JP5735030B2 - Resin sheet for sealing electronic device and method for manufacturing electronic device package - Google Patents

Description

  The present invention relates to an electronic device sealing resin sheet and an electronic device package manufacturing method.

  In producing an electronic device package, typically, one or a plurality of electronic devices fixed to a substrate or the like are sealed with a sealing resin, and the sealing body is packaged in units of electronic devices as necessary. The procedure of dicing is adopted. As such a sealing resin, a sheet-shaped sealing resin may be used.

  For example, Patent Document 1 describes that a resin sheet is formed by applying a varnish on a film and then drying the coating film.

JP 2006-19714 A

  In the method for producing a resin sheet (solvent coating) as in Patent Document 1, a solvent is used for varnish preparation. If the solvent remains in the resin sheet, the solvent volatilizes due to heating during thermosetting or solder reflow, and outgas is generated. It is difficult to sufficiently volatilize a solvent from a resin sheet produced by solvent coating, and it is particularly difficult for a resin sheet having a large sheet thickness.

  An object of the present invention is to solve the above-mentioned problems and to provide a resin sheet having a large sheet thickness and a reduced outgas amount.

  The present invention relates to a resin sheet for sealing an electronic device having a thickness of 100 to 2000 μm and a gas amount generated when cured at 150 ° C. for 1 hour is 500 ppm or less.

  Conventionally, it has been difficult to reduce the amount of gas generated when the resin sheet having a thickness within the above range is cured, but the outgas amount at the time of curing is reduced in the resin sheet of the present invention. Corrosion and malfunction of electronic devices due to

  It is preferable that 1% weight reduction temperature of the cured product obtained by curing the resin sheet for sealing an electronic device at 150 ° C. for 1 hour is 260 ° C. or more. When the temperature is 260 ° C. or higher, the amount of volatile components in the resin sheet is reduced, and the amount of gas (outgas) generated during solder reflow is reduced.

  The cured product obtained by curing the electronic device sealing resin sheet at 150 ° C. for 1 hour is heated from 40 ° C. to 260 ° C. at a heating rate of 10 ° C./min, and then heated at 260 ° C. for 1 minute. It is preferable that the amount of gas generated at the time is 500 ppm or less. The heating condition that is the premise of the gas amount assumes a solder reflow profile. When the gas amount is 500 ppm or less, the amount of gas (outgas) generated during solder reflow is reduced.

  The present invention also provides a sealing step in which the electronic device sealing resin sheet is laminated on the electronic device so as to cover one or more electronic devices, and the electronic device sealing resin sheet is cured. The present invention relates to a method for manufacturing an electronic device package, which includes a sealing body forming step of forming.

It is sectional drawing which shows typically the resin sheet which concerns on one Embodiment of this invention. It is a figure which shows typically 1 process of the manufacturing method of the electronic device package which concerns on one Embodiment of this invention. It is a figure which shows typically 1 process of the manufacturing method of the electronic device package which concerns on one Embodiment of this invention. It is a figure which shows typically 1 process of the manufacturing method of the electronic device package which concerns on one Embodiment of this invention.

  The present invention will be described in detail below with reference to embodiments, but the present invention is not limited only to these embodiments.

  [Resin sheet for sealing electronic devices]

  FIG. 1 is a cross-sectional view schematically showing a resin sheet 11 according to an embodiment of the present invention. The resin sheet 11 is typically provided in a state of being laminated on a support 11a such as a polyethylene terephthalate (PET) film. Note that a release treatment may be performed on the support 11a in order to easily peel off the resin sheet 11.

  The thickness of the resin sheet 11 is relatively thick, specifically, 100 to 2000 μm. Conventionally, it has been difficult to reduce the amount of outgas with a resin sheet having a thickness within the above range, but the amount of outgas with resin sheet 11 is reduced. The thickness of the resin sheet 11 is preferably 150 μm or more. On the other hand, the thickness of the resin sheet 11 is preferably 1000 μm or less.

