CN104253070B - The apparatus and method that the processing equipment of semiconductor element is adjusted using imaging device - Google Patents
The apparatus and method that the processing equipment of semiconductor element is adjusted using imaging device Download PDFInfo
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- CN104253070B CN104253070B CN201410289675.2A CN201410289675A CN104253070B CN 104253070 B CN104253070 B CN 104253070B CN 201410289675 A CN201410289675 A CN 201410289675A CN 104253070 B CN104253070 B CN 104253070B
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- electronic component
- processing equipment
- reference mark
- imaging device
- alignment
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
- G01R31/2867—Handlers or transport devices, e.g. loaders, carriers, trays
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
A kind of device for processing electronic component of the present invention, including：Slewing and multiple pick-up heads set around its annular, each pick-up head fix electronic component；Location determining device, for determining arrangement when electronic component is fixed by respective pick-up head；Reference mark, is arranged on the position for indicating the electronic component arrangement determined by location determining device；First imaging device, is set relative to reference mark；At least one processing equipment, for processing electronic component.The capture of first imaging device includes at least one image of reference mark and at least one processing equipment, deviation extracted from least one image that the first imaging device is captured so as to basis, between reference mark and at least one processing equipment, adjusts the position of at least one processing equipment with the processing equipment of arrangement positioned in alignment at least one relative to electronic component.A kind of method of at least one processing equipment position for adjusting the device for processing electronic component is also disclosed.
Description
Technical field
Set the present invention relates to a kind for the treatment of by using imaging device to adjust one or more treatment semiconductor elements
The apparatus and method of standby (handling devices).
Background technology
Traditional testing, sorting machine (test handler) include turntable and be coupled to the turntable, for fixation partly lead
The pick-up head of body packaging part.In operation, the turntable is such as used to test the property of semiconductor package part in various processing equipments
The top rotation of the test module of energy.Specifically, the pick-up head for being fixed with semiconductor package part is moved to test module, in order to
Test semiconductor package part.Particularly, the test module must be relative to the semiconductor package part pair fixed by each pick-up head
Neat positioning, in order to obtain good processing stability, functional test production capacity high and low packaging part spoilage.
At present, between test module and semiconductor package part positioned in alignment or position adjustment is by using artificial judgment
And realize.Because artificial judgment is subjective, and the operation of testing, sorting machine is needed to be looked at straight, if so semiconductor package
Piece installing it is small-sized so it become it is difficult or even may.Further, since lacking data to be used as accuracy
Basis, in this way needs considerable manual skill and work.
So, the purpose of the present invention is to seek to eliminate the place for one or more treatment semiconductor package parts of positioned in alignment
The foregoing deficiency of the conventional method of reason equipment, and provide useful selection to the general public.
The content of the invention
Therefore, first aspect present invention provides a kind of device for processing electronic component, and the device includes：I) rotate
Equipment and multiple pick-up heads, the plurality of pick-up head are set around slewing annular, and each pick-up head is operated to fixed electricity
Subcomponent；Ii) location determining device, arrangement when it is used to determine that electronic component is fixed by respective pick-up head；Iii) benchmark
Mark, it is arranged on the position for indicating the arrangement of electronic component determined by location determining device；Iv) the first imaging sets
Standby, it is set relative to reference mark；And v) at least one processing equipment, it is used to process electronic component.Specifically, first
Imaging device is operated to capture at least one image for including reference mark and at least one processing equipment, in order to basis
It is being extracted from least one image that the first imaging device is captured, between reference mark and at least one processing equipment
Deviation, the position of at least one processing equipment can be adjusted with the arrangement positioned in alignment relative to electronic component this at least one
Processing equipment.
