that the fiber base material which comprises the fiber base layer 3 is arrange | positioned so that it may be embedded in the surface part of the resin layer 2.

The fiber base may be a woven fabric, a nonwoven fabric may be used, and the fiber base may be any fiber base. Moreover, it is not specifically limited also about the constituent material, It can be set as glass fiber, aromatic polyamide fiber, cellulose fiber, polyester fiber, etc. These can be used individually or in mixture of 2 or more types.

As for a fiber base material, glass cross and glass paper are preferable, and glass cross is especially preferable. Although the kind of glass cross is not specifically limited, The plain weave E glass cross etc. which are prescribed | regulated to IPC-EG-140 are preferable, and 3078 micrometers of 1078 type, 1080 type, 1037 type, 1084 type, 2110 type, 7628 type are mentioned. Particularly preferred is a thickness of from 180 μm.

[Production method of composite sheet]

The composite sheet 1 includes, for example, a step of kneading the constituent components of the sheet-like resin composition at a temperature of 50 ° C to 110 ° C to obtain a kneaded material, and supplying the kneaded material to one side of the fiber base material, or kneading the kneaded material. After supplying between a pair of fiber base materials, it can manufacture through the process of integrally shape | molding in a sheet form by pressing a kneaded material to a fiber base material.

According to such a manufacturing method, the composite sheet 1 in which the fiber base layer 3 was closely adhered to the main surface of the resin layer 2 can be manufactured simply. Moreover, in this manufacturing method, the composite sheet 1 with the release film 4 can be manufactured by supplying the release film 4 to these one side or both sides with a kneaded material or a fiber base material.

The supply form of the kneaded product is not particularly limited, and may be formed into a lump, a sheet, or a molten phase. In addition, molding of a kneaded material and a fiber base material may be performed by a batch system, and may be performed continuously using a hot press, a press roll, etc.

In the production of the composite sheet 1, in particular, the kneaded material is fed to one side of the fiber substrate, or the kneaded material is fed between a pair of fiber substrates, and then these are passed through a pair of pressure rolls to form a sheet. The method of shaping is preferable. It is preferable that a pair of press rolls can adjust the clearance dimension, for example, it is preferable that diameter is 20 mm-60 mm, and a clearance dimension is about 5 micrometers-500 micrometers. Moreover, the shaping | molding for integration is 30 degreeC-180 degreeC, and it is preferable to pass a press roll at the speed of 0.1-5 m / min. By setting it as such a temperature and passing speed, the favorable composite sheet 1 is obtained.

FIG. 4: is a schematic block diagram which shows 1st Embodiment which shows the manufacturing apparatus and manufacturing method of the composite sheet 1. FIG. As for the manufacturing apparatus 10, the supply apparatus 11 and the fiber base material 6 which supply the resin composition 5 which becomes the resin layer 2 from a mass to a molten phase, for example, are wound, and the said fiber base material 6 ) A pair of release film rolls 13, a fiber base material 6, or a release film 4, on which a roll 12 for a substrate to be supplied), a release film 4, and which supplies the release film 4 are wound. ), A pair of guide rolls 14 for guiding), a pair of pressure rolls 15 for pressing the fibrous substrate 6, the release film 4, and the like.

The supply apparatus 11, the base material roll 12, and the release film roll 13 are arrange | positioned corresponding to the laminated structure of the composite sheet 1. For example, as shown in FIG. 4, one part of the outer periphery of one guide roll 14 (right guide roll 14) among a pair of guide rolls 14, and the fiber base material 6 and one side. It arrange | positions so that the other release film 4 may be wound around a part of the outer periphery of the other guide roll 14 so that the release film 4 of this may be wound. With such arrangement, some gaps for supplying the resin composition 5 can be formed between the fiber base material 6 and the other release film 4.

In this manufacturing apparatus 10, a pair of release film 4 is continuously supplied from a pair of rolls for release films 13 between a pair of guide rolls 14, and between them, a roll for a base material ( The fiber base material 6 is continuously supplied from 12). Moreover, between the fiber base material 6 and one release film 4, the resin composition 5 made into the molten form from the mass from the supply apparatus 11 is supplied. These feeds are also passed between a pair of pressure rolls 15.