The amount of gas (outgas) generated when the resin sheet 11 is cured at 150 ° C. for 1 hour is 500 ppm or less, preferably 300 ppm or less. Since it is 500 ppm or less, the amount of outgas at the time of curing is reduced, and corrosion and malfunction of the electronic device due to the outgas can be reduced. On the other hand, the lower limit of the amount of gas generated when cured at 150 ° C. for 1 hour is not particularly limited, and is, for example, 30 ppm or more.
The amount of gas generated when cured at 150 ° C. for 1 hour can be measured by the method described in Examples.

The 1% weight reduction temperature of the cured product obtained by curing the resin sheet 11 at 150 ° C. for 1 hour is preferably 260 ° C. or higher, and preferably 300 ° C. or higher. When the temperature is 260 ° C. or higher, the amount of volatile components in the resin sheet 11 is reduced, and the amount of gas (outgas) generated during solder reflow is reduced. The upper limit of the 1% weight reduction temperature of the cured product obtained by curing the resin sheet 11 at 150 ° C. for 1 hour is not particularly limited, but is, for example, 500 ° C. or less.
The 1% weight reduction temperature of the cured product obtained by curing the resin sheet 11 at 150 ° C. for 1 hour can be measured by the method described in Examples.

Gas generated when the cured product obtained by curing the resin sheet 11 at 150 ° C. for 1 hour is heated from 40 ° C. to 260 ° C. at a heating rate of 10 ° C./min and then heated at 260 ° C. for 1 minute. The amount is preferably 500 ppm or less. The heating condition that is the premise of the gas amount assumes a solder reflow profile. When the gas amount is 500 ppm or less, the amount of gas (outgas) generated during solder reflow is reduced. Although a minimum is not specifically limited, It is 30 ppm or more.
Gas generated when the cured product obtained by curing the resin sheet 11 at 150 ° C. for 1 hour is heated from 40 ° C. to 260 ° C. at a heating rate of 10 ° C./min and then heated at 260 ° C. for 1 minute. The amount can be measured by the method described in the examples.

  Although the manufacturing method of the resin sheet 11 is not specifically limited, the method of preparing the kneaded material of each component mentioned later and plastic-working the obtained kneaded material in a sheet form is preferable. Thereby, since the resin sheet 11 can be produced without using a solvent, the amount of outgas can be reduced. Further, in order to produce a thick resin sheet 11 by solvent coating, it is necessary to laminate a plurality of solvent-coated resin sheets. According to this, the resin sheet 11 can be produced without lamination. (The resin sheet 11 can be produced at once). Therefore, there is no fear of delamination. The uniformity of the sheet thickness is also improved. Moreover, since the surface area is smaller than in the case of stacking, low moisture absorption can be achieved, and as a result, the outgas amount can be reduced.

  Specifically, each component described later (for example, epoxy resin, phenol resin, thermoplastic resin, inorganic filler, curing accelerator, etc.) is melt-kneaded in a known kneader such as a mixing roll, a pressure kneader, or an extruder. Thus, a kneaded material is prepared, and the obtained kneaded material is plastically processed into a sheet shape. As the kneading conditions, the temperature is preferably equal to or higher than the softening point of each component described above. For example, when considering the thermosetting property of 30 to 150 ° C. and epoxy resin, preferably 40 to 140 ° C., more preferably 60 to 120. ° C. The time is, for example, 1 to 30 minutes, preferably 5 to 15 minutes.

The kneading is preferably performed under reduced pressure conditions (under reduced pressure atmosphere). Thereby, while being able to deaerate, the penetration | invasion of the gas to a kneaded material can be prevented, As a result, the amount of outgases can be reduced. The pressure under reduced pressure is preferably 0.1 kg / cm ² or less, more preferably 0.05 kg / cm ² or less. When it is 0.1 kg / cm ² or less, the amount of outgas can be reduced satisfactorily. Although the minimum of the pressure under pressure reduction is not specifically limited, For example, it is 1 * 10 < ^-4 > kg / cm < ² > or more.

