TWI544567B - An apparatus and method of using an imaging device for adjustment of at least one handling device for handling semiconductor components - Google Patents

Description

Apparatus and method for using an imaging device to adjust a processing device of a semiconductor element

The present invention relates to an apparatus and method for adjusting one or more handling devices for processing semiconductor components by using an imaging device.

A conventional test handler includes a turntable and a pick-up head coupled to the turntable for securing a semiconductor package. During operation, the turret rotates over various processing equipment, such as test modules for testing the performance of semiconductor packages. Specifically, the pickup head to which the semiconductor package is fixed is moved to the test module to facilitate testing of the semiconductor package. In particular, the test module must be aligned with respect to the semiconductor package held by each of the pick-up heads to achieve good process stability, high functional test throughput, and low package damage.

Currently, alignment or position adjustment between the test module and the semiconductor package is achieved by using manual judgment. Since the manual judgment is subjective and the operation of the test sorter needs to be directly viewed, it becomes difficult or even impossible if the size of the semiconductor package is small. In addition, because of the lack of data to use as the basis for accuracy, this method requires considerable manual skills and labor.

Accordingly, it is an object of the present invention to seek to eliminate the aforementioned deficiencies of conventional methods for aligning one or more processing devices that process semiconductor packages and to provide the general public with a useful choice.

Accordingly, a first aspect of the present invention provides an apparatus for processing an electronic component, the apparatus comprising: i) a rotating apparatus and a plurality of pick-up heads, the plurality of pick-up heads are disposed annularly around the rotating apparatus, each pick-up head being operated To fix the electronic components; ii) a position determining device for determining an arrangement when the electronic components are fixed by the respective pick-up heads; iii) a fiducial mark disposed at a position indicating an arrangement of the electronic components determined by the position determining device Iv) a first imaging device disposed relative to the fiducial mark; and v) at least one processing device for processing the electronic component. Specifically, the first imaging device is operative to capture at least one image including the fiducial marker and the at least one processing device to facilitate the fiducial marker and at least extracted from the at least one image captured from the first imaging device A deviation between the processing devices, the position of the at least one processing device can be adjusted to align the at least one processing device with respect to the arrangement of the electronic components.

A second aspect of the present invention provides a method of adjusting a position of at least one processing device of a device for processing an electronic component, the device comprising a rotating device and a plurality of pick-up heads, the plurality of pick-up heads being disposed around a circumference of the rotating device, The method includes the steps of: determining, by the position determining device, an arrangement when the electronic components are fixed by respective pick heads; using the first imaging device to capture at least one image including the fiducial mark and the at least one processing device, wherein the fiducial mark is set at the indication Adjusting the position of the electronic component determined by the position determining device; and adjusting the at least one based on a deviation between the fiducial mark and the at least one processing device extracted from the at least one image captured by the first imaging device The position of the processing device positions the at least one processing device in alignment with respect to the arrangement of the electronic components.

1‧‧‧Side vision system

2‧‧‧ benchmark mark

3‧‧‧Optical equipment

4‧‧‧ turntable

5‧‧‧ pick up head

6‧‧‧Location Determination Equipment

8‧‧‧Semiconductor package

9‧‧‧ Pick up head clip

11‧‧‧Contactor

13‧‧‧Motor

14‧‧‧Motor

16‧‧‧Motor

60‧‧‧View visual system

100‧‧‧Test Sorter

102‧‧‧ screw

104‧‧‧ Track

200‧‧ ‧ benchmark mark

205‧‧•The optical center of the vision system 60

210‧‧‧The optical center of the side vision system 1

600‧‧‧fine locator module

The preferred embodiment of the present invention will now be described, by way of example only, with reference to the drawings Embodiments, wherein: Figures 1a and 1b are respective side and top plan views of a test handler for processing semiconductor components, including an optical device with fiducial marks and a side vision system; A side schematic view of the configuration of the test handler shown in Figures 1a and 1b, which includes a viewing vision system; Figure 2b illustrates the fiducial marking repositioning to align with the optical center of the viewing vision system, and Figure 2c illustrates The side vision system is repositioned to align the optical center of the side vision system with respect to the repositioned fiducial mark shown in Figure 2b; Figure 3 shows the semiconductor component being fixed by the pick head; Figure 4 shows the test sorter Repositioning of the optical device to facilitate repositioning of the fiducial mark shown in dot pattern 2b; Figure 5 illustrates another configuration of the test sorter, which in more detail includes a contactor for testing electronic components; Figure 6 shows an image captured by a side vision system in a test sorter that contains alignment marks and contactors after alignment; Figure 7 shows the contactor Alignment with the aligned fiducial marks; Figure 8 illustrates yet another configuration of the test sorter shown in Figure 5, wherein the contactors are motorized; Figure 9 illustrates the use of electronic components when they are held by their respective pick heads. a precision module module for setting the electronic component arrangement; Figure 10 illustrates an optional fiducial marker repositioning for alignment with respect to the fine locator module shown in Figure 9; Figure 11 illustrates the optical center repositioning of the semiconductor component relative to the viewing vision system of the test handler of Figure 2a.

