JP2016028476A - Resin sheet for sealing electronic device, and method for manufacturing electronic device package - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide: a resin sheet for sealing an electronic device, which is hard to displace; and a method for manufacturing an electronic device package.SOLUTION: A resin sheet 11 for sealing an electronic device has a 25°C-probe tack of 5-500 g, which was measured by a probe of a diameter of 25 mm.EFFECT: The resin sheet 11 is placed in close contact with an electronic device when being put in a sealing position because of the 25°C-probe tack of 5 g or larger. Therefore, its displacement is not caused in handling after that, and it can be molded with a smaller rejection rate. Further, the resin sheet 11 can be peeled off for re-positioning and again set in position in the event of displacement when putting the resin sheet 11 because of the 25°C-probe tack of no larger than 500 g.SELECTED DRAWING: Figure 1

Description

  The present invention relates to an electronic device sealing resin sheet and an electronic device package manufacturing method.

  As a method for sealing an electronic device, a method for sealing the electronic device with a resin sheet is known.

  For example, in Patent Document 1 and Patent Document 2, a resin sheet is disposed on an electronic functional element (such as a SAW filter) mounted on a substrate, and then the electronic functional element mounted on the substrate and the resin sheet are gas-barrier. The method is disclosed in which the inside of the bag is depressurized and the electronic functional element in the bag is then sealed with a resin sheet. This method has the merit that the SAW filter can be sealed under reduced pressure, so that generation of voids can be reduced, and the method can be implemented with a simple pressure reducing device.

International Publication WO2005 / 071731 (International Publication No. 05/071731 Pamphlet) Japanese Patent No. 5223657

  However, in the methods described in Patent Document 1 and Patent Document 2, the resin sheet and the inner surface of the bag are easily in contact with each other, and the resin sheet is easily displaced. A resin sheet highly filled with an inorganic filler is particularly easily displaced.

  This invention solves the said subject and aims at providing the manufacturing method of the resin sheet for electronic device sealing which is hard to slip | deviate, and an electronic device package.

  The present invention relates to a resin sheet for encapsulating electronic devices in which a probe tack at 25 ° C. measured using a probe having a diameter of 25 mm is 5 g to 500 g. Since the resin sheet satisfies the above-described tackiness, it is difficult to slip.

  The surface roughness (Ra) of the resin sheet is preferably 400 nm or less. Thereby, said tack property can be achieved easily.

  It is preferable that the said resin sheet contains an inorganic filler and content of the said inorganic filler in the said resin sheet is 60-90 volume%. Thereby, a thermal expansion coefficient and a water absorption rate can be made small. In addition, deformation of the resin sheet due to contact between the resin sheet and the inner surface of the vacuum packaging container can be prevented or reduced.

  It is preferable that the resin sheet contains an epoxy resin, and the softening point of the epoxy resin is 100 ° C. or less. Thereby, said tack property can be achieved easily, without reducing an inorganic filler. That is, the difficulty of shifting can be increased without reducing the thermal expansion coefficient and the water absorption rate.

  In addition, it is preferable that the said resin sheet contains a phenol resin and the softening point of the said phenol resin is 100 degrees C or less. Thereby, said tack property can be achieved easily, without reducing an inorganic filler. That is, the difficulty of shifting can be increased without reducing the thermal expansion coefficient and the water absorption rate.

It is preferable that the tensile storage elastic modulus in 25 degreeC of the said resin sheet is 10 ^<-2 > MPa-10 ^{< 3} > MPa.

  The resin sheet is preferably used for sealing an electronic device arranged in a vacuum packaging container. The resin sheet is suitable for this method because it is not easily displaced even when it comes into contact with the inner surface of the vacuum packaging container.

  The resin sheet includes a step of disposing a resin sheet on an electronic device mounted on a substrate, the electronic device mounted on the substrate, and the resin sheet disposed on the electronic device in a vacuum packaging container. It is preferable to be used for the manufacturing method of an electronic device package including the process of putting in and the process of sealing the said electronic device in the said vacuum packaging container with the said resin sheet. The resin sheet is suitable for this method because it is not easily displaced even when it comes into contact with the inner surface of the vacuum packaging container. This method is described in International Publication WO2005 / 071731 and Japanese Patent No. 5223657.

  It is preferable that the electronic device is a SAW filter.

  The present invention also relates to a method for manufacturing an electronic device package including a step of sealing an electronic device with a resin sheet having a probe tack of 25 ° C. measured using a probe having a diameter of 25 mm and having a probe tack of 5 g to 500 g.

  The manufacturing method of the electronic device package includes a step of disposing the resin sheet on the electronic device mounted on a substrate, the electronic device mounted on the substrate, and the resin disposed on the electronic device. A step of placing the sheet in a vacuum packaging container, and in the step of sealing the electronic device, the electronic device in the vacuum packaging container is preferably sealed with the resin sheet.

3 is a schematic cross-sectional view of a resin sheet according to Embodiment 1. FIG. It is a cross-sectional schematic diagram of the printed wiring board which mounts a SAW filter. It is a figure which shows typically a mode that the resin sheet was laminated | stacked on the SAW filter mounted in the printed wiring board. It is a figure which shows typically a mode that the resin sheet on the SAW filter mounted on the printed wiring board and the SAW filter was put in the vacuum packaging container. It is a figure which shows typically a mode that the vacuum packaging container was sealed. It is a figure which shows typically a mode that the SAW filter embedded in the resin sheet was taken out from the vacuum packaging container. It is a cross-sectional schematic diagram of the SAW filter package after division.