  The kneaded material after melt-kneading is preferably subjected to plastic working in a high temperature state without cooling. The plastic working method is not particularly limited, and examples thereof include a flat plate pressing method, a T die extrusion method, a screw die extrusion method, a roll rolling method, a roll kneading method, an inflation extrusion method, a coextrusion method, and a calendering method. The plastic processing temperature is preferably higher than the softening point of each component described above, and is 40 to 150 ° C., preferably 50 to 140 ° C., more preferably 70 to 120 ° C., considering the thermosetting property and moldability of the epoxy resin. is there.

  The resin sheet 11 may have a single layer structure or a multilayer structure in which two or more resin sheets are laminated, but there is no fear of delamination, the sheet thickness is highly uniform, and the moisture absorption is reduced. A single layer structure is preferred because it is easy.

  Next, the composition of the resin sheet 11 will be described.

  The resin sheet 11 preferably contains an epoxy resin and a phenol resin. Thereby, favorable thermosetting is obtained.

  The epoxy resin is not particularly limited. For example, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, modified bisphenol A type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol F type epoxy resin, dicyclopentadiene type Various epoxy resins such as an epoxy resin, a phenol novolac type epoxy resin, and a phenoxy resin can be used. These epoxy resins may be used alone or in combination of two or more.

  From the viewpoint of ensuring the toughness of the epoxy resin after curing and the reactivity of the epoxy resin, those having an epoxy equivalent of 150 to 250 and a softening point or melting point of 50 to 130 ° C. are preferably solid, and particularly reliable. From the viewpoint, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, and biphenyl type epoxy resin are more preferable.

  The phenol resin is not particularly limited as long as it causes a curing reaction with the epoxy resin. For example, a phenol novolac resin, a phenol aralkyl resin, a biphenyl aralkyl resin, a dicyclopentadiene type phenol resin, a cresol novolak resin, a resole resin, or the like is used. These phenolic resins may be used alone or in combination of two or more.

  From the viewpoint of reactivity with the epoxy resin, it is preferable to use a phenol resin having a hydroxyl group equivalent of 70 to 250 and a softening point of 50 to 110 ° C., and in particular, a phenol novolac from the viewpoint of high curing reactivity. Resin can be used suitably. From the viewpoint of reliability, low hygroscopic materials such as phenol aralkyl resins and biphenyl aralkyl resins can also be suitably used.

  From the viewpoint of curing reactivity, the blending ratio of the epoxy resin and the phenol resin is blended so that the total number of hydroxyl groups in the phenol resin is 0.7 to 1.5 equivalents with respect to 1 equivalent of the epoxy group in the epoxy resin. Preferably, it is 0.9 to 1.2 equivalents.

  The total content of the epoxy resin and the phenol resin in the resin sheet 11 is preferably 2.0% by weight or more, and more preferably 3.0% by weight or more. Adhesive force with respect to an electronic device, a board | substrate, etc. is acquired favorably as it is 2.0 weight% or more. The total content of the epoxy resin and the phenol resin in the resin sheet 11 is preferably 20% by weight or less, and more preferably 10% by weight or less. If it is 20% by weight or less, the hygroscopicity can be kept low.

  The resin sheet 11 preferably contains a thermoplastic resin. Thereby, the handling property in a non-hardened state and the low stress property of hardened | cured material can be obtained.

  As thermoplastic resins, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplasticity Polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET and PBT, polyamideimide resin, fluorine resin, styrene-isobutylene-styrene block copolymer, etc. Can be mentioned. These thermoplastic resins can be used alone or in combination of two or more. Of these, a styrene-isobutylene-styrene block copolymer is preferred from the viewpoint of low stress and low water absorption.

  1.0 weight% or more is preferable and, as for content of the thermoplastic resin in the resin sheet 11, 1.5 weight% or more is more preferable. A softness | flexibility and flexibility are acquired as it is 1.0 weight% or more. The content of the thermoplastic resin in the resin sheet 11 is preferably 3.5% by weight or less, and more preferably 3% by weight or less. Adhesiveness with an electronic device or a board | substrate can be improved as it is 3.5 weight% or less.

  It is preferable that the resin sheet 11 contains an inorganic filler.

