SG10201602065VA - Sealing sheet and method for producing package - Google Patents
Sealing sheet and method for producing packageInfo
- Publication number
- SG10201602065VA SG10201602065VA SG10201602065VA SG10201602065VA SG10201602065VA SG 10201602065V A SG10201602065V A SG 10201602065VA SG 10201602065V A SG10201602065V A SG 10201602065VA SG 10201602065V A SG10201602065V A SG 10201602065VA SG 10201602065V A SG10201602065V A SG 10201602065VA
- Authority
- SG
- Singapore
- Prior art keywords
- sealing sheet
- producing package
- package
- producing
- sealing
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/003—Additives being defined by their diameter
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2207/00—Properties characterising the ingredient of the composition
- C08L2207/02—Heterophasic composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015056213A JP6497998B2 (en) | 2015-03-19 | 2015-03-19 | Manufacturing method of sealing sheet and package |
Publications (1)
Publication Number | Publication Date |
---|---|
SG10201602065VA true SG10201602065VA (en) | 2016-10-28 |
Family
ID=57044216
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
SG10201602065VA SG10201602065VA (en) | 2015-03-19 | 2016-03-17 | Sealing sheet and method for producing package |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP6497998B2 (en) |
CN (1) | CN105985600A (en) |
SG (1) | SG10201602065VA (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6883937B2 (en) * | 2015-03-19 | 2021-06-09 | 日東電工株式会社 | Manufacturing method of sealing sheet and hollow package |
JP6533399B2 (en) * | 2015-03-19 | 2019-06-19 | 日東電工株式会社 | Method of manufacturing sealing sheet and package |
JP7038575B2 (en) * | 2018-03-08 | 2022-03-18 | 日東電工株式会社 | Sealing sheet |
JP7461229B2 (en) | 2020-06-17 | 2024-04-03 | 日東電工株式会社 | Sealing resin sheet |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6300686B1 (en) * | 1997-10-02 | 2001-10-09 | Matsushita Electric Industrial Co., Ltd. | Semiconductor chip bonded to a thermal conductive sheet having a filled through hole for electrical connection |
JP5035580B2 (en) * | 2001-06-28 | 2012-09-26 | ナガセケムテックス株式会社 | Surface acoustic wave device and manufacturing method thereof |
CN100472741C (en) * | 2005-02-21 | 2009-03-25 | 日东电工株式会社 | Manufacturing method for semiconductor device |
JP4989402B2 (en) * | 2007-10-04 | 2012-08-01 | 日東電工株式会社 | Hollow device sealing resin composition sheet and hollow device sealed using the same |
JP2009141020A (en) * | 2007-12-04 | 2009-06-25 | Furukawa Electric Co Ltd:The | Electronic component sealing sheet |
JP5528936B2 (en) * | 2010-07-28 | 2014-06-25 | 日東電工株式会社 | Flip chip type film for semiconductor backside |
JP2012089750A (en) * | 2010-10-21 | 2012-05-10 | Hitachi Chem Co Ltd | Thermosetting resin composition for sealing and filling semiconductor, and semiconductor device |
JP5837381B2 (en) * | 2011-09-28 | 2015-12-24 | 日東電工株式会社 | Manufacturing method of semiconductor device |
JP5961055B2 (en) * | 2012-07-05 | 2016-08-02 | 日東電工株式会社 | Sealing resin sheet, electronic component package manufacturing method, and electronic component package |
JP6393092B2 (en) * | 2013-08-07 | 2018-09-19 | 日東電工株式会社 | Hollow type electronic device sealing resin sheet and method for producing hollow type electronic device package |
JP6478449B2 (en) * | 2013-08-21 | 2019-03-06 | キヤノン株式会社 | Device manufacturing method and device manufacturing method |
-
2015
- 2015-03-19 JP JP2015056213A patent/JP6497998B2/en active Active
-
2016
- 2016-03-17 CN CN201610153248.0A patent/CN105985600A/en active Pending
- 2016-03-17 SG SG10201602065VA patent/SG10201602065VA/en unknown
Also Published As
Publication number | Publication date |
---|---|
CN105985600A (en) | 2016-10-05 |
JP6497998B2 (en) | 2019-04-10 |
JP2016175975A (en) | 2016-10-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
PL3322659T3 (en) | Method and system for forming packages | |
EP3181182A4 (en) | Packaged microneedle sheet and method for producing same | |
EP3288835C0 (en) | Method and system for forming packages | |
ZA201707216B (en) | System and method for forming a custom-sized package | |
HK1221204A1 (en) | Package and method for manufacturing same | |
SG10201601597WA (en) | Sheet for sealing hollow electronic device and method for producing hollow electronic device package | |
ZA201607394B (en) | A packaging unit having improved sealing, and a method for forming such a packaging unit | |
PL3313737T3 (en) | Packaging machine and method for operation of the packaging machine | |
SG10201609120WA (en) | Sheet for sealing hollow electronic device and method for producing hollow electronic device package | |
HK1243040A1 (en) | Bottom-gusseted package and heat-sealing method | |
SG11201700624WA (en) | Packaging system and packaging method for laser-sealed glass package | |
PL3380409T3 (en) | Packaging system and blanks therefor | |
IL258767B (en) | Packaging material and method for producing a packaging material | |
SG10201602065VA (en) | Sealing sheet and method for producing package | |
PL3157746T3 (en) | Packaging means as well as device and method for producing a packaging means | |
SG10201602080PA (en) | Sealing sheet and method for producing hollow package | |
PL3173360T3 (en) | Packaging and blank for producing packaging | |
PT3130548T (en) | Method for manufacturing an object and packaging | |
PL3160849T3 (en) | Plant and method for making packages | |
EP3354621A4 (en) | Hydrotalcite and method for producing same | |
SG10201604267RA (en) | Sheet for sealing hollow electronic device, method for producing hollow electronic device package, and hollow electronic device package | |
SG10201609602VA (en) | Sheet for sealing electronic device and method for manufacturing electronic device package | |
HUE055225T2 (en) | Package and method for producing said package | |
GB2554640B (en) | Sealing method | |
PL3095938T3 (en) | Fitting and method for producing a fitting |