JP2016192500A - Resin molding device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a resin molding device capable of reducing a cost of positioning of a substrate and capable of preventing resin leakage.SOLUTION: On a substrate arrangement surface 21L of a lower metal mold plate 11 are provided positioning pins 22L and 23L protruding from the substrate arrangement surface 21L toward an upper metal mold plate 10. On a substrate arrangement surface 21R of the lower metal mold plate 11 are provided positioning pins 22R and 23R protruding from the substrate arrangement surface 21R toward the upper metal mold plate 10. A resin molding device makes the lower metal mold plate 11 come into contact with the upper metal mold plate 10 while preventing respective tips of the positioning pins 22L, 22R, 23L and 23R from penetrating a film 28.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a resin molding apparatus that seals an electronic component mounted on a substrate with resin.

  2. Description of the Related Art Conventionally, a resin molding apparatus that molds a resin molded body by sealing electronic components mounted on various substrates such as a ceramic substrate, a glass epoxy resin substrate, a polyimide substrate, and a lead frame with a resin is known.

  For example, Patent Document 1 discloses an apparatus in which a substrate and a resin film are sandwiched between an upper mold and a lower mold, and a resin is filled between the substrate and the film. By using a film in this way, a package can be formed without requiring a large clamping force. Therefore, it is not necessary to configure the mold with a metal that can withstand a large clamping force, or to process the mold so as to withstand the large clamping force, so that the cost can be reduced.

  On the other hand, it is known that a substrate is positioned using positioning pins when the substrate is placed in a mold (see, for example, Patent Document 2). For example, the substrate can be disposed at an appropriate position by inserting a positioning pin into a hole formed in advance in the outer peripheral portion of the substrate.

JP 2013-84709 A JP 2003-80552 A

  However, when the substrate is positioned using the positioning pins and the resin sealing is performed using the film, there are the following problems.

  For example, when a thin substrate is positioned using a positioning pin inserted into a hole in the outer peripheral portion of the substrate, the substrate warps inside the position where the positioning pin is inserted. As a solution to this, there is a problem in that it is costly to provide means (for example, a spring or the like) for pressing the substrate so as not to warp.

  Further, when the positioning pin protruding from the substrate penetrates the film, the resin injected from the penetrating portion into the cavity of the mold leaks. If the resin leaks in this way, the molded product becomes not only defective, but the mold is contaminated by the leaked resin, and there is a problem that production must be stopped for a long time and disassembled and cleaned for recovery. . Furthermore, there is a problem that the leaked resin is wasted.

  The objective of this invention is providing the resin molding apparatus which can reduce the cost of positioning of a board | substrate and can prevent resin leakage.

  A resin molding apparatus according to an aspect of the present invention includes a first mold in which a pot in which resin is disposed is formed, and a second mold in which a cavity into which the resin disposed in the pot is injected is formed. And injecting the resin between the substrate disposed in the first mold and the film adsorbed in the cavity of the second mold, and sealing the electronic component mounted on the substrate with the resin. A resin molding apparatus for molding a stopped resin molded body, wherein the first mold includes an end side on the pot side of an arrangement surface of the substrate and an arrangement side of the resin molding body. A positioning pin that is inserted into the first hole of the substrate is an area between the molding area and a straight line including the edge on the pot side, excluding the flow path of the resin flowing into the cavity. From the arrangement surface of the substrate of the first mold toward the second mold Provided out, it is brought into contact with the first mold and said second mold the tip of the positioning pin without penetrating into the film.

  According to the present invention, the cost of positioning a substrate can be reduced, and resin leakage can be prevented.