  The inorganic filler is not particularly limited, and various conventionally known fillers can be used. For example, quartz glass, talc, silica (such as fused silica and crystalline silica), alumina, aluminum nitride, silicon nitride And boron nitride powder. These may be used alone or in combination of two or more. Among these, silica and alumina are preferable, and silica is more preferable because the linear expansion coefficient can be satisfactorily reduced.

As silica, silica powder is preferable, and fused silica powder is more preferable. Examples of the fused silica powder include spherical fused silica powder and crushed fused silica powder. From the viewpoint of fluidity, spherical fused silica powder is preferable. Especially, the thing of the range whose average particle diameter is 10-30 micrometers is preferable, and the thing of the range which is 15-25 micrometers is more preferable.
The average particle diameter can be derived, for example, by using a sample arbitrarily extracted from the population and measuring it using a laser diffraction / scattering particle size distribution measuring apparatus.

  Content of the inorganic filler in the resin sheet 11 becomes like this. Preferably it is 70 volume% or more, More preferably, it is 74 volume% or more. A linear expansion coefficient can be designed low as it is 70 volume% or more. On the other hand, the content of the inorganic filler is preferably 90% by volume or less, and more preferably 85% by volume or less. A softness | flexibility, fluidity | liquidity, and adhesiveness are favorably obtained as it is 90 volume% or less.

The content of the inorganic filler can be explained by using “wt%” as a unit. Typically, the content of silica will be described in units of “% by weight”.
Since silica usually has a specific gravity of 2.2 g / cm ³ , the preferred range of the silica content (% by weight) is, for example, as follows.
That is, the content of silica in the resin sheet 11 is preferably 81% by weight or more, and more preferably 84% by weight or more. 94 weight% or less is preferable and, as for content of the silica in the resin sheet 11, 91 weight% or less is more preferable.

Since alumina usually has a specific gravity of 3.9 g / cm ³ , the preferred range of the alumina content (% by weight) is, for example, as follows.
That is, the content of alumina in the resin sheet 11 is preferably 88% by weight or more, and more preferably 90% by weight or more. 97 weight% or less is preferable and, as for content of the alumina in the resin sheet 11, 95 weight% or less is more preferable.

  It is preferable that the resin sheet 11 contains a hardening accelerator.

  The curing accelerator is not particularly limited as long as it cures the epoxy resin and the phenol resin, and examples thereof include organic phosphorus compounds such as triphenylphosphine and tetraphenylphosphonium tetraphenylborate; 2-phenyl-4, And imidazole compounds such as 5-dihydroxymethylimidazole and 2-phenyl-4-methyl-5-hydroxymethylimidazole. Among these, 2-phenyl-4,5-dihydroxymethylimidazole is preferable because the curing reaction does not proceed rapidly even when the temperature rises during kneading and the resin sheet 11 can be satisfactorily produced.

  As for content of a hardening accelerator, 0.1-5 weight part is preferable with respect to a total of 100 weight part of an epoxy resin and a phenol resin.

  It is preferable that the resin sheet 11 contains a flame retardant component. This can reduce the expansion of combustion when ignition occurs due to component short-circuiting or heat generation. As the flame retardant composition, for example, various metal hydroxides such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, complex metal hydroxides; phosphazene flame retardants, etc. should be used. Can do. Of these, phosphazene-based flame retardants are preferred, and compounds represented by formula (1) or formula (2) are preferred because they are excellent in flame retardancy and strength after curing.

（式中、Ｒ^１及びＲ^２は、同一若しくは異なって、アルコキシ基、フェノキシ基、アミノ基、水酸基、アリル基又はこれらの基からなる群より選択される少なくとも１種の基を有する１価の有機基を表す。ｘは３〜２５の整数を表す。）

(Wherein R ¹ and R ² are the same or different and are monovalent having at least one group selected from the group consisting of an alkoxy group, a phenoxy group, an amino group, a hydroxyl group, an allyl group, or these groups) Represents an organic group, x represents an integer of 3 to 25)

