JP2014156516A - Electronic component encapsulation resin sheet, resin seal type semiconductor device and manufacturing method of resin encapsulation type semiconductor device - Google Patents

Electronic component encapsulation resin sheet, resin seal type semiconductor device and manufacturing method of resin encapsulation type semiconductor device Download PDF

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Publication number
JP2014156516A
JP2014156516A JP2013026935A JP2013026935A JP2014156516A JP 2014156516 A JP2014156516 A JP 2014156516A JP 2013026935 A JP2013026935 A JP 2013026935A JP 2013026935 A JP2013026935 A JP 2013026935A JP 2014156516 A JP2014156516 A JP 2014156516A
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JP
Japan
Prior art keywords
resin
electronic component
resin sheet
sealing
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2013026935A
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Japanese (ja)
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JP6228734B2 (en
Inventor
Hideshi Toyoda
英志 豊田
Hiroyuki Mori
弘幸 森
yusaku Shimizu
祐作 清水
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
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Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=51354146&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JP2014156516(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP2013026935A priority Critical patent/JP6228734B2/en
Priority to SG11201505837RA priority patent/SG11201505837RA/en
Priority to PCT/JP2014/053318 priority patent/WO2014126147A1/en
Priority to KR1020157025085A priority patent/KR20150119265A/en
Priority to CN201480008390.5A priority patent/CN105190867A/en
Priority to TW103104995A priority patent/TWI624914B/en
Publication of JP2014156516A publication Critical patent/JP2014156516A/en
Publication of JP6228734B2 publication Critical patent/JP6228734B2/en
Application granted granted Critical
Ceased legal-status Critical Current
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • H01L23/295—Organic, e.g. plastic containing a filler
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/10—Adhesives in the form of films or foils without carriers
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
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    • C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
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    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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Abstract

PROBLEM TO BE SOLVED: To provide an electronic component encapsulation resin sheet capable of improving a reliability of a resin seal type semiconductor device.SOLUTION: An electronic component encapsulation resin sheet is used in manufacturing a resin seal type semiconductor device. The electronic component encapsulation resin sheet includes an inorganic filler of 70-93 wt.% to the entire electronic component encapsulation resin sheet. Water vapor transmission after thermal curing at thickness 250 μm is 300 g/m/24 hours or lower under a condition at temperature of 85°C, humidity of 85% and for 168 hours.

Description

本発明は、電子部品封止用樹脂シート、樹脂封止型半導体装置、及び、樹脂封止型半導体装置の製造方法に関する。   The present invention relates to a resin sheet for encapsulating electronic components, a resin-encapsulated semiconductor device, and a method for manufacturing a resin-encapsulated semiconductor device.

従来、半導体装置の製造においては、リードフレームや回路基板等の各種基板に半導体チップを搭載した後、半導体チップ等の電子部品を覆うように樹脂封止が行なわれる。このようにして製造される樹脂封止型半導体装置においては、封止樹脂の吸水性が高いと信頼性が低下するという問題があった。そこで、従来、吸水性の低い封止樹脂を使用することにより、樹脂封止型半導体装置の信頼性の向上が図られていた。   Conventionally, in manufacturing a semiconductor device, a semiconductor chip is mounted on various substrates such as a lead frame and a circuit board, and then resin sealing is performed so as to cover an electronic component such as a semiconductor chip. In the resin-encapsulated semiconductor device manufactured in this way, there is a problem that reliability is lowered when the water absorption of the encapsulating resin is high. Therefore, conventionally, the reliability of the resin-encapsulated semiconductor device has been improved by using an encapsulating resin with low water absorption.

一方、従来、耐透湿性を有するポリプロピレン系樹脂シートが知られている（例えば、特許文献１参照）。特許文献１に記載のポリプロピレン系樹脂シートは、各種包装や容器に使用されるものである。   On the other hand, conventionally, a polypropylene resin sheet having moisture permeability resistance is known (for example, see Patent Document 1). The polypropylene resin sheet described in Patent Document 1 is used for various packaging and containers.

特開平０７−１４８８５３号公報Japanese Unexamined Patent Publication No. 07-148853

しかしながら、樹脂封止型半導体装置の製造において、吸水性の低い封止樹脂を使用したとしても、信頼性が向上しない場合があるといった問題があった。   However, in the manufacture of a resin-encapsulated semiconductor device, there is a problem in that reliability may not be improved even when an encapsulating resin with low water absorption is used.

本発明は前記問題点に鑑みなされたものであり、その目的は、樹脂封止型半導体装置の信頼性を向上させることが可能な電子部品封止用樹脂シート、及び、信頼性の高い樹脂封止型半導体装置を提供することにある。   The present invention has been made in view of the above problems, and an object thereof is to provide an electronic component sealing resin sheet capable of improving the reliability of a resin-encapsulated semiconductor device, and a highly reliable resin encapsulation. The object is to provide a stationary semiconductor device.

本願発明者等は、上記従来の問題点を解決すべく検討した結果、樹脂封止型半導体装置においては、封止樹脂の透湿度が信頼性に関与していることを見出し、本発明を完成させるに至った。   As a result of studying the above conventional problems, the inventors of the present application have found that in a resin-encapsulated semiconductor device, the moisture permeability of the encapsulating resin is involved in reliability, and the present invention has been completed. I came to let you.

すなわち、本発明に係る電子部品封止用樹脂シートは、樹脂封止型半導体装置の製造に使用される電子部品封止用樹脂シートであって、無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含み、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であることを特徴とする。 That is, the resin sheet for encapsulating an electronic component according to the present invention is an electronic component encapsulating resin sheet used for manufacturing a resin-encapsulated semiconductor device, and an inorganic filler is added to the entire resin sheet for encapsulating an electronic component. In contrast, the moisture permeability after thermosetting when it is 70 to 93% by weight and the thickness is 250 μm is 300 g / m 2 · 24 hours or less under the conditions of a temperature of 85 ° C., a humidity of 85%, and 168 hours. It is characterized by being.

従来、樹脂封止型半導体装置の信頼性は、封止樹脂の吸水性に依存すると考えられており、透湿度については検討されていなかった。そのため、封止樹脂の吸水性が低いにも関わらず、樹脂封止型半導体装置の信頼性が確保できないといった事態が発生していた。本発明者らは、鋭意検討した結果、封止樹脂の透湿度が低いと、樹脂封止型半導体装置の信頼性が向上することを突き止めた。その理由として、本発明者らは、封止樹脂の透湿度が低いと、外部から電子部品にまで水が到達し難くなるためと推察している。つまり、たとえ、吸水性が低いとしても透湿度が高い封止樹脂を使用した場合には、やがて水が電子部品に到達することになるため、樹脂封止型半導体装置の信頼性が低下することになると推察している。   Conventionally, the reliability of a resin-encapsulated semiconductor device is considered to depend on the water absorption of the encapsulating resin, and moisture permeability has not been studied. Therefore, there has been a situation in which the reliability of the resin-encapsulated semiconductor device cannot be ensured despite the low water absorption of the encapsulating resin. As a result of intensive studies, the inventors have found that the reliability of the resin-encapsulated semiconductor device is improved when the moisture permeability of the encapsulating resin is low. As a reason for this, the present inventors presume that when the moisture permeability of the sealing resin is low, it is difficult for water to reach the electronic component from the outside. In other words, even when a sealing resin with high moisture permeability is used even if water absorption is low, the reliability of the resin-encapsulated semiconductor device decreases because water eventually reaches the electronic component. I guess it will be.

前記構成によれば、無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含んでおり、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であるため、外部から電子部品にまで水が到達しにくい。その結果、樹脂封止型半導体装置の信頼性を向上させることができる。なお、透湿度の評価条件を、温度８５℃、湿度８５％、１６８時間としたのは、半導体パッケージの耐はんだ信頼性試験（ＭＳＬ試験）において最も厳しい吸湿条件であるＬｅｖｅｌ １条件に合わせためである。
なお、厚さが２５０μｍではない場合には、下記式１により換算して、温度８５℃、湿度８５％、１６８時間の条件下における、厚さ２５０μｍにした際の透湿度とする。
（式１） Ａ−（２５０−Ｄ）×０．１０１
（Ａ：透湿度、Ｄ：サンプル厚み（μｍ）） According to the said structure, 70-93 weight% is included with respect to the whole resin sheet for electronic component sealing, and the water vapor transmission rate after thermosetting when it is set to 250 micrometers in thickness is the temperature of 85 degreeC, Since it is 300 g / m 2 · 24 hours or less under the conditions of 85% humidity and 168 hours, water hardly reaches the electronic parts from the outside. As a result, the reliability of the resin-encapsulated semiconductor device can be improved. The evaluation conditions of the moisture permeability were set to a temperature of 85 ° C., a humidity of 85%, and a duration of 168 hours in order to meet the Level 1 condition which is the most severe moisture absorption condition in the solder resistance test (MSL test) of the semiconductor package. is there.
When the thickness is not 250 μm, it is converted to the moisture permeability when the thickness is 250 μm under the conditions of a temperature of 85 ° C., a humidity of 85%, and 168 hours, converted by the following formula 1.
(Formula 1) A- (250-D) × 0.101
(A: moisture permeability, D: sample thickness (μm))

前記構成においては、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度６０℃、湿度９０％、１６８時間の条件下において、１００ｇ／ｍ２・２４時間以下であることが好ましい。厚さ２５０μｍにした際の熱硬化後の透湿度が、温度６０℃、湿度９０％、１６８時間の条件下において、１００ｇ／ｍ２・２４時間以下であると、樹脂封止型半導体装置の信頼性をより向上させることができる。なお、透湿度の評価条件を、温度６０℃、湿度９０％、１６８時間としたのは、本条件が半導体パッケージの高温高湿放置試験におけるもっとも厳しい条件の一つであるからである。
なお、厚さが２５０μｍではない場合には、下記式２により換算して、温度６０℃、湿度９０％、１６８時間の条件下における、厚さ２５０μｍにした際の透湿度とする。
（式２） Ａ−（２５０−Ｄ）×０．０１０
（Ａ：透湿度、Ｄ：サンプル厚み（μｍ） In the said structure, it is preferable that the water vapor transmission rate after thermosetting when it is 250 micrometers in thickness is 100 g / m < 2 > * 24 hours or less on the conditions of temperature 60 degreeC, humidity 90%, and 168 hours. When the thickness is 250 μm, the moisture permeability after thermosetting is 100 g / m 2 · 24 hours or less under the conditions of a temperature of 60 ° C., a humidity of 90%, and 168 hours. The sex can be further improved. The evaluation condition of moisture permeability is set to a temperature of 60 ° C., a humidity of 90%, and 168 hours because this condition is one of the most severe conditions in a high temperature and high humidity leaving test of a semiconductor package.
If the thickness is not 250 μm, it is converted to the moisture permeability when the thickness is 250 μm under the conditions of a temperature of 60 ° C., a humidity of 90%, and 168 hours, converted according to the following formula 2.
(Formula 2) A- (250-D) × 0.010
(A: moisture permeability, D: sample thickness (μm)

前記構成においては、混練押出により製造されていることが好ましい。本発明の電子部品封止用樹脂シートは、無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含むため、シート状に成型し難い。そこで、混練押出により製造することにより、ボイド（気泡）等の少ない均一なシートとすることができる。その結果、さらに、低透湿性を実現することが可能となる。   In the said structure, it is preferable to manufacture by kneading | mixing extrusion. Since the resin sheet for encapsulating electronic parts of the present invention contains 70 to 93% by weight of the inorganic filler with respect to the entire resin sheet for encapsulating electronic parts, it is difficult to mold the sheet. Therefore, by producing by kneading extrusion, a uniform sheet with few voids (bubbles) can be obtained. As a result, low moisture permeability can be realized.