Schematic diagram showing the overall configuration of the resin molding apparatus according to Embodiments 1 and 2 of the present invention Sectional drawing of the upper metal mold plate (before film adsorption | suction) and the lower metal mold plate (before board | substrate arrangement | positioning) concerning Embodiment 1 of this invention 1 is a perspective view of an upper mold plate (before film adsorption) and a lower mold plate (before substrate placement) according to Embodiment 1 of the present invention. Sectional drawing of the upper metal mold plate (after film adsorption | suction) and the lower metal mold plate (after board | substrate arrangement | positioning) concerning Embodiment 1 of this invention 1 is a perspective view of an upper mold plate (after film adsorption) and a lower mold plate (after substrate placement) according to Embodiment 1 of the present invention. Partial enlarged view of the lower mold plate (after substrate placement) shown in FIG. 1 is a perspective view of an upper mold plate (after resin molding) and a lower mold plate (after resin molding) according to Embodiment 1 of the present invention. Partial enlarged view of the lower die plate (after resin molding) shown in FIG. Sectional drawing of the upper metal mold plate (before film adsorption | suction) and the lower metal mold plate (before board | substrate arrangement | positioning) concerning Embodiment 2 of this invention The perspective view of the upper metal mold plate (before film adsorption) and the lower metal mold plate (before substrate arrangement) concerning Embodiment 2 of the present invention Sectional drawing of the upper metal mold plate (after film adsorption | suction) and the lower metal mold plate (after board | substrate arrangement | positioning) concerning Embodiment 2 of this invention The perspective view of the upper mold plate (after film adsorption) and the lower mold plate (after substrate arrangement) concerning Embodiment 2 of the present invention Partial enlarged view of the lower mold plate (after substrate placement) shown in FIG. FIG. 13 is a partially enlarged view of the lower mold plate (after molding the resin molded body) shown in FIG.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
Embodiment 1 of the present invention will be described.

  First, the whole structure of the resin molding apparatus 100 of this Embodiment is demonstrated using FIG. FIG. 1 is a schematic diagram illustrating an example of a resin molding apparatus 100 according to the present embodiment.

  The resin molding apparatus 100 includes an upper platen 1, a lower platen 2, a moving platen 3, a tie bar 4, a press mechanism 5, a transfer mechanism 6, an upper mold 7, and a lower mold 8.

  The upper mold 7 is fixed to the upper platen 1. The upper mold 7 is provided with an upper mold plate 10. In the upper mold plate 10, resin flow paths (for example, a cal 13, a runner 14, a gate 15, and a cavity 16, which will be described later) are formed on a surface facing the lower mold plate 11 which will be described later. A specific example of the upper mold plate 10 will be described later. The upper mold plate 10 may be detachable from the upper mold 7 or may be formed integrally with the upper mold 7.

  The lower mold 8 is fixed to the moving platen 3. The lower mold 8 is provided with a lower mold plate 11. The lower mold plate 11 is formed with a resin transfer path (for example, a pot 20 described later) and a substrate arrangement surface on the surface facing the above-described upper mold plate 10. A specific example of the lower mold plate 11 will be described later. The lower mold plate 11 may be detachable from the lower mold 8 or may be formed integrally with the lower mold 8.

  Further, the transfer platen 3 is provided with a transfer mechanism 6 on the back surface of the surface on which the lower mold 8 is provided. A specific example of the transfer mechanism 6 will be described later.

  A press mechanism 5 for moving (raising / lowering) the moving platen 3 is fixed to the lower platen 2.

  The tie bar 4 is fixedly erected on the lower platen 2 and is fixed on the upper platen 1 with a nut (not shown). That is, the upper platen 1 and the lower platen 2 are fixed to the tie bar 4. On the other hand, the movable platen 3 is slidably provided on the tie bar 4 and is raised / lowered by the press mechanism 5. As a result, the movable platen 3 reciprocates along the tie bar 4 between the upper platen 1 and the lower platen 2. A press operation is executed by the reciprocating movement of the moving platen 3.

  The press operation refers to an operation that transitions from the mold opening state to the mold closing state and returns to the mold opening state again. The mold open state refers to a state where the press mechanism 5 lowers the movable platen 3, that is, a state where the upper mold 7 and the lower mold 8 are separated from each other. The mold closed state refers to a state where the press mechanism 5 raises the movable platen 3, that is, a state where the upper mold 7 and the lower mold 8 are in contact with each other. FIG. 1 shows the mold open state.

  Next, the configuration of the upper mold plate 10 and the lower mold plate 11 according to the present embodiment will be described with reference to FIGS. FIG. 2 is a cross-sectional view of the upper mold plate 10 and the lower mold plate 11. FIG. 3 is a perspective view of the upper mold plate 10 and the lower mold plate 11.

