JP2016201557A5 - - Google Patents
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- Publication number
- JP2016201557A5 JP2016201557A5 JP2016135649A JP2016135649A JP2016201557A5 JP 2016201557 A5 JP2016201557 A5 JP 2016201557A5 JP 2016135649 A JP2016135649 A JP 2016135649A JP 2016135649 A JP2016135649 A JP 2016135649A JP 2016201557 A5 JP2016201557 A5 JP 2016201557A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- amide group
- structural unit
- containing polymer
- main chain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 125000003368 amide group Chemical group 0.000 claims 5
- 229920000642 polymer Polymers 0.000 claims 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 4
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 4
- 238000005498 polishing Methods 0.000 claims 4
- 229910052710 silicon Inorganic materials 0.000 claims 4
- 239000010703 silicon Substances 0.000 claims 4
- 229910052799 carbon Inorganic materials 0.000 claims 2
- 125000003156 secondary amide group Chemical group 0.000 claims 2
- 125000003142 tertiary amide group Chemical group 0.000 claims 2
- 239000006061 abrasive grain Substances 0.000 claims 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims 1
- 125000003342 alkenyl group Chemical group 0.000 claims 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 claims 1
- 125000003545 alkoxy group Chemical group 0.000 claims 1
- 125000000217 alkyl group Chemical group 0.000 claims 1
- 125000000304 alkynyl group Chemical group 0.000 claims 1
- 125000003710 aryl alkyl group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 claims 1
- 125000001309 chloro group Chemical group Cl* 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- VILAVOFMIJHSJA-UHFFFAOYSA-N dicarbon monoxide Chemical group [C]=C=O VILAVOFMIJHSJA-UHFFFAOYSA-N 0.000 claims 1
- 125000001028 difluoromethyl group Chemical group [H]C(F)(F)* 0.000 claims 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 1
- 125000001424 substituent group Chemical group 0.000 claims 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013120328 | 2013-06-07 | ||
| JP2013120328 | 2013-06-07 | ||
| JP2014010836 | 2014-01-23 | ||
| JP2014010836 | 2014-01-23 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015521346A Division JP6037416B2 (ja) | 2013-06-07 | 2014-05-02 | シリコンウエハ研磨用組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016201557A JP2016201557A (ja) | 2016-12-01 |
| JP2016201557A5 true JP2016201557A5 (show.php) | 2017-04-13 |
| JP6360108B2 JP6360108B2 (ja) | 2018-07-18 |
Family
ID=52007952
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015521346A Active JP6037416B2 (ja) | 2013-06-07 | 2014-05-02 | シリコンウエハ研磨用組成物 |
| JP2016135649A Active JP6360108B2 (ja) | 2013-06-07 | 2016-07-08 | シリコンウエハ研磨用組成物 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015521346A Active JP6037416B2 (ja) | 2013-06-07 | 2014-05-02 | シリコンウエハ研磨用組成物 |
Country Status (8)
| Country | Link |
|---|---|
| US (2) | US20160122591A1 (show.php) |
| EP (1) | EP3007213B1 (show.php) |
| JP (2) | JP6037416B2 (show.php) |
| KR (1) | KR102239045B1 (show.php) |
| CN (1) | CN105264647B (show.php) |
| SG (1) | SG11201508398TA (show.php) |
| TW (1) | TWI650410B (show.php) |
| WO (1) | WO2014196299A1 (show.php) |
Families Citing this family (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6366139B2 (ja) * | 2014-12-25 | 2018-08-01 | 花王株式会社 | シリコンウェーハ用研磨液組成物の製造方法 |
| JP6403324B2 (ja) * | 2014-12-25 | 2018-10-10 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
| US10748778B2 (en) | 2015-02-12 | 2020-08-18 | Fujimi Incorporated | Method for polishing silicon wafer and surface treatment composition |
| KR102520942B1 (ko) * | 2015-02-12 | 2023-04-13 | 가부시키가이샤 후지미인코퍼레이티드 | 실리콘 웨이퍼의 연마 방법 및 표면 처리 조성물 |
| CN107735471B (zh) * | 2015-07-10 | 2021-02-12 | 费罗公司 | 用于抛光有机聚合物基眼用基材的浆液组合物和添加剂以及方法 |
| JP6801964B2 (ja) * | 2016-01-19 | 2020-12-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物及びシリコン基板の研磨方法 |