また、本発明に係る樹脂封止型半導体装置は被着体と、前記被着体にフリップチップ接続された半導体チップと、前記半導体チップを封止する電子部品封止用樹脂シートとを備え、前記電子部品封止用樹脂シートは、無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含み、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であり、前記被着体と前記半導体チップとの間には、空隙が形成されていることを特徴とする。 The resin-encapsulated semiconductor device according to the present invention includes an adherend, a semiconductor chip flip-chip connected to the adherend, and an electronic component sealing resin sheet for sealing the semiconductor chip, The resin sheet for encapsulating electronic parts contains 70 to 93% by weight of an inorganic filler with respect to the entire resin sheet for encapsulating electronic parts, and the moisture permeability after thermosetting when the thickness is 250 μm has a temperature of 85. It is 300 g / m 2 · 24 hours or less under the conditions of ° C., humidity 85%, 168 hours, and a gap is formed between the adherend and the semiconductor chip.

加速度センサ、圧力センサ、ジャイロセンサ等のＭＥＭＳ（Ｍｉｃｒｏ Ｅｌｅｃｔｒｏ Ｍｅｃｈａｎｉｃａｌ Ｓｙｓｔｅｍｓ）や表面弾性波フィルター（ｓｕｒｆａｃｅ ａｃｏｕｓｔｉｃ ｗａｖｅ ｆｉｌｔｅｒ、ＳＡＷフィルター）においては、構造上、被着体と半導体チップとの間に空隙が形成されている必要があるものがある。しかしながら、このような空隙には、一旦、外部から水が侵入すると排除することは困難であり、この水により樹脂封止型半導体装置の信頼性が低下することになる。   In the MEMS (Micro Electro Mechanical Systems) and surface acoustic wave filters (SAW filters) such as acceleration sensors, pressure sensors, and gyro sensors, a gap is formed between the adherend and the semiconductor chip. There is something that needs to be done. However, once water enters the gap, it is difficult to eliminate it, and the reliability of the resin-encapsulated semiconductor device is reduced by this water.

前記構成によれば、電子部品封止用樹脂シートが、無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含んでおり、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であるため、外部から、被着体と半導体チップとの間の空隙に水が侵入し難い。その結果、樹脂封止型半導体装置の信頼性を向上させることができる。 According to the said structure, the resin sheet for electronic component sealing contains 70 to 93 weight% of inorganic fillers with respect to the whole resin sheet for electronic component sealing, and after thermosetting when it is 250 micrometers in thickness Since the water vapor permeability is 300 g / m 2 · 24 hours or less under the conditions of a temperature of 85 ° C., a humidity of 85% and 168 hours, water enters the gap between the adherend and the semiconductor chip from the outside. It is hard to do. As a result, the reliability of the resin-encapsulated semiconductor device can be improved.

また、本発明に係る樹脂封止型半導体装置は、前記に記載の電子部品封止用樹脂シートを有することを特徴とする。   Moreover, the resin-encapsulated semiconductor device according to the present invention has the above-described resin sheet for encapsulating electronic components.

前記構成によれば、電子部品封止用樹脂シートが無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含んでおり、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であるため、外部から電子部品にまで水が到達しにくい。その結果、樹脂封止型半導体装置の信頼性を向上させることができる。 According to the said structure, the resin sheet for electronic component sealing contains 70 to 93 weight% with respect to the whole resin sheet for electronic component sealing with respect to the whole resin sheet for electronic component sealing, and after thermosetting when it is set to 250 micrometers in thickness. Since the water vapor transmission rate is 300 g / m 2 · 24 hours or less under conditions of a temperature of 85 ° C., a humidity of 85%, and 168 hours, water hardly reaches the electronic component from the outside. As a result, the reliability of the resin-encapsulated semiconductor device can be improved.

また、本発明に係る樹脂封止型半導体装置の製造方法は、被着体上にフリップチップ接続された半導体チップを覆うように、半導体チップ側から電子部品封止用樹脂シートを積層する工程を具備し、前記電子部品封止用樹脂シートは、無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含み、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であることを特徴とする。 The method for manufacturing a resin-encapsulated semiconductor device according to the present invention includes a step of laminating a resin sheet for encapsulating electronic components from the semiconductor chip side so as to cover the semiconductor chip flip-chip connected on the adherend. The electronic component sealing resin sheet comprises 70 to 93% by weight of an inorganic filler with respect to the entire electronic component sealing resin sheet, and has a moisture permeability after thermosetting when the thickness is 250 μm. The temperature is 300 g / m 2 · 24 hours or less under the conditions of 85 ° C., 85% humidity and 168 hours.

前記構成によれば、前記電子部品封止用樹脂シートが無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含んでおり、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であるため、製造される樹脂封止型半導体装置は、外部から電子部品にまで水が到達しにくい。その結果、樹脂封止型半導体装置の信頼性を向上させることができる。 According to the said structure, the said resin sheet for electronic component sealing contains 70 to 93 weight% with respect to the whole resin sheet for electronic component sealing, and after thermosetting when it makes thickness 250 micrometers Is 300 g / m 2 · 24 hours or less under the conditions of a temperature of 85 ° C., a humidity of 85%, and 168 hours, the manufactured resin-encapsulated semiconductor device has water from the outside to the electronic components. Is hard to reach. As a result, the reliability of the resin-encapsulated semiconductor device can be improved.

本実施形態に係る電子部品封止用樹脂シートの一例を示す断面模式図である。It is a cross-sectional schematic diagram which shows an example of the resin sheet for electronic component sealing which concerns on this embodiment. 本実施形態に係る樹脂封止型半導体装置の製造方法を説明するための断面模式図である。It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the resin-encapsulated semiconductor device which concerns on this embodiment. 本実施形態に係る樹脂封止型半導体装置の製造方法を説明するための断面模式図である。It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the resin-encapsulated semiconductor device which concerns on this embodiment. 本実施形態に係る樹脂封止型半導体装置の製造方法を説明するための断面模式図である。It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the resin-encapsulated semiconductor device which concerns on this embodiment. 本実施形態に係る樹脂封止型半導体装置の製造方法を説明するための断面模式図である。It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the resin-encapsulated semiconductor device which concerns on this embodiment. 本実施形態に係る樹脂封止型半導体装置の製造方法を説明するための断面模式図である。It is a cross-sectional schematic diagram for demonstrating the manufacturing method of the resin-encapsulated semiconductor device which concerns on this embodiment.

本発明の実施形態について、図面を参照しながら説明するが、本発明はこれらの例に限定されない。図１は、本実施形態に係る電子部品封止用樹脂シートの一例を示す断面模式図である。なお、本明細書において、図には、説明に不要な部分は省略し、また、説明を容易にするために拡大又は縮小等して図示した部分がある。   Embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited to these examples. FIG. 1 is a schematic cross-sectional view showing an example of an electronic component sealing resin sheet according to the present embodiment. Note that in this specification, parts unnecessary for description are omitted in the drawings, and there are parts illustrated in an enlarged or reduced manner for ease of description.

（電子部品封止用樹脂シート）
図１で示されるように、電子部品封止用樹脂シート２は、シート状の形態を有している。電子部品封止用樹脂シート２は、樹脂封止型半導体装置（例えば、図６に示す樹脂封止型半導体装置５０）の製造に使用される。 (Electronic component sealing resin sheet)
As shown in FIG. 1, the electronic component sealing resin sheet 2 has a sheet-like form. The resin sheet 2 for electronic component sealing is used for manufacturing a resin-sealed semiconductor device (for example, the resin-sealed semiconductor device 50 shown in FIG. 6).

電子部品封止用樹脂シート２は、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であり、２００ｇ／ｍ２・２４時間以下であることが好ましく、１００ｇ／ｍ２・２４時間以下であることがより好ましい。また、前記透湿度は、小さいほど好ましいが、例えば、１ｇ／ｍ２・２４時間以上、である。厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であるため、外部から電子部品にまで水が到達しにくい。その結果、電子部品封止用樹脂シート２を有する樹脂封止型半導体装置の信頼性を向上させることができる。 The resin sheet 2 for sealing an electronic component has a moisture permeability of 300 g / m 2 · 24 hours or less under conditions of a temperature of 85 ° C., a humidity of 85%, and 168 hours when the thickness is 250 μm. 200 g / m 2 · 24 hours or less is preferable, and 100 g / m 2 · 24 hours or less is more preferable. Moreover, although the said water vapor transmission rate is so preferable that it is small, it is 1 g / m < 2 > * 24 hours or more, for example. The moisture permeability after thermosetting when the thickness is 250 μm is 300 g / m 2 · 24 hours or less under the conditions of a temperature of 85 ° C., a humidity of 85%, and 168 hours. Hard to reach. As a result, the reliability of the resin-encapsulated semiconductor device having the electronic component encapsulating resin sheet 2 can be improved.

また、電子部品封止用樹脂シート２は、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度６０℃、湿度９０％、１６８時間の条件下において、１００ｇ／ｍ２・２４時間以下であることが好ましく、５０ｇ／ｍ２・２４時間以下であることがより好ましく、２０ｇ／ｍ２・２４時間以下であることがさらに好ましい。また、前記透湿度は、小さいほど好ましいが、例えば、０．５ｇ／ｍ２・２４時間以上である。厚さ２５０μｍにした際の熱硬化後の透湿度が、温度６０℃、湿度９０％、１６８時間の条件下において、１００ｇ／ｍ２・２４時間以下であると、電子部品封止用樹脂シート２を有する樹脂封止型半導体装置の信頼性をより向上させることができる。 In addition, the resin sheet 2 for sealing an electronic component has a moisture permeability of 100 g / m 2 · 24 hours or less under conditions of a temperature of 60 ° C., a humidity of 90%, and 168 hours when the thickness is 250 μm. It is preferably 50 g / m 2 · 24 hours or less, and more preferably 20 g / m 2 · 24 hours or less. Moreover, although the said water vapor transmission rate is so preferable that it is small, it is 0.5 g / m < 2 > * 24 hours or more, for example. When the thickness is 250 μm, the moisture permeability after thermosetting is 100 g / m 2 · 24 hours or less under the conditions of a temperature of 60 ° C., a humidity of 90%, and 168 hours. The reliability of the resin-encapsulated semiconductor device having can be further improved.