  First, the upper mold plate 10 will be described.

  As shown in FIGS. 2 and 3, the upper mold plate 10 is a substantially rectangular member. A cull block 12 is provided in the center of the upper mold plate 10 in the direction D1 along the direction D2. The direction D1 is the short direction of the upper mold plate 10, the substrates 24 and 25, and the lower mold plate 11. The direction D2 is the longitudinal direction of the upper mold plate 10, the substrates 24 and 25, and the lower mold plate 11.

  As shown in FIG. 2, a cull 13 is formed in the cull block 12 as one of the flow paths of resin transferred from a pot 20 described later. The cal 13 is formed to face the pot 20. In addition, although illustration is abbreviate | omitted in FIG. 3, the cull 13 is formed in multiple numbers along the direction D2 and corresponding to the position of each pot 20. As shown in FIG.

  In addition, as shown in FIG. 2, suction holes 17 communicating with the cull 13 are formed in the cull block 12 along the thickness direction of the upper mold plate 10. The suction holes 17 are holes for sucking and sucking the film 28 (for example, a resin film) shown in FIG. 4 to the upper mold plate 10.

  Further, as shown in FIG. 2, the upper mold plate 10 is formed with a runner 14 communicating with the cull 13, a gate 15 communicating with the runner 14, and a cavity 16 communicating with the gate 15 along the direction D1. Yes. The runner 14, the gate 15, and the cavity 16 are resin flow paths that are transferred from the pot 20 in the same manner as the cal 13.

  As shown in FIG. 2, two suction holes 17 communicating with the cavity 16 are formed along the thickness direction of the upper mold plate 10.

  As shown in FIG. 2, positioning pin holes 18 </ b> L and 18 </ b> R are formed in the upper mold plate 10. The positioning pin hole 18L is a hole into which a tip of a positioning pin 22L described later and a part of the film 28 pushed up to the tip are inserted when the mold is closed. Similarly, the positioning pin hole 18R is a hole into which a tip of a positioning pin 22R described later and a part of the film 28 pushed up to the tip are inserted when the mold is closed. Although not shown in FIGS. 2 and 3, positioning pin holes into which the tips of positioning pins 23R and 23L, which will be described later, are inserted in the upper mold plate 10 are also the positioning pin holes 18L and 18R. It is formed in the same way.

  Next, the lower mold plate 11 will be described.

  As shown in FIGS. 2 and 3, the lower mold plate 11 is a substantially rectangular member. A pot block 19 is provided in the center of the lower mold plate 10 in the direction D1 along the direction D2. In the lower mold plate 11, the pot block 19 is provided at a position facing the cull block 12.

  As shown in FIG. 2, the pot block 19 is formed with a pot 20 that is a space in which a resin (for example, a resin tablet or a liquid resin) is placed. As shown in FIG. 3, a plurality of pots 20 are formed along the direction D <b> 2 and corresponding to the positions of the respective culls 13.

  A plunger (not shown) is provided inside the pot 20. The plunger can be moved up and down in the pot 20 by sliding on the inner surface of the pot 20 by the transfer mechanism 6. The transfer mechanism 6 is, for example, a hydraulic mechanism, a screw feed mechanism, a cam feed mechanism, or the like. The resin disposed inside the pot 20 is melted by the heated plunger in the mold closed state, transferred upward by the plunger, and pushed out into the cal 13. Although details will be described later, the resin extruded into the cal 13 is filled into the cal 13, the runner 14, the gate 15, and the cavity 16 and cured, as shown in FIGS. 14, a resin molded body reflecting the shapes of the gate 15 and the cavity 16. 7 and 8, the resin molded body reflecting the shape of the cavity 16 is particularly shown as “resin molded body 30”.