In accordance with a preferred embodiment of the present invention, FIG. 1a illustrates a semiconductor component, such as a semiconductor package (shown by reference numeral 8 in FIG. 3 and secured by pick-up head 9). A schematic view of the device (shown as test sorter 100). A top plan view of test sorter 100 is shown in Figure 1b.

The test sorter 100 includes: i) a rotating device (shown as a turntable 4); ii) a plurality of pick-up heads 5 disposed around a circular wrap around the turntable 4, wherein each pick-up head 5 is operated to secure the semiconductor package 8 Iii) position determining device 6 (viewing vision system 60 as shown in Figure 2c) for determining the arrangement of semiconductor package 8; iv) at least one processing device for processing semiconductor package 8 (as shown in Figure 5) a contactor 11) for testing a semiconductor component; v) an optical device 3 mounted to the turntable 4 by one or more screws 102, wherein the optical device 3 comprises a fiducial mark 2; and vi) a side vision system 1 It is disposed relative to the optical device 3.

The optical device 3 is configured to transmit an image of the fiducial marker 2 and a typical image of the contactor 11 to the side vision system 1. The optical device 3 may be a beam splitter, a mirror or a prism for reflecting an image, and is mounted to the turntable 4 at a position between two adjacent pick-up heads 5, as shown in Fig. 1b. The fiducial mark 2 is a pattern that can be easily viewed by the side vision system 1. In this example, the fiducial mark 2 is a checkerboard pattern (see, see Figs. 2b and 2c), but other patterns are also usable. Preferably, in the image captured by the side vision system 1, the image of the fiducial mark 2 is overlaid (or overlapped) on a typical image of the contactor 11. Specifically, the side vision system 1 includes a camera, an optical device, and a lighting device for inspecting the fiducial mark 2 s position. The side vision system 1 may be mounted on a bolster plate.

It is worth noting that a typical image of the contactor 11 may include any image indicative of the position of the contactor 11 and may include one or more portions of the contactor 11 and/or markings from the contactor 11.

The use of fiducial marker 2 as a reference marker will now be described to perform position adjustment of one or more processing devices.

Figure 2a shows a side view of the test handler 100 whereby the position of the semiconductor package 8 held by the respective pick-up heads 5 is captured by the viewing vision system 60 for subsequent analysis by image processing. In particular, viewing vision system 60 is repositioned to position its optical center relative to the position of semiconductor package 8 as it is fixed by each pick head 5. However, it is worth noting that viewing the repositioning of the vision system 60 may not be necessary as long as the optical center of the viewing vision system 60 and the average deviation between the arrangements of the semiconductor package 8 as fixed by the respective pick heads 5 can be determined.

Next, as the viewing vision system 60 remains fixedly positioned, the turntable 4 rotates to position the optical device 3 over the viewing vision system 60, as shown in Figure Ib. The side vision system 1 is moved in such a manner as to move synchronously with the turntable 4 so that the relative arrangement between the side view system 1 and the turntable 4 remains the same. This can be done by coupling the side vision system 1 to the turntable 4. Alternatively, the side vision system 1 may be separate from the turntable 4 and mounted to a drive that moves synchronously with the turntable 4. Still additionally, a plurality of side vision systems 1 may be placed around the turntable 4.

The position of fiducial marker 2 is then captured by viewing vision system 60 for analysis by image processing. Suitably, the fiducial marker 2 is repositioned to facilitate its alignment with the optical center 205 of the viewing vision system 60, as shown in Figure 2b. Since the optical device 3 is straight through the screw 102 Attached to the turntable 4, the alignment or positional adjustment of the fiducial mark 2 can be accomplished by loosening the screw 102 and repositioning the optical device 3 along respective tracks 104 along which the screw 102 is attached for optical The device 3 is locked to the turntable 4 as shown in FIG. In this case, thereby viewing the optical center 205 of the vision system 60 is positioned relative to the position at which the semiconductor package 8 is fixed by the respective pick-up heads 5, the repositioning of the fiducial marks 2 at the optical center 205 of the vision system 60 means The position of the fiducial mark 2 can be used as a positional reference for those semiconductor packages 8. After the fiducial marker 2 has been aligned, it will then be used as a general reference marker to adjust the position of the contactor 11 and all other processing devices.