Second aspect present invention provides a kind of at least one processing equipment for adjusting the device for processing electronic component
The method of position, the device includes slewing and multiple pick-up heads, and the plurality of pick-up head sets around the slewing circumference
Put, the method includes following steps：Cloth when determining that electronic component is fixed by respective pick-up head using location determining device
Put；At least one image for including reference mark and at least one processing equipment, wherein base are captured using the first imaging device
Fiducial mark note is arranged on the position for indicating the arrangement of electronic component determined by location determining device；And according to from the first one-tenth
As deviation being extracted at least one image that equipment is captured, between reference mark and at least one processing equipment, adjust
The position of whole at least one processing equipment is with least one processing equipment of the arrangement positioned in alignment relative to electronic component.
Brief description of the drawings
Now only by the mode of example, presently preferred embodiments of the present invention is described in conjunction with the accompanying, wherein：
Fig. 1 a and Fig. 1 b show the respective side-looking of the testing, sorting machine for processing semiconductor element and overlook and illustrates
Figure, it includes the optical device with reference mark and side vision system；
Fig. 2 a show the side schematic view of the configuration of the testing, sorting machine shown in Fig. 1 a and Fig. 1 b, and it includes checks and regard
Feel system；
Fig. 2 b indicate reference mark and reposition with relative to checking the optical centre positioned in alignment of vision system, and scheme
2c indicates side vision system and repositions with the reference mark positioned in alignment side relative to the repositioning shown in Fig. 2 b
The optical centre of vision system；
Fig. 3 indicates the semiconductor element just fixed by pick-up head；
Fig. 4 indicates the repositioning of the optical device in testing, sorting machine, in order to the base shown in relocation clock 2b
Fiducial mark is remembered；
Fig. 5 indicates another configuration of testing, sorting machine, and it includes connecing for testing electronic element in more detail
Tentaculum (contactor)；
Fig. 6 indicates the image captured by side vision system in testing, sorting machine, after it includes positioned in alignment
Reference mark and contactor；
Fig. 7 indicates the reference mark positioned in alignment after contactor and alignment；
Fig. 8 indicates the another configuration of the testing, sorting machine shown in Fig. 5, and wherein contactor carries out motorization control；
Fig. 9 is indicated when electronic component is fixed by respective pick-up head for setting the finely positioning that electronic component is arranged
Device (precisor module) module；
Figure 10 indicates optional reference mark and repositions and determines with relative to the fine positioner module alignment shown in Fig. 9
Position；And
Figure 11 indicates the optical centre for checking vision system in testing, sorting machine of the semiconductor element relative to Fig. 2 a
Reposition.
Specific embodiment
According to present pre-ferred embodiments, Fig. 1 a are shown for processing semiconductor element, such as semiconductor package part
The device of (reference 8 shows one of them in figure 3, and is fixed by pick-up head clamp 9) (show testing, sorting machine
100) schematic side view.And the schematic top plan view of testing, sorting machine 100 is represented in Figure 1b.
Testing, sorting machine 100 includes：I) slewing (showing turntable 4)；Ii) it is multiple around the circular rings of turntable 4 around
The pick-up head 5 of setting, wherein each pick-up head 5 are operated to fix semiconductor package part 8；Iii) location determining device 6 is (as schemed
Vision system 60 is checked shown in 2c), the arrangement for determining semiconductor package part 8；Iv) at least one processing equipment, is used for
Treatment semiconductor package part 8 (contactor 11 for testing semiconductor element as shown in Figure 5)；V) one or more spiral shells are passed through
Bar 102 is attached to the optical device 3 on turntable 4, and wherein optical device 3 includes reference mark 2；And vi) side vision system
System 1, it is set relative to optical device 3.
Optical device 3 is configured to the typical figure of the image and contactor 11 to the transmission reference mark 2 of side vision system 1
Picture.Optical device 3 is probably optical splitter, reflective mirror or the prism for reflected image, and between two adjacent pick-up heads 5
A position at be mounted on turntable 4, as shown in Figure 1 b.Reference mark 2 be one can be by side vision system 1 easily
The pattern that views.In this example, reference mark 2 is checkerboard pattern (referring to, such as Fig. 2 b and 2c), but other figures
Case also can be what is used.More suitably, in the image captured by side vision system 1, the image quilt of reference mark 2
Covering (or overlap) is on the typical image of contactor 11.Specifically, side vision system 1 includes video camera, optics
And lighting apparatus, for checking the position of reference mark 2.Side vision system 1 is possibly mounted at support plate (bolster
Plate on).