  As shown in FIGS. 2 and 3, the lower mold plate 11 is provided with substrate arrangement surfaces 21L and 21R on which the substrates 24 and 25 are arranged. For example, the substrate 25 having the same thickness as the height from the substrate arrangement surface 21L to the surface on which the opening of the pot 20 is formed in the pot block 19 (pot opening surface 20a) is arranged on the substrate arrangement surface 21L. (See FIG. 4). Thereby, since no step is formed between the substrate 25 arranged on the substrate arrangement surface 21L and the pot opening surface 20a, it becomes easy to prevent the resin flowing through the runner 14 from leaking in the direction D2. Similarly, for example, the substrate 24 having the same thickness as the height from the substrate arrangement surface 21R to the pot opening surface 20a is arranged on the substrate arrangement surface 21R (see FIG. 4). As a result, no step is formed between the substrate 24 arranged on the substrate arrangement surface 21R and the pot opening surface 20a, so that sealing becomes easy and leakage of the resin flowing through the runner 14 in the direction D2 can be prevented. It becomes easy. The substrates 24 and 25 are, for example, a ceramic substrate, a glass epoxy resin substrate, a polyimide substrate, or a lead frame.

  2 and 3, the lower mold plate 11 has positioning pins 22L and 23L for positioning the substrate 25 and positioning pins 22R and 23R for positioning the substrate 24. Is provided. The positioning pins 22L and 23L are formed so as to protrude from the substrate placement surface 21L toward the upper mold plate 10. Similarly, the positioning pins 22 </ b> R and 23 </ b> R are formed so as to protrude from the substrate placement surface 21 </ b> R toward the upper mold plate 10.

  Here, the installation positions of the positioning pins 22L, 22R, 23L, and 23R will be described with reference to FIG. FIG. 8 is a perspective view showing a state where the resin molded body 30 is molded on the substrates 24 and 25.

  As shown in FIG. 8, the positioning pins 22L and 22R are provided in the area A1 of the board placement surfaces 21L and 21R. The region A1 is a region between the end side S1 and the straight line L1, and is a region excluding the resin flow path (for example, the runner 14) flowing into the cavity 16. The end side S1 is an end side on the pot 20 side of the substrate arrangement surface 21L or the substrate arrangement surface 21R. The straight line L1 is a straight line including an end side on the pot 20 side of a region where the resin molded body 30 is molded (hereinafter referred to as a molding region). Although not shown, the positioning pins 23L and 23R are also provided in the area A1 of the substrate placement surfaces 21L and 21R, respectively.

  The positioning pins 22L and 23L are inserted through the positioning pin holes 26L and 27L formed in the substrate 25 when the substrate 25 is disposed on the substrate placement surface 21L. Thereby, the tips of the positioning pins 22L and 23L protrude from the substrate 25. The positioning pins 22R and 23R are inserted into the positioning pin holes 26R and 27R formed in the substrate 24 when the substrate 24 is disposed on the substrate disposition surface 21R. As a result, the tips of the positioning pins 22R and 23R protrude from the substrate 24.

  Each tip of the positioning pins 22L, 22R, 23L, and 23R has a rounded shape. This is to prevent each tip (portion protruding from the substrates 24 and 25) inserted into the corresponding positioning pin hole from breaking the film 28 described later when the mold is closed. Note that the shape of each tip of the positioning pins 22L, 22R, 23L, and 23R is not limited to a rounded shape, and may be any shape that does not penetrate the film 28 when the mold is closed. That is, in the present embodiment, the upper mold plate 10 and the lower mold plate 11 are brought into contact with each other without penetrating the tip of the positioning pin through the film 28.

  In the present embodiment, the number of positioning pins is four, but at least one positioning pin is sufficient. Moreover, if the position of the positioning pin is between the opening of the pot 20 and the molding region of the resin molded body 30 shown in FIGS. 7 and 8 in the direction D1, it is limited to the position shown in FIGS. Not.

  In the present embodiment, when the positioning pins are inserted into the positioning pin holes by making the lengths of the portions protruding from the substrate placement surfaces 21L and 21R longer than the thicknesses of the substrates 24 and 25 in each positioning pin. The tip of the positioning pin is configured to protrude from the substrate, but the present invention is not limited to this. For example, in each positioning pin, the length of the portion protruding from the board placement surfaces 21L and 21R is the same as or shorter than the thickness of the boards 24 and 25, so that when the positioning pin is inserted into the positioning pin hole, You may comprise so that a front-end | tip may not protrude from a board | substrate. In this case, it is not necessary to form a positioning pin hole in the upper mold plate 10. That is, in the present embodiment, the upper mold plate 10 and the lower mold plate 11 are brought into contact with each other without penetrating the tip of the positioning pin through the film 28.