However, it is again worth noting that the repositioning of the fiducial marker 2 may not be necessary as long as the deviation between the optical center 205 of the vision system 60 and the fiducial marker 2 can be determined.

Thereafter, the position of the fiducial marker 2 is captured by the viewing vision system 60 and analyzed by image processing. Suitably, the side vision system 1 is repositioned so that its optical center 210 and fiducial mark 2 are aligned, as shown in Figure 2c, but such repositioning can be omitted again, as long as the fiducial mark 2 and the side vision system 1 The deviation between the optical centers 210 can be determined.

The positional adjustment of the contactor 11 will now be described.

First, as shown in FIG. 5, the turntable 4 is sequentially positioned to set the optical device 3 above the contactor 11. Then, the side vision system 1 captures an image containing the fiducial mark 2 and the contactor 11, as shown in FIG. Specifically, the image of the reference mark 2 is transmitted through the optical device 3 to the side vision system 1, and the image of the upper surface of the contactor 11 is reflected by the optical device 3 to the side vision system 1. Thereafter, the image captured by the side vision system 1 is analyzed to extract the fiducial marker 2 and the contactor Deviation between 11. Again, as shown in FIG. 7, the position of the contactor 11 is adjusted with respect to the reference mark 2 based on the extracted deviation. When the deviation between the reference mark 2 and the contactor 11 falls within the prescribed standard range, the adjustment is achieved. This thereby ensures that when the semiconductor package 8 is fixed by the pick-up head 5 of the test sorter 100 during operation, the semiconductor package 8 and the contactor 11 are properly aligned. In this example, the optical center 210 of the side vision system 1 is thereby aligned with respect to the aligned fiducial marks 2, and the repositioning of the contactor 11 at the optical center 210 of the side vision system 1 can also achieve the contactor 11 and Alignment positioning of the semiconductor package 8.

Alternatively, as shown in FIG. 8, the contactor 11 may include motors 13, 14, 16 to provide movement in a tangential, radial, and θ direction with respect to a path of movement of the semiconductor package 8. In the case of using such a motorized contactor 11, after the deviation between the fiducial mark 2 and the motorized contactor 11 has been extracted from one or more images captured by the side vision system 1, the main processing The device can accordingly issue matching command signals to the motors 13, 14, 16 to compensate for the deviation, for example, based on the distance-angle difference between the reference mark 2 and the motorized contactor 11 relative to the semiconductor package 8. The position of the contactor 11 is processed.

In another configuration of the test sorter 100, the position determining device 6 is a fine locator module 600, as shown in Figure 9, instead of viewing the position of the vision system 60. The fine positioner module 600 is operable and configured to set the arrangement of the semiconductor package 8 when the semiconductor package 8 is fixed by the respective pick-up heads 5 of the test sorter 100 during operation. Preferably, first, the fine positioner module 600 is aligned with respect to the position of the pick-up head 5 before the pick-up head 5 processes the pick-up of the semiconductor package 8. Thereafter, the pick head 5 moves through the fine positioner module 600 to facilitate determination of the arrangement of the semiconductor package 8 by the fine positioner module 600. The turntable 4 is then rotated to sequentially position the optical device 3 to a position above the fine positioner module 600. Again, the side vision system 1 The movement is synchronized with the turntable 4 so that the relative arrangement between the side vision system 1 and the turntable 4 remains the same.

FIG. 10 illustrates an image captured by the side vision system 1 that includes an optional fiducial marker 200 and a fine locator module 600. The captured image is then analyzed to extract the offset between the position of the fiducial marker 200 and the position of the fine locator module 600. Thereafter, based on the extracted deviation, the position of the optical device 3 is adjusted such that by adjusting the position of the optical device 3, the fiducial mark 200 is repositioned to be aligned with the fine locator module 6, as shown in FIG. In this way, the repositioned fiducial mark 200 can be used again as a reference for the position of the semiconductor package 8 when it is fixed by the respective pick-up heads 5.

Beneficially, the test sorter 100 is capable of obtaining a higher degree of accuracy of the aligned positioning of one or more processing devices relative to the arrangement of the semiconductor package 8 for processing, as compared to conventional methods of using manual judgment. In addition, the side vision system 1 provides a clear vision that facilitates the process of extracting alignment-related and quantitative measurements. Moreover, automatic alignment positioning is also possible in the case where the motors 13, 14, 16 are applied to the processing device to positionally adjust relative to the semiconductor package 8 as it is held by the pickup head 5.