（式中、Ｒ^３及びＲ^５は、同一若しくは異なって、アルコキシ基、フェノキシ基、アミノ基、水酸基、アリル基又はこれらの基からなる群より選択される少なくとも１種の基を有する１価の有機基を表す。Ｒ^４は、アルコキシ基、フェノキシ基、アミノ基、水酸基及びアリル基からなる群より選択される少なくとも１種の基を有する２価の有機基を表す。ｙは３〜２５の整数を表す。ｚは３〜２５の整数を表す。）

(Wherein R ³ and R ⁵ are the same or different and are monovalent having at least one group selected from the group consisting of an alkoxy group, a phenoxy group, an amino group, a hydroxyl group, an allyl group, or these groups) R ⁴ represents an organic group, R ⁴ represents a divalent organic group having at least one group selected from the group consisting of an alkoxy group, a phenoxy group, an amino group, a hydroxyl group and an allyl group, and y is 3 to 25. Represents an integer, and z represents an integer of 3 to 25.)

Examples of the alkoxy group for R ¹ and R ² include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, and a t-butoxy group. Especially, a C4-C10 alkoxy group is preferable.

（式中、Ｒ^１１は、水素、水酸基、アルキル基、アルコキシ基、グリシジル基又はこれらの基からなる群より選択される少なくとも１種の基を有する１価の有機基を表す。） Examples of the phenoxy group for R ¹ and R ² include a group represented by the formula (3).

(In the formula, R ¹¹ represents hydrogen, a hydroxyl group, an alkyl group, an alkoxy group, a glycidyl group, or a monovalent organic group having at least one group selected from the group consisting of these groups.)

Examples of the alkyl group for R ¹¹ include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, iso-butyl group, sec-butyl group, tert-butyl group, pentyl group, and hexyl group. , Heptyl group, 2-ethylhexyl group, octyl group, nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, pentadecyl group, octadecyl group and the like. Examples of the alkoxy group for R ¹¹ include the same groups as the alkoxy groups for R ¹ and R ² .

As R ¹ and R ² , a phenoxy group is preferable and a group represented by the formula (3) is more preferable because flame retardancy and strength after curing can be favorably obtained.

  x represents an integer of 3 to 25, but 3 to 10 is preferable and 3 to 4 is more preferable because the flame retardancy and the strength after curing can be obtained satisfactorily.

In the formula (2), examples of the alkoxy group of R ³ and R ⁵ include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, and a t-butoxy group. Especially, a C4-C10 alkoxy group is preferable.

Examples of the phenoxy group for R ³ and R ⁵ include a group represented by the formula (3).

The monovalent organic group having at least one group selected from the group consisting of an alkoxy group, a phenoxy group, an amino group, a hydroxyl group and an allyl group in R ³ and R ⁵ is not particularly limited.

As R ³ and R ⁵ , a phenoxy group is preferable and a group represented by the formula (3) is more preferable because flame retardancy and strength after curing can be favorably obtained.

Examples of the alkoxy group contained in the divalent organic group represented by R ⁴ include a methoxy group, an ethoxy group, an n-propoxy group, an isopropoxy group, an n-butoxy group, and a t-butoxy group. Especially, a C4-C10 alkoxy group is preferable.

Examples of the phenoxy group contained in the divalent organic group represented by R ⁴ include a group represented by the formula (3).

  Although y represents the integer of 3-25, 3-10 are preferable from the reason that flame retardance and the intensity | strength after hardening are acquired favorably.

  Although z represents the integer of 3-25, 3-10 are preferable from the reason that flame retardance and the intensity | strength after hardening are acquired favorably.

  From the viewpoint of exhibiting a flame retardant effect even in a small amount, the phosphorus element content contained in the phosphazene flame retardant is preferably 12% by weight or more.

  The content of the flame retardant component is preferably 10% by weight or more, more preferably 15% by weight or more, in 100% by weight of the organic component (all components excluding the inorganic filler). A flame retardance is favorably acquired as it is 10 weight% or more. The content of the flame retardant component is preferably 30% by weight or less, and more preferably 25% by weight or less. When the content is 30% by weight or less, there is a tendency that there is little decrease in physical properties of the cured product (specifically, physical properties such as glass transition temperature and high-temperature resin strength).