電子部品封止用樹脂シート２を形成する樹脂組成物は、電子部品（例えば、半導体チップ５）の封止に利用可能なものであれば、特に限定されないが、例えば以下のＡ成分からＥ成分を含有する樹脂組成物が好ましいものとして挙げられる。
Ａ成分：エポキシ樹脂
Ｂ成分：フェノール樹脂
Ｃ成分：エラストマー
Ｄ成分：無機充填剤
Ｅ成分：硬化促進剤 The resin composition for forming the resin sheet 2 for sealing an electronic component is not particularly limited as long as it can be used for sealing an electronic component (for example, the semiconductor chip 5). For example, the following A component to E component The resin composition containing is mentioned as a preferable thing.
A component: Epoxy resin B component: Phenol resin C component: Elastomer D component: Inorganic filler E component: Curing accelerator

（Ａ成分）
エポキシ樹脂（Ａ成分）としては、特に限定されるものではない。例えば、トリフェニルメタン型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂、変性ビスフェノールＡ型エポキシ樹脂、ビスフェノールＡ型エポキシ樹脂、ビスフェノールＦ型エポキシ樹脂、変性ビスフェノールＦ型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、フェノキシ樹脂等の各種のエポキシ樹脂を用いることができる。これらエポキシ樹脂は単独で用いてもよいし２種以上併用してもよい。 (A component)
The epoxy resin (component A) is not particularly limited. For example, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, biphenyl type epoxy resin, modified bisphenol A type epoxy resin, bisphenol A type epoxy resin, bisphenol F type epoxy resin, modified bisphenol F type epoxy resin, dicyclopentadiene type Various epoxy resins such as an epoxy resin, a phenol novolac type epoxy resin, and a phenoxy resin can be used. These epoxy resins may be used alone or in combination of two or more.

エポキシ樹脂の硬化後の靭性及びエポキシ樹脂の反応性を確保する観点からは、エポキシ当量１５０〜２５０、軟化点もしくは融点が５０〜１３０℃の常温で固形のものが好ましく、中でも、信頼性の観点から、トリフェニルメタン型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ビフェニル型エポキシ樹脂が好ましい。   From the viewpoint of ensuring the toughness after curing of the epoxy resin and the reactivity of the epoxy resin, those having an epoxy equivalent of 150 to 250 and a softening point or melting point of 50 to 130 ° C. are preferably solid, and in particular, from the viewpoint of reliability. Therefore, triphenylmethane type epoxy resin, cresol novolac type epoxy resin, and biphenyl type epoxy resin are preferable.

また、低応力性の観点から、アセタール基やポリオキシアルキレン基等の柔軟性骨格を有する変性ビスフェノールＡ型エポキシ樹脂が好ましく、アセタール基を有する変性ビスフェノールＡ型エポキシ樹脂は、液体状で取り扱いが良好であることから、特に好適に用いることができる。   Also, from the viewpoint of low stress, a modified bisphenol A type epoxy resin having a flexible skeleton such as an acetal group or a polyoxyalkylene group is preferable, and a modified bisphenol A type epoxy resin having an acetal group is in a liquid state and is easy to handle. Therefore, it can be particularly preferably used.

エポキシ樹脂（Ａ成分）の含有量は、電子部品封止用樹脂シート全体に対して１〜１０重量％であることが好ましく、２〜５重量％であることがより好ましい。   The content of the epoxy resin (component A) is preferably 1 to 10% by weight and more preferably 2 to 5% by weight with respect to the entire resin sheet for sealing an electronic component.

（Ｂ成分）
フェノール樹脂（Ｂ成分）は、エポキシ樹脂（Ａ成分）との間で硬化反応を生起するものであれば特に限定されるものではない。例えば、フェノールノボラック樹脂、フェノールアラルキル樹脂、ビフェニルアラルキル樹脂、ジシクロペンタジエン型フェノール樹脂、クレゾールノボラック樹脂、レゾール樹脂、等が用いられる。これらフェノール樹脂は単独で用いてもよいし、２種以上併用してもよい。 (B component)
The phenol resin (component B) is not particularly limited as long as it causes a curing reaction with the epoxy resin (component A). For example, a phenol novolak resin, a phenol aralkyl resin, a biphenyl aralkyl resin, a dicyclopentadiene type phenol resin, a cresol novolak resin, a resole resin, or the like is used. These phenolic resins may be used alone or in combination of two or more.

フェノール樹脂としては、エポキシ樹脂（Ａ成分）との反応性の観点から、水酸基当量が７０〜２５０、軟化点が５０〜１１０℃のものを用いることが好ましく、中でも硬化反応性が高いという観点から、フェノールノボラック樹脂を好適に用いることができる。また、信頼性の観点から、フェノールアラルキル樹脂やビフェニルアラルキル樹脂のような低吸湿性のものも好適に用いることができる。   From the viewpoint of reactivity with the epoxy resin (component A), it is preferable to use a phenolic resin having a hydroxyl equivalent weight of 70 to 250 and a softening point of 50 to 110 ° C., among which the curing reactivity is high. A phenol novolac resin can be preferably used. From the viewpoint of reliability, low hygroscopic materials such as phenol aralkyl resins and biphenyl aralkyl resins can also be suitably used.

エポキシ樹脂（Ａ成分）とフェノール樹脂（Ｂ成分）の配合割合は、硬化反応性という観点から、エポキシ樹脂（Ａ成分）中のエポキシ基１当量に対して、フェノール樹脂（Ｂ成分）中の水酸基の合計が０．７〜１．５当量となるように配合することが好ましく、より好ましくは０．９〜１．２当量である。   From the viewpoint of curing reactivity, the blending ratio of the epoxy resin (component A) and the phenol resin (component B) is a hydroxyl group in the phenol resin (component B) with respect to 1 equivalent of the epoxy group in the epoxy resin (component A). It is preferable to mix | blend so that it may become 0.7-1.5 equivalent, More preferably, it is 0.9-1.2 equivalent.

（Ｃ成分）
エポキシ樹脂（Ａ成分）及びフェノール樹脂（Ｂ成分）とともに用いられるエラストマー（Ｃ成分）は、電子部品封止用樹脂シートをシート状にした場合の半導体チップ５の封止に必要な可撓性を樹脂組成物に付与するものであり、このような作用を奏するものであれば特にその構造を限定するものではない。例えば、ポリアクリル酸エステル等の各種アクリル系共重合体、スチレンアクリレート系共重合体、ブタジエンゴム、スチレン−ブタジエンゴム（ＳＢＲ）、エチレン−酢酸ビニルコポリマー（ＥＶＡ）、イソプレンゴム、アクリロニトリルゴム等のゴム質重合体を用いることができる。中でも、エポキシ樹脂（Ａ成分）へ分散させやすく、またエポキシ樹脂（Ａ成分）との反応性も高いために、得られる電子部品封止用樹脂シートの耐熱性や強度を向上させることができるという観点から、アクリル系共重合体を用いることが好ましい。これらは単独で用いてもよいし、２種以上併せて用いてもよい。 (C component)
The elastomer (C component) used together with the epoxy resin (A component) and the phenol resin (B component) provides flexibility necessary for sealing the semiconductor chip 5 when the resin sheet for sealing electronic components is formed into a sheet shape. The structure is not particularly limited as long as it is imparted to the resin composition and exhibits such an action. For example, various acrylic copolymers such as polyacrylates, styrene acrylate copolymers, butadiene rubber, styrene-butadiene rubber (SBR), ethylene-vinyl acetate copolymer (EVA), isoprene rubber, acrylonitrile rubber, etc. Polymers can be used. Among them, it is easy to disperse in the epoxy resin (component A), and because the reactivity with the epoxy resin (component A) is high, the heat resistance and strength of the resulting resin sheet for sealing electronic components can be improved. From the viewpoint, it is preferable to use an acrylic copolymer. These may be used alone or in combination of two or more.

なお、アクリル系共重合体は、例えば、所定の混合比にしたアクリルモノマー混合物を、定法によってラジカル重合することにより合成することができる。ラジカル重合の方法としては、有機溶剤を溶媒に行う溶液重合法や、水中に原料モノマーを分散させながら重合を行う懸濁重合法が用いられる。その際に用いる重合開始剤としては、例えば、２，２’−アゾビスイソブチロニトリル、２，２’−アゾビス−（２，４−ジメチルバレロニトリル）、２，２’−アゾビス−４−メトキシ−２，４−ジメチルバレロニトリル、その他のアゾ系又はジアゾ系重合開始剤、ベンゾイルパーオキサイド及びメチルエチルケトンパーオキサイド等の過酸化物系重合開始剤等が用いられる。なお、懸濁重合の場合は、例えばポリアクリルアミド、ポリビニルアルコールのような分散剤を加えることが望ましい。   The acrylic copolymer can be synthesized, for example, by radical polymerization of an acrylic monomer mixture having a predetermined mixing ratio by a conventional method. As a method for radical polymerization, a solution polymerization method in which an organic solvent is used as a solvent or a suspension polymerization method in which polymerization is performed while dispersing raw material monomers in water are used. As a polymerization initiator used in that case, for example, 2,2′-azobisisobutyronitrile, 2,2′-azobis- (2,4-dimethylvaleronitrile), 2,2′-azobis-4- Methoxy-2,4-dimethylvaleronitrile, other azo or diazo polymerization initiators, peroxide polymerization initiators such as benzoyl peroxide and methyl ethyl ketone peroxide are used. In the case of suspension polymerization, it is desirable to add a dispersing agent such as polyacrylamide or polyvinyl alcohol.

エラストマー（Ｃ成分）の含有量は、電子部品封止用樹脂シート全体に対して１〜１０重量％であることが好ましく、２〜５重量％であることがより好ましい。エラストマー（Ｃ成分）の含有量を１重量％以上とすることにより、シートに可とう性、じん性をもたせることができる。また、エラストマー（Ｃ成分）の含有量を１０重量％以下とすることにより、パッケージとして必要な成型物強度を発現することができる。   The content of the elastomer (component C) is preferably 1 to 10% by weight and more preferably 2 to 5% by weight with respect to the entire resin sheet for sealing an electronic component. By setting the content of the elastomer (component C) to 1% by weight or more, the sheet can have flexibility and toughness. Moreover, the intensity | strength of a molded object required as a package can be expressed by content of an elastomer (C component) being 10 weight% or less.

