PH12014000181A1 - An apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components - Google Patents

An apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components

Info

Publication number
PH12014000181A1
PH12014000181A1 PH12014000181A PH12014000181A PH12014000181A1 PH 12014000181 A1 PH12014000181 A1 PH 12014000181A1 PH 12014000181 A PH12014000181 A PH 12014000181A PH 12014000181 A PH12014000181 A PH 12014000181A PH 12014000181 A1 PH12014000181 A1 PH 12014000181A1
Authority
PH
Philippines
Prior art keywords
handling
electronic components
imaging device
fiducial mark
handling device
Prior art date
Application number
PH12014000181A
Other versions
PH12014000181B1 (en
Inventor
Siu Hing Suen
Cheung Yu Sze
Original Assignee
Asm Tech Singapore Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Tech Singapore Pte Ltd filed Critical Asm Tech Singapore Pte Ltd
Publication of PH12014000181A1 publication Critical patent/PH12014000181A1/en
Publication of PH12014000181B1 publication Critical patent/PH12014000181B1/en

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
    • G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Environmental & Geological Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Length Measuring Devices By Optical Means (AREA)

Abstract

Disclosed is an apparatus for handling electronic components. The apparatus comprises: 5 i) a rotary device and a plurality of pick heads arranged circumferentially around the rotary device, each pick head being operable to hold an electronic component; ii) a position-determining device for determining an arrangement of the electronic components as held by the respective pick heads; iii) a fiducial mark arranged in a position that is indicative of the arrangement of the electronic 10 components, as determined by the position-determining device; iv) a first imaging device arranged relative to the fiducial mark; and v) at least one handling device for handling the electronic components. Specifically, the first imaging device is operable to capture at least one image comprising the fiducial mark and the at least one handling device so that a position of the at least one handling device is adjustable to align the at least one handling device with respect to the 15 arrangement of the electronic components, based on an offset between the fiducial mark and the at least one handling device as derived from the at least one image captured by the first imaging device. A method of adjusting the position of at least one handling device of an apparatus for handling electronic components is also disclosed.
PH12014000181A 2013-06-27 2014-06-25 An apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components PH12014000181B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201361839922P 2013-06-27 2013-06-27
US201461930744P 2014-01-23 2014-01-23

Publications (2)

Publication Number Publication Date
PH12014000181A1 true PH12014000181A1 (en) 2016-05-23
PH12014000181B1 PH12014000181B1 (en) 2016-05-23

Family

ID=52187855

Family Applications (1)

Application Number Title Priority Date Filing Date
PH12014000181A PH12014000181B1 (en) 2013-06-27 2014-06-25 An apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components

Country Status (5)

Country Link
KR (1) KR101582809B1 (en)
CN (1) CN104253070B (en)
MY (1) MY167674A (en)
PH (1) PH12014000181B1 (en)
TW (1) TWI544567B (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10115620B2 (en) * 2015-08-31 2018-10-30 Asm Technology Singapore Pte Ltd Apparatus and method for adjustment of a handling device for handling electronic components
US10324126B2 (en) * 2016-06-10 2019-06-18 Asm Technology Singapore Pte Ltd. Method and apparatus for aligning probe pins with respect to positions of electronic devices
US10473714B2 (en) * 2017-03-06 2019-11-12 Asm Technology Singapore Pte Ltd Method and apparatus for aligning electronic components
DE102021111953A1 (en) * 2021-05-07 2022-11-10 Mühlbauer Gmbh & Co. Kg Optical component inspection

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3738632B2 (en) * 1999-12-16 2006-01-25 セイコーエプソン株式会社 Detection data correction method for optical detection means, position detection apparatus provided with optical detection means, and electronic component mounting apparatus
JP4616514B2 (en) * 2001-06-07 2011-01-19 富士機械製造株式会社 Electrical component mounting system and position error detection method therefor
US7190446B2 (en) * 2003-12-19 2007-03-13 Asm Assembly Automation Ltd. System for processing electronic devices
KR20060094146A (en) * 2005-02-23 2006-08-29 삼성전자주식회사 Wafer aligner and method for align
US7851721B2 (en) * 2009-02-17 2010-12-14 Asm Assembly Automation Ltd Electronic device sorter comprising dual buffers
JP5510923B2 (en) * 2009-12-01 2014-06-04 上野精機株式会社 Position correcting apparatus and handler provided with the same
CN102540781B (en) * 2010-12-28 2015-09-30 上海微电子装备有限公司 A kind of backside alignment device and method
JP2012243920A (en) * 2011-05-18 2012-12-10 Sharp Corp Chip sorting device and chip sorting method
WO2013084296A1 (en) * 2011-12-06 2013-06-13 上野精機株式会社 Electronic component transporting device

Also Published As

Publication number Publication date
CN104253070B (en) 2017-07-07
PH12014000181B1 (en) 2016-05-23
TWI544567B (en) 2016-08-01
TW201503278A (en) 2015-01-16
CN104253070A (en) 2014-12-31
KR101582809B1 (en) 2016-01-07
KR20150002512A (en) 2015-01-07
MY167674A (en) 2018-09-21

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