JP2016197629A5 - - Google Patents

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JP2016197629A5
JP2016197629A5 JP2015076048A JP2015076048A JP2016197629A5 JP 2016197629 A5 JP2016197629 A5 JP 2016197629A5 JP 2015076048 A JP2015076048 A JP 2015076048A JP 2015076048 A JP2015076048 A JP 2015076048A JP 2016197629 A5 JP2016197629 A5 JP 2016197629A5
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recognition camera
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die transfer
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JP2015076048A
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Japanese (ja)
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JP2016197629A (ja
JP6438826B2 (ja
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JP2015076048A 2015-04-02 2015-04-02 ボンディング装置及びボンディング方法 Active JP6438826B2 (ja)

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Application Number Priority Date Filing Date Title
JP2015076048A JP6438826B2 (ja) 2015-04-02 2015-04-02 ボンディング装置及びボンディング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015076048A JP6438826B2 (ja) 2015-04-02 2015-04-02 ボンディング装置及びボンディング方法

Publications (3)

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JP2016197629A JP2016197629A (ja) 2016-11-24
JP2016197629A5 true JP2016197629A5 (cg-RX-API-DMAC7.html) 2018-02-22
JP6438826B2 JP6438826B2 (ja) 2018-12-19

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JP2015076048A Active JP6438826B2 (ja) 2015-04-02 2015-04-02 ボンディング装置及びボンディング方法

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JP (1) JP6438826B2 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7018341B2 (ja) 2018-03-26 2022-02-10 ファスフォードテクノロジ株式会社 ダイボンディング装置および半導体装置の製造方法
JP7232071B2 (ja) * 2019-02-12 2023-03-02 株式会社ディスコ 加工装置におけるカメラの位置ずれ検出方法
DE102021105594B3 (de) * 2021-03-09 2022-06-09 Asm Assembly Systems Gmbh & Co. Kg Verfahren zur Positionskorrektur von Bauteilen mit einer Aufnahmevorrichtung, Aufnahmevorrichtung, Computerprogrammprodukt und computerlesbares Medium
JP7292463B1 (ja) * 2022-03-29 2023-06-16 キヤノンマシナリー株式会社 位置合わせ装置、位置合わせ方法、ボンディング装置、ボンディング方法、および半導体装置製造方法
JP7607973B1 (ja) 2023-07-31 2025-01-06 アスリートＦａ株式会社 電子部品接合装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4728293B2 (ja) * 2007-06-28 2011-07-20 ヤマハ発動機株式会社 部品移載装置
CH698334B1 (de) * 2007-10-09 2011-07-29 Esec Ag Verfahren für die Entnahme und Montage von auf einem Wafertisch bereitgestellten Halbleiterchips auf einem Substrat.
JP5344145B2 (ja) * 2008-12-25 2013-11-20 澁谷工業株式会社 ボンディング装置における電子部品と基板の位置合わせ方法
JP6259615B2 (ja) * 2013-09-13 2018-01-10 ファスフォードテクノロジ株式会社 ダイボンダ及びダイボンディング方法

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