また、エラストマー（Ｃ成分）のエポキシ樹脂（Ａ成分）に対する重量比率（Ｃ成分の重量／Ａ成分の重量）は、０．３〜２とすることが好ましく、０．７〜１．５とすることがより好ましい。上記重量比率を０．３以上とすることにより、シートにじん性および可とう性を付与することができる。一方、上記重量比率を２以下とすることにより、硬化後のパッケージの信頼性を維持することができる。   The weight ratio of the elastomer (component C) to the epoxy resin (component A) (weight of component C / weight of component A) is preferably 0.3 to 2, and preferably 0.7 to 1.5. It is more preferable. By setting the weight ratio to 0.3 or more, toughness and flexibility can be imparted to the sheet. On the other hand, by setting the weight ratio to 2 or less, the reliability of the package after curing can be maintained.

（Ｄ成分）
無機質充填剤（Ｄ成分）は、特に限定されるものではなく、従来公知の各種充填剤を用いることができ、例えば、石英ガラス、タルク、シリカ（溶融シリカや結晶性シリカ等）、アルミナ、窒化アルミニウム、窒化珪素等の粉末が挙げられる。これらは単独で用いてもよいし、２種以上併用してもよい。 (D component)
The inorganic filler (component D) is not particularly limited, and various conventionally known fillers can be used. For example, quartz glass, talc, silica (fused silica, crystalline silica, etc.), alumina, nitriding Examples thereof include powders such as aluminum and silicon nitride. These may be used alone or in combination of two or more.

中でも、透湿性が低いという点から、シリカ粉末を用いることが好ましく、シリカ粉末の中でも溶融シリカ粉末を用いることがより好ましい。溶融シリカ粉末としては、球状溶融シリカ粉末、破砕溶融シリカ粉末が挙げられるが、流動性という観点から、球状溶融シリカ粉末を用いることが特に好ましい。中でも、平均粒径が０．１〜５０μｍの範囲のものを用いることが好ましく、０．３〜２５μｍの範囲のものを用いることが特に好ましい。   Especially, it is preferable to use a silica powder from the point that moisture permeability is low, and it is more preferable to use a fused silica powder among silica powders. Examples of the fused silica powder include spherical fused silica powder and crushed fused silica powder. From the viewpoint of fluidity, it is particularly preferable to use a spherical fused silica powder. Among them, those having an average particle size in the range of 0.1 to 50 μm are preferable, and those having a range of 0.3 to 25 μm are particularly preferable.

なお、平均粒径は、例えば、母集団から任意に抽出される試料を用い、レーザー回折散乱式粒度分布測定装置を用いて測定することにより導き出すことができる。   The average particle diameter can be derived, for example, by using a sample arbitrarily extracted from the population and measuring it using a laser diffraction / scattering particle size distribution measuring apparatus.

無機質充填剤（Ｄ成分）の含有量は、電子部品封止用樹脂シート全体に対して、７０〜９３重量％であることが好ましく、７５〜９０重量％であることがより好ましく、８０〜８８重量％であることがさらに好ましい。無機充填剤は、透湿性が低いため、含有量を７０重量％以上とすることにより、電子部品封止用樹脂シート２の透湿度を低くすることができる。一方、無機充填剤の含有量を９３重量％以下とすることにより、電子部品封止用樹脂シート２を容易にシート状にすることができる。   The content of the inorganic filler (component D) is preferably 70 to 93% by weight, more preferably 75 to 90% by weight, and more preferably 80 to 88% with respect to the entire resin sheet for sealing an electronic component. More preferably, it is% by weight. Since the inorganic filler has low moisture permeability, the moisture permeability of the electronic component sealing resin sheet 2 can be lowered by setting the content to 70% by weight or more. On the other hand, by setting the content of the inorganic filler to 93% by weight or less, the resin sheet 2 for sealing an electronic component can be easily formed into a sheet shape.

（Ｅ成分）
硬化促進剤（Ｅ成分）は、エポキシ樹脂とフェノール樹脂の硬化を進行させるものであれば特に限定されるものではないが、硬化性と保存性の観点から、トリフェニルホスフィンやテトラフェニルホスホニウムテトラフェニルボレート等の有機リン系化合物や、イミダゾール系化合物が好適に用いられる。これら硬化促進剤は、単独で用いても良いし、他の硬化促進剤と併用しても構わない。 (E component)
The curing accelerator (component E) is not particularly limited as long as it allows curing of the epoxy resin and the phenol resin, but from the viewpoint of curability and storage stability, triphenylphosphine or tetraphenylphosphonium tetraphenyl. Organic phosphorus compounds such as borates and imidazole compounds are preferably used. These curing accelerators may be used alone or in combination with other curing accelerators.

硬化促進剤（Ｅ成分）の含有量は、エポキシ樹脂（Ａ成分）及びフェノール樹脂（Ｂ成分）の合計１００重量部に対して０．１〜５重量部であることが好ましい。   It is preferable that content of a hardening accelerator (E component) is 0.1-5 weight part with respect to a total of 100 weight part of an epoxy resin (A component) and a phenol resin (B component).

（その他の成分）
また、樹脂組成物には、Ａ成分からＥ成分に加えて、難燃剤成分を加えてもよい。難燃剤組成分としては、例えばホスファゼンなどの有機リン系難燃剤、水酸化アルミニウム、水酸化マグネシウム、水酸化鉄、水酸化カルシウム、水酸化スズ、複合化金属水酸化物等の各種金属水酸化物などを用いることができる。樹脂組成物中での分散性の観点から有機リン系難燃剤が好ましいが、場合によっては、比較的少ない添加量で難燃性を発揮できる観点や、コスト的な観点から水酸化アルミニウム又は水酸化マグネシウムを用いる場合もある。これらは単独で用いても、組合せで用いても良い。 (Other ingredients)
In addition to the A component to the E component, a flame retardant component may be added to the resin composition. Examples of the flame retardant composition include organophosphorus flame retardants such as phosphazene, various metal hydroxides such as aluminum hydroxide, magnesium hydroxide, iron hydroxide, calcium hydroxide, tin hydroxide, and complex metal hydroxides. Etc. can be used. Organophosphorous flame retardants are preferred from the viewpoint of dispersibility in the resin composition, but depending on the case, aluminum hydroxide or hydroxide may be used from the viewpoint of exhibiting flame retardancy with a relatively small addition amount or from a cost viewpoint. Sometimes magnesium is used. These may be used alone or in combination.

なお、樹脂組成物は、上記の各成分以外に必要に応じて、カーボンブラックをはじめとする顔料等、他の添加剤を適宜配合することができる。   In addition to the above components, the resin composition can be appropriately mixed with other additives such as a pigment including carbon black as necessary.

（電子部品封止用樹脂シートの作製方法）
電子部品封止用樹脂シート２の作製方法について、電子部品封止用樹脂シート２がシート状熱硬化型樹脂層である場合の手順を以下に説明する。 (Method for producing resin sheet for sealing electronic parts)
About the preparation methods of the resin sheet 2 for electronic component sealing, the procedure in case the resin sheet 2 for electronic component sealing is a sheet-like thermosetting resin layer is demonstrated below.

まず、上述の各成分を混合することにより樹脂組成物を調製する。混合方法は、各成分が均一に分散混合される方法であれば特に限定するものではない。その後、例えば、各成分を有機溶剤等に溶解又は分散したワニスを塗工してシート状に形成する。あるいは、各配合成分を直接ニーダー等で混練することにより混練物を調製し、このようにして得られた混練物を押し出してシート状に形成してもよい。   First, a resin composition is prepared by mixing the above-described components. The mixing method is not particularly limited as long as each component is uniformly dispersed and mixed. Thereafter, for example, a varnish in which each component is dissolved or dispersed in an organic solvent or the like is applied to form a sheet. Alternatively, a kneaded material may be prepared by directly kneading each compounding component with a kneader or the like, and the kneaded material thus obtained may be extruded to form a sheet.

ワニスを用いる具体的な作製手順としては、上記Ａ〜Ｅ成分及び必要に応じて他の添加剤を常法に準じて適宜混合し、有機溶剤に均一に溶解あるいは分散させ、ワニスを調製する。ついで、上記ワニスをポリエステル等の支持体上に塗布し乾燥させることにより電子部品封止用樹脂シート２を得ることができる。そして必要により、電子部品封止用樹脂シートの表面を保護するためにポリエステルフィルム等の剥離シートを貼り合わせてもよい。剥離シートは封止時に剥離する。   As a specific production procedure using a varnish, the above components A to E and, if necessary, other additives are appropriately mixed according to a conventional method, and uniformly dissolved or dispersed in an organic solvent to prepare a varnish. Subsequently, the resin sheet 2 for electronic component sealing can be obtained by apply | coating the said varnish on support bodies, such as polyester, and making it dry. And if necessary, in order to protect the surface of the resin sheet for electronic component sealing, you may bond together peeling sheets, such as a polyester film. The release sheet peels at the time of sealing.

上記有機溶剤としては、特に限定されるものではなく従来公知の各種有機溶剤、例えばメチルエチルケトン、アセトン、シクロヘキサノン、ジオキサン、ジエチルケトン、トルエン、酢酸エチル等を用いることができる。これらは単独で用いてもよいし、２種以上併せて用いてもよい。また通常、ワニスの固形分濃度が３０〜６０重量％の範囲となるように有機溶剤を用いることが好ましい。   The organic solvent is not particularly limited, and various conventionally known organic solvents such as methyl ethyl ketone, acetone, cyclohexanone, dioxane, diethyl ketone, toluene, and ethyl acetate can be used. These may be used alone or in combination of two or more. Usually, it is preferable to use an organic solvent so that the solid content concentration of the varnish is in the range of 30 to 60% by weight.

有機溶剤乾燥後のシートの厚みは、特に制限されるものではないが、厚みの均一性と残存溶剤量の観点から、通常、５〜１００μｍに設定することが好ましく、より好ましくは２０〜７０μｍである。   Although the thickness of the sheet after drying the organic solvent is not particularly limited, it is usually preferably set to 5 to 100 μm, more preferably 20 to 70 μm, from the viewpoint of uniformity of thickness and the amount of residual solvent. is there.