  The present invention will be described in detail below with reference to embodiments, but the present invention is not limited only to these embodiments.

[Embodiment 1]
FIG. 1 is a schematic cross-sectional view of a resin sheet 11 according to the first embodiment. Note that supports such as a polyethylene terephthalate (PET) film may be provided on both surfaces of the resin sheet 11. In order to perform peeling from the resin sheet 11 easily, a release treatment may be applied to the support.

  The resin sheet 11 is preferably thermosetting.

About the resin sheet 11, the 25 degreeC probe tack measured using the probe of diameter 25mm is 5 g or more, and 20 g or more is preferable. Since it is 5 g or more, when the resin sheet 11 is mounted on the sealing portion, the resin sheet 11 is brought into close contact with the electronic device, and no misalignment occurs during subsequent handling, and molding with a low defect rate is possible. The probe tack at 25 ° C. is 500 g or less. Since it is 500 g or less, when the resin sheet 11 is displaced at the time of mounting, it can be peeled off and mounted again for alignment.
In addition, the probe tack of 25 degreeC measured using the probe of diameter 25mm can be measured by the method as described in an Example.

The surface roughness (Ra) of the resin sheet 11 is preferably 400 nm or less, and more preferably 200 nm or less. When the thickness is 400 nm or less, the above-described tackiness can be easily achieved. Although the minimum of surface roughness (Ra) is not specifically limited, For example, it is 20 nm or more.
The surface roughness can be measured by the method described in the examples.

The tensile storage elastic modulus at 25 ° C. of the resin sheet 11 is preferably 10 ³ MPa or less. Good tackiness is obtained when it is 10 ³ MPa or less. The tensile storage modulus at 25 ° C. is preferably 10 ⁻² MPa or more. When it is 10 ⁻² MPa or more, deformation of the resin sheet 11 due to contact between the resin sheet 11 and the inner surface of the vacuum packaging container can be prevented or reduced.
In addition, the 25 degreeC tensile storage elastic modulus can be measured by the method as described in an Example.

  It is preferable that the resin sheet 11 contains an epoxy resin.

  The epoxy resin is not particularly limited. For example, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, modified bisphenol A type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol F type epoxy resin, dicyclopentadiene type Various epoxy resins such as an epoxy resin, a phenol novolac type epoxy resin, and a phenoxy resin can be used. These epoxy resins may be used alone or in combination of two or more.

As a softening point of an epoxy resin, 100 degrees C or less is preferable. A tackiness can be improved as it is 100 degrees C or less. As a softening point of an epoxy resin, 80 degrees C or less is more preferable. On the other hand, the softening point of the epoxy resin is preferably 30 ° C. or higher. When it is 30 ° C. or higher, handling is good when raw materials are mixed.
The softening point can be measured by DSC (differential scanning calorimetry). Specifically, using a differential scanning calorimeter (Q2000 manufactured by TA Instruments), the softening point from a DSC curve obtained under the conditions of a measurement temperature of −10 ° C. to 300 ° C. and a heating rate of 5 ° C./min. Can be requested.

  From the viewpoint of ensuring the reactivity of the epoxy resin, the epoxy equivalent of the epoxy resin is preferably 150 to 250.

  It is preferable that the resin sheet 11 contains a phenol resin.

  The phenol resin is not particularly limited as long as it causes a curing reaction with the epoxy resin. For example, a phenol novolac resin, a phenol aralkyl resin, a biphenyl aralkyl resin, a dicyclopentadiene type phenol resin, a cresol novolak resin, a resole resin, or the like is used. These phenolic resins may be used alone or in combination of two or more.

  From the viewpoint of reactivity with the epoxy resin, it is preferable to use a phenolic resin having a hydroxyl equivalent weight of 70 to 250 and a softening point of 30 to 110 ° C. Among them, a phenol novolac from the viewpoint of high curing reactivity. Resin can be used suitably. From the viewpoint of reliability, low hygroscopic materials such as phenol aralkyl resins and biphenyl aralkyl resins can also be suitably used.

  As a softening point of a phenol resin, 100 degrees C or less is preferable. A tackiness can be improved as it is 100 degrees C or less. As a softening point of a phenol resin, 80 degrees C or less is more preferable. On the other hand, the softening point of the phenol resin is preferably 30 ° C. or higher. When it is 30 ° C. or higher, handling is good when raw materials are mixed.

  The total content of the epoxy resin and the phenol resin in the resin sheet 11 is preferably 5% by weight or more. Adhesive strength with respect to an electronic device, a board | substrate, etc. is acquired favorably as it is 5 weight% or more. The total content of the epoxy resin and the phenol resin in the resin sheet 11 is preferably 20% by weight or less. If it is 20% by weight or less, the hygroscopicity can be kept low.