It should be noted that different embodiments of test sorter 100 are also possible within the scope of the present invention. For example, the alignment positioning process described above is equally applicable to the position adjustment of any kind of processing device that processes semiconductor components. The term "processing" should be understood to mean any kind of testing or packaging of semiconductor components. Moreover, viewing vision system 60 can be further utilized to orient the position of semiconductor package 8 as it is being held by pick head 5 of test sorter 100. In particular, each pick-up head 5 can include a separate drive that is capable of rotating about a vertical Z-axis to achieve a θ correction such that the optical center relative to the viewing vision system 60 The 205 is oriented and aligned to position the semiconductor package 8 held by the pickup head body 9, as shown in FIG.

1‧‧‧Side vision system

2‧‧‧ benchmark mark

3‧‧‧Optical equipment

4‧‧‧ turntable

5‧‧‧ pick up head

6‧‧‧Location Determination Equipment

100‧‧‧Test Sorter

102‧‧‧ screw

Claims (16)

An apparatus for processing an electronic component, the apparatus comprising: a rotating device and a plurality of pick-up heads, the plurality of pick-up heads are disposed annularly around the rotating device, each pick-up head being operated to fix an electronic component; and a position determining device An arrangement for determining when the electronic components are fixed by the respective pick-up heads; a fiducial mark disposed at a position indicating an arrangement of the electronic components determined by the position determining device when the electronic components are held by the respective pick-up heads a first imaging device disposed relative to the fiducial marker; and at least one processing device for processing the electronic component, wherein the first imaging device is operative to capture a fiducial marker and at least one processing device in an image At least one image of the deviation between the fiducial marker and the at least one processing device extracted from the at least one image captured from the first imaging device when the electronic component is clamped via the respective pick-up head The position of the at least one processing device can be adjusted to align the at least one position relative to the arrangement of the electronic components Processing devices. The device of claim 1, wherein the position determining device is a second imaging device that is operative to determine an arrangement of the electronic components. The device of claim 2, wherein the fiducial marker is movable to be aligned with respect to an optical center of the second imaging device. The device of claim 3, wherein the first imaging device is moveable to position the optical center of the first imaging device in alignment with respect to the aligned fiducial marks. The device of claim 4, wherein the at least one processing device is moveable to be positioned in alignment with respect to an optical center of the first imaging device. The device of claim 1, wherein the at least one processing device is motorized and operable to automatically align positioning relative to the arrangement of the electronic components. The device of claim 1, wherein the position determining device is a fine locator module that is operative to set an arrangement when the electronic components are fixed by the respective pick heads. The apparatus of claim 1, the apparatus further comprising: an optical device operative to transmit the fiducial marker and the respective image of the at least one processing device to the first imaging device. The device of claim 8, wherein the optical device is a device selected from the group consisting of The group includes: i) a beam splitter; ii) a mirror; and iii) a prism. A method of adjusting a position of at least one processing device for processing a device for an electronic component, the device comprising a rotating device and a plurality of pick-up heads disposed about a circumference of the rotating device, the method comprising the steps of: Determining, by the position determining device, an arrangement when the electronic components are fixed by the respective pick-up heads; capturing at least one image including the fiducial mark and the at least one processing device using the first imaging device, wherein the fiducial mark is set at the indication determined by the position determining device Positioning the electronic component; and adjusting the position of the at least one processing device relative to the deviation between the fiducial marker and the at least one processing device based on the at least one image captured from the first imaging device The at least one processing device is positioned in alignment with the arrangement of the electronic components. The method of claim 10, wherein the position determining device is a second imaging device, the method comprising the steps of capturing respective images of the electronic components to determine an arrangement of the electronic components. The method of claim 11, the method further comprising the step of locating the second imaging device to facilitate alignment of the optical center of the second imaging device relative to the arrangement of the electronic components. The method of claim 12, the method further comprising the step of locating the fiducial marker such that the fiducial marker is aligned with respect to an optical center of the second imaging device. The method of claim 13, the method further comprising the step of locating the first imaging device such that the optical center of the first imaging device is aligned with respect to the aligned fiducial markers. The method of claim 14, wherein the step of adjusting the position of the at least one processing device comprises positioning the at least one processing device in alignment with an optical center of the first imaging device. The method of claim 10, wherein the at least one processing device is motorized, and the step of adjusting the location of the at least one processing device is done automatically.