一方、混練を用いる場合には、上記Ａ〜Ｅ成分及び必要に応じて他の添加剤の各成分をミキサーなど公知の方法を用いて混合し、その後、溶融混練することにより混練物を調製する。溶融混練する方法としては、特に限定されないが、例えば、ミキシングロール、加圧式ニーダー、押出機などの公知の混練機により、溶融混練する方法などが挙げられる。混練条件としては、温度が、上記した各成分の軟化点以上であれば特に制限されず、例えば３０〜１５０℃、エポキン樹脂の熱硬化性を考慮すると、好ましくは４０〜１４０℃、さらに好ましくは６０〜１２０℃であり、時間が、例えば１〜３０分間、好ましくは５〜１５分間である。これによって、混練物を調製することができる。   On the other hand, when kneading is used, the above components A to E and, if necessary, each component of other additives are mixed using a known method such as a mixer, and then kneaded to prepare a kneaded product. . The method of melt kneading is not particularly limited, and examples thereof include a method of melt kneading with a known kneader such as a mixing roll, a pressure kneader, or an extruder. The kneading conditions are not particularly limited as long as the temperature is equal to or higher than the softening point of each component described above. For example, when considering the thermosetting property of 30 to 150 ° C. and the epoxy resin, preferably 40 to 140 ° C., more preferably It is 60-120 degreeC, and time is 1 to 30 minutes, for example, Preferably it is 5 to 15 minutes. Thereby, a kneaded material can be prepared.

得られる混練物を押出成形により成形することにより、電子部品封止用樹脂シート２を得ることができる。具体的には、溶融混練後の混練物を冷却することなく高温状態のままで、押出成形することで、電子部品封止用樹脂シート２を形成することができる。このような押出方法としては、特に制限されず、Ｔダイ押出法、ロール圧延法、ロール混練法、共押出法、カレンダー成形法などが挙げられる。押出温度としては、上記した各成分の軟化点以上であれば、特に制限されないが、エポキシ樹脂の熱硬化性および成形性を考慮すると、例えば４０〜１５０℃、好ましくは、５０〜１４０℃、さらに好ましくは７０〜１２０℃である。以上により、電子部品封止用樹脂シート２を形成することができる。   By molding the obtained kneaded material by extrusion molding, the resin sheet 2 for sealing an electronic component can be obtained. Specifically, the resin sheet 2 for sealing an electronic component can be formed by extrusion molding without cooling the kneaded product after melt-kneading. Such an extrusion method is not particularly limited, and examples thereof include a T-die extrusion method, a roll rolling method, a roll kneading method, a co-extrusion method, and a calendar molding method. The extrusion temperature is not particularly limited as long as it is equal to or higher than the softening point of each component described above, but considering the thermosetting property and moldability of the epoxy resin, for example, 40 to 150 ° C, preferably 50 to 140 ° C, Preferably it is 70-120 degreeC. The resin sheet 2 for electronic component sealing can be formed by the above.

なかでも、無機充填剤を電子部品封止用樹脂シート２全体に対して、７０〜９３重量％含むため、シート状への成型性の観点から、混練押出により製造することが好ましい。混練押出により製造することにより、ボイド（気泡）等の少ない均一なシートとすることができる。その結果、さらに、低透湿性を実現することが可能となる。   Especially, since 70-93 weight% of inorganic fillers are included with respect to the whole resin sheet 2 for electronic component sealing, it is preferable to manufacture by kneading extrusion from a viewpoint of the moldability to a sheet form. By producing by kneading extrusion, a uniform sheet with less voids (bubbles) can be obtained. As a result, low moisture permeability can be realized.

このようにして得られた電子部品封止用樹脂シート２は、必要により所望の厚みとなるように積層して使用してもよい。すなわち、シート状樹脂組成物は、単層構造にて使用してもよいし、２層以上の多層構造に積層してなる積層体として使用してもよい。   The electronic component sealing resin sheet 2 obtained in this way may be used by being laminated so as to have a desired thickness if necessary. That is, the sheet-like resin composition may be used in a single layer structure, or may be used as a laminate formed by laminating two or more multilayer structures.

（樹脂封止型半導体装置の製造方法）
次に、本実施形態に係る樹脂封止型半導体装置の製造方法について、図２〜図６を参照しながら以下に説明する。図２〜図６は、本実施形態に係る樹脂封止型半導体装置の製造方法を説明するための断面模式図である。 (Method for manufacturing resin-encapsulated semiconductor device)
Next, a method for manufacturing a resin-encapsulated semiconductor device according to the present embodiment will be described below with reference to FIGS. 2-6 is a cross-sectional schematic diagram for demonstrating the manufacturing method of the resin sealing type | mold semiconductor device which concerns on this embodiment.

前記半導体装置の製造方法は、被着体上にフリップチップ接続された半導体チップを覆うように、半導体チップ側から電子部品封止用樹脂シートを積層する工程を少なくとも具備する。   The semiconductor device manufacturing method includes at least a step of laminating an electronic component sealing resin sheet from the semiconductor chip side so as to cover the semiconductor chip flip-chip connected to the adherend.

［マウント工程］
先ず、図２で示されるように、基材３１上に粘着剤層３２が積層されたダイシングテープ３の粘着剤層３２上に半導体ウエハ４を貼着して、これを接着保持させ固定する（マウント工程）。粘着剤層３２は、半導体ウエハ４の裏面に貼着される。半導体ウエハ４の裏面とは、回路面とは反対側の面（非回路面、非電極形成面などとも称される）を意味する。貼着方法は特に限定されないが、圧着による方法が好ましい。圧着は、通常、圧着ロール等の押圧手段により押圧しながら行われる。なお、ダイシングテープ３としては、従来公知のものを使用することができる。 [Mounting process]
First, as shown in FIG. 2, the semiconductor wafer 4 is stuck on the pressure-sensitive adhesive layer 32 of the dicing tape 3 in which the pressure-sensitive adhesive layer 32 is laminated on the base material 31, and this is adhered and held and fixed ( Mounting process). The pressure-sensitive adhesive layer 32 is attached to the back surface of the semiconductor wafer 4. The back surface of the semiconductor wafer 4 means a surface opposite to the circuit surface (also referred to as a non-circuit surface or a non-electrode forming surface). Although the sticking method is not specifically limited, the method by pressure bonding is preferable. The crimping is usually performed while pressing with a pressing means such as a crimping roll. In addition, as a dicing tape 3, a conventionally well-known thing can be used.

基材３１としては、例えば、例えば、低密度ポリエチレン、直鎖状ポリエチレン、中密度ポリエチレン、高密度ポリエチレン、超低密度ポリエチレン、ランダム共重合ポリプロピレン、ブロック共重合ポリプロピレン、ホモポリプロレン、ポリブテン、ポリメチルペンテン等のポリオレフィン、エチレン−酢酸ビニル共重合体、アイオノマー樹脂、エチレン−（メタ）アクリル酸共重合体、エチレン−（メタ）アクリル酸エステル（ランダム、交互）共重合体、エチレン−ブテン共重合体、エチレン−ヘキセン共重合体、ポリウレタン、ポリエチレンテレフタレート、ポリエチレンナフタレート等のポリエステル、ポリカーボネート、ポリイミド、ポリエーテルエーテルケトン、ポリイミド、ポリエーテルイミド、ポリアミド、全芳香族ポリアミド、ポリフェニルスルフィド、アラミド（紙）、ガラス、ガラスクロス、フッ素樹脂、ポリ塩化ビニル、ポリ塩化ビニリデン、セルロース系樹脂、シリコーン樹脂、金属（箔）、紙等も用いることができる。   Examples of the base material 31 include, for example, low density polyethylene, linear polyethylene, medium density polyethylene, high density polyethylene, very low density polyethylene, random copolymer polypropylene, block copolymer polypropylene, homopolyprolene, polybutene, and polymethyl. Polyolefin such as pentene, ethylene-vinyl acetate copolymer, ionomer resin, ethylene- (meth) acrylic acid copolymer, ethylene- (meth) acrylic acid ester (random, alternating) copolymer, ethylene-butene copolymer , Ethylene-hexene copolymer, polyurethane, polyethylene terephthalate, polyethylene naphthalate, etc. polyester, polycarbonate, polyimide, polyetheretherketone, polyimide, polyetherimide, polyamide, wholly aromatic poly Bromide, polyphenyl sulfide, aramid (paper), glass, glass cloth, fluorine resin, polyvinyl chloride, polyvinylidene chloride, cellulose resin, silicone resin, metal (foil) can also be used such as paper.

粘着剤層３２の形成に用いる粘着剤としては、例えば、アクリル系粘着剤、ゴム系粘着剤等の一般的な感圧性粘着剤を用いることができる。また、粘着剤層３２は紫外線硬化型粘着剤により形成することができる。紫外線硬化型粘着剤は、紫外線の照射により架橋度を増大させてその粘着力を容易に低下させることができ、ダイシング工程後に紫外線照射することにピックアップを容易とすることができる。   As the pressure-sensitive adhesive used for forming the pressure-sensitive adhesive layer 32, for example, a general pressure-sensitive pressure-sensitive adhesive such as an acrylic pressure-sensitive adhesive or a rubber-based pressure-sensitive adhesive can be used. The pressure-sensitive adhesive layer 32 can be formed of an ultraviolet curable pressure-sensitive adhesive. The ultraviolet curable pressure-sensitive adhesive can increase the degree of crosslinking by irradiation with ultraviolet rays and easily reduce its adhesive strength, and can be easily picked up when irradiated with ultraviolet rays after the dicing step.

［ダイシング工程］
次に、図３で示されるように、半導体ウエハ４のダイシングを行う。これにより、半導体ウエハ４を所定のサイズに切断して個片化（小片化）し、半導体チップ５を製造する。ダイシングは、例えば、半導体ウエハ４の回路面側から常法に従い行われる。本工程で用いるダイシング装置としては特に限定されず、従来公知のものを用いることができる。 [Dicing process]
Next, as shown in FIG. 3, the semiconductor wafer 4 is diced. As a result, the semiconductor wafer 4 is cut into a predetermined size and divided into pieces (small pieces), whereby the semiconductor chip 5 is manufactured. Dicing is performed according to a conventional method from the circuit surface side of the semiconductor wafer 4, for example. It does not specifically limit as a dicing apparatus used at this process, A conventionally well-known thing can be used.

なお、ダイシングテープ３のエキスパンドを行う場合、該エキスパンドは従来公知のエキスパンド装置を用いて行うことができる。エキスパンド装置は、ダイシングリングを介してダイシングテープ３を下方へ押し下げることが可能なドーナッツ状の外リングと、外リングよりも径が小さくダイシングテープ３を支持する内リングとを有している。このエキスパンド工程により、後述のピックアップ工程において、隣り合う半導体チップ同士が接触して破損するのを防ぐことが出来る。   In addition, when expanding the dicing tape 3, the expanding can be performed using a conventionally known expanding apparatus. The expanding device has a donut-shaped outer ring that can push down the dicing tape 3 through the dicing ring, and an inner ring that has a smaller diameter than the outer ring and supports the dicing tape 3. By this expanding process, it is possible to prevent adjacent semiconductor chips from coming into contact with each other and being damaged in a pickup process described later.

