JP2016197629A5 - - Google Patents
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- JP2016197629A5 JP2016197629A5 JP2015076048A JP2015076048A JP2016197629A5 JP 2016197629 A5 JP2016197629 A5 JP 2016197629A5 JP 2015076048 A JP2015076048 A JP 2015076048A JP 2015076048 A JP2015076048 A JP 2015076048A JP 2016197629 A5 JP2016197629 A5 JP 2016197629A5
- Authority
- JP
- Japan
- Prior art keywords
- reference mark
- recognition camera
- transfer tool
- origin
- die transfer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000003384 imaging method Methods 0.000 claims 6
- 230000000007 visual effect Effects 0.000 claims 5
- 239000000758 substrate Substances 0.000 claims 3
- 230000032258 transport Effects 0.000 claims 3
- 238000006073 displacement reaction Methods 0.000 claims 2
Claims (16)
前記ダイ移送ツールに設けられた第２の基準マークと、
前記第１の基準マークを視野範囲内とする認識カメラと、
前記ダイ移送ツールが、前記第２の基準マークの位置を、前記第１の基準マークの位置と一定の関係にある位置に前記認識カメラの撮像視野内で移動することに基づき、前記認識カメラの原点または前記ダイ移送ツールの原点を補正する補正手段と、
を有するボンディング装置。 A first fiducial mark provided within the movement range of the die transfer tool;
A second fiducial mark provided on the die transfer tool;
A recognition camera having the first fiducial mark within the field of view;
Said die transfer tool, the position of the second reference mark, based on be moved within the first imaging visual field position and the recognition camera to the location in the fixed relationship of the reference mark, the recognition camera origin or a correcting means for correcting the origin of the die transfer tool,
A bonding apparatus.
請求項１記載のボンディング装置。 The correction means, based on the trajectory due to the first reference mark in the imaging visual field of the recognition camera is moved, a manual stage you correct the origin of the recognition camera,
The bonding apparatus according to claim 1.
請求項１記載のボンディング装置。 The correction means, based on the trajectory due to the second reference marks in the imaging visual field of the recognition camera is moved, a manual stage you correct the origin of the die transfer tool,
The bonding apparatus according to claim 1.
前記補正手段は、前記第１−１の基準マークおよび第１−２の基準マークに基づき、前記ダイ移送ツールの原点を補正する手段である、
請求項１記載のボンディング装置。 The first reference mark is two reference marks, a 1-1 reference mark and a 1-2 reference mark,
It said correction means, before SL based on the reference mark and the 1-2 reference mark of the first -1, Ru means der you correct the origin of the die transfer tool,
The bonding apparatus according to claim 1 .
請求項４記載のボンディング装置。 It said correcting means, by the recognition camera takes an image of the reference marks of the first 1-1 fiducial mark and the second 1-2, a means for correcting the origin of the recognition camera,
The bonding apparatus according to claim 4.
請求項４または５記載のボンディング装置。 The correction means moves the die transfer tool so that the second reference mark coincides with the 1-1 reference mark position imaged by the recognition camera, and the first-2 imaged by the recognition camera. Means for correcting the origin of the die transfer tool by moving the die transfer tool so that the second reference mark coincides with the position of the reference mark.
Claim 4 or 5 bonding apparatus according.
前記ダイ移送ツールの原点の補正は、前記ダイ移送ツールの位置ずれまたは方向ずれの補正である、
請求項１乃至６のいずれか１項に記載のボンディング装置。 The correction of the origin of the recognition camera, or positional deviation of the recognition camera of the recognition system is a correction of the direction shift,
The correction of the origin of die transfer tool, positional displacement or the die transfer tool is a correction of the direction shift,
Bonding device according to any one of claims 1 to 6.
ボンディング方法。 The die transfer tool is arranged such that the position of the second reference mark provided on the die transfer tool is in a fixed relationship with the position of the first reference mark provided within the movement range of the die transfer tool. the basis that the first reference mark moves in the field of view of the recognition camera to the imaging field of view, the origin of the recognition camera or that have a correction method for correcting the origin of the die transfer tool,
Bonding method .