  From the viewpoint of curing reactivity, the blending ratio of the epoxy resin and the phenol resin is blended so that the total number of hydroxyl groups in the phenol resin is 0.7 to 1.5 equivalents with respect to 1 equivalent of the epoxy group in the epoxy resin. Preferably, it is 0.9 to 1.2 equivalents.

  It is preferable that the resin sheet 11 contains a hardening accelerator.

  The curing accelerator is not particularly limited as long as it cures the epoxy resin and the phenol resin. For example, 2-methylimidazole (trade name; 2MZ), 2-undecylimidazole (trade name; C11-Z). ), 2-heptadecylimidazole (trade name; C17Z), 1,2-dimethylimidazole (trade name; 1.2DMZ), 2-ethyl-4-methylimidazole (trade name; 2E4MZ), 2-phenylimidazole (product) Name; 2PZ), 2-phenyl-4-methylimidazole (trade name; 2P4MZ), 1-benzyl-2-methylimidazole (trade name; 1B2MZ), 1-benzyl-2-phenylimidazole (trade name; 1B2PZ), 1-cyanoethyl-2-methylimidazole (trade name; 2MZ-CN), 1-cyanoethyl- -Undecylimidazole (trade name; C11Z-CN), 1-cyanoethyl-2-phenylimidazolium trimellitate (trade name; 2PZCNS-PW), 2,4-diamino-6- [2'-methylimidazolyl- ( 1 ′)]-ethyl-s-triazine (trade name; 2MZ-A), 2,4-diamino-6- [2′-undecylimidazolyl- (1 ′)]-ethyl-s-triazine (trade name; C11Z-A), 2,4-diamino-6- [2′-ethyl-4′-methylimidazolyl- (1 ′)]-ethyl-s-triazine (trade name; 2E4MZ-A), 2,4-diamino -6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine isocyanuric acid adduct (trade name; 2MA-OK), 2-phenyl-4,5-dihydroxymethylimid Examples include imidazole-based curing accelerators such as Zole (trade name; 2PHZ-PW) and 2-phenyl-4-methyl-5-hydroxymethylimidazole (trade name; 2P4MHZ-PW) (both are Shikoku Chemicals Co., Ltd.) Made).

  Among these, an imidazole-based curing accelerator is preferable because the curing reaction at the kneading temperature can be suppressed, and 2-phenyl-4,5-dihydroxymethylimidazole is more preferable.

  As for content of a hardening accelerator, 0.1-5 weight part is preferable with respect to a total of 100 weight part of an epoxy resin and a phenol resin.

  It is preferable that the resin sheet 11 contains a thermoplastic resin (elastomer).

  As thermoplastic resins, natural rubber, butyl rubber, isoprene rubber, chloroprene rubber, ethylene-vinyl acetate copolymer, ethylene-acrylic acid copolymer, ethylene-acrylic acid ester copolymer, polybutadiene resin, polycarbonate resin, thermoplasticity Polyimide resin, polyamide resin such as 6-nylon and 6,6-nylon, phenoxy resin, acrylic resin, saturated polyester resin such as PET and PBT, polyamideimide resin, fluororesin, styrene-isobutylene-styrene triblock copolymer, And methyl methacrylate-butadiene-styrene copolymer (MBS resin). These thermoplastic resins can be used alone or in combination of two or more.

  The content of the thermoplastic resin in the resin sheet 11 is preferably 1% by weight or more. A softness | flexibility and flexibility can be provided as it is 1 weight% or more. The content of the thermoplastic resin in the resin sheet 11 is preferably 30% by weight or less, more preferably 15% by weight or less, and still more preferably 10% by weight or less. When it is 30% by weight or less, good adhesive force can be obtained for electronic devices and the like.

  It is preferable that the resin sheet 11 contains an inorganic filler. By blending the inorganic filler, the thermal expansion coefficient can be reduced.

  Examples of the inorganic filler include quartz glass, talc, silica (such as fused silica and crystalline silica), alumina, aluminum nitride, silicon nitride, and boron nitride. Among these, silica and alumina are preferable and silica is more preferable because the thermal expansion coefficient can be satisfactorily reduced. Silica is preferably fused silica and more preferably spherical fused silica because it is excellent in fluidity.

The average particle diameter of the inorganic filler is preferably 5 μm or more. When the thickness is 5 μm or more, it is easy to obtain flexibility and flexibility of the resin sheet 11. The average particle diameter of the inorganic filler is preferably 50 μm or less, more preferably 30 μm or less. When it is 50 μm or less, it is easy to increase the filling rate of the inorganic filler.
The average particle size can be derived by, for example, using a sample arbitrarily extracted from the population and measuring it using a laser diffraction / scattering particle size distribution measuring apparatus.

  The inorganic filler is preferably treated with a silane coupling agent (pretreatment). Thereby, the wettability with resin can be improved and the dispersibility of an inorganic filler can be improved.

  A silane coupling agent is a compound having a hydrolyzable group and an organic functional group in the molecule.

  As a hydrolysable group, C1-C6 alkoxy groups, such as a methoxy group and an ethoxy group, an acetoxy group, 2-methoxyethoxy group etc. are mentioned, for example. Among these, a methoxy group is preferable because it easily removes volatile components such as alcohol generated by hydrolysis.