［ピックアップ工程］
ダイシングテープ３に接着固定された半導体チップ５を回収する為に、図４で示されるように、半導体チップ５のピックアップを行って、半導体チップ５をダイシングテープ３より剥離させる。ピックアップの方法としては特に限定されず、従来公知の種々の方法を採用できる。例えば、個々の半導体チップ５を基材３１側からニードルによって突き上げ、突き上げられた半導体チップ５をピックアップ装置によってピックアップする方法等が挙げられる。 [Pickup process]
In order to collect the semiconductor chip 5 bonded and fixed to the dicing tape 3, the semiconductor chip 5 is picked up and peeled off from the dicing tape 3 as shown in FIG. 4. The pickup method is not particularly limited, and various conventionally known methods can be employed. For example, a method of pushing up the individual semiconductor chips 5 from the base 31 side with a needle and picking up the pushed-up semiconductor chips 5 with a pick-up device may be mentioned.

［フリップチップ接続工程］
ピックアップした半導体チップ５は、図５で示されるように、基板等の被着体に、フリップチップボンディング方式（フリップチップ実装方式）により固定させる。具体的には、半導体チップ５を、半導体チップ５の回路面（表面、回路パターン形成面、電極形成面などとも称される）が被着体６と対向する形態で、被着体６に常法に従い固定させる。例えば、半導体チップ５の回路面側に形成されているバンプ５１を、被着体６の接続パッドに被着された接合用の導電材（半田など）６１に接触させて押圧しながら導電材を溶融させることにより、半導体チップ５と被着体６との電気的導通を確保し、半導体チップ５を被着体６に固定させることができる（フリップチップボンディング工程）。このとき、半導体チップ５と被着体６との間には空隙が形成されており、その空隙間距離は、一般的に１５μｍ〜３００μｍ程度である。尚、半導体チップ５を被着体６上にフリップチップボンディング（フリップチップ接続）した後は、半導体チップ５と被着体６との対向面や間隙を洗浄してもよい。また、該空隙は、半導体装置の用途に応じて封止材（封止樹脂など）を充填させて封止してもよく、空隙のままとしておいてもよい。ただし、加速度センサ、圧力センサ、ジャイロセンサ等のＭＥＭＳや表面弾性波フィルター（ＳＡＷフィルター）においては、構造上、被着体と半導体チップとの間に空隙が形成されている必要があるため、このような用途においては、空隙のままとしておく。 [Flip chip connection process]
As shown in FIG. 5, the picked-up semiconductor chip 5 is fixed to an adherend such as a substrate by a flip chip bonding method (flip chip mounting method). Specifically, the semiconductor chip 5 is always placed on the adherend 6 such that the circuit surface (also referred to as a surface, a circuit pattern formation surface, an electrode formation surface, etc.) of the semiconductor chip 5 faces the adherend 6. Fix according to law. For example, the bump 51 formed on the circuit surface side of the semiconductor chip 5 is brought into contact with a bonding conductive material (solder or the like) 61 attached to the connection pad of the adherend 6 while pressing the conductive material. By melting, it is possible to secure electrical continuity between the semiconductor chip 5 and the adherend 6 and fix the semiconductor chip 5 to the adherend 6 (flip chip bonding step). At this time, a gap is formed between the semiconductor chip 5 and the adherend 6, and the air gap distance is generally about 15 μm to 300 μm. Note that after the semiconductor chip 5 is flip-chip bonded (flip chip connection) on the adherend 6, the facing surface and the gap between the semiconductor chip 5 and the adherend 6 may be cleaned. Further, the gap may be sealed by being filled with a sealing material (such as a sealing resin) depending on the use of the semiconductor device, or may be left as it is. However, in MEMS and surface acoustic wave filters (SAW filters) such as acceleration sensors, pressure sensors, and gyro sensors, it is necessary to form a gap between the adherend and the semiconductor chip due to the structure. In such applications, leave the void.

被着体６としては、リードフレームや回路基板（配線回路基板など）等の各種基板を用いることができる。このような基板の材質としては、特に限定されるものではないが、セラミック基板や、プラスチック基板が挙げられる。プラスチック基板としては、例えば、エポキシ基板、ビスマレイミドトリアジン基板、ポリイミド基板等が挙げられる。   As the adherend 6, various substrates such as a lead frame and a circuit substrate (such as a wiring circuit substrate) can be used. The material of such a substrate is not particularly limited, and examples thereof include a ceramic substrate and a plastic substrate. Examples of the plastic substrate include an epoxy substrate, a bismaleimide triazine substrate, and a polyimide substrate.

フリップチップボンディング工程において、バンプや導電材の材質としては、特に限定されず、例えば、錫−鉛系金属材、錫−銀系金属材、錫−銀−銅系金属材、錫−亜鉛系金属材、錫−亜鉛−ビスマス系金属材等の半田類（合金）や、金系金属材、銅系金属材などが挙げられる。   In the flip chip bonding process, the material of the bump or the conductive material is not particularly limited, and examples thereof include a tin-lead metal material, a tin-silver metal material, a tin-silver-copper metal material, and a tin-zinc metal. Materials, solders (alloys) such as tin-zinc-bismuth metal materials, gold metal materials, copper metal materials, and the like.

なお、フリップチップボンディング工程では、導電材を溶融させて、半導体チップ５の回路面側のバンプと、被着体６の表面の導電材とを接続させているが、この導電材の溶融時の温度としては、通常、２６０℃程度（例えば、２５０℃〜３００℃）となっている。   In the flip chip bonding process, the conductive material is melted to connect the bumps on the circuit surface side of the semiconductor chip 5 and the conductive material on the surface of the adherend 6. The temperature is usually about 260 ° C. (for example, 250 ° C. to 300 ° C.).

次に、必要に応じて、フリップチップボンディングされた半導体チップ５と被着体６との間の間隙を封止するための封止工程を行う。封止工程は、アンダーフィル用封止樹脂を用いて行われる。このときの封止条件としては特に限定されないが、通常、１７５℃で６０秒間〜９０秒間の加熱を行うことにより、封止樹脂の熱硬化が行われるが、本発明はこれに限定されず、例えば１６５℃〜１８５℃で、数分間キュアすることができる。   Next, if necessary, a sealing step for sealing the gap between the flip-chip bonded semiconductor chip 5 and the adherend 6 is performed. The sealing step is performed using an underfill sealing resin. Although it does not specifically limit as sealing conditions at this time, Usually, the thermosetting of the sealing resin is performed by heating at 175 ° C. for 60 seconds to 90 seconds, but the present invention is not limited thereto, For example, it can be cured at 165 ° C. to 185 ° C. for several minutes.

前記アンダーフィル用封止樹脂としては、絶縁性を有する樹脂（絶縁樹脂）であれば特に制限されず、公知の封止樹脂等の封止材から適宜選択して用いることができるが、弾性を有する絶縁樹脂がより好ましい。アンダーフィル用封止樹脂としては、例えば、エポキシ樹脂を含む樹脂組成物等が挙げられる。エポキシ樹脂としては、前記に例示のエポキシ樹脂等が挙げられる。また、エポキシ樹脂を含む樹脂組成物によるアンダーフィル用封止樹脂としては、樹脂成分として、エポキシ樹脂以外に、エポキシ樹脂以外の熱硬化性樹脂（フェノール樹脂など）や、熱可塑性樹脂などが含まれていてもよい。なお、フェノール樹脂としては、エポキシ樹脂の硬化剤としても利用することができ、このようなフェノール樹脂としては、前記に例示のフェノール樹脂などが挙げられる。   The underfill sealing resin is not particularly limited as long as it is an insulating resin (insulating resin), and can be appropriately selected from sealing materials such as known sealing resins. An insulating resin is more preferable. Examples of the underfill sealing resin include a resin composition containing an epoxy resin. Examples of the epoxy resin include the epoxy resins exemplified above. In addition, the sealing resin for underfill using a resin composition containing an epoxy resin includes, as a resin component, a thermosetting resin other than an epoxy resin (such as a phenol resin) or a thermoplastic resin. It may be. In addition, as a phenol resin, it can utilize also as a hardening | curing agent of an epoxy resin, As such a phenol resin, the phenol resin illustrated above etc. are mentioned.

［電子部品封止用樹脂シートの積層工程］
電子部品封止用樹脂シートの積層工程では、半導体チップ５を覆うように半導体チップ５側から電子部品封止用樹脂シート２を被着体６上に積層する（図６参照）。この電子部品封止用樹脂シート２は、半導体チップ５及びそれに付随する要素を外部環境から保護するための封止樹脂として機能する。 [Lamination process of resin sheet for sealing electronic parts]
In the stacking process of the electronic component sealing resin sheet, the electronic component sealing resin sheet 2 is stacked on the adherend 6 from the semiconductor chip 5 side so as to cover the semiconductor chip 5 (see FIG. 6). The electronic component sealing resin sheet 2 functions as a sealing resin for protecting the semiconductor chip 5 and its accompanying elements from the external environment.

電子部品封止用樹脂シート２の積層方法としては特に限定されず、電子部品封止用樹脂シートを形成するための樹脂組成物の溶融混練物を押出成形し、押出成形物を半導体チップ５側から被着体６上に載置してプレスすることにより電子部品封止用樹脂シートの形成と積層とを一括にて行う方法や、電子部品封止用樹脂シートを形成するための樹脂組成物を半導体チップ５側から被着体６上に塗布し、その後乾燥させる方法、該樹脂組成物を離型処理シート上に塗布し、塗布膜を乾燥させて電子部品封止用樹脂シート２を形成した上で、この電子部品封止用樹脂シート２を半導体チップ５側から被着体６上に転写する方法などが挙げられる。   The method for laminating the resin sheet 2 for sealing an electronic component is not particularly limited, and a melt-kneaded product of a resin composition for forming the resin sheet for sealing an electronic component is extruded, and the extruded product is formed on the semiconductor chip 5 side. A method for forming and laminating a resin sheet for encapsulating electronic parts in a lump by placing and pressing on an adherend 6 from the substrate, and a resin composition for forming a resin sheet for encapsulating electronic parts Is applied to the adherend 6 from the semiconductor chip 5 side, and then dried, the resin composition is applied onto the release treatment sheet, and the coating film is dried to form the resin sheet 2 for sealing an electronic component. Then, a method of transferring the resin sheet 2 for sealing an electronic component from the semiconductor chip 5 side onto the adherend 6 is exemplified.