It is worth noting that, the typical image of contactor 11 potentially includes any image of the position of detector bar 11,
And one or more local and/or marks from contactor 11 of contactor 11 may be included.
The use that reference mark 2 is used as reference marker will now be described, to carry out the position of one or more processing equipments
Put adjustment.
Fig. 2 a show the schematic side view of testing, sorting machine 100, the semiconductor packages thereby fixed by each pick-up head 5
The position of part 8 is checked that vision system 60 is captured, and follow-up analysis is carried out with by image procossing.Specifically, vision is checked
The aligned in position that system 60 is relocated during being fixed by each pick-up head 5 relative to semiconductor package part 8 positions its optics
Center.However, it is noteworthy that the repositioning for checking vision system 60 may not be necessary, as long as checking vision system
The average deviation between arrangement when the optical centre and semiconductor package part 8 of system 60 are fixed by each pick-up head 5 can be able to
It is determined that.
Next, when checking that vision system 60 keeps stationary positioned, turntable 4 rotates check the top of vision system 60
Optical device 3 is set, as shown in Figure 1 b.Side vision system 1 is moved with the synchronization-moving mode of turntable 4, in order to side
Holding positioned opposite between vision system 1 and turntable 4 is identical.This may by the way that side vision system 1 is coupled into turntable 4 and
It is accomplished.Alternatively, side vision system 1 may be separated with turntable 4, and be mounted to synchronization-moving with turntable 4
On driver.Also in addition, multiple side vision systems 1 may be set around turntable 4.
Then, the position of reference mark 2 is checked that vision system 60 is captured and is analyzed with by image procossing.More close
Suitable ground, reference mark 2 is repositioned in it and the positioned in alignment of optical centre 205 for checking vision system 60, such as Fig. 2 b
It is shown.Because optical device 3 is directly mounted on turntable 4 by screw rod 102, so the positioned in alignment of reference mark 2 or position
Adjustment can be accomplished, screw rod 102 by unclamping screw rod 102 and repositioning optical device 3 along respective track 104
Connected along the track 104 and secured on turntable 4 with by optical device 3, as shown in Figure 4.In this case, vision is thereby checked
The position when optical centre 205 of system 60 is fixed relative to semiconductor package part 8 by respective pick-up head 5 and position setting,
The repositioning of reference mark 2 means that the position of reference mark 2 can act as that at the optical centre 205 of vision system 60
The reference by location of a little semiconductor package parts 8.After reference mark 2 has been aligned positioning, then it will be used as general
Reference marker adjusting the position of contactor 11 and all other processing equipment.
However, it is worth noting again that the repositioning of reference mark 2 may not be necessary, as long as vision system
Deviation between 60 optical centre 205 and reference mark 2 can be determined.
Thereafter, the position of reference mark 2 is checked that vision system 60 is captured and is analyzed by image procossing.More close
Suitable ground, side vision system 1 is repositioned to optical centre 210 and the positioned in alignment of reference mark 2 in it, such as Fig. 2 c institutes
Show, but this repositioning can be omitted again, as long as the optical centre 210 of reference mark 2 and side vision system 1 it
Between deviation can be determined.
The position adjustment of contactor 11 will now be described.
First, as shown in figure 5, turntable 4 sets optical device 3 by positioned in sequence with the top of contactor 11.Then, side
Facial vision system 1 captures the image for including reference mark 2 and contactor 11, as shown in Figure 6.Specifically, the figure of reference mark 2
As being transmitted through optical device 3 to side vision system 1, and the image of the upper surface of contactor 11 is reflected by optical device 3
To side vision system 1.Thereafter, the image for being captured by side vision system 1 is analyzed, to extract reference mark 2 and contact
Deviation between device 11.Again, as shown in fig. 7, based on the deviation extracted, the position of contactor 11 is relative to reference mark 2
And adjusted.When the deviation between reference mark 2 and contactor 11 falls into the critical field of regulation, adjustment is achieved.