  Next, the substrates 24 and 25 will be described.

  As shown in FIG. 3, the substrates 24 and 25 are plate-like members. Electronic components 29 are arranged on the substrates 24 and 25 at positions corresponding to the cavities 16.

  Further, as shown in FIG. 3, the substrate 24 has a positioning pin hole 26R formed at a position corresponding to the positioning pin 22R, and a positioning pin hole 27R formed at a position corresponding to the positioning pin 23R. The shape of the positioning pin hole 26R is a perfect circle shape, and the shape of the positioning pin hole 27R is an elliptical shape whose major axis is along the direction D2.

  As shown in FIG. 3, the substrate 25 has positioning pin holes 26L formed at positions corresponding to the positioning pins 22L, and positioning pin holes 27L formed at positions corresponding to the positioning pins 23L. The shape of the positioning pin hole 26L is an elliptical shape whose major axis is along the direction D2, and the shape of the positioning pin hole 27R is a perfect circle.

  Next, using FIG. 4 to FIG. 6, the film 28 is adsorbed to the upper mold plate 10 according to the present embodiment, and the substrates 24 and 25 are disposed on the lower mold plate 11 according to the present embodiment. The state will be described. FIG. 4 is a cross-sectional view of the upper mold plate 10 and the lower mold plate 11. FIG. 5 is a perspective view of the upper mold plate 10 and the lower mold plate 11. 6 is an enlarged perspective view of a part of the lower mold plate 11 shown in FIG.

  As shown in FIG. 4, in the upper mold plate 10, the film 28 is adsorbed along the cull 13, the runner 14, the gate 15, and the cavity 16 by sucking out the air in each adsorption hole 17.

  4 to 6, in the lower mold plate 11, the substrate 25 is disposed on the substrate placement surface 21L, and the substrate 24 is disposed on the substrate placement surface 21R. At this time, the positioning pin 22L is inserted into the positioning pin hole 26L of the substrate 25, and the positioning pin 23L is inserted into the positioning pin hole 27L of the substrate 25. Further, the positioning pin 22R is inserted into the positioning pin hole 26R of the substrate 24, and the positioning pin 23R is inserted into the positioning pin hole 27R of the substrate 24. Here, the positioning pins 22L and 23L are provided at positions where the end of the substrate 25 along the direction D2 of the substrate 25 is in contact with the pot block 19 without a gap by this positioning. Similarly, the positioning pins 22 </ b> R and 23 </ b> R are provided at positions where the pot block 19 side end along the direction D <b> 2 of the substrate 24 contacts the pot block 19 without a gap.

  Thus, in the present embodiment, the substrates 24 and 25 can be positioned at a position close to the pot block 19. Accordingly, it is not necessary to provide means (for example, a spring or the like) for pressing the substrates 24 and 25 so that the substrates 24 and 25 are not warped, and the cost can be reduced.

  4 to 6, after the film 28 is adsorbed on the upper mold plate 10 and the substrates 24 and 25 are arranged on the lower mold plate 11, the upper mold plate 10 (upper mold 7) and The lower mold plate 11 (lower mold 8) is closed. When the mold is closed, as described above, the tips of the positioning pins 22L, 22R, 23L, and 23R (projections from the substrates 24 and 25) are inserted into the corresponding positioning pin holes. At this time, the film 28 is pushed into the positioning pin hole by each tip, but each tip does not penetrate the film 28 because it has a rounded shape.

  After closing the mold, the resin placed in the pot 20 is transferred by the plunger and injected into the cull 13. Then, the resin injected into the cal 13 flows into the runner 14, the gate 15, and the cavity 16. At this time, since each positioning pin does not penetrate the film 28 as described above, the resin does not leak. Therefore, waste of resin due to resin leakage can be eliminated. In addition, it is possible to prevent a molded product from being defective due to resin leakage, and further, it is not necessary to stop production for a long time and perform disassembly and cleaning in order to recover a mold contaminated by resin leakage.

  Then, after the resin filled in the cal 13, the runner 14, the gate 15, and the cavity 16 is cured, the upper mold plate 10 (upper mold 7) and the lower mold plate 11 (lower mold 8) are opened. Is done.