電子部品封止用樹脂シート２がシート状であるため、半導体チップ５の被覆をする際は、半導体チップ５側から被着体６上に貼り付けるだけで半導体チップ５を埋め込むことができ、半導体装置の生産効率を向上させることができる。この場合、熱プレスやラミネーターなど公知の方法により電子部品封止用樹脂シート２を被着体６上に積層することができる。熱プレス条件としては、温度が、例えば、４０〜１２０℃、好ましくは、５０〜１００℃であり、圧力が、例えば、５０〜２５００ｋＰａ、好ましくは、１００〜２０００ｋＰａであり、時間が、例えば、０．３〜１０分間、好ましくは、０．５〜５分間である。また、電子部品封止用樹脂シート２の半導体チップ５への密着性および追従性の向上を考慮すると、好ましくは、減圧条件下（例えば１０〜２０００Ｐａ）において、プレスすることが好ましい。   Since the electronic component sealing resin sheet 2 is in a sheet form, when the semiconductor chip 5 is coated, the semiconductor chip 5 can be embedded simply by sticking on the adherend 6 from the semiconductor chip 5 side. The production efficiency of the apparatus can be improved. In this case, the resin sheet 2 for electronic component sealing can be laminated on the adherend 6 by a known method such as hot press or laminator. As the hot press conditions, the temperature is, for example, 40 to 120 ° C., preferably 50 to 100 ° C., the pressure is, for example, 50 to 2500 kPa, preferably 100 to 2000 kPa, and the time is, for example, 0 .3 to 10 minutes, preferably 0.5 to 5 minutes. Moreover, when the improvement of the adhesiveness and followable | trackability to the semiconductor chip 5 of the resin sheet 2 for electronic component sealing is considered, it is preferable to press on pressure reduction conditions (for example, 10-2000 Pa).

このようにして半導体チップ５側から被着体６上に電子部品封止用樹脂シート２を積層させた後、電子部品封止用樹脂シート２を硬化させる。電子部品封止用樹脂シート２の硬化は、１２０℃から１９０℃の温度範囲、１分から６０分の加熱時間、０．１ＭＰａから１０ＭＰａの圧力にて行われる。以上により、樹脂封止型半導体装置５０が得られる。特に、被着体６と半導体チップ５との間にアンダーフィル用封止樹脂を用いなかった場合には、被着体６と半導体チップ５との間に、空隙５２が形成されている樹脂封止型半導体装置５０を製造することができる。   In this way, after the electronic component sealing resin sheet 2 is laminated on the adherend 6 from the semiconductor chip 5 side, the electronic component sealing resin sheet 2 is cured. The electronic component sealing resin sheet 2 is cured in a temperature range of 120 ° C. to 190 ° C., a heating time of 1 minute to 60 minutes, and a pressure of 0.1 MPa to 10 MPa. As described above, the resin-encapsulated semiconductor device 50 is obtained. In particular, when an underfill sealing resin is not used between the adherend 6 and the semiconductor chip 5, the resin seal in which a gap 52 is formed between the adherend 6 and the semiconductor chip 5. The stationary semiconductor device 50 can be manufactured.

上述した実施形態では、電子部品封止用樹脂シートをフリップチップ型の半導体装置の製造に用いられる場合について説明した。しかしながら、本発明の電子部品封止用樹脂シートは、この例に限定されず、半導体チップの裏面が被着体に貼り付けられている半導体装置の製造にも用いることができる。   In the embodiment described above, the case where the resin sheet for sealing an electronic component is used for manufacturing a flip chip type semiconductor device has been described. However, the resin sheet for sealing an electronic component of the present invention is not limited to this example, and can be used for manufacturing a semiconductor device in which the back surface of a semiconductor chip is attached to an adherend.

上述した実施形態では、半導体チップの裏面には何も貼り付けられていない場合について説明したが、本発明ではこの例に限定されず、半導体チップの裏面に、フリップチップ型半導体裏面用フィルムを貼り付けてもよい。フリップチップ型半導体裏面用フィルムは、半導体チップをフリップチップボンディングにより基板に実装する際に、半導体チップの裏面（露出している裏面）を保護するために用いられるものであり、従来公知のものを採用することができる。   In the above-described embodiment, the case where nothing is attached to the back surface of the semiconductor chip has been described. However, the present invention is not limited to this example, and a flip chip type semiconductor back film is attached to the back surface of the semiconductor chip. May be attached. The flip chip type film for semiconductor back surface is used to protect the back surface (exposed back surface) of the semiconductor chip when the semiconductor chip is mounted on the substrate by flip chip bonding. Can be adopted.

上述した実施形態では、被着体上にフリップチップ接続された半導体チップを覆うように、半導体チップ側から電子部品封止用樹脂シートを積層する場合について説明したが、本発明における電子部品封止用樹脂シートは、半導体チップに限らず、その他の電子部品（例えば、コンデンサ、抵抗等）を覆うように、積層してもよい。すなわち、本発明の電子部品封止用樹脂シートは、半導体チップの埋め込みに限定されず、その他の電子部品の埋め込みに使用してもよい。   In the above-described embodiment, the case where the resin sheet for sealing an electronic component is laminated from the semiconductor chip side so as to cover the semiconductor chip flip-chip connected to the adherend has been described. The resin sheet for use may be laminated so as to cover not only the semiconductor chip but also other electronic components (for example, a capacitor, a resistor, etc.). That is, the resin sheet for encapsulating electronic components of the present invention is not limited to embedding semiconductor chips, and may be used for embedding other electronic components.

以下、本発明に関し実施例を用いて詳細に説明するが、本発明はその要旨を超えない限り、以下の実施例に限定されるものではない。また、各例中、部は特記がない限りいずれも重量基準である。   EXAMPLES Hereinafter, although this invention is demonstrated in detail using an Example, this invention is not limited to a following example, unless the summary is exceeded. In each example, all parts are based on weight unless otherwise specified.

＜電子部品封止用樹脂シートの混練物の作製＞
（実施例１）
以下の成分を２軸混練り機により、１２０℃で５分間混練し、混練物を調製した。 <Preparation of kneaded product of resin sheet for sealing electronic parts>
Example 1
The following components were kneaded with a biaxial kneader at 120 ° C. for 5 minutes to prepare a kneaded product.

Ａ成分（エポキシ樹脂）：ビスフェノールＦ型エポキシ樹脂（東都化成（株）社製、ＹＳＬＶ−８０ＸＹ） ３．３８部
Ｂ成分（フェノール樹脂）：ビフェニルアラルキル骨格を有するフェノール樹脂（明和化成社製、ＭＥＨ７８５１ＳＳ） ３．５８部
Ｃ成分（エラストマー）：熱可塑性エラストマー（（株）カネカ社製、製品名：ＳＩＢＳＴＥＲ ０７２Ｔ） ３．０４部
Ｄ成分（無機充填剤）：球状シリカ（電気化学工業社製、製品名ＦＢ−９４５４ＦＣ、平均粒子径２０μｍ） ８８部
Ｅ成分（硬化促進剤）：硬化触媒としてのイミダゾール系触媒（四国化成工業（株）製２ＰＨＺ−ＰＷ） ０．１１９部
その他成分１：カーボンブラック（三菱化学社製、＃３０３０Ｂ） ０．３部
その他成分２：難燃剤（フェノキシホスファゼンオリゴマー、製品名：ＦＰ−１００、伏見製薬所製） １．５８部 Component A (epoxy resin): bisphenol F type epoxy resin (manufactured by Toto Kasei Co., Ltd., YSLV-80XY) 3.38 parts Component B (phenol resin): phenol resin having a biphenylaralkyl skeleton (Maywa Kasei Co., Ltd., MEH7851SS) 3.58 parts C component (elastomer): thermoplastic elastomer (manufactured by Kaneka Corporation, product name: SIBSTER 072T) 3.04 parts D component (inorganic filler): spherical silica (manufactured by Denki Kagaku Kogyo Co., Ltd., product) Name FB-9454FC, average particle size 20 μm) 88 parts E component (curing accelerator): imidazole catalyst as a curing catalyst (2PHZ-PW manufactured by Shikoku Chemicals Co., Ltd.) 0.119 part Other components 1: Carbon black ( Mitsubishi Chemical Corporation, # 3030B) 0.3 part Other components 2: Flame retardant (phenoxyphosphazene oligo) Over, the product name: FP-100, manufactured by Fushimiseiyakusho) 1.58 parts

次に、上記混練物を押出成形し、押出成形物を真空プレスにて一定の厚み（本実施例１では、２５０μｍ）とした。真空プレスは、９０度に熱したチャンバー内を真空状態にし、５分間プレス（プレス圧：２ＭＰａ）の条件で行なった。これにより、実施例１に係る電子部品封止用樹脂シートを得た。その後、１５０℃で１時間加熱し、硬化させた。   Next, the kneaded product was extrusion molded, and the extruded product was made constant thickness (250 μm in Example 1) by a vacuum press. The vacuum pressing was performed under the condition of pressing the inside of the chamber heated to 90 ° C. for 5 minutes (pressing pressure: 2 MPa). Thereby, the resin sheet for electronic component sealing which concerns on Example 1 was obtained. Then, it heated at 150 degreeC for 1 hour, and was hardened.

（実施例２〜６、及び、比較例１）
配合量を表１の通りに変更した以外は、実施例１と同様にして実施例２〜６、及び、比較例１に係るに電子部品封止用樹脂シートを得た。その後、１５０℃で１時間加熱し、硬化させた。 (Examples 2-6 and Comparative Example 1)
Except having changed the compounding quantity as Table 1, it carried out similarly to Example 1, and obtained the resin sheet for electronic component sealing based on Examples 2-6 and the comparative example 1. FIG. Then, it heated at 150 degreeC for 1 hour, and was hardened.

（実施例７）
以下の成分を４００重量部のメチルエチルケトンに溶解し、ホモジナイザーにて均一になるように配合した。 (Example 7)
The following components were dissolved in 400 parts by weight of methyl ethyl ketone and blended so as to be uniform with a homogenizer.