Thus, the composite sheet 1 in which the fiber base material 6 was embedded in the main surface of the resin composition 5, or the fiber base material 6 was impregnated with the resin composition 5, and the release film 4 was provided in the outermost layer. ) Can be prepared. In particular, the pair of pressure rolls 15 can be adjusted in the gap dimensions, and the embedding degree of the fiber base material 6 into the resin composition 5 or the fiber base material is caused by passing the constituent material of the composite sheet 1 through these gaps. The impregnation degree of the resin composition 5 to (6) can be adjusted, and the thickness of the whole composite sheet 1 can also be adjusted.

FIG. 5: is a schematic block diagram which shows 2nd Embodiment which shows the manufacturing apparatus and manufacturing method of the composite sheet 1. FIG. In this manufacturing apparatus 10, the roll 12 for a base material is further added to the manufacturing apparatus 10 shown in FIG. 4, and the pair of base material roll 12 is provided. The pair of substrate rolls 12 is arranged to wind each fibrous substrate 6 around a portion of the outer perimeter of the pair of guide rolls 14.

In this manufacturing apparatus 10, a pair of release film 4 is continuously supplied from a pair of rolls for release films 13 between a pair of guide rolls 14, and a pair of base material is between them. A pair of fiber base material 6 is continuously supplied from the molten roll 12. FIG. Thus, the composite sheet 1 which has a pair of fiber base material 6 on both main surfaces of the resin layer 2 can be manufactured.

FIG. 6: is a schematic block diagram which shows 3rd Embodiment which shows the manufacturing apparatus and manufacturing method of the composite sheet 1. FIG. This manufacturing apparatus 10 has the same basic structure as the manufacturing apparatus 10 shown in FIG. 4, The single piece of sheet-like resin composition 7 is wound instead of the supply apparatus 11, and the said sheet-like resin composition ( The point provided with the sheet | seat roll 16 which supplies 7) differs. Thus, you may manufacture the composite sheet 1 by supplying the sheet-like resin composition 7 directly.

FIG. 7: is a schematic block diagram which shows 4th Embodiment which shows the manufacturing apparatus and manufacturing method of the composite sheet 1. FIG. The said manufacturing apparatus 10 adds the roll 12 for a base material further to the manufacturing apparatus 10 shown in FIG. 6, and provides a pair of base rolls 12. As shown in FIG. Thus, the composite sheet 1 which has a pair of fiber base material 6 on both main surfaces of the resin layer 2 can be manufactured.

As mentioned above, although the method of manufacturing the composite sheet 1 continuously using the press roll 15 was demonstrated, the composite sheet 1 laminated | stacked the constituent material in predetermined order, and it was 50 degreeC-100 degreeC with a molding machine. You may manufacture by pressing on the conditions of the temperature of a grade and the pressure of 0.5 MPa-1.5 MPa.

Subsequently, application examples of the sheet-shaped resin composition 7 and the composite sheet 1 of the present invention will be specifically described. In addition, below, although the sheet-like resin composition 7 is demonstrated as an example, it can apply also to the composite sheet 1 by the same method.

[Circuit components]

The circuit board on which electronic components, such as a semiconductor, a chip resistor, a diode, and a capacitor, were mounted can be made into a circuit component by simply sealing and covering the surface by covering and thermosetting the sheet-like resin composition 7 of this invention. There is no restriction | limiting in particular in the sealing and coating method of the electronic component by the sheet-like resin composition 7 of this invention, For example, sealing and coating can be performed as follows.

After covering the sheet-like resin composition 7 on the circuit board on which the electronic component is mounted, for example to cover the electronic component, the sheet is heated to a temperature of about 80 ° C to 200 ° C, preferably 100 ° C to 150 ° C. After the upper resin composition 7 is fluidized so that there are no unfilled points around the electronic component, the resin is heated by heating at a temperature of 100 ° C to 180 ° C for about 0.5 to 2 hours to cure the fluidized resin. The circuit component of the invention can be obtained. In the circuit component obtained in this way, hardened | cured material does not generate | occur | produce curvature and torsion, and there is little generation of the uncharged place around an electronic component.