  Examples of the organic functional group include a vinyl group, an epoxy group, a styryl group, a methacryl group, an acrylic group, an amino group, a ureido group, a mercapto group, a sulfide group, and an isocyanate group. Among these, an epoxy group is preferable because it easily reacts with an epoxy resin or a phenol resin.

  Examples of the silane coupling agent include vinyl group-containing silane coupling agents such as vinyltrimethoxysilane and vinyltriethoxysilane; 2- (3,4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropylmethyl Epoxy group-containing silane coupling agents such as dimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, 3-glycidoxypropyltriethoxysilane; p-styryltrimethoxysilane, etc. A styryl group-containing silane coupling agent; 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldiethoxysilane, 3-methacryloxypropyltrie Methacrylic group-containing silane coupling agents such as xyloxysilane; Acrylic group-containing silane coupling agents such as 3-acryloxypropyltrimethoxysilane; N-2- (aminoethyl) -3-aminopropylmethyldimethoxysilane, N-2- (Aminoethyl) -3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, N -Amino group-containing silane coupling agents such as phenyl-3-aminopropyltrimethoxysilane and N- (vinylbenzyl) -2-aminoethyl-3-aminopropyltrimethoxysilane; Ureides such as 3-ureidopropyltriethoxysilane Group-containing silane coupling A mercapto group-containing silane coupling agent such as 3-mercaptopropylmethyldimethoxysilane and 3-mercaptopropyltrimethoxysilane; a sulfide group-containing silane coupling agent such as bis (triethoxysilylpropyl) tetrasulfide; 3-isocyanate Examples include isocyanate group-containing silane coupling agents such as propyltriethoxysilane.

  The method for treating the inorganic filler with the silane coupling agent is not particularly limited, and is a wet method in which the inorganic filler and the silane coupling agent are mixed in a solvent, and the inorganic filler and the silane coupling agent are treated in a gas phase. And dry method.

  Although the processing amount of a silane coupling agent is not specifically limited, It is preferable to process 0.1-1 weight part of silane coupling agents with respect to 100 weight part of untreated inorganic fillers.

  Content of the inorganic filler in the resin sheet 11 becomes like this. Preferably it is 60 volume% or more, More preferably, it is 74 volume% or more. When it is 60% by volume or more, the thermal expansion coefficient can be reduced, and the hygroscopicity can be reduced. On the other hand, the content of the inorganic filler is preferably 90% by volume or less, and more preferably 85% by volume or less. When it is 90% by volume or less, good tackiness, flexibility, fluidity, and adhesiveness can be obtained.

The content of the inorganic filler can be explained by using “wt%” as a unit. Typically, the content of silica will be described in units of “% by weight”.
Since silica usually has a specific gravity of 2.2 g / cm ³ , the preferred range of the silica content (% by weight) is, for example, as follows.
That is, the content of silica in the resin sheet 11 is preferably 74% by weight or more, and more preferably 84% by weight or more. 94 weight% or less is preferable and, as for content of the silica in the resin sheet 11, 91 weight% or less is more preferable.

Since alumina usually has a specific gravity of 3.9 g / cm ³ , the preferred range of the alumina content (% by weight) is, for example, as follows.
That is, the content of alumina in the resin sheet 11 is preferably 83% by weight or more, and more preferably 90% by weight or more. 97 weight% or less is preferable and, as for content of the alumina in the resin sheet 11, 95 weight% or less is more preferable.

  In addition to the above components, the resin sheet 11 may appropriately contain a compounding agent generally used in the production of a sealing resin, for example, a flame retardant component, a pigment, a silane coupling agent, and the like.

  Examples of the flame retardant component that can be used include aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, various metal hydroxides such as complex metal hydroxides; phosphazene compounds and the like. Of these, phosphazene compounds are preferred because they are excellent in flame retardancy and strength after curing.

  The pigment is not particularly limited, and examples thereof include carbon black.

  Although content of a silane coupling agent is not specifically limited, 0.1-1 weight part is preferable with respect to 100 weight part of inorganic fillers.

  Although the manufacturing method of the resin sheet 11 is not particularly limited, there is a method in which a kneaded material obtained by kneading the respective components (for example, an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator, and the like) is plastically processed into a sheet shape. preferable. Thereby, the inorganic filler can be highly filled and the thermal expansion coefficient can be designed low.

Specifically, a kneaded material was prepared by melting and kneading an epoxy resin, a phenol resin, an inorganic filler, a curing accelerator, and the like with a known kneader such as a mixing roll, a pressure kneader, and an extruder. The kneaded product is plastically processed into a sheet. As kneading conditions, the upper limit of the temperature is preferably 140 ° C. or less, and more preferably 130 ° C. or less. The lower limit of the temperature is preferably equal to or higher than the softening point of each component described above, for example, 30 ° C or higher, and preferably 50 ° C or higher. The kneading time is preferably 1 to 30 minutes. The kneading is preferably performed under reduced pressure conditions (under reduced pressure atmosphere), and the pressure under reduced pressure conditions is, for example, 1 × 10 ^{−4 to} 0.1 kg / cm ² .