Ａ成分１（エポキシ樹脂１）：（ＤＩＣ社製、ＥＸＡ−４８５０−１５０）３．６２部
Ａ成分２（エポキシ樹脂２）：ノボラック型エポキシ樹脂（大日本インキ社製、ＥＰＰＮ５０１ＨＹ） １．５３部
Ｂ成分（フェノール樹脂）：（群栄化学製、ＧＳ−２００） １．８４部
Ｃ成分（エラストマー）：アクリル酸ブチル８６部、アクリロニトリル７部、メタクリル酸グリシジル７部からなる重量平均分子量７５万のアクリル系共重合体
１７．０２部
Ｄ成分（無機充填剤）：球状シリカ（アドマテックス社製、ＳＯ−Ｅ２、平均粒子径０．５μｍ） ７５部
Ｅ成分（硬化促進剤）：硬化触媒としてのイミダゾール系触媒（四国化成工業（株）製２ＰＨＺ−ＰＷ） ０．２５部
その他成分：カーボンブラック（三菱化学社製、＃２０） ０．７４部 A component 1 (epoxy resin 1): 3.62 parts (manufactured by DIC, EXA-4850-150) A component 2 (epoxy resin 2): novolac type epoxy resin (manufactured by Dainippon Ink Co., Ltd., EPPN501HY) 1.53 parts Component B (phenol resin): (Gunei Chemical Co., GS-200) 1.84 parts Component C (elastomer): 86 parts by weight of butyl acrylate, 7 parts of acrylonitrile, 7 parts of glycidyl methacrylate and having a weight average molecular weight of 750,000 Acrylic copolymer
17.02 parts D component (inorganic filler): spherical silica (manufactured by Admatechs, SO-E2, average particle size 0.5 μm) 75 parts E component (curing accelerator): imidazole catalyst as a curing catalyst (Shikoku 2PHZ-PW manufactured by Kasei Kogyo Co., Ltd.) 0.25 part Other components: Carbon black (Mitsubishi Chemical Corporation, # 20) 0.74 part

次に、上記配合物をコンマコーターを用いて塗工し、溶剤乾燥することにより厚みが５０μｍの樹脂シートを得た。その後、７０℃に加熱したロールラミネータにて上記樹脂シートを５枚積層することにより、厚さ２５０μｍの実施例７に係る電子部品封止用樹脂シートを得た。その後、透湿度測定用に１５０℃で１時間加熱し、硬化させた。   Next, the compound was coated using a comma coater and dried with a solvent to obtain a resin sheet having a thickness of 50 μm. Then, the resin sheet for electronic component sealing which concerns on Example 7 with a thickness of 250 micrometers was obtained by laminating | stacking five said resin sheets with the roll laminator heated at 70 degreeC. Thereafter, it was cured by heating at 150 ° C. for 1 hour for moisture permeability measurement.

（比較例２、及び、比較例３）
配合量を表２の通りに変更した以外は、実施例７と同様にして比較例２、及び、比較例３に係るに電子部品封止用樹脂シートを得た。その後、１５０℃で１時間加熱し、硬化させた。 (Comparative Example 2 and Comparative Example 3)
Except having changed the compounding quantity as Table 2, it carried out similarly to Example 7, and obtained the resin sheet for electronic component sealing based on the comparative example 2 and the comparative example 3. FIG. Then, it heated at 150 degreeC for 1 hour, and was hardened.

＜透湿度測定＞
ＪＩＳ Ｚ ０２０８（カップ法）の規定に準じて、実施例、比較例で作成した電子部品封止用樹脂シート（熱硬化後）の透湿度を測定した。測定条件は下記の通りとした。結果を表１、及び、表２に示す。
（測定条件１）
温度８５℃、湿度８５％、１６８時間、電子部品封止用樹脂シートの厚さ：２５０μｍ
（測定条件２）
温度６０℃、湿度９０％、１６８時間、電子部品封止用樹脂シートの厚さ：２５０μｍ <Measurement of moisture permeability>
In accordance with the provisions of JIS Z 0208 (cup method), the moisture permeability of the electronic component sealing resin sheets (after thermosetting) prepared in Examples and Comparative Examples was measured. The measurement conditions were as follows. The results are shown in Table 1 and Table 2.
(Measurement condition 1)
Temperature 85 ° C., humidity 85%, 168 hours, thickness of resin sheet for sealing electronic components: 250 μm
(Measurement condition 2)
Temperature 60 ° C., humidity 90%, 168 hours, thickness of resin sheet for sealing electronic parts: 250 μm

＜信頼性評価結果＞
厚さ０．５ｍｍのアルミナ基板に、１ｍｍｘ１ｍｍｘ０．２ｍｍｔサイズのＳｉチップ２５個（５列×５列、チップ間隔は０．５ｍｍとした）が、金バンプによって超音波接続されたもの（チップ下面と基板とのギャップ：２０μｍ）を準備した。
次に、実施例、及び、比較例にて作製した電子部品封止用樹脂シートを用いて、真空プレスにより上記Ｓｉチップの封止を行い（封止条件：５０℃、１ＭＰａ、１分、真空度１０００Ｐａ）、１５０℃で１時間硬化させた。これにより各チップの下部に空隙が形成された状態の硬化物を得た。その後、ダイシングにより個別のパッケージに分割した。これをＪＥＤＥＣのＭＳＬ１（Ｍｏｉｓｔｕｒｅ Ｓｅｎｓｉｔｉｖｉｔｙ Ｌｅｖｅｌ）試験に準拠した手法で、８５℃、８５％、１６８時間の条件にて吸湿させた。その後、ＩＲリフロー装置にて２６０℃×３回の吸湿リフロー試験を行った。試験後のパッケージを超音波顕微鏡で観察し、基板、樹脂間に剥離が観察されたものを×、観察されなかったものを○とした。結果を表１、及び、表２に示す。 <Reliability evaluation results>
A 25 mm 1 mm × 1 mm × 0.2 mmt size Si chip (5 rows × 5 rows, with a chip spacing of 0.5 mm) ultrasonically connected by gold bumps to a 0.5 mm thick alumina substrate (chip bottom surface and A gap with the substrate: 20 μm) was prepared.
Next, the Si chip was sealed by vacuum press using the resin sheet for sealing an electronic component produced in Examples and Comparative Examples (sealing conditions: 50 ° C., 1 MPa, 1 minute, vacuum And cured at 150 ° C. for 1 hour. As a result, a cured product in a state where voids were formed at the bottom of each chip was obtained. Then, it was divided into individual packages by dicing. This was moisture-absorbed under conditions of 85 ° C., 85%, and 168 hours by a method based on JEDEC's MSL1 (Moisture Sensitivity Level) test. Then, the moisture absorption reflow test was performed 3 times at 260 ° C. using an IR reflow apparatus. The package after the test was observed with an ultrasonic microscope. The case where peeling was observed between the substrate and the resin was indicated as x, and the case where no separation was observed was indicated as ◯. The results are shown in Table 1 and Table 2.

２ 電子部品封止用樹脂シート
３ ダイシングテープ
３１ 基材
３２ 粘着剤層
４ 半導体ウエハ
５ 半導体チップ
５１ 半導体チップ５の回路面側に形成されているバンプ
５２ 空隙
６ 被着体
６１ 被着体６の接続パッドに被着された接合用の導電材 2 Electronic component sealing resin sheet 3 Dicing tape 31 Base material 32 Adhesive layer 4 Semiconductor wafer 5 Semiconductor chip 51 Bumps formed on the circuit surface side of the semiconductor chip 5 52 Void 6 Adhered body 61 Adhered body 6 Conductive material for bonding applied to connection pad

Claims (6)

樹脂封止型半導体装置の製造に使用される電子部品封止用樹脂シートであって、
無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含み、
厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であることを特徴とする電子部品封止用樹脂シート。 An electronic component sealing resin sheet used for manufacturing a resin-encapsulated semiconductor device,
Including 70 to 93% by weight of an inorganic filler with respect to the entire electronic component sealing resin sheet,
For sealing electronic parts, wherein the moisture permeability after thermosetting when the thickness is 250 μm is 300 g / m 2 · 24 hours or less under the conditions of a temperature of 85 ° C., a humidity of 85%, and 168 hours Resin sheet. 厚さ２５０μｍにした際の熱硬化後の透湿度が、温度６０℃、湿度９０％、１６８時間の条件下において、１００ｇ／ｍ２・２４時間以下であることを特徴とする請求項１に記載の電子部品封止用樹脂シート。 The moisture permeability after thermosetting when the thickness is 250 µm is 100 g / m 2 · 24 hours or less under the conditions of a temperature of 60 ° C, a humidity of 90%, and 168 hours. Resin sheet for sealing electronic parts. 混練押出により製造されていることを特徴とする請求項１又は２に記載の電子部品封止用樹脂シート。   The resin sheet for sealing an electronic component according to claim 1 or 2, wherein the resin sheet is manufactured by kneading extrusion. 被着体と、
前記被着体にフリップチップ接続された半導体チップと、
前記半導体チップを封止する電子部品封止用樹脂シートと
を備え、
前記電子部品封止用樹脂シートは、
無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含み、厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であり、
前記被着体と前記半導体チップとの間には、空隙が形成されていることを特徴とする樹脂封止型半導体装置。 The adherend,
A semiconductor chip flip-chip connected to the adherend;
An electronic component sealing resin sheet for sealing the semiconductor chip,
The electronic component sealing resin sheet is:
The moisture permeability after thermosetting when the inorganic filler is 70 to 93% by weight and the thickness is 250 μm with respect to the entire resin sheet for sealing an electronic component is a temperature 85 ° C., humidity 85%, and 168 hours. Below, 300 g / m 2 · 24 hours or less,
A resin-encapsulated semiconductor device, wherein a gap is formed between the adherend and the semiconductor chip. 請求項１〜３のいずれか１に記載の電子部品封止用樹脂シートを有する樹脂封止型半導体装置。   A resin-encapsulated semiconductor device comprising the electronic component-encapsulating resin sheet according to claim 1. 樹脂封止型半導体装置の製造方法であって、
被着体上にフリップチップ接続された半導体チップを覆うように、半導体チップ側から電子部品封止用樹脂シートを積層する工程を具備し、
前記電子部品封止用樹脂シートは、
無機充填剤を電子部品封止用樹脂シート全体に対して、７０〜９３重量％含み、
厚さ２５０μｍにした際の熱硬化後の透湿度が、温度８５℃、湿度８５％、１６８時間の条件下において、３００ｇ／ｍ２・２４時間以下であることを特徴とする樹脂封止型半導体装置の製造方法。 A method for manufacturing a resin-encapsulated semiconductor device,
A step of laminating a resin sheet for sealing an electronic component from the semiconductor chip side so as to cover the semiconductor chip flip-chip connected on the adherend,
The electronic component sealing resin sheet is:
Including 70 to 93% by weight of an inorganic filler with respect to the entire electronic component sealing resin sheet,
The resin-encapsulated semiconductor having a moisture permeability of 300 g / m 2 · 24 hours or less under conditions of a temperature of 85 ° C., a humidity of 85% and a humidity of 168 hours when the thickness is 250 μm Device manufacturing method.
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