[Sealing of hollow electronic components]

Sealing of the electronic component which has a hollow part like a SAW device can be performed easily and in a high yield with the sheet-like resin composition 7 of this invention. First, for example, the electronic component mounted on the board | substrate is coat | covered with the sheet-like resin composition 7, and it heats to the temperature of about 80 to 150 degreeC, Preferably it is 100 to 150 degreeC, and forms the sheet-like resin composition (7). ), And then the sheet-like resin composition 7 heated by heating at a temperature of about 100 ° C to 180 ° C for about 0.5 to 2 hours to cure the fluidized sheet-like resin composition 7 to seal or close the gap around the gap formed between the electronic component and the substrate. It can be charged.

An example of the cross-sectional schematic diagram is shown to FIG. 8 (a)-(e). In each of the drawings, reference numeral 7 denotes a sheet-like resin composition, 31 and 32 are electronic components (31 is a chip-like device, 32 is a bump, for example, and 33). Is a substrate. In the present invention, the closed state refers to a state in which a gap formed between the electronic component and the substrate is maintained as shown in FIGS. 8A, 8C, and 8D, and charging refers to FIGS. 8B and 8E. As described above, the resin composition is filled in the same gap and there is no gap. According to the sheet-shaped resin composition 7 of this invention, the clearance gap formed between an electronic component and a board | substrate can also be filled by adjustment of a heating temperature, etc., The gap formed between an electronic component and a board | substrate is hold | maintained, for example, As shown to (d) of 8, sealing can also be performed in the state in which an electronic functional part does not contact a resin composition or a board | substrate. Examples of the element having an electronic functional unit include piezoelectric elements such as quartz crystal oscillators, circuit elements for forming a high frequency circuit, and sensor elements such as light receiving elements.

[Electrical Connection of Electronic Components]

By using the sheet-shaped resin composition 7 of this invention, electrical connection of an electronic component and a board | substrate can be performed simply and with high yield. 9-13 is process drawing for demonstrating the connection method of an electronic component.

First, as shown, for example in FIG. 9, the board | substrate 41 in which the land part 42 as a 1st electrode was formed is prepared. The substrate 41 may be formed of, for example, a glass substrate, a ceramic substrate, a resin substrate (BT, PET, etc.), a glass epoxy substrate (FR-4, FR-5), a metal plate coated on the surface of a metal oxide, or the like. .

10, the electrically conductive paste 43 is apply | coated on the land part 42 of the board | substrate 41. Then, as shown in FIG. The electrically conductive paste 43 can use what made resin into a base resin, and added electroconductive particle. Subsequently, as shown in FIG. 11, the sheet-like resin composition 7 is arrange | positioned in the non-formation area | region of the land part 42 and the electrically conductive paste 43 of the board | substrate 41. FIG.

Subsequently, as shown in FIG. 12, the electronic component 44 is prepared. An electrode pad 45 as a second electrode is formed on the lower surface of the electronic component 44. On the electrode pad 45, metal electrode bumps 46 are formed by an electroplating method through a barrier metal film such as Cr-Cu, Ti-Pd, or the like. The metal electrode bumps 46 may be made of, for example, Au, Ag, or Cu. It is also possible to provide solder bumps by supplying and reflowing the solder material instead of the metal electrode bumps 46. In addition, although the conductive paste 43 was provided on the land part 42 of the board | substrate 41 in this embodiment, it can also be provided on the metal electrode bump 46. FIG.

Thereafter, the electronic component 44 is placed on the substrate 41 so that the positions of the metal electrode bumps 46 of the electronic component 44 and the conductive paste 43 of the substrate 41 coincide with each other. Under the pressure of 0.1 Pa, it is heated to a temperature of about 80 to 150 ° C. Then, the conductive paste 43 and the sheet-like resin composition 7 are melted at the same time, and then cooled to cure the conductive paste 43 and the sheet-like resin composition 7 collectively. Thereby, as shown in FIG. 13, the board | substrate 41 and the electronic component 44 are electrically connected by the electrical connection body 47 which is hardened | cured material, such as the electrically conductive paste 43, and also the sheet-like resin composition ( It is mechanically connected by the hardened | cured material 8 of 7).