  The kneaded material after melt-kneading is preferably subjected to plastic working in a high temperature state without cooling. The plastic working method is not particularly limited, and examples thereof include a flat plate pressing method, a T die extrusion method, a screw die extrusion method, a roll rolling method, a roll kneading method, an inflation extrusion method, a coextrusion method, and a calendering method. The plastic processing temperature is preferably higher than the softening point of each component described above, and is 40 to 150 ° C., preferably 50 to 140 ° C., more preferably 70 to 120 ° C., considering the thermosetting property and moldability of the epoxy resin. is there.

  Although the thickness of the resin sheet 11 is not specifically limited, Preferably it is 100 micrometers or more, More preferably, it is 150 micrometers or more. Moreover, the thickness of the resin sheet 11 becomes like this. Preferably it is 2000 micrometers or less, More preferably, it is 1000 micrometers or less. An electronic device can be favorably sealed as it is in the above-mentioned range.

  In addition, in FIG. 1, although the case where the resin sheet 11 is a single layer is shown, the resin sheet 11 is not limited to this, A multilayer may be sufficient.

  The resin sheet 11 is used for sealing an electronic device. Especially, the resin sheet 11 can be used conveniently in order to seal the electronic device arrange | positioned in a vacuum packaging container. For example, the resin sheet 11 includes a step of disposing the resin sheet 11 on the electronic device mounted on the substrate, an electronic device mounted on the substrate, and the resin sheet 11 disposed on the electronic device in a vacuum packaging container. And a method of manufacturing an electronic device package including a step of sealing an electronic device in a vacuum packaging container with a resin sheet 11. This method is described in International Publication WO2005 / 071731 and Japanese Patent No. 5223657.

  Electronic devices include sensors, MEMS (Micro Electro Mechanical Systems), SAW (Surface Acoustic Wave) filters and other electronic devices having a hollow structure (hollow electronic devices); semiconductors such as semiconductor chips, ICs (integrated circuits), and transistors Examples include an element, a capacitor, and a resistor. Especially, it can be used especially suitably for a SAW filter. The hollow structure refers to a hollow portion formed between the electronic device and the substrate when the electronic device is mounted on the substrate. The substrate is not particularly limited, and examples thereof include a printed wiring board, an LTCC (Low Temperature Co-fired Ceramics) substrate (low temperature co-fired ceramic substrate), a ceramic substrate, a silicon substrate, and a metal substrate.

  It does not specifically limit as a vacuum packaging container, For example, the bag provided with gas barrier property etc. can be used. Moreover, as a vacuum packaging container, what is equipped with heat resistance is preferable, and what specifically has heat resistance which can endure the temperature at the time of thermosetting is good. Moreover, as a vacuum packaging container, what is equipped with a softness | flexibility and heat sealing property is preferable.

  Specific examples of the vacuum packaging container include a multilayer structure having a polyester film as an outer layer and a polyethylene film having heat sealability as an inner layer (sealant layer). As the inner layer, a polypropylene film or the like can also be suitably used. As the outer layer, a polyimide film, a polyamide film or the like can also be suitably used. An intermediate layer may be provided between the outer layer and the inner layer. As the intermediate layer, a layer having a high gas barrier property is preferable. For example, an aluminum layer is preferable.

  Typical methods for sealing the electronic device with the resin sheet 11 include a method of embedding the electronic device in the resin sheet 11 and a method of covering the electronic device with the softened resin sheet 11.

  The resin sheet 11 can function as a sealing resin for protecting the electronic device and its accompanying elements from the external environment.

  [Method of manufacturing electronic device package]

  As a manufacturing method of an electronic device package, for example, there are a first manufacturing method for sealing an electronic device after vacuum packaging, a second manufacturing method for sealing an electronic device before vacuum packaging, and the like.

  Hereinafter, the first manufacturing method and the second manufacturing method will be described. As a representative example, a manufacturing example of a SAW filter package will be described.

[First manufacturing method]
(SAW filter mounting substrate preparation process)
In the SAW filter mounting substrate preparing step, the LTCC substrate 12 on which a plurality of SAW filters 13 are mounted is prepared (see FIG. 2). The SAW filter 13 can be formed by dicing a piezoelectric crystal on which predetermined comb-shaped electrodes are formed by a known method. For mounting the SAW filter 13 on the LTCC substrate 12, a known device such as a flip chip bonder or a die bonder can be used. The SAW filter 13 and the LTCC substrate 12 are electrically connected via protruding electrodes 13a such as bumps. A hollow portion 14 is maintained between the SAW filter 13 and the LTCC substrate 12 so as not to inhibit the propagation of surface acoustic waves on the surface of the SAW filter. The distance between the SAW filter 13 and the LTCC substrate 12 can be set as appropriate, and is generally about 15 to 50 μm.

(Arrangement process)
The resin sheet 11 is disposed on the SAW filter 13 mounted on the LTCC substrate 12 (see FIG. 3). Note that a release sheet (for example, the above-described support) may be provided on the surface of the resin sheet 11 that does not contact the SAW filter 13. This state is shown in FIG. 5 of International Publication WO2005 / 071731.

(Insertion process)
Next, the SAW filter 13 mounted on the LTCC substrate 12 and the resin sheet 11 on the SAW filter 13 are placed in a vacuum packaging container 21 (see FIG. 4).