請求項９記載のボンディング方法。 The correction method is based on the trajectory due to the first reference mark in the imaging visual field of the recognition camera is moved, it is how you correct the movement origin of the recognition camera,
The bonding method according to claim 9.
請求項９記載のボンディング方法。 The correction method is based on the trajectory due to the second reference marks in the imaging visual field of the recognition camera is moved, it is how you correct the movement origin of the die transfer tool,
The bonding method according to claim 9.
請求項９記載のボンディング方法。 The correction method is provided on a transport path for transporting a substrate, and the die transfer tool is based on the first reference mark which is two reference marks of a 1-1 reference mark and a 1-2 reference mark. which is the way you correct the origin,
The bonding method according to claim 9.
請求項１２記載のボンディング方法。 The correction method, by the recognition camera takes an image of the reference marks of the first 1-1 fiducial mark and the second 1-2, a method of correcting the origin of the recognition camera,
The bonding method according to claim 12.
請求項１２または１３記載のボンディング方法。 In the correction method, the die transfer tool is moved so that the second reference mark coincides with the 1-1 reference mark position imaged by the recognition camera, and the first-2 imaged by the recognition camera. A method of correcting the origin of the die transfer tool by moving the die transfer tool so that the second reference mark coincides with the position of the reference mark of
12. or 13, wherein bonding method.
前記ダイ移送ツールの原点の補正は、前記ダイ移送ツールの位置ずれまたは方向ずれの補正である、
請求項９乃至１４のいずれか１項に記載のボンディング方法。 The correction of the origin of the recognition camera, or positional deviation of the recognition camera of the recognition system is a correction of the direction shift,
The correction of the origin of die transfer tool, positional displacement or the die transfer tool is a correction of the direction shift,
Bonding method according to any one of claims 9 to 14.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015076048A JP6438826B2 (en) | 2015-04-02 | 2015-04-02 | Bonding apparatus and bonding method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015076048A JP6438826B2 (en) | 2015-04-02 | 2015-04-02 | Bonding apparatus and bonding method |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016197629A JP2016197629A (en) | 2016-11-24 |
| JP2016197629A5 true JP2016197629A5 (en) | 2018-02-22 |
| JP6438826B2 JP6438826B2 (en) | 2018-12-19 |
Family
ID=57358533
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015076048A Active JP6438826B2 (en) | 2015-04-02 | 2015-04-02 | Bonding apparatus and bonding method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6438826B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7292463B1 (en) | 2022-03-29 | 2023-06-16 | キヤノンマシナリー株式会社 | Alignment Apparatus, Alignment Method, Bonding Apparatus, Bonding Method, and Semiconductor Device Manufacturing Method |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7018341B2 (en) | 2018-03-26 | 2022-02-10 | ファスフォードテクノロジ株式会社 | Manufacturing method of die bonding equipment and semiconductor equipment |
| JP7232071B2 (en) * | 2019-02-12 | 2023-03-02 | 株式会社ディスコ | Camera position deviation detection method in processing equipment |
| DE102021105594B3 (en) * | 2021-03-09 | 2022-06-09 | Asm Assembly Systems Gmbh & Co. Kg | Method for correcting the position of components with a recording device, recording device, computer program product and computer-readable medium |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4728293B2 (en) * | 2007-06-28 | 2011-07-20 | ヤマハ発動機株式会社 | Parts transfer device |
| CH698334B1 (en) * | 2007-10-09 | 2011-07-29 | Esec Ag | A process for the removal and installation of a wafer table provided on the semiconductor chip on a substrate. |
| JP5344145B2 (en) * | 2008-12-25 | 2013-11-20 | 澁谷工業株式会社 | Method for aligning electronic component and substrate in bonding apparatus |
| JP6259615B2 (en) * | 2013-09-13 | 2018-01-10 | ファスフォードテクノロジ株式会社 | Die bonder and die bonding method |
-
2015
- 2015-04-02 JP JP2015076048A patent/JP6438826B2/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7292463B1 (en) | 2022-03-29 | 2023-06-16 | キヤノンマシナリー株式会社 | Alignment Apparatus, Alignment Method, Bonding Apparatus, Bonding Method, and Semiconductor Device Manufacturing Method |
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