  The state when the mold is opened is shown in FIGS. FIG. 7 is a perspective view showing an example in which a resin molded body is formed on the substrates 24 and 25. FIG. 8 is an enlarged perspective view showing a part of the resin molded body shown in FIG.

  As shown in FIGS. 7 and 8, the resin molded body has a shape reflecting the shapes of the cull 13, the runner 14, the gate 15, and the cavity 16. 7 and 8, the resin molded body reflecting the shape of the cavity 16 is used as the resin molded body 30. The resin molded body 30 is separated into pieces by cutting the substrate 24 or the substrate 25 along a line parallel to each side. Thereby, a package including the resin molded body 30, the electronic component 29, the substrate 24 or the substrate 25 can be obtained.

(Embodiment 2)
A second embodiment of the present invention will be described. In the present embodiment, in addition to the positioning pins described above, the lower mold plate includes an introduction pin for fixing the outer peripheral portion of the substrate during positioning. 9 to 13 used in the description of the present embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof is omitted below.

  The overall configuration of the resin molding apparatus of the present embodiment is the same as that of the resin molding apparatus 100 shown in FIG. In the present embodiment, an upper mold plate 40 described later is provided in the upper mold 7 instead of the upper mold plate 10, and a lower mold plate 41 described later is replaced in the lower mold 8 instead of the lower mold plate 11. Is provided. The upper mold plate 40 may be detachable from the upper mold 7 or may be formed integrally with the upper mold 7. The lower mold plate 41 may be detachable from the lower mold 8 or may be formed integrally with the lower mold 8.

  Next, the configuration of the upper mold plate 40 and the lower mold plate 41 according to the present embodiment will be described. FIG. 9 is a cross-sectional view of the upper mold plate 40 and the lower mold plate 41. FIG. 10 is a perspective view of the upper mold plate 40 and the lower mold plate 41.

  First, the upper mold plate 40 will be described.

  As shown in FIG. 9, introduction pin holes 35 </ b> L and 35 </ b> R are formed in the upper mold plate 40. The introduction pin hole 35L is a hole into which a tip of an introduction pin 31L described later and a part of the film 28 pushed up at the tip are inserted when the mold is closed. Similarly, the introduction pin hole 35R is a hole into which a tip of an introduction pin 31R described later and a part of the film 28 pushed up to the tip are inserted when the mold is closed. Although not shown in FIGS. 9 and 10, the upper mold plate 40 is also provided with introduction pin holes into which the tips of introduction pins 32L and 32R described later are inserted. It is formed in the same way.

  Next, the lower mold plate 41 will be described.

  As shown in FIGS. 9 and 10, the lower mold plate 41 is provided with introduction pins 31 </ b> L and 32 </ b> L for introducing the substrate 45, and introduction pins 31 </ b> R and 32 </ b> R for introducing the substrate 44. . The introduction pins 31L and 32L are formed so as to protrude from the substrate placement surface 21L toward the upper mold plate 40. Similarly, the introduction pins 31 </ b> R and 32 </ b> R are formed to protrude from the substrate arrangement surface 21 </ b> R toward the upper mold plate 40.

  Here, the installation positions of the introduction pins 31L, 31R, 32L, and 32R will be described with reference to FIG. FIG. 14 is a perspective view showing a state where the resin molded body 30 is molded on the substrates 44 and 45.

  As shown in FIG. 14, the introduction pins 31L and 31R are provided in the region A2 of the substrate placement surfaces 21L and 21R. The region A2 is a region between the end side S2 and the straight line L2. The end side S2 is an end side facing the end side on the pot 20 side of the substrate arrangement surface 21L or the substrate arrangement surface 21R. The straight line L <b> 2 is a straight line including an end side facing the end side on the pot 20 side of the molding region of the resin molded body 30. In addition, although illustration is abbreviate | omitted, the introduction pins 32L and 32R are also provided in area | region A2 of the board | substrate arrangement | positioning surfaces 21L and 21R, respectively.