  The resin sheet 11 preferably contains a silane coupling agent. It does not specifically limit as a silane coupling agent, 3-Glycidoxypropyl trimethoxysilane etc. are mentioned.

  The content of the silane coupling agent in the resin sheet 11 is preferably 0.1 to 3% by weight. When it is 0.1% by weight or more, sufficient strength of the cured product can be obtained and the water absorption rate can be reduced. If it is 3% by weight or less, the outgas amount can be kept low.

  The resin sheet 11 preferably contains a pigment. The pigment is not particularly limited, and examples thereof include carbon black.

  The content of the pigment in the resin sheet 11 is preferably 0.1 to 2% by weight. When the content is 0.1% by weight or more, good marking properties can be obtained. When the content is 2% by weight or less, a cured product strength is sufficiently obtained.

  In addition to the above components, other additives can be appropriately blended in the resin composition as necessary.

  The resin sheet 11 includes a SAW (Surface Acoustic Wave) filter; a MEMS (Micro Electro Mechanical Systems) such as a pressure sensor and a vibration sensor; an IC (integrated circuit) such as an LSI; a semiconductor such as a transistor; a capacitor; and an electronic device such as a resistor. Used for sealing. Especially, it can use suitably for the sealing of the electronic device (specifically SAW filter, MEMS) which needs hollow sealing, and can use it especially suitably for sealing of a SAW filter.

  The sealing method is not particularly limited, and examples thereof include a method in which an uncured resin sheet 11 is laminated on a substrate so as to cover an electronic device on the substrate, and then the resin sheet 11 is cured and sealed. . It does not specifically limit as a board | substrate, For example, a printed wiring board, a ceramic substrate, a silicon substrate, a metal substrate etc. are mentioned.

[Method of manufacturing electronic device package]
2A to 2C are views schematically showing one step of the method for manufacturing the electronic device package according to the embodiment of the present invention. In the present embodiment, the SAW filter 13 mounted on the printed wiring board 12 is hollow-sealed with the resin sheet 11 to produce an electronic device package.

(SAW filter mounting substrate preparation process)
In the SAW filter mounting board preparing step, a printed wiring board 12 on which a plurality of SAW filters 13 are mounted is prepared (see FIG. 2A). The SAW filter 13 can be formed by dicing a piezoelectric crystal on which predetermined comb-shaped electrodes are formed by a known method. For mounting the SAW filter 13 on the printed wiring board 12, a known device such as a flip chip bonder or a die bonder can be used. The SAW filter 13 and the printed wiring board 12 are electrically connected via protruding electrodes 13a such as bumps. Further, a hollow portion 14 is maintained between the SAW filter 13 and the printed wiring board 12 so as not to inhibit the propagation of surface acoustic waves on the surface of the SAW filter. The distance between the SAW filter 13 and the printed wiring board 12 can be set as appropriate, and is generally about 15 to 50 μm.

(Sealing process)
In the sealing step, the resin sheet 11 is laminated on the printed wiring board 12 so as to cover the SAW filter 13, and the SAW filter 13 is resin-sealed with the resin sheet 11 (see FIG. 2B). The resin sheet 11 functions as a sealing resin for protecting the SAW filter 13 and its accompanying elements from the external environment.

  The method of laminating the resin sheet 11 on the printed wiring board 12 is not particularly limited, and can be performed by a known method such as hot pressing or laminator. As hot press conditions, the temperature is, for example, 40 to 100 ° C., preferably 50 to 90 ° C., the pressure is, for example, 0.1 to 10 MPa, preferably 0.5 to 8 MPa, and the time is, for example, 0.3 to 10 minutes, preferably 0.5 to 5 minutes. Moreover, when the adhesiveness to the SAW filter 13 and the printed wiring board 12 of the resin sheet 11 and improvement in followability are taken into consideration, it is preferable to press under reduced pressure conditions (for example, 0.1 to 5 kPa).

(Sealing body forming process)
In the sealing body forming step, the resin sheet 11 is thermally cured to form the sealing body 15 (see FIG. 2B).