Thus, in this embodiment, since the electrically conductive paste 43 and the sheet-like resin composition 7 are melted and hardened collectively, and the board | substrate 41 and the electronic component 44 are electrically and mechanically connected, it is one step compared with the past. It is enough just to perform the heating process. In addition, since the electrically conductive paste 43 and the sheet-like resin composition 7 fluidize simultaneously by the above-mentioned heat processing, the pressure applied to the electronic component 44 can be 0.1 Pa at maximum. Therefore, even when the electronic component 44 is weak, the electronic component 44 is not destroyed.

[Adhesion and Fixing of Electronic Components]

By using the sheet-shaped resin composition 7 of the present invention, electronic components such as small electronic devices can be easily and securely fixed to a substrate or a housing without a fixing jig. It demonstrates in FIGS. 14-16 and 17-19.

14-16 is process drawing for demonstrating the connection method of the vibration motor as an electronic component of this embodiment to the board | substrate. 14 and 16 are front views for explaining the connection method of the vibration motor, and FIG. 15 is a side view of the connection method of the vibration motor shown in FIG.

First, for example, as illustrated in FIGS. 14 and 15, a substrate or a housing 51 and a vibration motor 52 are prepared. The board | substrate or the housing 51 is comprised, for example with the glass epoxy plate, the metal plate which coated the metal oxide on the surface. The vibration motor 52 has the motor main body 520 and the eccentric weight 522, for example. As shown in FIG. 14 and FIG. 15, the motor main body 520 is covered with the sheet-like resin composition 7 cut | disconnected to predetermined length, and the edge part of the sheet-like resin composition 7 is the board | substrate or the housing 51. As shown in FIG. Is fixed in contact. In addition, the contact fixing to the board | substrate or the housing | casing 51 of the sheet-like resin composition 7 may be performed through a predetermined | prescribed adhesive agent, and may be performed by making the sheet-like resin composition 7 partially melt and adhere | attach. .

In the case of this embodiment, as shown in FIG. 16, the sheet-like resin composition 7 is softened by heating the sheet-like resin composition 7, and a part of the board | substrate or the housing 51 and a part of the motor main body 520 are shown. It softens and melts as it is, and the contact part of the board | substrate or the housing 51 and the motor main body 520 spreads along each surface, and it hardens | cures in this state, and becomes the hardened | cured material 8 as shown, The vibration generating device 50 can be manufactured. Therefore, the substrate or the housing 51 and the vibration motor 52 can be firmly adhesively fixed.

17-19 is process drawing for demonstrating the other connection method of the vibration motor of this embodiment. 17 and 19 are front views for explaining the connection method of the vibration motor, and FIG. 18 is a side view of the connection method of the vibration motor shown in FIG.

As shown in FIG. 17, FIG. 18, the sheet-like resin composition 7 is laminated | stacked on the board | substrate or the housing | casing 51, and the vibration motor 52 is arrange | positioned at the said sheet-like resin composition 7. Subsequently, as shown in FIG. 19, in the case of melting before hardening by heat-hardening the sheet-like resin composition 7, the vibration motor 52 is in the sheet-like resin composition 7 in which one part melted by self weight. It is embedded and the periphery of the vibration motor 52 becomes high, and the periphery of the vibration motor 52 is maintained in a wide surface. After that, the adhesive is fixed by the cured product 8 of the sheet-shaped resin composition 7.

According to this embodiment, it arrange | positions so that the board | substrate or the housing | casing 51 and the motor main body 520, ie, the vibration motor 52, may contact each sheet-like resin composition 7 arrange | positioned between them, and arrange | positioned, and a sheet-like resin composition (7) is heat-hardened and fixed, and the vibration generating apparatus 10 is comprised. Since the sheet-like resin composition 7 is thin compared to elastic bodies, such as rubber | gum, and in this embodiment, the sheet-like resin composition 7 is heat-hardened, the sheet-like resin composition in which one part of the vibration motor 52 melted ( It is supposed to bury in 7).