(Vacuum packaging process)
Next, after the pressure inside the vacuum packaging container 21 is reduced (for example, 500 Pa or less), the vacuum packaging container 21 is sealed (see FIG. 5).

  Specifically, the vacuum packaging container 21 containing the LTCC substrate 12, the SAW filter 13 and the resin sheet 11 is placed in a sealed container, and then the inside of the sealed container is deaerated with a vacuum pump, Reduce pressure. Thereafter, the vicinity of the opening of the vacuum packaging container 21 is fused from both sides by a heat fusion heater (heat sealer) to seal the vacuum packaging container 21 (see FIG. 5). This state is shown in FIG. 3 of International Publication WO2005 / 071731. The opening of the vacuum packaging container 21 can be closed with a clip or the like.

  When the sealed vacuum packaging container 21 is taken out from the sealed container to atmospheric pressure, the vacuum packaging container 21 comes into close contact with the LTCC substrate 12 and the resin sheet 11 due to a pressure difference between the inside and outside of the vacuum packaging container 21.

  In addition, as a method of decompressing the inside of the vacuum packaging container 21, a method in which a metal pipe connected to a vacuum pump is hermetically inserted into the opening of the vacuum packaging container 21 and the inside of the vacuum packaging container 21 is deaerated. .

(Heating process)
In the heating step, the resin sheet 11 is heated and softened together with the vacuum packaging container 21. The heating temperature is usually lower than the curing temperature of the resin sheet 11 and is, for example, 50 ° C to 140 ° C.

  Accordingly, the softened resin sheet 11 enters between the SAW filters 13 mounted on the LTCC substrate 12. As a result, the SAW filter 13 is covered with the resin sheet 11.

  In the heating step, the vacuum packaging container 21 can be heated under a pressure higher than the inside of the vacuum packaging container 21 (for example, under atmospheric pressure). Thereby, the softened resin sheet 11 can be infiltrated between the SAW filters 13 mounted on the LTCC substrate 12 using the pressure difference between the inside and outside of the vacuum packaging container 21.

  As shown in FIGS. 8 and 9 of International Publication WO 2005/071731 and FIG. 8 of Japanese Patent No. 5223657, the vacuum packaging container 21 is heated and pressurized by a heating / pressure roller or a press machine. The softened resin sheet 11 may be inserted between the SAW filters 13 mounted on the LTCC substrate 12.

(Thermosetting process)
Next, the resin sheet 11 is heated together with the vacuum packaging container 21 to thermally cure the resin sheet 11.

  As a specific method, for example, after the sealed vacuum packaging container 21 is put in the sealed container, the vacuum packaging container 21 is pressed in a state where pressure is applied to the vacuum packaging container 21 with a pressure medium filled in the sealed container. And the resin sheet 11 is thermoset. In this method, the vacuum packaging container 21 can be pressurized and heated via a pressure medium, so that the shape and dimensions of the hollow portion 14 can be easily managed. Examples of the pressure medium include air, water, and oil. This state is shown in FIG. 4 of International Publication WO2005 / 071731.

  The heating temperature is, for example, 60 ° C to 150 ° C.

  Other specific methods include, for example, a method in which the vacuum packaging container 21 is hot-pressed by a press machine to thermally cure the resin sheet 11, under a pressure higher than the inside of the vacuum packaging container 21 (for example, under atmospheric pressure). A method of heating the vacuum packaging container 21 and thermosetting the resin sheet 11 is also suitable. This is shown in FIGS. 8 and 9 of Japanese Patent No. 5223657.

(Division process)
Thereafter, the SAW filter 13 sealed with the resin sheet 11 is taken out from the vacuum packaging container 21, and the LTCC substrate 12 is divided for each SAW filter 13 (see FIGS. 6 and 7). Thereby, the SAW filter package 16 can be obtained. Examples of the division method include dicing and cut / break.

  The method of the above example has the merit that the SAW filter can be sealed under reduced pressure, so that generation of voids can be reduced, and the method can be implemented with a simple pressure reducing device.

  In the above example, when a semiconductor chip is used instead of the SAW filter 13, an underfill material may be filled between the semiconductor chip and the substrate. This state is shown in FIG. 7 of International Publication WO2005 / 071731.

  In the above example, a method of performing the heating step and the thermosetting step in two stages is shown, but a method of combining these in one step is also suitable.

  As described above, for the first manufacturing method, for example, the step of placing the resin sheet 11 on the electronic device mounted on the substrate, the electronic device mounted on the substrate, and the resin sheet disposed on the electronic device 11 in a vacuum packaging container, a process of vacuum packaging the substrate, the electronic device and the resin sheet 11 placed in the vacuum packaging container, and a process of sealing the electronic device in the vacuum packaging container with the resin sheet 11 An electronic device package can be manufactured by a method including:

  In addition, the vacuum degree in the vacuum packaging container after vacuum packaging is 500 Pa or less, for example.

  Usually, a 1st manufacturing method originates in the process of hardening the part originating in the resin sheet 11 of the sealing body obtained by sealing an electronic device with the resin sheet 11, the resin sheet 11 of a sealing body. It further includes a step of taking out the cured body obtained by curing the portion from the vacuum packaging container, and a step of dicing the cured body.