  As the conditions for the thermosetting treatment, the heating temperature is preferably 100 ° C. or higher, more preferably 120 ° C. or higher. On the other hand, the upper limit of the heating temperature is preferably 200 ° C. or lower, more preferably 180 ° C. or lower. The heating time is preferably 10 minutes or more, more preferably 30 minutes or more. On the other hand, the upper limit of the heating time is preferably 180 minutes or less, more preferably 120 minutes or less. Moreover, you may pressurize as needed, Preferably it is 0.1 Mpa or more, More preferably, it is 0.5 Mpa or more. On the other hand, the upper limit is preferably 10 MPa or less, more preferably 5 MPa or less.

(Dicing process)
Subsequently, dicing of the sealing body 15 may be performed (see FIG. 2C). Thereby, the electronic device package 18 in the SAW filter 13 unit can be obtained.

(Board mounting process)
If necessary, a substrate mounting step can be performed in which rewiring and bumps are formed on the electronic device package 18 and mounted on a separate substrate (not shown). For mounting the electronic device package 18 on the substrate, a known apparatus such as a flip chip bonder or a die bonder can be used.

  Hereinafter, preferred embodiments of the present invention will be described in detail by way of example. However, the materials, blending amounts, and the like described in the examples are not intended to limit the scope of the present invention only to those unless otherwise specified.

（式中、ｍは３〜４の整数を表す。）
硬化促進剤１：四国化成工業社製の２ＰＨＺ−ＰＷ（２−フェニル−４，５−ジヒドロキシメチルイミダゾール）
硬化促進剤２：北興化学工業社製のＴＰＰ−ＭＫ（テトラフェニルホスホニウムテトラ−ｐ−トリルボレート） The components used in the examples will be described.
Epoxy resin 1: YSLV-80XY manufactured by Nippon Steel Chemical Co., Ltd. (bisphenol F type epoxy resin, epkin equivalent 200 g / eq. Softening point 80 ° C.)
Epoxy resin 2: EPPN-501HY (triphenylmethane type epoxy resin) manufactured by Nippon Kayaku Co., Ltd.
Epoxy resin 3: YL980 (bisphenol A type epoxy resin) manufactured by Mitsubishi Chemical Corporation
Phenol resin 1: MEH-7851-SS manufactured by Meiwa Kasei Co., Ltd. (phenol resin having a biphenylaralkyl skeleton, hydroxyl group equivalent 203 g / eq., Softening point 67 ° C.)
Phenol resin 2: ND564 manufactured by Showa Polymer Co., Ltd.
Thermoplastic resin 1: SIBSTER 072T (styrene-isobutylene-styrene block copolymer) manufactured by Kaneka Corporation
Thermoplastic resin 2: SG-P3 manufactured by Nagase ChemteX Corporation
Inorganic filler: FB-9454FC manufactured by Denki Kagaku Kogyo Co., Ltd. (fused spherical silica, average particle size 20 μm)
Silane coupling agent: KBM-403 (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.
Carbon black: # 20 manufactured by Mitsubishi Chemical
Flame retardant: FP-100 manufactured by Fushimi Pharmaceutical (phosphazene flame retardant: compound represented by formula (4))

(In the formula, m represents an integer of 3 to 4.)
Curing accelerator 1: 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazole) manufactured by Shikoku Kasei Kogyo Co., Ltd.
Curing accelerator 2: TPP-MK (tetraphenylphosphonium tetra-p-tolylborate) manufactured by Hokuko Chemical Co., Ltd.

Examples 1-3
Each component was blended according to the blending ratio shown in Table 1, and melt-kneaded under a reduced pressure condition (0.01 kg / cm ² ) at 60 to 120 ° C. for 10 minutes using a biaxial kneader to prepare a kneaded product. Next, the obtained kneaded material was formed into a sheet shape by a flat plate pressing method, and a resin sheet having a thickness shown in Table 1 was produced. A separator was attached to the obtained resin sheet.

  The following evaluation was performed using the obtained resin sheet. The results are shown in Table 1.