Therefore, compared with the case where the vibration motor is fixed by the elastic body arrange | positioned in the housing which arrange | positions a vibration motor, and when the vibration motor is fixed with a metal holder, it does not require a complicated process, and it can carry out a vibration motor simply and inexpensively. It can be fixed to the substrate or the housing.

[Electronic component, electronic device]

The sheet-like resin composition 7 of this invention adheres to the surface of an electronic component body | body, and insulates the said surface, and is used for manufacture of an electronic component. In addition, the sheet-like resin composition 7 of this invention is covered with an electronic component, for example, and is used for manufacture of an electronic device by sealing the said electronic component. Although it does not restrict | limit especially as an electronic component, For example, a semiconductor element, a resistor, a diode, and a capacitor are mentioned. Examples of electronic components include hollow devices such as surface acoustic wave devices (SAW devices), crystal devices, high frequency devices, and acceleration sensors.

An example of the electronic component body used for manufacture of an electronic component is shown in FIG. The electronic component body 61 has, for example, a body body 62 and two external connection electrodes 63 provided separately from each other on the surface of the body body 62. For example, the distance between electrodes of the two external connection electrodes 63 is 2.0 mm, and electrode height is 0.3 mm. The sheet-like resin composition 7 is used for insulation between two external connection electrodes 63, for example. Insulation by the sheet-like resin composition 7 can be performed as follows, for example.

That is, the sheet-like resin composition 7 is covered between two external connection electrodes 63. Thereafter, the sheet-like resin composition 7 is fluidized by heating to a temperature of about 80 ° C to 200 ° C, preferably 100 ° C to 150 ° C. Moreover, the sheet-like resin composition 7 hardened by heating at a temperature of 100 degreeC-180 degreeC for 0.5 to 2 hours is fluidized. 21 and 22, the electronic component 64 can be obtained by appropriately covering and insulating the electrodes 63 for external connection with the sheet-shaped resin composition 7 (cured product). Can be. At this time, using the composite sheet 1 instead of the sheet-like resin composition 7, it is easy to obtain what is flat as shown in FIG.

Example

Subsequently, although an Example demonstrates this invention further in detail, this invention is not limited at all by these examples. In addition, the various characteristic of each example was calculated | required by the method shown below.

<Sheet-like resin composition>

(1) gel time

Based on the test tube method of JISC2105, the time until a sheet-like resin composition turns into a gel in an oil bath of 100 degreeC was measured.

(2) sheet characteristics

The following evaluation criteria evaluated.

(Circle): It is flexible at room temperature, it does not produce a crack and distortion, and is not a liquid phase.

(Triangle | delta): It is flexible at room temperature and is not a liquid phase, but cracks and dents are generated.

X: Sheeting is impossible.

(3) fluidity during melting

The 2 mm square chip provided on the FR-4 board | substrate was sealed with the sheet form composition, and the embedding property was visually confirmed. Curing conditions are 100 degreeC and 2 hours. The following evaluation criteria evaluated.

○: Good

X: There is an uncharged point around a part.

(4) Melt viscosity

It measured by the rheometer (RhenemetricScientific company make) (100 degreeC).

<Hard cargo>

(5) glass transition point

In TMA / SS150 (manufactured by Seiko Instruments Co., Ltd.), the temperature was raised to room temperature to 200 deg. C (heating rate 10 deg. C / min), and the glass transition point was measured.

(6) flame retardant

In accordance with UL94, flame retardance was evaluated at a test piece thickness of 1.6 mm.

(7) bending

A sheet-like composition (30 mm x 20 mm) was placed on a FR-4 substrate (45 mm x 30 mm) having a thickness of 0.3 mm, cured at 100 ° C for 2 hours, and the height of the four corners of the substrate after curing was measured. The average value was made into the index of curvature.