  In the first manufacturing method, in the step of sealing the electronic device with the resin sheet 11, for example, the electronic device mounted on the substrate and the resin sheet 11 disposed on the electronic device are heated together with the vacuum packaging container. The electronic device in the vacuum packaging container is sealed with the resin sheet 11 by softening the resin sheet 11 and covering the electronic device with the softened resin sheet 11. In this step, it is preferable to heat the resin sheet 11 and the like together with the vacuum packaging container under a pressure higher than the inside of the vacuum packaging container (for example, under atmospheric pressure).

  In the step of curing the portion derived from the resin sheet 11 of the sealing body, for example, the portion derived from the resin sheet 11 of the sealing body is cured by heating the sealing body together with the vacuum packaging container. In this step, it is preferable to heat the sealing body together with the vacuum packaging container under a pressure higher than the inside of the vacuum packaging container (for example, under atmospheric pressure).

[Second manufacturing method]
In the first manufacturing method, the vacuum packaging container 21 is sealed and then heated, but in the second manufacturing method, the LTCC substrate 12, the SAW filter 13, and the resin sheet 11 are contained in a decompressed sealed container. The vacuum packaging container 21 containing is heated below the curing temperature of the resin sheet 11, and then the vacuum packaging container 21 is sealed. Thereby, when a solvent exists in the resin sheet 11, a solvent can be volatilized. This is shown in FIG. 3 of Japanese Patent No. 5223657.

  As described above, for the second manufacturing method, for example, the step of disposing the resin sheet 11 on the electronic device mounted on the substrate, the electronic device mounted on the substrate, and the resin sheet disposed on the electronic device 11 is placed in a vacuum packaging container, the electronic device in the vacuum packaging container is sealed with the resin sheet 11, and the sealing body obtained by sealing the electronic device with the resin sheet 11 is vacuum packaged. The electronic device package can be suitably manufactured by the method including the step of performing.

  In the second manufacturing method, in the step of sealing the electronic device with the resin sheet 11, for example, the electronic device mounted on the substrate and the resin sheet 11 disposed on the electronic device together with the vacuum packaging container in a reduced-pressure atmosphere. The resin sheet 11 is softened by heating, and the electronic device is covered with the softened resin sheet 11, thereby sealing the electronic device in the vacuum packaging container with the resin sheet 11.

  Usually, the second manufacturing method includes a step of curing a portion derived from the resin sheet 11 of the sealed package that has been vacuum-packed, and a curing obtained by curing a portion derived from the resin sheet 11 of the sealed body. The method further includes a step of removing the body from the vacuum packaging container and a step of dicing the cured body.

  As described above, when the first manufacturing method and the second manufacturing method are summarized, for example, the step of arranging the resin sheet 11 on the electronic device mounted on the substrate, the electronic device mounted on the substrate, and the electronic device The electronic device package can be suitably manufactured by a method including the step of putting the resin sheet 11 disposed on the substrate into the vacuum packaging container and the step of sealing the electronic device in the vacuum packaging container with the resin sheet 11.

  In the above method, the resin sheet 11 and the inner surface of the bag are easily in contact with each other, and the resin sheet is liable to be displaced.

  Hereinafter, preferred embodiments of the present invention will be described in detail by way of example. However, the materials, blending amounts, and the like described in the examples are not intended to limit the scope of the present invention only to those unless otherwise specified.

The components used in the examples will be described.
Epoxy resin: YSLV-80XY manufactured by Nippon Steel Chemical Co., Ltd. (bisphenol F type epoxy resin, epkin equivalent 200 g / eq. Softening point 80 ° C.)
Phenol resin A: MEH-7851-SS manufactured by Meiwa Kasei Co., Ltd. (phenol resin having a biphenylaralkyl skeleton, hydroxyl group equivalent 203 g / eq. Softening point 67 ° C.)
Phenol resin B: ND564 (Phenol novolac resin, hydroxyl group equivalent 107 g / eq. Softening point 60 ° C.) manufactured by Showa Polymer Co., Ltd.
Thermoplastic resin: Metablene J-5800 manufactured by Mitsubishi Rayon Co., Ltd. (MBS resin, primary particle size 0.5 μm)
Inorganic filler: FB-9454FC manufactured by Denki Kagaku Kogyo Co., Ltd. (fused spherical silica, average particle size 20 μm)
Silane coupling agent: KBM-403 (3-glycidoxypropyltrimethoxysilane) manufactured by Shin-Etsu Chemical Co., Ltd.
Carbon black: # 20 manufactured by Mitsubishi Chemical
Curing accelerator: 2PHZ-PW (2-phenyl-4,5-dihydroxymethylimidazole) manufactured by Shikoku Kasei Kogyo Co., Ltd.

The cover film used in the examples will be described.
Cover film 1: MRF manufactured by Mitsubishi Plastics Co., Ltd. (thickness 50 μm, surface roughness 50 nm)
Cover film 2: U4 manufactured by Teijin DuPont Films (thickness 50 μm, surface roughness 400 nm)
Cover film 3: Lumirror made by Mitsui Chemicals (film with sand mat treatment, thickness 50 μm, surface roughness 200 nm)

[Examples and Comparative Examples]
Each component was blended according to the blending ratio shown in Table 1, and melt-kneaded in a roll kneader at 60 to 120 ° C. for 10 minutes under reduced pressure conditions (0.01 kg / cm ² ) to prepare a kneaded product. Next, the obtained kneaded material was placed between two cover films, and the kneaded material was formed into a sheet by a flat plate pressing method to produce a resin sheet having a thickness of 200 μm.