[Outgas amount]
A sample of 1 cm × 1 cm × 200 μm thickness was cut out from the uncured resin sheet, and the separator attached to the sample was peeled off. Samples were placed in vials and weighed. Thereafter, the sample was heated with a headspace sampler (HSS) at 150 ° C. for 1 hour. 1 ml of heated gas was injected into 6890GC-MS manufactured by Agilent Technologies, and the amount of outgas was measured.

[1% weight loss temperature of cured product]
After removing the separator from the uncured resin sheet, the resin sheet was cured by heating at 150 ° C. for 1 hour. About 8 mg of sample was cut from the cured product. The sample was heated at 10 ° C./min from room temperature to 500 ° C. with a TG / DTA220 manufactured by SII Nano Technology, Inc. at a gas flow rate of 200 mg / min in Air, and subjected to gravimetric analysis.

[Outgas amount of cured product]
A sample of 1 cm × 1 cm × 200 μm thickness was cut out from the uncured resin sheet, and the separator attached to the sample was peeled off. The sample was cured by heating at 150 ° C. for 1 hour. The cured product was placed in a vial and weighed. Thereafter, the cured product was heated with a headspace sampler (HSS) (heating condition: heated from 40 ° C. to 260 ° C. at a heating rate of 10 ° C./min and then held at 260 ° C. for 1 minute). 1 ml of heated gas was injected into 6890GC-MS manufactured by Agilent Technologies, and the amount of outgas was measured.

Comparative Examples 1-2
Each component was blended according to the blending ratio shown in Table 1, and the same amount of methyl ethyl ketone as the total amount of each component was added thereto to prepare a varnish. The obtained varnish was coated on a release-treated surface of a 50 μm thick polyester film A (MRF-50, manufactured by Mitsubishi Chemical Polyester Co., Ltd.) with a comma coater so that the thickness after drying was 50 μm. Dried. Next, a 38 μm thick polyester film B (MRF-38, manufactured by Mitsubishi Chemical Polyester Co., Ltd.) was bonded to the dried varnish to prepare a thin film resin sheet.
Thereafter, while peeling the polyester film A and the polyester film B as appropriate, four thin film resin sheets were laminated by a roll laminator to prepare a resin sheet having a thickness of 200 μm.

  Said evaluation was performed using the obtained resin sheet. The results are shown in Table 1.

DESCRIPTION OF SYMBOLS 11 Resin sheet 11a Support body 13 SAW filter 15 Sealing body 18 Electronic device package

Claims (5)

The thickness is 100 to 2000 μm,
Amount of gas generated when cured for 1 hour at 0.99 ° C. is Ri der less 500 ppm,
The resin sheet for electronic device sealing whose 1% weight reduction | decrease temperature of the hardened | cured material obtained by hardening | curing at 150 degreeC for 1 hour is 260 degreeC or more . A cured product obtained by curing at 150 ° C. for 1 hour,
2. The resin sheet for encapsulating an electronic device according to claim 1, wherein the amount of gas generated when heated from 40 ° C. to 260 ° C. at a heating rate of 10 ° C./min and then heated at 260 ° C. for 1 minute is 500 ppm or less. . A lamination step of laminating the electronic device sealing resin sheet according to claim 1 or 2 on the electronic device so as to cover one or more electronic devices, and the electronic device sealing resin sheet is cured and sealed. The manufacturing method of the electronic device package including the sealing body formation process which forms a stop. The thickness is 100 to 2000 μm,
Amount of gas generated when cured for 1 hour at 0.99 ° C. is Ri der less 500 ppm,
A cured product obtained by curing at 150 ° C. for 1 hour,
A resin sheet for encapsulating electronic devices , wherein the amount of gas generated when heated from 40 ° C. to 260 ° C. at a heating rate of 10 ° C./min and then heated at 260 ° C. for 1 minute is 500 ppm or less . A laminating step of laminating the electronic device sealing resin sheet according to claim 4 on the electronic device so as to cover one or more electronic devices; and
The manufacturing method of the electronic device package including the sealing body formation process which hardens the said resin sheet for electronic device sealing, and forms a sealing body.

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