[Examples 1 to 9 and Comparative Examples 1 to 3]

Each raw material of the compounding composition shown in Table 1 was inject | poured into the kneader, and it stirred and mixed at 70 degreeC for 1 hour, and prepared each resin composition. Subsequently, after cooling each resin composition at 30 degreeC, each sheet-like resin composition was produced by press-molding on the conditions of 70 degreeC and 1.0 MPa by the molding machine, and set it as the sheet of thickness 0.5mm.

The evaluation results of various properties of each example are shown in Table 1 below. For example, SP57 degreeC described in the horizontal of the solid epoxy resin of following Table 1 shows a softening point.

Each component used is as follows.

1. Liquid epoxy resin

(1) R140P: Bisphenol A type epoxy resin made from Mitsui Chemicals (number average molecular weight: 380, epoxy equivalent: 190)

(2) DER383J: Bisphenol A epoxy resin (Epoxy equivalent: 190) made from Dow Chemical company

(3) Epicoat # 807: Bisphenol F-type epoxy resin (Epoxy equivalent: 160-175) made from Japan epoxy resin company

2. Solid Epoxy Resin

(1) NC3000: Nippon Kayaku Co., Ltd. biphenyl skeleton containing polyfunctional epoxy resin (epoxy equivalent: 285, softening point: 57 degreeC)

(2) NC3000H: Biphenyl skeleton epoxy resin made by Nippon Kayaku Co., Ltd. (epoxy equivalent: 290, softening point: 70 ° C)

(3) YDCN704: cresol novolac type epoxy resin made by Todogase Corporation (epoxy equivalent: 210, softening point 90 ° C)

3. Curing agent

(1) DICY: Dicyandiamide made by Nippon Carbide Co., Ltd.

(2) EH-4370S: modified aliphatic polyamine made by ADEKA Corporation

4. Curing accelerator

U-CAT3502T: aromatic dimethyl urea made by Sunflo

5. Weapon filler

FB-959: spherical silica made by Denki Chemical Co., Ltd. (mass average particle diameter: 25 μm)

6. Flame retardant

(1) SPB-100: A phosphazene compound manufactured by Ozuka Chemical Co., Ltd. [all of R ¹ and R ² in Formula 3 are phenyl groups, k is 3 or more]

(2) H42M: Aluminum hydroxide (particle diameter: 1.5 micrometer) by Showa Denko Corporation.

In addition, when aluminum hydroxide is used as a flame retardant, the compounding quantity is put in an inorganic filler.

As can be understood from Table 1, the examples are basically good in the sheet properties, fluidity at the time of melting, flame retardancy, bending. On the other hand, the solid polyfunctional epoxy resin whose (A) liquid bisphenol-type epoxy resin is not used like the comparative example 1, but (A) liquid bisphenol-type epoxy resin and (B) softening point of a comparative example 2 are 70 degrees C or less. The mass ratio (A) / (B) of which is outside the range of 10/90 to 30/70 means that the sheet property is higher than 70 ° C. as in Comparative Example 3, and the fluidity at the time of melting is inferior.

The sheet-like resin composition of this invention can be manufactured like a conventional adhesive sheet, without requiring a large coating installation, can be manufactured without using an organic solvent, and also there are few curvatures and twists of hardened | cured material, Sealing of circuit components can be performed easily. Such a sheet-like resin composition can be used suitably for manufacture of a circuit component, sealing, connection, and fixing of an electronic component. Moreover, the sheet-like resin composition of this invention can be used suitably for manufacture of an electronic component as a composite sheet.

1: composite sheet 2: resin layer
3: fiber base layer 4: release film
5: resin composition 6: fiber base material
7: sheet-like resin composition 8: hardened | cured material
10: manufacturing apparatus 11: supply apparatus
12: roll for substrate 13: roll for release film
14: guide roll 15: pressure roll
31, 32: electronic component 33: substrate
41 substrate 42 land part
43: conductive paste 44: electronic components
45: electrode pad 46: metal electrode bump
47: electrical connection 51: substrate or housing
52: vibration motor

Claims (18)