  The introduction pins 31L and 32L are inserted into the introduction pin holes 33L and 34L formed in the substrate 45 when the substrate 45 is arranged on the substrate arrangement surface 21L (see FIG. 12). As a result, the leading ends of the introduction pins 31L and 32L protrude from the substrate 45. The introduction pins 31R and 32R are inserted through the introduction pin holes 33R and 34R formed in the substrate 44 when the substrate 44 is arranged on the substrate arrangement surface 21L (see FIG. 12). As a result, the tips of the introduction pins 31R and 32R protrude from the substrate 44.

  In addition, each tip of the introduction pins 31L, 31R, 32L, and 32R has a rounded shape like the positioning pins, but is not limited to this shape. For example, each tip may have a pointed shape that can penetrate the film 28 when the mold is closed. For example, as shown in FIG. 9, the introduction pins 31 </ b> L and 31 </ b> R are located away from the resin flow path (cal 13, runner 14, gate 15, cavity 16) in the direction D <b> 1. This is because even if a through hole is formed in the film 28 by 31L and 31R, the resin does not leak from the through hole.

  In the present embodiment, the number of introduction pins is four, but at least one introduction pin is sufficient. Further, the position of the introduction pin is between the end farthest from the opening of the pot 20 and the end of the substrate closest to the end of the molding region of the resin molded body 30 in the direction D1. If there is, it is not limited to the positions shown in FIGS.

  Further, in this embodiment, when each introduction pin is inserted into the introduction pin hole by making the length of the portion protruding from the substrate placement surfaces 21L, 21R longer than the thickness of the substrates 44, 45. The tip of the introduction pin is configured to protrude from the substrate, but the present invention is not limited to this. For example, in each introduction pin, the length of the portion protruding from the substrate placement surfaces 21L and 21R is the same as or shorter than the thickness of the substrates 44 and 45, so that when the introduction pin is inserted into the introduction pin hole, You may comprise so that a front-end | tip may not protrude from a board | substrate. In this case, it is not necessary to form the introduction pin hole in the upper mold plate 40.

  Next, the substrates 44 and 45 will be described.

  As shown in FIG. 10, in the substrate 44, an introduction pin hole 33R is formed at a position corresponding to the introduction pin 31R, and an introduction pin hole 34R is formed at a position corresponding to the introduction pin 32R. The shape of the introduction pin hole 33R is an elliptical shape whose major axis is along the direction D2, and the shape of the introduction pin hole 34R is a perfect circle shape.

  As shown in FIG. 10, the substrate 45 has an introduction pin hole 33L formed at a position corresponding to the introduction pin 31L, and an introduction pin hole 34L formed at a position corresponding to the introduction pin 32L. The shape of the introduction pin hole 33L is a perfect circle shape, and the shape of the introduction pin hole 34L is an elliptical shape whose major axis is along the direction D2.

  Next, using FIG. 11 to FIG. 13, the film 28 is adsorbed to the upper mold plate 40 according to the present embodiment, and the substrates 44 and 45 are arranged on the lower mold plate 41 according to the present embodiment. The state will be described. FIG. 11 is a cross-sectional view of the upper mold plate 40 and the lower mold plate 41. FIG. 12 is a perspective view of the upper mold plate 40 and the lower mold plate 41. FIG. 13 is an enlarged perspective view of a part of the lower mold plate 41 shown in FIG.

  As shown in FIG. 11, in the upper mold plate 40, the air in each suction hole 17 is sucked out, so that the film 28 is sucked along the cull 13, the runner 14, the gate 15, and the cavity 16.

  As shown in FIGS. 11 to 13, in the lower mold plate 41, the substrate 45 is arranged on the substrate arrangement surface 21 </ b> L. At this time, the positioning pin 22L is inserted into the positioning pin hole 26L of the substrate 45, and the positioning pin 23L is inserted into the positioning pin hole 27L of the substrate 45. Further, the introduction pin 31L is inserted into the introduction pin hole 33L of the substrate 45, and the introduction pin 32L is inserted into the introduction pin hole 34L of the substrate 45. Here, the positioning pins 22L and 23L are provided at positions where the end of the substrate 25 along the direction D2 of the substrate 25 is in contact with the pot block 19 without a gap by this positioning. Similarly, the positioning pins 22 </ b> R and 23 </ b> R are provided at positions where the end on the pot block 19 side along the direction D <b> 2 of the substrate 44 contacts the pot block 19 without a gap.