So thereby assuring that when the pick-up head 5 that semiconductor package part 8 is tested separator 100 in operation is fixed, partly leading
Body packaging part 8 and contactor 11 are by suitably positioned in alignment.In this example, the optical centre 210 of side vision system 1 by
This is relative to the positioned in alignment of reference mark 2 after alignment, weight of the contactor 11 at the optical centre 210 of side vision system 1
New definition equally can also realize the positioned in alignment of contactor 11 and semiconductor package part 8.
Alternatively, as shown in figure 8, contactor 11 can include motor 13,14,16 with relative to semiconductor package part 8
Mobile route provide tangent line on, radially andMovement on direction.In the case of contactor 11 using this motorization,
Deviation between reference mark 2 and the contactor of motorization 11 captured from side vision system 1 one or more
After being extracted in image, primary processor can correspondingly send the command signal for matching to motor 13,14,16, be somebody's turn to do with compensating
Deviation, for example, according to the distance between reference mark 2 and the contactor of motorization 11-angle difference relative to semiconductor packages
Part 8 adjusts the position of contactor 11 to be processed.
In another configuration of testing, sorting machine 100, location determining device 6 is a fine positioner module 600, such as
Shown in Fig. 9, instead of the position for checking vision system 60.Fine positioner module 600 is operable to, and in operation when
Each pick-up head 5 that semiconductor package part 8 is tested separator 100 is configured to set the cloth of semiconductor package part 8 when fixing
Put.More suitably, first, pick-up head 5 treatment pickup semiconductor package part 8 before, fine positioner module 600 relative to
The aligned in position positioning of pick-up head 5.Thereafter, pick-up head 5 is moved through fine positioner module 600 in order to by fine positioner
Module 600 determines the arrangement of semiconductor package part 8.Then, turntable 4 is rotated with positioned in sequence optical device 3 to fine positioner
The position of the top of module 600.Again, side vision system 1 is moved with the synchronization-moving mode of turntable 4, is regarded in order to side
Holding positioned opposite between feel system 1 and turntable 4 is identical.
Figure 10 indicates the image captured by side vision system 1, and it includes optional reference mark 200 and fine
Locator 600.Then, analyzed position and the fine positioner module to extract reference mark 200 of image for being captured
Deviation between 600 position.Thereafter, according to the deviation extracted, the position of optical device 3 is adjusted, so that passing through
Adjust optical device 3 position, reference mark 200 be relocated and with the positioned in alignment of fine positioner module 6, such as Figure 10 institutes
Show.By this way, the reference mark 200 after repositioning can be again acted as semiconductor package part 8 is picked up at it by each
Take reference by location during first 5 fixation.
Valuably, the method with traditional use artificial judgment is compared, and testing, sorting machine 100 is obtained in that one or more
Higher accuracy of the processing equipment relative to the positioned in alignment of the arrangement of the semiconductor package part 8 for processing.In addition, side
Vision system 1 provides clearly vision, and it causes that the treatment for extracting the related and quantitative measurement result of positioned in alignment is easy.
And, carried out when it is picked first 5 fixation with relative to semiconductor package part 8 using motor 13,14,16 on a processing device
In the case of position adjustment, automatic aligning positioning is also possible.
It is worth noting that, the different embodiments of testing, sorting machine 100 are likely to be within the scope of the invention.Example
Such as, above-described positioned in alignment treatment is equally applicable to the position tune of the processing equipment of any kind for the treatment of semiconductor element
It is whole.Term " treatment " is construed as any kind of test or encapsulation of semiconductor element.And, check the energy of vision system 60
It is enough to be further used for orienting position of the semiconductor package part 8 when the pick-up head 5 of its tested separator 100 is fixed.