As a sheet-like resin composition containing (A) liquid bisphenol-type epoxy resin, (B) softening point solid state polyfunctional epoxy resin of 70 degrees C or less, and (C) hardening | curing agent for epoxy resins as an essential component,
The sheet-like resin composition whose said (A) / (B) mass ratio is 10 / 90-30 / 70. The method of claim 1,
Wherein (B) is a sheet-like resin composition is a mixture of biphenyl skeleton-containing aralkyl type epoxy resin represented by the following formula (1), m represents an integer of 1 to 4.
(Formula 1)

The method of claim 1,
Furthermore, (D) the sheet-like resin composition containing 10 mass%-80 mass% of spherical silica of 4 micrometers-30 micrometers of mass average particle diameters with respect to composition whole quantity. The method of claim 1,
Furthermore, (E) the sheet-like resin composition containing a phosphazene compound as a flame retardant. The circuit component formed by sealing or adhering with the sheet-like resin composition of Claim 1. As a sealing method of the electronic component which coats the electronic component mounted on the board | substrate with the sheet-like resin composition of Claim 1, and heat-cures,
The electronic component sealing method of covering the said electronic component with the said sheet-like resin composition, and sealing the periphery of the contact part of the said electronic component and the said board | substrate, and forming a gap between the said electronic component and the said board | substrate. The method according to claim 6,
A method for sealing an electronic component, wherein the sheet-like resin composition is fluidized at 80 ° C to 150 ° C, and then the sheet-shaped resin composition is cured by heating at 100 ° C to 180 ° C for 0.5 to 2 hours. A method of electrically connecting a substrate having a first electrode for connection and an electronic component having a second electrode for connection to each other through the first electrode and the second electrode,
A method for connecting an electronic component comprising the step of electrically connecting the electronic component to the substrate using the sheet-like resin composition according to claim 1. The method of claim 8,
Disposing a conductive paste on the first electrode of the substrate,
Disposing the sheet-like resin composition in a non-forming region of the first electrode of the substrate, and
The electronic component is mounted on the substrate such that the second electrode and the first electrode of the substrate come into contact with each other, and the conductive paste and the sheet-like resin composition are simultaneously heated and cured to electrically connect the electronic component to the substrate. The connection method of the electronic component which comprises the process of connecting. A method of securing an electronic component to a substrate or housing,
A method for fixing an electronic component, wherein the sheet-like resin composition according to claim 1 is placed in contact with the substrate or the housing and the electronic component, and the substrate or the housing and the electronic component are fixed with the sheet-shaped resin composition. 11. The method of claim 10,
A method for fixing an electronic component covering the electronic component with the sheet-shaped resin composition, curing by heat softening or hot melting, and adhesively fixing the substrate or the housing and the electronic component. 11. The method of claim 10,
The sheet-like resin composition is mounted on the electronic component mounting surface of the substrate or the housing, and the electronic component is mounted on the sheet-shaped resin composition. Then, the sheet-shaped resin composition is heated by heat softening or hot melting. A method for fixing an electronic component by curing the substrate or the housing and the electronic component by curing. The resin layer which has a sheet-like resin composition of Claim 1, and
A composite sheet having a fiber base layer having a fiber base formed in close contact with at least one main surface of the resin layer. The method of claim 13,
The composite sheet in which the proportion of the resin in the composite sheet is 65% by volume to 93% by volume. The method of claim 13,
Said fiber base material is at least 1 sort (s) selected from an inorganic fiber base material and an organic fiber base material. Electronic component bodies, and
The electronic component which has a composite sheet of Claim 13 arrange | positioned on the surface of at least one part of the said electronic component main body, and insulates the said surface. Electronic components, and
The electronic device which has the composite sheet of Claim 13 which seals the said electronic component. A step of kneading the constituent components of the sheet-like resin composition according to claim 1 at a temperature of 50 ° C to 110 ° C to obtain a kneaded product, and
After the kneaded material is supplied to one side of the fiber base material or the kneaded material is supplied between the pair of fiber base materials, the kneaded material is integrally formed into a sheet by pressing the kneaded material onto the fiber base material. The manufacturing method of the composite sheet which has a process of obtaining a composite sheet | seat.

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