  As shown in FIGS. 11 to 13, in the lower mold plate 41, the substrate 44 is disposed on the substrate placement surface 21 </ b> R. At this time, the positioning pin 22R is inserted into the positioning pin hole 26R of the substrate 44, and the positioning pin 23R is inserted into the positioning pin hole 27R of the substrate 44. Furthermore, the introduction pin 31R is inserted into the introduction pin hole 33R of the substrate 44, and the introduction pin 32R is inserted into the introduction pin hole 34R of the substrate 44. By this positioning, one of the end portions along the direction D2 of the substrate 44 contacts the pot block 19 without a gap.

  As described above, in this embodiment, in addition to the effects obtained by the positioning pins described in the first embodiment, the introduction pins that can fix the outer peripheral portions of the substrates 44 and 45 are used, thereby providing higher accuracy. Positioning is possible.

  11 to 13, after the film 28 is adsorbed on the upper mold plate 40 and the substrates 44 and 45 are arranged on the lower mold plate 41, the mold is closed as in the first embodiment. Resin injection and mold opening are performed. Thereby, as shown in FIG. 14, the resin molding 30 can be obtained. And as demonstrated in Embodiment 1, a package can be obtained by separating the resin molding 30 into pieces.

  The embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  The present invention can be applied to a resin molding apparatus that seals an electronic component mounted on a substrate with a resin.

DESCRIPTION OF SYMBOLS 1 Upper platen 2 Lower platen 3 Moving platen 4 Tie bar 5 Press mechanism 6 Transfer mechanism 7 Upper die 8 Lower die 10, 40 Upper die plate 11, 41 Lower die plate 12 Cal block 13 Cal 14 Runner 15 Gate 16 Cavity 17 Adsorption hole 18L, 18R Positioning pin hole 19 Pot block 20 Pot 20a Pot opening surface 21L, 21R Substrate placement surface 22L, 22R, 23L, 23R Positioning pin 24, 25, 44, 45 Substrate 26L, 26R, 27L, 27R Positioning pin Hole 28 Film 29 Electronic component 30 Resin molded body 31L, 31R, 32L, 32R Introducing pin 33L, 33R, 34L, 34R Introducing pin hole 35L, 35R Introducing pin hole 100 Resin molding device

Claims (5)

A first mold having a pot in which resin is disposed; and a second mold having a cavity into which the resin disposed in the pot is poured, and disposed in the first mold. A resin molding apparatus for injecting the resin between a substrate and a film adsorbed in the cavity of the second mold, and molding a resin molded body in which an electronic component mounted on the substrate is sealed with the resin; There,
In the first mold,
Of the arrangement surface of the substrate, the cavity is an area between the pot-side end side of the substrate arrangement surface and a straight line including the pot-side end side of the molding region of the resin molded body, and the cavity Positioning pins that are inserted into the first holes of the substrate protrude from the substrate placement surface of the first mold toward the second mold in a region excluding the flow path of the resin flowing into the substrate. And
Abutting the first mold and the second mold without penetrating the tip of the positioning pin through the film;
Resin molding equipment. The shape of the tip of the positioning pin is a rounded shape.
The resin molding apparatus according to claim 1. In the first mold,
Of the arrangement surface of the substrate, an end side facing the pot side end side of the substrate arrangement surface, and a straight line including an end side facing the pot side end side of the molding region of the resin molded body, In the region between, an introduction pin inserted into the second hole of the substrate is provided so as to protrude from the arrangement surface of the substrate of the first mold toward the second mold,
The resin molding apparatus according to claim 1 or 2. The length of the positioning pin protruding from the arrangement surface of the substrate is shorter than the thickness of the substrate.
The resin molding apparatus of any one of Claim 1 to 3. The first mold is
A pot block formed with the pot;
The substrate having the same thickness as the height from the substrate placement surface to the surface where the pot opening is formed in the pot block is placed on the substrate placement surface, and the substrate is positioned by the positioning pins. ,
The resin molding apparatus of any one of Claim 1 to 4.

Images