Specifically, each pick-up head 5 can include independent driver, and it is dynamic that the driver can carry out rotation around vertical Z axis
Make and realizeAmendment, so that being oriented with positioned in alignment by pick-up head relative to the optical centre 205 for checking vision system 60
The semiconductor package part 8 that clamp 9 is fixed, as shown in figure 11.
Claims (16)
1. a kind of device for processing electronic component, the device includes：
Slewing and multiple pick-up heads, the plurality of pick-up head are set around slewing annular, and each pick-up head is operated
To fix electronic component；
Location determining device, arrangement when it is used to determine that electronic component is fixed by respective pick-up head；
Reference mark, it is arranged on and indicates that electronic component fixes when institute by respective pick-up head determined by location determining device
At the position of arrangement；
First imaging device, it is set relative to reference mark；And
At least one processing equipment, it is used to process electronic component,
Wherein, the first imaging device is being operated to capture at least one image, and reference mark and at least one are included in image
Individual processing equipment, extracted from least one image that the first imaging device is captured in order to basis, reference mark and
Deviation between at least one processing equipment, the position of at least one processing equipment can be adjusted existing with relative to electronic component
Arrangement positioned in alignment at least one processing equipment when being fixed by respective pick-up head.
2. device as claimed in claim 1, wherein, the location determining device is the second imaging device, second imaging device
It is operative to determine the arrangement of electronic component.
3. device as claimed in claim 2, wherein, the reference mark is moveable, with relative to second imaging device
Optical centre positioned in alignment.
4. device as claimed in claim 3, wherein, first imaging device is moveable, with relative to the base after alignment
Fiducial mark remembers the optical centre of positioned in alignment first imaging device.
5. device as claimed in claim 4, wherein, at least one processing equipment be it is moveable, with relative to this first
The optical centre positioned in alignment of imaging device.
6. device as claimed in claim 1, wherein, at least one processing equipment is motorization, and can be operated to phase
For the arrangement automatically positioned in alignment of electronic component.
7. device as claimed in claim 1, wherein, the location determining device is fine positioner module, the fine positioner
Module is operated to set arrangement when electronic component is fixed by respective pick-up head.
8. device as claimed in claim 1, the device has been further comprised：
Optical device, it is operated to transmit the respective image of the reference mark and at least one processing equipment to the first one-tenth
As equipment.
9. device as claimed in claim 8, wherein, the optical device is the equipment selected from following group, and the group includes：i）
Optical splitter；ii）Reflective mirror；And iii）Prism.
10. a kind of method of the position of at least one processing equipment for adjusting the device for processing electronic component, the device bag
Containing slewing and multiple pick-up heads, the plurality of pick-up head is set around the slewing circumference, and the method includes following
Step：
Arrangement when determining that electronic component is fixed by respective pick-up head using location determining device；
At least one image is captured using the first imaging device, reference mark and at least one processing equipment is included in image,
Wherein reference mark is arranged on the position for indicating the arrangement of electronic component determined by location determining device；And
Set according to extracted at least one image captured from the first imaging device, reference mark and at least one treatment
Deviation between standby, adjust the position of at least one processing equipment with the arrangement positioned in alignment relative to electronic component this at least
One processing equipment.
11. methods as claimed in claim 10, wherein, the location determining device is the second imaging device, and the method includes
Following steps：Each image of electronic component is captured to determine the arrangement of electronic component.
12. methods as claimed in claim 11, the method also includes following steps：The second imaging device is positioned, in order to
Arrangement positioned in alignment of the optical centre of the second imaging device relative to electronic component.
13. methods as claimed in claim 12, the method also includes following steps：The reference mark is positioned, so that should
Optical centre positioned in alignment of the reference mark relative to second imaging device.
14. methods as claimed in claim 13, the method also includes following steps：First imaging device is positioned, so that
In first imaging device optical centre relative to the reference mark positioned in alignment after alignment.
15. methods as claimed in claim 14, wherein, include the step of the position for adjusting at least one processing equipment：
Relative to the optical centre positioned in alignment of first imaging device at least one processing equipment.