[Evaluation]
The following evaluation was performed using the obtained resin sheet. The results are shown in Table 1.

(25 ° C probe tack)
Two plates of 25 mmφ (diameter 25 mm) were attached to a viscoelasticity measuring device (RSA-3 manufactured by TA Instruments). After fixing the resin sheet to the lower plate of the two plates with double-sided tape, the upper plate is pressed against the resin sheet with a load of 100 g by lowering the upper plate (probe) in an atmosphere at 25 ° C. It was. Thereafter, the load required to lift the upper plate from the resin sheet by raising the upper plate was measured.

(Surface roughness (Ra))
The surface roughness (Ra) of the resin sheet was measured based on JIS B 0601 using a non-contact three-dimensional roughness measuring apparatus (NT3300) manufactured by Veeco. The measurement conditions were 50 times, and the measurement values were obtained by applying a median filter to the measurement data. The measurement was performed 5 times while changing the measurement location, and the average value was defined as the surface roughness (Ra).

(25 ° C tensile storage modulus)
A strip-shaped sample (length 30 mm × width 10 mm × thickness 200 μm) was cut out from the resin sheet. About this sample, using a dynamic viscoelasticity measuring device (RSAIII manufactured by Rheometrics Scientific Co., Ltd.), a tensile storage at a distance between chucks of 20 mm, a heating rate of 10 ° C./min, and 0 to 50 ° C. in tensile measurement mode. The elastic modulus was measured. From the measurement results, the tensile storage modulus at 25 ° C. was determined.

(Position displacement)
After placing a resin sheet (size 65 mm square, thickness 200 μm) on an alumina substrate (size 70 mm square, thickness 0.25 mm), the alumina substrate and the resin sheet are placed in a vacuum packaging container (a three-sided bag for aluminum retort, white type, HA-1013H, size 100 mm × 130 mm), and vacuum packaged at 90 ° C. and 1 torr. The alumina substrate and the resin sheet were heated together with the vacuum packaging container at 150 ° C. for 1 hour to cure the resin sheet. After allowing the vacuum packaging container to cool to room temperature, the laminate made of the cured product of the alumina substrate and the resin sheet was taken out from the vacuum packaging container, and it was confirmed whether or not the cured product of the resin sheet was displaced from the initial position. The misregistration was confirmed for 30 laminates, and the number of laminates in which misalignment occurred was counted.
The case where the ratio represented by ((number of laminated bodies in which misalignment occurred / 30 laminated bodies) × 100) was 10% or less was judged as ◯, and the case where it exceeded 10% was judged as x.

(Handling properties)
When the resin sheet with the cover film removed was mounted on the mounting substrate, the case where the original sheet shape could not be maintained due to the resin sheet being in close contact with the finger or the chuck was determined as “x”. On the other hand, the case where the original sheet shape could be maintained was determined as “◯”.

DESCRIPTION OF SYMBOLS 11 Resin sheet 12 LTCC board | substrate 13 SAW filter 13a Projection electrode 14 Hollow part 18 Electronic device package 21 Vacuum packaging container

Claims (10)

A resin sheet for sealing an electronic device,
A resin sheet having a probe tack of 25 g to 500 g measured using a probe with a diameter of 25 mm (except when the resin sheet contains a polyisobutylene resin). The resin sheet according to claim 1, wherein the surface roughness (Ra) is 400 nm or less. Containing inorganic fillers,
The resin sheet according to claim 1 or 2, wherein the content of the inorganic filler in the resin sheet is 60 to 90% by volume. Including epoxy resin,
The softening point of the said epoxy resin is 100 degrees C or less, The resin sheet in any one of Claims 1-3. The resin sheet according to any one of claims 1 to 4, wherein a tensile storage elastic modulus at 25 ° C is 10 ^-2 MPa to 10 ³ MPa. The resin sheet in any one of Claims 1-5 used in order to seal the said electronic device arrange | positioned in a vacuum packaging container. Placing the resin sheet on the electronic device mounted on a substrate;
Placing the electronic device mounted on the substrate and the resin sheet disposed on the electronic device into a vacuum packaging container; and
The resin sheet according to claim 1, wherein the resin sheet is used in a method for producing an electronic device package including a step of sealing the electronic device in the vacuum packaging container with the resin sheet. The resin sheet according to claim 1, wherein the electronic device is a SAW filter. An electron including a step of sealing an electronic device with a resin sheet (except for the case where the resin sheet contains a polyisobutylene resin) having a probe tack at 25 ° C. of 5 g to 500 g measured using a probe having a diameter of 25 mm Device package manufacturing method. Placing the resin sheet on the electronic device mounted on a substrate;
A step of placing the electronic device mounted on the substrate and the resin sheet disposed on the electronic device in a vacuum packaging container,
The method for manufacturing an electronic device package according to claim 9, wherein in the step of sealing the electronic device, the electronic device in the vacuum packaging container is sealed with the resin sheet.

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