| KR102645587B1 (ko) | 2016-02-29 | 2024-03-11 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 및 이것을 사용한 연마 방법 |
| CN109716487B (zh) * | 2016-09-21 | 2023-12-01 | 福吉米株式会社 | 表面处理组合物 |
| EP3605588A4 (en) * | 2017-03-31 | 2021-01-13 | Fujimi Incorporated | POLISHING COMPOSITION |
| JP6916039B2 (ja) * | 2017-06-05 | 2021-08-11 | Ａｔシリカ株式会社 | 研磨用組成物 |
| CN111315835B (zh) * | 2017-11-06 | 2022-08-26 | 福吉米株式会社 | 研磨用组合物及其制造方法 |
| JP7353051B2 (ja) * | 2019-03-26 | 2023-09-29 | 株式会社フジミインコーポレーテッド | シリコンウェーハ研磨用組成物 |
| JP7356248B2 (ja) * | 2019-03-28 | 2023-10-04 | 株式会社フジミインコーポレーテッド | リンス用組成物およびリンス方法 |
| CN110922897B (zh) * | 2019-11-18 | 2024-03-08 | 宁波日晟新材料有限公司 | 一种用于硅化合物的低雾值无损伤抛光液及其制备方法 |
| JP7512035B2 (ja) * | 2019-12-24 | 2024-07-08 | ニッタ・デュポン株式会社 | 研磨用組成物 |
| WO2021182276A1 (ja) * | 2020-03-13 | 2021-09-16 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| US20230143074A1 (en) * | 2020-03-13 | 2023-05-11 | Fujimi Incorporated | Polishing composition and polishing method |
| JP7562453B2 (ja) | 2021-03-12 | 2024-10-07 | キオクシア株式会社 | 研磨液、研磨装置、及び研磨方法 |
| JP2024523285A (ja) * | 2021-06-14 | 2024-06-28 | インテグリス・インコーポレーテッド | 硬質基板の研削 |
| KR20240167843A (ko) | 2022-03-23 | 2024-11-28 | 가부시키가이샤 후지미인코퍼레이티드 | 연마용 조성물 |
| WO2024195575A1 (ja) * | 2023-03-20 | 2024-09-26 | 株式会社フジミインコーポレーテッド | 研磨用組成物 |
| WO2025115883A1 (ja) * | 2023-11-28 | 2025-06-05 | 大阪有機化学工業株式会社 | 研磨組成物 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100447551B1 (ko) * | 1999-01-18 | 2004-09-08 | 가부시끼가이샤 도시바 | 복합 입자 및 그의 제조 방법, 수계 분산체, 화학 기계연마용 수계 분산체 조성물 및 반도체 장치의 제조 방법 |
| KR20010046395A (ko) * | 1999-11-12 | 2001-06-15 | 안복현 | 연마용 조성물 |
| JPWO2004068570A1 (ja) * | 2003-01-31 | 2006-05-25 | 日立化成工業株式会社 | Ｃｍｐ研磨剤及び研磨方法 |
| EP1870928A4 (en) * | 2005-04-14 | 2009-01-21 | Showa Denko Kk | POLISH |
| CN101560373B (zh) | 2005-11-11 | 2013-09-04 | 日立化成株式会社 | 氧化硅用研磨剂、添加液以及研磨方法 |
| JPWO2008013226A1 (ja) * | 2006-07-28 | 2009-12-17 | 昭和電工株式会社 | 研磨組成物 |
| JP2008091524A (ja) * | 2006-09-29 | 2008-04-17 | Fujifilm Corp | 金属用研磨液 |
| JP2008181955A (ja) * | 2007-01-23 | 2008-08-07 | Fujifilm Corp | 金属用研磨液及びそれを用いた研磨方法 |
| JP2009123880A (ja) * | 2007-11-14 | 2009-06-04 | Showa Denko Kk | 研磨組成物 |
| CN102084465A (zh) * | 2008-02-01 | 2011-06-01 | 福吉米株式会社 | 研磨用组合物以及使用其的研磨方法 |
| US20110081780A1 (en) * | 2008-02-18 | 2011-04-07 | Jsr Corporation | Aqueous dispersion for chemical mechanical polishing and chemical mechanical polishing method |
| JP5207002B2 (ja) * | 2008-02-27 | 2013-06-12 | Ｊｓｒ株式会社 | 化学機械研磨用水系分散体およびそれを用いた化学機械研磨方法、化学機械研磨用水系分散体の再生方法 |
| CN104178088B (zh) * | 2008-04-23 | 2016-08-17 | 日立化成株式会社 | 研磨剂及使用该研磨剂的基板研磨方法 |
| JP5413456B2 (ja) * | 2009-04-20 | 2014-02-12 | 日立化成株式会社 | 半導体基板用研磨液及び半導体基板の研磨方法 |
| SG177270A1 (en) | 2009-07-15 | 2012-02-28 | Lam Res Corp | Materials and systems for advanced substrate cleaning |
| CN102666760B (zh) * | 2009-11-11 | 2015-11-25 | 可乐丽股份有限公司 | 化学机械抛光用浆料以及使用其的基板的抛光方法 |
| JP4772156B1 (ja) | 2010-07-05 | 2011-09-14 | 花王株式会社 | シリコンウエハ用研磨液組成物 |
| WO2012105651A1 (ja) * | 2011-02-03 | 2012-08-09 | ニッタ・ハース株式会社 | 研磨用組成物およびそれを用いた研磨方法 |
| CN107617968A (zh) * | 2012-02-21 | 2018-01-23 | 日立化成株式会社 | 研磨剂、研磨剂组和基体的研磨方法 |
| JP5822356B2 (ja) * | 2012-04-17 | 2015-11-24 | 花王株式会社 | シリコンウェーハ用研磨液組成物 |
-
2014
- 2014-05-02 KR KR1020157034595A patent/KR102239045B1/ko active Active
- 2014-05-02 CN CN201480032514.3A patent/CN105264647B/zh active Active
- 2014-05-02 SG SG11201508398TA patent/SG11201508398TA/en unknown
- 2014-05-02 JP JP2015521346A patent/JP6037416B2/ja active Active
- 2014-05-02 WO PCT/JP2014/062176 patent/WO2014196299A1/ja not_active Ceased
- 2014-05-02 EP EP14807048.5A patent/EP3007213B1/en active Active
- 2014-05-02 US US14/895,318 patent/US20160122591A1/en not_active Abandoned
- 2014-05-21 TW TW103117769A patent/TWI650410B/zh active
-
2016
- 2016-07-08 JP JP2016135649A patent/JP6360108B2/ja active Active
-
2017
- 2017-05-23 US US15/602,679 patent/US10745588B2/en active Active