16. methods as claimed in claim 10, wherein, at least one processing equipment is motorization, and adjusts this at least
The step of position of one processing equipment, is automatically completed.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201361839922P | 2013-06-27 | 2013-06-27 | |
| US61/839,922 | 2013-06-27 | ||
| US201461930744P | 2014-01-23 | 2014-01-23 | |
| US61/930,744 | 2014-01-23 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104253070A CN104253070A (en) | 2014-12-31 |
| CN104253070B true CN104253070B (en) | 2017-07-07 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410289675.2A Active CN104253070B (en) | 2013-06-27 | 2014-06-25 | The apparatus and method that the processing equipment of semiconductor element is adjusted using imaging device |
Country Status (5)
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| KR (1) | KR101582809B1 (en) |
| CN (1) | CN104253070B (en) |
| MY (1) | MY167674A (en) |
| PH (1) | PH12014000181B1 (en) |
| TW (1) | TWI544567B (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10115620B2 (en) * | 2015-08-31 | 2018-10-30 | Asm Technology Singapore Pte Ltd | Apparatus and method for adjustment of a handling device for handling electronic components |
| US10324126B2 (en) * | 2016-06-10 | 2019-06-18 | Asm Technology Singapore Pte Ltd. | Method and apparatus for aligning probe pins with respect to positions of electronic devices |
| US10473714B2 (en) * | 2017-03-06 | 2019-11-12 | Asm Technology Singapore Pte Ltd | Method and apparatus for aligning electronic components |
| DE102021111953A1 (en) * | 2021-05-07 | 2022-11-10 | Mühlbauer Gmbh & Co. Kg | Optical component inspection |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3738632B2 (en) * | 1999-12-16 | 2006-01-25 | セイコーエプソン株式会社 | Detection data correction method for optical detection means, position detection apparatus provided with optical detection means, and electronic component mounting apparatus |
| JP4616514B2 (en) * | 2001-06-07 | 2011-01-19 | 富士機械製造株式会社 | Electrical component mounting system and position error detection method therefor |
| US7190446B2 (en) * | 2003-12-19 | 2007-03-13 | Asm Assembly Automation Ltd. | System for processing electronic devices |
| KR20060094146A (en) * | 2005-02-23 | 2006-08-29 | 삼성전자주식회사 | Wafer aligner and method for align |
| US7851721B2 (en) * | 2009-02-17 | 2010-12-14 | Asm Assembly Automation Ltd | Electronic device sorter comprising dual buffers |
| JP5510923B2 (en) * | 2009-12-01 | 2014-06-04 | 上野精機株式会社 | Position correcting apparatus and handler provided with the same |
| CN102540781B (en) * | 2010-12-28 | 2015-09-30 | 上海微电子装备有限公司 | A kind of backside alignment device and method |
| JP2012243920A (en) * | 2011-05-18 | 2012-12-10 | Sharp Corp | Chip sorting device and chip sorting method |
| WO2013084296A1 (en) * | 2011-12-06 | 2013-06-13 | 上野精機株式会社 | Electronic component transporting device |
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2014
- 2014-06-24 TW TW103121622A patent/TWI544567B/en active
- 2014-06-25 CN CN201410289675.2A patent/CN104253070B/en active Active
- 2014-06-25 MY MYPI2014001900A patent/MY167674A/en unknown
- 2014-06-25 PH PH12014000181A patent/PH12014000181B1/en unknown
- 2014-06-26 KR KR1020140078730A patent/KR101582809B1/en active IP Right Grant
Also Published As
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|---|---|
| PH12014000181A1 (en) | 2016-05-23 |
| PH12014000181B1 (en) | 2016-05-23 |
| TWI544567B (en) | 2016-08-01 |
| TW201503278A (en) | 2015-01-16 |
| CN104253070A (en) | 2014-12-31 |
| KR101582809B1 (en) | 2016-01-07 |
| KR20150002512A (en) | 2015-01-07 |
| MY167674A (en) | 2018-09-21 |
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